CN211208672U

CN211208672U - Radiation component, waveguide antenna subarray and waveguide array antenna

Info

Publication number: CN211208672U
Application number: CN202020272670.XU
Authority: CN
Inventors: 邢星
Original assignee: Northwest Instrument Inc
Current assignee: Northwest Instrument Inc
Priority date: 2020-03-06
Filing date: 2020-03-06
Publication date: 2020-08-07
Anticipated expiration: 2030-03-06

Abstract

The utility model relates to a radiation component, waveguide antenna subarray and waveguide array antenna. A radiating assembly for a waveguide array antenna comprising: the first radiation layer is provided with a plurality of first radiation windows, and each first radiation window in the plurality of first radiation windows is provided with a metal grid bar so as to divide the first radiation window into two radiation holes; and a second radiation layer having a plurality of second radiation windows which correspond to the plurality of first radiation windows one to one and in which metal grid bars are not provided, wherein a thickness of the second radiation layer is greater than a thickness of the first radiation layer, and wherein the first radiation layer and the second radiation layer are manufactured independently of each other. The radiation component can enhance the mouth-to-face radiation polarization purity of the waveguide array antenna to which the radiation component belongs, so that a higher antenna cross polarization index is achieved.

Description

Radiation component, waveguide antenna subarray and waveguide array antenna

Technical Field

The present invention relates to microwave antenna-related technologies, and in particular, to a radiation assembly for a waveguide array antenna, a waveguide antenna subarray, and a waveguide array antenna.

Background

First, the conventional patch array antenna is mostly implemented by using a single-layer or multi-layer PCB structure. Although the light-weight structure has the characteristic of light weight, the light-weight structure is easy to integrate with equipment, and has certain advantages in the aspects of manufacturing consistency and cost. However, the microstrip line has too large transmission loss at millimeter wave frequency, and the mutual coupling problem of the array elements of the radiating window surface also exists objectively, so that the microstrip patch array antenna is difficult to obtain higher surface radiation efficiency and obtain better electrical indexes of XPD (cross polarization of antenna) and higher gain.

In addition, in the traditional waveguide slot array, the transmission network adopts air waveguide transmission, so that the transmission network has a lower transmission loss value, and the mouth surface mostly adopts a cavity or slot array, so that the traditional waveguide slot array has unique advantages in mouth surface efficiency and array element mutual coupling related indexes, such as XPD (x-ray diffraction) indexes, dual-polarized IPI (inter-port isolation) indexes and the like. However, the array number of the waveguides still depends on the selection of the array element spacing, and the array element spacing of about 0.5 wavelength enables the array element number of the limited area to be limited, and the continuity and uniformity of the field distribution still have certain defects. In addition, in the aspect of pattern envelope, because of the distribution rule of the mouth surface field, amplitude distribution shaping is difficult to carry out, and the pattern index of lower side lobe is realized.

The reason for this is that, in the conventional radiation unit for the waveguide array antenna, both sides of the radiation unit are respectively processed by opening a mold, but the manufacturing accuracy of the radiation unit with such an integrated structure is poor, which causes poor cross polarization of the antenna, and cannot meet the Class3 requirement of ETSI of european standardization institute.

SUMMERY OF THE UTILITY MODEL

The technical problems are overcome, namely the defects that the antenna comprising the integrated radiating element has poor manufacturing precision and poor cross polarization and cannot meet the Class3 requirement of the ETSI. In order to solve the above technical problems in the prior art, a first aspect of the present disclosure proposes a radiation assembly for a waveguide array antenna, the radiation assembly including:

a first radiation layer having a plurality of first radiation windows, each of the plurality of first radiation windows having a metal grating therein to divide the first radiation window into two radiation holes; and

a second radiation layer having a plurality of second radiation windows corresponding to the plurality of first radiation windows one to one and having no metal bars in the plurality of second radiation windows of the second radiation layer,

wherein a thickness of the second radiation layer is greater than a thickness of the first radiation layer, and wherein the first radiation layer and the second radiation layer are fabricated independently of each other.

The radiation assembly improves the mouth-to-face radiation polarization purity by adding the metal grid bars between the narrow edges of the radiation window of the radiation assembly under the condition of not reducing the gain so as to achieve higher antenna cross polarization (XPD) indexes. Also, the radiating assembly according to the present disclosure reduces side lobe levels to meet the ETSI level 3 requirements.

