CN209571395U - Wafer transfer device - Google Patents

Abstract

The utility model discloses a kind of wafer transfer devices, by first movement mechanism, so that substrate is moved to the first predeterminated position；Again by the second mobile mechanism, so that wafer disks are moved to the second predeterminated position, at this point, wafer disks are correspondingly arranged with substrate, that is, the plant crystalline substance position on the wafer and substrate in wafer disks is correspondingly arranged；Then, by ejecting mechanism, so that the wafer in wafer disks is directly ejected to substrate.In this way, wafer is directly transferred on substrate by this wafer transfer device from wafer disks, intermediate transfer link is eliminated, greatly improves wafer transfer efficiency.Simultaneously, this wafer transfer device is in wafer transfer process, pass through first movement mechanism and the second mobile mechanism, adjust the corresponding position of wafer disks and substrate, so that wafer is accurately positioned on the plant crystalline substance position of substrate, without going positioning to plant brilliant position again after picking up wafer by transfer arm, in this way, greatly improving the transfer precision of wafer.

Description

Wafer transfer device

technical field

The utility model relates to the technical field of semiconductor processing, in particular to a wafer transfer device.

Background technique

In the semiconductor processing technology, it is necessary to transfer the wafer from the wafer plate to the substrate. The traditional transfer method usually uses a transfer arm to pick up the wafer from the wafer tray and transfer it to the substrate. However, with the rapid development of the semiconductor industry, semiconductor products tend to be highly integrated, and the smaller the wafer size, the better, such as mini LED and Micro LED. As the size of the wafer is getting smaller and smaller, it is difficult for the traditional transfer method to accurately and efficiently assemble the wafer to the target position.

Utility model content

Based on this, it is necessary to provide a wafer transfer device capable of effectively and accurately transferring wafers.

Its technical scheme is as follows:

A wafer transfer device, comprising: a first moving mechanism, the first moving mechanism is used for installing a substrate, and the first moving mechanism is used for moving the substrate; a second moving mechanism, the second moving mechanism is used for Wafer discs are installed, and the second moving mechanism is used to move the wafer discs to corresponding settings with the substrate; and an ejection mechanism, the ejection mechanism is used to move the wafers on the wafer discs A dome emerges onto the substrate.

The above-mentioned wafer transfer device moves the substrate to the first preset position through the first moving mechanism; and then moves the wafer disc to the second preset position through the second moving mechanism. At this time, the wafer disc and the substrate Corresponding setting, that is, the wafer on the wafer tray is set corresponding to the crystal planting position on the substrate; then, the wafer on the wafer tray is directly ejected to the substrate through the ejection mechanism. In this way, the wafer transfer device directly transfers the wafer from the wafer tray to the substrate, eliminating the intermediate transfer link and greatly improving the efficiency of wafer transfer. At the same time, during the wafer transfer process, the wafer transfer device adjusts the corresponding positions of the wafer disk and the substrate through the first moving mechanism and the second moving mechanism, so that the wafer is accurately positioned on the crystal planting position of the substrate, and There is no need to pick up the wafer through the transfer arm and then locate the crystal planting position, thus greatly improving the transfer accuracy of the wafer.

In one of the embodiments, the wafer transfer device further includes a visual mechanism, the visual mechanism is used to take images of the substrate and the wafer disk, and output the positions of the substrate and the wafer disk respectively information.

In one of the embodiments, the ejection mechanism includes a first driving member, a mounting base and a plug, the plug is installed on the mounting base, and the mounting base is driven by the output end of the first driving member. connected, the first driving member is used to drive the plug to transfer the wafer onto the substrate.

In one of the embodiments, the ejection mechanism further includes a guide rail and a first sliding member slidingly fitted with the guide rail, and the installation seat is installed on the first sliding member.

In one embodiment, the first driving element is a voice coil motor.

In one of the embodiments, the first moving mechanism includes a first moving assembly, a second moving assembly and a first carrier installed on the second moving assembly, and the second moving assembly is installed on the On the first moving component, the first moving component drives the second moving component to move along a first direction, and the second moving component drives the first carrier to move along a second direction, and the first direction Intersecting with the second direction, the first carrier is used for installing the substrate.