In one embodiment according to the present disclosure, the first radiation layer and the second radiation layer are joined by means of vacuum diffusion welding.

The radiation assembly according to the present disclosure is assembled through a vacuum diffusion welding process, and the radiation layer thereof is independently manufactured through etching or laser engraving, so that the processing precision is higher, the corresponding mold opening cost is saved, and the cost is reduced.

In one embodiment according to the present disclosure, the second radiation layer has at least two radiation sublayers, which have the same structure. Preferably, in an embodiment according to the present disclosure, the first radiation window includes two relatively narrow sides disposed oppositely, and the metal grid is between the two relatively narrow sides of the first radiation window and divides the first radiation window equally into the two radiation holes. Preferably, the first radiation window further comprises a relatively long side connecting the two narrow sides, and the metal grid is arranged in parallel with the relatively long side of the first radiation window.

In one embodiment according to the present disclosure, the thickness of the first radiation layer and the thickness of the second radiation layer are associated with an operating frequency of a signal transmitted by the radiation assembly. Preferably, the first radiation layer has a thickness of one twentieth of a wavelength corresponding to the operating frequency. Further preferably, the thickness of the second radiation layer is one fifth of the wavelength corresponding to the operating frequency. By the above optimization of the thickness of the radiation layer, optimization for different wavelengths can be achieved, further optimizing the performance of the radiation assembly.

In one embodiment according to the present disclosure, the first radiation window, the second radiation window and the two radiation holes are configured by etching or laser engraving. Compared with the traditional process of manufacturing by a die, the manufacturing method of the radiation component by etching or laser engraving can further improve the manufacturing precision, and further improve the performance of the radiation component.

Furthermore, the second aspect of the present disclosure also provides a waveguide antenna sub-array comprising the proposed radiating component for a waveguide array antenna according to the first aspect of the present disclosure.

In one embodiment according to the present disclosure, the waveguide antenna sub-array further includes:

the first coupling layer is provided with a plurality of first coupling gaps which are in one-to-one correspondence with a plurality of second radiation windows in the second radiation layer, and a first angle is staggered between the first coupling gaps and the second radiation windows corresponding to the first coupling gaps. Preferably, the first angle is 45 degrees. And the first-stage polarization rotation from 0 degree to 45 degrees is realized through the optimization of the interlayer feed network technology.

the power distribution layer is provided with a plurality of power distribution cavities in an H shape, and the tail end of each power distribution cavity corresponds to one first coupling gap in the first coupling layer.

a second coupling layer having a plurality of second coupling slits therein, each of the plurality of second coupling slits corresponding to one power distribution cavity.

a feed network layer, a plurality of feed network layer ends of the feed network layer corresponding to the plurality of second coupling slots and configured to provide an input signal to the component for a waveguide array antenna via the feed network layer.

a substrate having signal inputs therein to input signals into the sub-array of waveguide antennas via the signal inputs.

Finally, a third aspect of the present disclosure proposes a waveguide array antenna comprising at least the radiating component proposed according to the first aspect of the present disclosure for a waveguide array antenna or a sub-array of waveguide antennas proposed according to the second aspect of the present disclosure.

In summary, the radiation assembly according to the present disclosure is assembled by a vacuum diffusion welding process, and the radiation layer is independently manufactured by etching or laser engraving, so that the processing precision is higher, the corresponding mold opening cost is saved, and the cost is reduced. And the radiation assembly increases the mouth face radiation polarization purity by adding the metal grid bar between the narrow edges of the radiation window of the radiation assembly under the condition of not reducing the gain so as to achieve higher antenna cross polarization (XPD) index. In addition, by the distribution scheme (rhombic distribution) of the rotating array elements, the tapered shaping of the polarization component of the mouth-face field is realized, and the shaping optimization of a directional diagram is realized under the condition of certain radiation efficiency attenuation. The sidelobe levels are reduced to meet the ETSI level 3 requirements.

Drawings

Embodiments are shown and described with reference to the drawings. These drawings are provided to illustrate the basic principles and thus only show the aspects necessary for understanding the basic principles. The figures are not to scale. In the drawings, like reference numerals designate similar features.

Fig. 1A shows an overall schematic view of a first radiation layer 110 proposed according to the present disclosure;

FIG. 1B shows a partially enlarged schematic view of a portion 112 of the first radiation layer 110 of FIG. 1A;

fig. 2A shows an overall schematic view of a second radiation layer 120 proposed according to the present disclosure;

fig. 2B shows a partially enlarged schematic view of a portion 122 of the second radiation layer 120 in fig. 2A;

fig. 3A shows an overall schematic view of a first coupling layer 130 proposed according to the present disclosure;

FIG. 3B shows a partially enlarged schematic view of a portion 132 of the first coupling layer 130 of FIG. 3A;

fig. 4A shows an overall schematic diagram of a proposed power distribution layer 140 in accordance with the present disclosure;

FIG. 4B shows a partially enlarged schematic view of a portion 142 of the power distribution layer 140 of FIG. 4A;

fig. 5A shows an overall schematic view of a second coupling layer 150 proposed according to the present disclosure;

FIG. 5B shows a partially enlarged schematic view of a portion 152 of the second coupling layer 150 of FIG. 5A;

fig. 6A shows an overall schematic diagram of the feed network layer 160 proposed according to the present disclosure;

fig. 6B shows a partially enlarged schematic view of a portion 162 of the feed network layer 160 in fig. 6A;

fig. 7 shows an overall schematic view of a substrate proposed according to the present disclosure;

fig. 8 shows a schematic diagram of a proposed waveguide antenna sub-array 200 according to a first embodiment of the present disclosure;

fig. 9 shows a schematic diagram of a proposed waveguide antenna sub-array 300 according to a second embodiment of the present disclosure; and

fig. 10 illustrates a flow chart of a method 400 of a vacuum diffusion welding process in accordance with use in the present disclosure.

Other features, characteristics, advantages and benefits of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

Detailed Description

In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings, which form a part hereof. The accompanying drawings illustrate, by way of example, specific embodiments in which the disclosure can be practiced. The example embodiments are not intended to be exhaustive of all embodiments according to the disclosure. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims.

Fig. 1A shows an overall schematic view of a first radiation layer 110 proposed according to the present disclosure, and fig. 1B shows a partially enlarged schematic view of a portion 112 of the first radiation layer 110 in fig. 1A. As can be seen from fig. 1A and 1B, the radiation windows 1122 of the first radiation layer 110 have metal bars therein, so that each radiation window is divided into two radiation holes, so that the final signal is radiated through the radiation holes of the surface of the radiation layer, so as to optimize the XPD performance of the radiation assembly. In a preferred embodiment according to the present disclosure, the metal grid is between the relatively narrow sides of the first radiation window and divides the first radiation window equally into the two radiation apertures. Preferably, the metal grid is arranged parallel to the relatively long side of the radiation window. The first radiation window comprises two relatively narrow sides and two relatively long sides, the two relatively narrow sides are connected with the two relatively long sides, the metal grid bars are arranged between the two relatively narrow sides, and the metal grid bars are arranged in parallel with the relatively long sides. The XPD performance of the radiating component can thereby be further optimized.

Fig. 2A shows an overall schematic view of the second radiation layer 120 proposed according to the present disclosure, and fig. 2B shows a partially enlarged schematic view of a portion 122 of the second radiation layer 120 in fig. 2A. As can be seen from fig. 2A and 2B, the second radiation layer 120 has substantially the same structure as the first radiation layer, except that there is no metal grid in the second radiation window above the second radiation layer 120, so that better XPD performance can be achieved in cooperation with the first radiation layer 110. In addition, the thickness of the second radiation layer 120 may be the same as that of the first radiation layer 110, thereby facilitating the process; the thickness of the second radiation layer 120 may be different from the thickness of the first radiation layer 110, and the thickness of the second radiation layer 120 is greater than the thickness of the first radiation layer 110, so as to further simplify the structure of the radiation element composed of the first radiation layer 110 and the second radiation layer 120. Preferably, in the case that the thickness of the second radiation layer 120 may be the same as that of the first radiation layer 110, the second radiation layer 120 has at least two radiation sublayers (not shown in the figure) having the same structure. In one embodiment consistent with the present disclosure, the thickness of the first radiation layer 110 and the thickness of the second radiation layer 120 are associated with an operating frequency of a signal transmitted by the radiation assembly. Preferably, the thickness of the first radiation layer 110 is one twentieth of the wavelength corresponding to the operating frequency. Further preferably, the thickness of the second radiation layer 120 is one fifth of the wavelength corresponding to the operating frequency. By the above optimization of the thickness of the radiation layer, optimization for different wavelengths can be achieved, further optimizing the performance of the radiation assembly.