In one of the embodiments, the second moving mechanism includes a third moving assembly, a fourth moving assembly and a second carrier mounted on the fourth moving assembly, and the fourth moving assembly is installed on the On the third moving component, the third moving component drives the fourth moving component to move along a third direction, and the fourth moving component drives the second carrier to move along a fourth direction, and the third direction Intersecting with the fourth direction, the second carrier is used for mounting the wafer.

In one of the embodiments, the first direction is set parallel to the fourth direction, and the second direction is set parallel to the third direction.

In one of the embodiments, the first direction is set parallel to the third direction, and the second direction is set parallel to the fourth direction.

In one of the embodiments, the first moving assembly includes a second driving member and a second sliding member, the second sliding member is in drive connection with the output end of the second driving member, and the second moving assembly is installed on on the second slider.

A wafer transfer method, comprising the steps of: moving a substrate, placing the substrate at a first preset position; moving a wafer, placing the wafer at a second preset position, and placing the wafer The wafer on the wafer and the planting position on the substrate are set correspondingly to the plug; move the plug, and place the top of the wafer from the side of the wafer disc facing away from the wafer. to the corresponding implant location.

In the wafer transfer method described above, the substrate is moved to place the substrate at the first preset position; the wafer tray is then moved to place the wafer tray at the second preset position. The wafers on the disc are set corresponding to the planting positions on the substrate; then, the wafers on the wafer disc are directly ejected onto the substrate through the plug. In this way, the wafer transfer method directly transfers the wafer from the wafer plate to the substrate, which saves the intermediate transfer link and greatly improves the efficiency of wafer transfer. At the same time, during the wafer transfer process, the wafer transfer method adjusts the corresponding position between the wafer plate and the substrate so that the wafer can be accurately positioned on the substrate’s implantation position without picking up the wafer by the transfer arm and then positioning it. The implant position, in this way, greatly improves the transfer accuracy of the wafer.

In one of the embodiments, the step further includes: moving the plug to separate the plug from the surface of the wafer; moving the substrate and the wafer respectively to remove the The next wafer and the next crystal-planting position on the substrate are set correspondingly to the plug; the plug is moved to push the wafer to the corresponding crystal-planting position.

In one embodiment, the distance between the second preset position and the first preset position is 0.1 mm˜2 mm.

Description of drawings

FIG. 1 is a schematic structural diagram of a wafer transfer device according to an embodiment of the present invention;

Fig. 2 is a schematic diagram of the ejection mechanism described in an embodiment of the present invention;

Fig. 3 is the enlarged schematic view of the structure at circle A in Fig. 2;

Fig. 4 is a schematic diagram of cooperation between the first moving mechanism and the second moving mechanism described in an embodiment of the present invention;

5 is a schematic diagram of a wafer transfer process according to an embodiment of the present invention;

6 is a flowchart of a wafer transfer method according to an embodiment of the present invention;

FIG. 7 is a flowchart of a wafer transfer method according to another embodiment of the present invention.

Explanation of reference signs:

100. Wafer transfer device, 110. First moving mechanism, 111. First moving assembly, 1111. Second driving member, 1112. Second sliding member, 112. Second moving assembly, 1121. Third driving member, 113 , the first carrier, 120, the second moving mechanism, 121, the third moving assembly, 1211, the fourth driving element, 1212, the third sliding element, 122, the fourth moving assembly, 1221, the fifth driving element, 123, Second bearing part, 130, ejection mechanism, 131, first driving part, 132, mounting seat, 133, plug, 1331, ejection surface, 1332, conical structure, 134, guide rail, 135, first sliding part, 136 , grating sensing component, 137, bracket, 138, connection seat, 139, fixture, 140, visual mechanism, 150, limit switch, 160, drag chain, 200, substrate, 300, wafer plate, 310, blue film, 320. Wafer.