A radiation assembly for a waveguide array antenna can be composed of the first radiation layer 110 in fig. 1A, 1B and the second radiation layer 120 in fig. 2A, 2B, and includes: a first radiation layer 110, the first radiation layer 110 having a plurality of first radiation windows 1122, each of the plurality of first radiation windows 1122 having a metal bar therein to divide the first radiation window 1122 into two radiation holes; and the radiation assembly further includes a second radiation layer 120, the second radiation layer 120 having a plurality of second radiation windows 1222, the plurality of second radiation windows 1222 are in one-to-one correspondence with the plurality of first radiation windows 1122 and the plurality of second radiation windows 1222 of the second radiation layer 120 do not have a metal grid therein, wherein a thickness of the second radiation layer 120 is greater than a thickness of the first radiation layer 110, and wherein the first radiation layer 110 and the second radiation layer 120 are manufactured independently of each other. Preferably, the first radiation layer 110 and the second radiation layer 120 are connected by means of vacuum diffusion welding. The radiation assembly according to the present disclosure is assembled through a vacuum diffusion welding process, and the radiation layer thereof is independently manufactured through etching or laser engraving, so that the processing precision is higher, the corresponding mold opening cost is saved, and the cost is reduced. And the radiation assembly increases the mouth face radiation polarization purity by adding the metal grid bar between the narrow edges of the radiation window of the radiation assembly under the condition of not reducing the gain so as to achieve higher antenna cross polarization (XPD) index. Also, the radiating assembly according to the present disclosure reduces side lobe levels to meet the ETSI level 3 requirements.

In the embodiment shown in fig. 1A, 1B, 2A and 2B, the first radiation window 112, the second radiation window 122 and the two radiation openings are formed by etching or laser engraving. Compared with the traditional process of manufacturing by a die, the manufacturing method of the radiation component by etching or laser engraving can further improve the manufacturing precision, and further improve the performance of the radiation component.

Fig. 3A shows an overall schematic view of a first coupling layer 130 proposed according to the present disclosure, and fig. 3B shows a partially enlarged schematic view of a portion 132 of the first coupling layer 130 in fig. 3A. As can be seen from the figure, the plurality of first coupling slits 1322 in the first coupling layer 130 correspond to the plurality of second radiation windows 1222 in the second radiation layer 120 in a one-to-one manner, and the first coupling slits 1322 and the corresponding second radiation windows 1222 are staggered by a first angle. Preferably, the first angle is 45 degrees. And the first-stage polarization rotation from 0 degree to 45 degrees is realized through the optimization of the interlayer feed network technology.

Fig. 4A shows an overall schematic view of the proposed power distribution layer 140 according to the present disclosure, and fig. 4B shows a partially enlarged schematic view of a portion 142 of the power distribution layer 140 in fig. 4A. As can be seen from the figure, the power distribution layer 140 has a plurality of power distribution cavities 1422 in an H shape, and an end 14222 of each power distribution cavity 1422 corresponds to one first coupling slot 1322 in the first coupling layer 130.

Fig. 5A shows an overall schematic view of a second coupling layer 150 proposed according to the present disclosure, and fig. 5B shows a partially enlarged schematic view of a portion 152 of the second coupling layer 150 in fig. 5A. As can be seen from the figure, the second coupling layer 150 has a plurality of second coupling slits 1522 therein, and each second coupling slit 1522 of the plurality of second coupling slits 1522 corresponds to one power distribution cavity 1422.

Fig. 6A shows an overall schematic diagram of the feed network layer 160 proposed according to the present disclosure, while fig. 6B shows a partially enlarged schematic diagram of a portion 162 of the feed network layer 160 in fig. 6A. As can be seen from the figure, a plurality of feed network layer ends 1622 in the feed network layer 160 correspond to the plurality of second coupling slots 1522 and are configured to provide input signals for the assembly for a waveguide array antenna via the feed network layer 160.

Fig. 7 shows an overall schematic view of a substrate proposed according to the present disclosure. As can be seen from fig. 7, there is a signal input terminal in the middle of the substrate for inputting signals.