Detailed ways

In order to make the purpose, technical solutions and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the utility model, and do not limit the protection scope of the utility model.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of this invention. The terminology used herein in the description of the utility model is only for the purpose of describing specific implementations, and is not intended to limit the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The "first" and "second" mentioned in the utility model do not represent the specific quantity and order, but are only used to distinguish the names.

In one embodiment, please refer to FIG. 1 , a wafer transfer device 100 includes a first moving mechanism 110 , a second moving mechanism 120 and an ejecting mechanism 130 . The first moving mechanism 110 is used to install the substrate 200 , and the first moving mechanism 110 is used to move the substrate 200 . The second moving mechanism 120 is used to install the wafer tray 300 , and the second moving mechanism 120 is used to move the wafer tray 300 to a position corresponding to the substrate 200 . The ejection mechanism 130 is used to eject the wafer 320 on the wafer tray 300 onto the substrate 200 .

The above-mentioned wafer transfer device 100 moves the substrate 200 to the first preset position through the first moving mechanism 110; and then moves the wafer tray 300 to the second preset position through the second moving mechanism 120. At this time, The wafer tray 300 is arranged correspondingly to the substrate 200, that is, the wafer 320 on the wafer tray 300 is arranged correspondingly to the crystal planting position on the substrate 200; directly onto the substrate 200 . In this way, the wafer transfer device 100 directly transfers the wafer 320 from the wafer tray 300 to the substrate 200 , eliminating the intermediate transfer process and greatly improving the transfer efficiency of the wafer 320 . At the same time, during the transfer process of the wafer 320, the wafer transfer device 100 adjusts the corresponding positions of the wafer tray 300 and the substrate 200 through the first moving mechanism 110 and the second moving mechanism 120, so that the wafer 320 is accurately positioned on the substrate. 200 at the crystal planting position, without picking up the wafer 320 by the transfer arm and then positioning the crystal planting position, thus greatly improving the transfer accuracy of the wafer 320 . Wherein, the corresponding setting of the wafer tray 300 and the substrate 200 in this embodiment should be understood as that the wafer 320 on the wafer tray 300 corresponds exactly to the planting position on the substrate 200, so that the accurate transfer of the wafer 320 to the substrate 200 is facilitated. .

Optionally, the distance between the first preset position and the second preset position is 0.1mm-2mm, that is, the distance between the correspondingly set substrate 200 and the correspondingly set wafer disk 300 is 0.1mm-2mm , so that the substrate 200 and the wafer tray 300 after corresponding setting are kept at a relatively short distance, the transfer distance of the wafer 320 is shortened, the wafer 320 is accurately transferred to the substrate 200, and the wafer 320 is prevented from occurring during the long-distance transfer process. Misalignment can lead to inaccurate transfer. At the same time, it is also beneficial to improve the transfer efficiency of the wafer 320 .

Specifically, the distance between the first preset position and the second preset position is 2mm. In this embodiment, the first preset position and the second preset position are designed to be 2mm. The purpose is not only to improve the transfer accuracy and efficiency of the wafer 320, but also to effectively avoid the If the location is too close, the transferred wafer 320 will be re-adsorbed on the wafer tray 300 .

Further, the wafer transfer apparatus 100 further includes a visual mechanism 140 . The vision mechanism 140 is used for capturing images of the substrate 200 and the wafer 300 , and outputting position information of the substrate 200 and the wafer 300 respectively. In this way, the position information of the substrate 200 and the wafer tray 300 can be accurately positioned by the vision mechanism 140 , so that the substrate 200 and the wafer tray 300 can be moved to desired positions by the first moving mechanism 110 and the second moving mechanism 120 .

Optionally, the vision mechanism 140 can be set on the ejection mechanism 130 , and can also be arranged on the ejection mechanism 130 . When the vision mechanism 140 is arranged on the ejection mechanism 130, the camera end of the vision mechanism 140 is aligned with the ejection end of the ejection mechanism 130, so that the vision mechanism 140 can more conveniently and accurately push out the ejection mechanism 130. The end acts on the wafer 320.