The waveguide antenna sub-array provided according to the second aspect of the present disclosure can be composed of the respective sheets of fig. 1 to 6, which of course includes the radiation assembly for a waveguide array antenna proposed according to the first aspect of the present disclosure. Preferably, the waveguide antenna sub-array can further comprise a substrate as shown according to fig. 7 to increase structural stability. That is, the waveguide antenna sub-array can further include a substrate 170 having a signal input terminal therein to input an input signal to the waveguide antenna sub-array via the signal input terminal.

Fig. 8 shows a schematic diagram of a proposed waveguide antenna sub-array 200 according to a first embodiment of the present disclosure. As can be seen from the figure, the waveguide antenna sub-array 200 includes, from top to bottom, a first radiation layer 210, a second radiation layer 220, a first coupling layer 230, a power distribution layer 240, a second coupling layer 250, and a feed network layer 260. In this embodiment, each of the first radiation layer 210 and the second radiation layer 220 is composed of only one metal plate, and the thickness of the metal plate of the second radiation layer 220 is significantly greater than that of the metal plate of the first radiation layer 210. The product can be formed by welding sheets with different thicknesses, and each layer has different thickness within the range of 0.1-1 mm. The hollow-out shapes of the cavities of all layers are different and the sizes of the hollow-out shapes are not uniform due to different performance requirements. The middle interlayer is provided with a small cavity and a large cavity, the minimum layer has the thickness of only 0.1mm and cannot be processed by a machining process or an injection molding process, if the inner cavity is processed by a 3D printing process, the precision is far less than the design requirement, the middle interlayer is processed by an etching process or a laser engraving process, namely, the laser engraving process is selected to process each thin sheet with different thicknesses, meanwhile, the bottom plate is processed by a CNC (Computer numerical control) machine tool, and finally, the finished product is formed by vacuum diffusion welding after each layer is accurately positioned.

Fig. 9 shows a schematic diagram of a proposed waveguide antenna sub-array 300 according to a second embodiment of the present disclosure. As can be seen from the figure, the waveguide antenna sub-array 300 includes, from top to bottom, a first radiation layer 310, a second radiation layer 320, a first coupling layer 330, a power distribution layer 340, a second coupling layer 350, and a feeding network layer 360. In this embodiment, the first radiation layer 310 is composed of only one metal plate, and the second radiation layer 320 is composed of a plurality of metal plates, and the thickness of the metal plate of the second radiation layer 220 is significantly greater than that of the metal plate of the first radiation layer 210. The product can be formed by welding sheets with the same thickness, the thickness of each layer is the same, and the thickness range is 0.1-0.3 mm. The hollow-out shapes of the cavities of all layers are different and the sizes of the hollow-out shapes are not uniform due to different performance requirements. The middle interlayer is provided with a small cavity and a large cavity, the minimum layer has the thickness of only 0.1mm, and cannot be machined or injection-molded, and if a 3D printing process is adopted to machine the inner cavity, the precision is far below the design requirement.

Fig. 10 illustrates a flow chart of a method 400 of a vacuum diffusion welding process in accordance with use in the present disclosure. Diffusion welding is a pressure welding method for completing welding by mutually diffusing atoms on contact surfaces of two closely attached welding parts in vacuum or protective atmosphere through keeping a certain temperature and pressure.

The vacuum diffusion welding process has the following four characteristics:

firstly, because no soldering flux exists, the internal cavity does not retain the soldering flux;

secondly, the heating temperature does not reach the melting point, and the cavity does not deform to influence the dimensional accuracy;

moreover, the same substances are fused together, so that reliability problems such as electric corrosion, corrosion and the like can not be caused;

finally, the physical, chemical, mechanical and electrical properties of the original base metal are maintained after welding.

The conventional diffusion bonding process flow is as follows:

the method comprises the steps of assembling the object, cleaning, placing the object in a welding furnace, heating to a specified temperature within a specified time, pressurizing and preserving heat for a certain time, decompressing and cooling, and taking out the object.

According to different materials, different thicknesses of the materials, different pressures, different temperatures and different heat preservation times. For example: the welding temperature of the copper material is about 1140 ℃, the pressurization is about 6MPa, and the welding time is about 10 hours.

As can be seen in fig. 10, the method 400 broadly includes the following four steps, first, in method step 410, cutting a substrate panel into a sheet-like sheet of appropriate thickness; in method step 420, the sheet-like metal material is then processed by etching/laser engraving or by means of a numerical control machine to form

first radiation layer

110, 210, 310,

second radiation layer

120, 220, 320,

first coupling layer

130, 230, 330,

power distribution layer

140, 240, 340,

second coupling layer

150, 250, 350, power

supply network layer

160, 260, 360 and substrate 170, respectively. Next, in method step 430, the

first radiation layer

110, 210, 310, the

second radiation layer

120, 220, 320, the

first coupling layer

130, 230, 330, the

power distribution layer

140, 240, 340, the

second coupling layer

150, 250, 350, the

feed network layer

160, 260, 360 and the substrate 170 are aligned and assembled; finally, in method step 440, the

first radiation layer

110, 210, 310, the

second radiation layer

120, 220, 320, the

first coupling layer

130, 230, 330, the

power distribution layer

140, 240, 340, the

second coupling layer

150, 250, 350, the

feed network layer

160, 260, 360 and the substrate 170 are welded together using a vacuum diffusion welding process.

More specifically, the present disclosure provides a broadband high-gain low-sidelobe low-profile waveguide array antenna, including a plurality of broadband antenna sub-arrays and a waveguide broadband power division feed network, where the broadband antenna sub-arrays include a radiation unit, a radiation unit coupling slit, a sub-array power layering, a power layering coupling slit, and a feed waveguide, where the radiation unit is located at a first layer (the uppermost layer), and the radiation unit coupling slit is located between the radiation unit and the sub-array power layering, and is located at a second layer; the power layered coupling slot is positioned on the fourth layer, and the feed waveguide is positioned on the fifth layer. The input end of the waveguide broadband power distribution feed network is an E-surface waveguide magic T, the input end of the E-surface waveguide is used as the input end of the antenna, and the two output ends are respectively connected with a plurality of H-surface waveguide magic Ts in a cascading mode. The tail end of the waveguide broadband power distribution feed network is connected with the input waveguide of the broadband antenna sub-array. Furthermore, a plurality of broadband antenna subarrays are arranged in a diamond shape. Furthermore, each broadband sub-array comprises 4 radiation units, 4 radiation unit coupling gaps, 1 sub-array power layering, 1 power layering coupling gap and 1 feed waveguide. Furthermore, a metal strip is arranged on the central line of the narrow edge of the upper surface of the radiation unit to divide the window of the upper surface of the radiation unit into two halves. Further, the subarrays are layered successfully, with an outline resembling the lying letter "H". And the radiation unit coupling slits are positioned at four ends of the H. Furthermore, the geometric centers of the radiation unit and the radiation unit coupling seam are overlapped, and an included angle of 45 degrees is formed between the radiation unit and the radiation unit coupling seam. Furthermore, the geometric center of the upper surface of the power layering coupling seam coincides with the geometric center of the lower surface of the sub-array power layering coupling seam. Furthermore, the power layering coupling slot is positioned on the surface of the broadside of the feed waveguide, is parallel to the waveguide, and deviates from the geometric center line of the waveguide. Furthermore, the input port of the E-surface magic T is a standard waveguide, and the two output port waveguides adopt a single-ridge waveguide structure. Further, the H-surface magic T has two forms: the H-face magic T input port at the tail end is of a single-ridge waveguide structure, and the two output ports are standard waveguides. The middle cascaded H-face magic T has three ports all adopting a single-ridge waveguide structure. The radiation units are arranged in a rhombic array, so that the tapering shaping of the polarization component of the mouth surface field is realized, and the shaping optimization of a directional diagram is realized under the condition of certain radiation efficiency attenuation. The sidelobe levels are reduced to meet the ETSI Class3 requirement. By adding the grid bars in the direction parallel to the wide side at the center of the narrow side of the radiation window of the radiation unit, the cross polarization (XPD) of the antenna is effectively improved under the condition of not reducing the gain. In the invention, the polarization first-stage rotation from 0 degree to 45 degrees is realized through the optimization of the interlayer feed network, so that the whole structural scheme is more compact and has higher process cost. The feed network in the invention adopts the combination form of E-surface magic T and H-surface magic T, so that the antenna input port is positioned at the geometric center of the antenna, and the integration and installation with the transmitting outdoor unit are facilitated. The waveguide broadband feed network mainly adopts a single ridge waveguide structure, thereby effectively improving the working bandwidth and reducing the volume.