In one embodiment, please refer to FIG. 2 and FIG. 5 , the ejection mechanism 130 includes a first driving member 131 , a mounting base 132 and a plug 133 . The plug 133 is installed on the mounting base 132 . The mounting base 132 is in transmission connection with the output end of the first driving member 131 , and the first driving member 131 is used to drive the tip 133 to transfer the wafer 320 onto the substrate 200 . It can be seen from this that when the substrate 200 and the wafer tray 300 move to the desired position, the first driving member 131 is activated to drive the mounting seat 132 to move, and drive the plug 133 to move to the wafer tray 300. At this time, the plug 133 moves from The side of the wafer plate 300 facing away from the wafer 320 is pressed against the wafer 320; along with the operation of the first driving member 131, the top 133 gradually lifts the wafer 320 away from the wafer plate 300, and quickly pushes the wafer 320 away from the wafer 320. transfer on the substrate 200 , thus effectively completing the transfer operation of the wafer 320 . In this embodiment, the wafer 320 is quickly and accurately transferred on the substrate 200 through the first driving member 131 and the plug 133 , which greatly improves the transfer efficiency and the transfer accuracy of the wafer 320 . Wherein, the first driving member 131 can be a hydraulic cylinder, an air cylinder, an electric cylinder, a motor or other driving devices.

Further, the ejection mechanism 130 further includes a guide rail 134 and a first sliding member 135 slidingly matched with the guide rail 134 . The mounting base 132 is mounted on the first sliding member 135 . In this way, through the first slider 135 and the guide rail 134 , the movement of the plug 133 is more stable, so that the plug 133 can transfer the wafer 320 to the implanting position of the substrate 200 more accurately, which is beneficial to improve the transfer accuracy of the wafer 320 . Specifically, in this embodiment, the ejection mechanism 130 further includes a bracket 137 and a connecting seat 138 mounted on the bracket 137 , and the guide rail 134 and the first driving member 131 are both disposed on the connecting seat 138 . At the same time, the connecting base 138 is also provided with a grating sensing component 136 , through which the moving distance of the plug 133 can be accurately measured.

In one embodiment, please refer to FIG. 2 , FIG. 3 and FIG. 5 , the plug 133 includes an ejection surface 1331 , and the ejection surface 1331 is configured to be attached to the surface of the wafer 320 . In this way, when the plug 133 is placed on the wafer 320, since the ejection surface 1331 of the plug 133 is placed in close contact with the surface of the wafer 320, the contact surface between the plug 133 and the wafer 320 is increased to avoid the transfer process. , leaving marks on the surface of the wafer 320 . Simultaneously, because ejection surface 1331 and the surface of wafer 320 are attached and arranged, therefore, in the transfer process, the force on the surface of wafer 320 is relatively uniform, so that wafer 320 is always in a stable state during the transfer process, thereby making wafer 320 more stable. Stable and accurate transfer on the substrate 200. Specifically, in this embodiment, one end of the plug 133 is arranged in a tapered structure 1332, so that the plug 133 can easily puncture the blue film 310 on the wafer plate 300, so that the plug 133 can push the wafer 320 onto the substrate 200 .

In one embodiment, the ejecting mechanism 130 further includes a clamp 139 , and the plug 133 is mounted on the mounting base 132 through the clamp 139 . In this way, the plug 133 is stably clamped by the clamp 139 , so that the plug 133 acts on the wafer 320 more accurately. At the same time, the jig 139 greatly facilitates the assembly and disassembly of the plug 133 , which is beneficial to improve the assembly efficiency of the wafer transfer device 100 .

Further, there are multiple plugs 133 , and the multiple plugs 133 are installed on the fixture 139 at intervals. During the transfer process of the wafer 320 , the distance between the plugs 133 and the plugs 133 is adjusted in advance, so that multiple plugs 133 can correspond to multiple wafers 320 on the wafer tray 300 at the same time. In this way, when the first driving member 131 is activated, the multiple heads 133 push the multiple wafers 320 onto the substrate 200 at the same time, thus greatly improving the transfer efficiency of the wafers 320 .