In summary, the radiation assembly according to the present disclosure is assembled by a vacuum diffusion welding process, and the radiation layer is independently manufactured by etching or laser engraving, so that the processing precision is higher, the corresponding mold opening cost is saved, and the cost is reduced. And the radiation assembly increases the mouth face radiation polarization purity by adding the metal grid bar between the narrow edges of the radiation window of the radiation assembly under the condition of not reducing the gain so as to achieve higher antenna cross polarization (XPD) index. In addition, by the distribution scheme (rhombic distribution) of the rotating array elements, the tapered shaping of the polarization component of the mouth-face field is realized, and the shaping optimization of a directional diagram is realized under the condition of certain radiation efficiency attenuation. The sidelobe levels are reduced to meet the ETSI level 3 requirements. Finally, the substrate can meet the requirement of key small-size precision through process laser engraving, and the multilayer substrates are laminated and combined in a vacuum diffusion welding mode to finally realize the overall electrical index.

It will be understood by those skilled in the art that various changes and modifications may be made in the above-disclosed embodiments without departing from the spirit of the invention. Accordingly, the scope of the disclosure should be limited only by the attached claims.

While various exemplary embodiments of the disclosure have been described, it will be apparent to those skilled in the art that various changes and modifications can be made which will achieve some of the advantages of the disclosure without departing from the spirit and scope of the disclosure. Other components performing the same function may be substituted as appropriate by those reasonably skilled in the art. It should be mentioned that features explained herein with reference to a particular figure may be combined with features of other figures, even in those cases where this is not explicitly mentioned. Further, the methods of the present disclosure may be implemented in either all software implementations using appropriate processor instructions or hybrid implementations using a combination of hardware logic and software logic to achieve the same result. Such modifications to the solution according to the disclosure are intended to be covered by the appended claims.

Claims

1. A radiating assembly for a waveguide array antenna, the radiating assembly comprising:

2. The radiating assembly of claim 1, wherein the second radiating layer has at least two radiating sublayers, the at least two radiating sublayers having the same structure.

3. The radiation assembly defined in claim 1 or claim 2, wherein the first radiation window comprises two relatively narrow sides disposed in opposition, and the metal grid is between the two relatively narrow sides of the first radiation window and divides the first radiation window equally into the two radiation apertures.

4. The radiation assembly defined in claim 3, wherein the first radiation window further comprises a relatively longer side connecting the two narrower sides, the metal grid being disposed parallel to the relatively longer side of the first radiation window.

5. The radiating assembly of claim 1, wherein a thickness of the first radiating layer and a thickness of the second radiating layer are associated with an operating frequency of a signal transmitted by the radiating assembly.

6. The radiating element of claim 5, wherein the first radiating layer has a thickness of one twentieth of a wavelength corresponding to the operating frequency.

7. A radiating assembly according to claim 5 or 6, wherein the thickness of the second radiating layer is one fifth of the wavelength corresponding to the operating frequency.

8. The radiation assembly defined in claim 1, wherein the first radiation window, the second radiation window and the two radiation apertures are configured by etching or laser engraving.

9. The radiation assembly defined in claim 1, wherein the first radiation layer and the second radiation layer are joined by vacuum diffusion welding.

10. A waveguide antenna sub-array, characterized in that it comprises a radiating component for a waveguide array antenna according to any of claims 1 to 9.

11. The waveguide antenna sub-array of claim 10, further comprising:

the first coupling layer is provided with a plurality of first coupling gaps which are in one-to-one correspondence with a plurality of second radiation windows in the second radiation layer, and a first angle is staggered between the first coupling gaps and the second radiation windows corresponding to the first coupling gaps.

12. The waveguide antenna sub-array of claim 11 wherein the first angle is 45 degrees.

13. The waveguide antenna sub-array of claim 11, further comprising:

14. The waveguide antenna sub-array of claim 13, further comprising:

15. The waveguide antenna sub-array of claim 14, further comprising:

16. The waveguide antenna sub-array of claim 15, further comprising:

17. A waveguide array antenna, characterized in that it comprises at least:

a radiating component for a waveguide array antenna according to any one of claims 1 to 9; or

The waveguide antenna sub-array of any one of claims 10 to 16.