In one embodiment, the first driving element 131 is a voice coil motor. When the first driver 131 is a voice coil motor, the first driver 131 can accurately control the output pressure acting on the ejection mechanism 130, so that the ejection mechanism 130 can effectively push the wafer 320 out of the wafer tray 300 and transfer On the substrate 200 , at the same time, the output pressure of the ejection mechanism 130 to press the wafer 320 on the substrate 200 can be accurately controlled to prevent the ejection mechanism 130 from crushing the wafer 320 on the substrate 200 due to excessive output pressure. At the same time, the first driving member 131 is designed as a voice coil motor, and it is accurately judged whether the plug 133 acts on the wafer 300 or the substrate 200 by inducing the current change of the voice coil motor.

In one embodiment, please refer to FIG. 1 and FIG. 4 , the first moving mechanism 110 includes a first moving component 111 , a second moving component 112 and a first carrier 113 mounted on the second moving component 112 . The second moving assembly 112 is installed on the first moving assembly 111, the first moving assembly 111 drives the second moving assembly 112 to move along the first direction, and the second moving assembly 112 drives the first carrier 113 to move along the second direction , the first direction intersects the second direction, and the first carrier 113 is used for mounting the substrate 200 . It can be seen that, through the first moving assembly 111 and the second moving assembly 112, the substrate 200 disposed on the first carrier 113 can be moved along the first direction and the second direction, so that the substrate 200 can be moved accurately and conveniently. Move to the desired position. Specifically, in this embodiment, the first direction and the second direction are vertically set, so that the position adjustment of the substrate 200 becomes more convenient. Specifically, in this embodiment, there are multiple first carriers 113, and the plurality of first carriers 113 are arranged at intervals on the second moving assembly 112. In this way, when the wafer 320 transfer operation of the previous substrate 200 is completed, by The second moving component 112 moves the current substrate 200 to a desired position, thus avoiding the reduction of wafer 320 transfer efficiency caused by the need to replace the substrate 200 multiple times. Wherein, in order to facilitate understanding of the first direction and the second direction in this embodiment, taking FIG. 4 as an example, the first direction and the _second direction are the directions indicated by S1 and S2 in FIG. ₄ respectively.

Further, the second moving mechanism 120 includes a third moving component 121 , a fourth moving component 122 and a second carrier 123 mounted on the fourth moving component 122 . The fourth moving assembly 122 is mounted on the third moving assembly 121 . The third moving component 121 drives the fourth moving component 122 to move along the third direction. The fourth moving component 122 drives the second carrier 123 to move along the fourth direction. The third direction intersects with the fourth direction. The second carrier 123 is used for mounting the wafer tray 300 . It can be seen from this that when the substrate 200 is moved to the required position by the first moving assembly 111 and the second moving assembly 112, the third moving assembly 121 and the fourth moving assembly 122 will make the crystal placed on the second carrier 123 The disc 300 can move along the third direction and the fourth direction, so that the wafer disc 300 can be moved to a desired position accurately and conveniently. Specifically, in this embodiment, there are multiple second carriers 123, and the plurality of second carriers 123 are arranged at intervals on the fourth moving assembly 122. In this way, when the wafer 320 transfer operation of the previous wafer tray 300 is completed , the current wafer tray 300 is moved to a desired position by the fourth moving assembly 122 , thus avoiding the need to replace the wafer tray 300 multiple times and resulting in a reduction in wafer 320 transfer efficiency. Wherein, in order to facilitate understanding of the third direction and the fourth direction in this embodiment, taking FIG. 4 as an example, the third direction and the _fourth direction are the directions indicated by S3 and S4 in FIG. ₄ respectively.

Furthermore, the first direction is set parallel to the fourth direction, and the second direction is set parallel to the third direction. It can be seen that, in this embodiment, the first moving assembly 111 is arranged in parallel with the fourth moving assembly 122 , and the second moving assembly 112 is arranged in parallel with the third moving assembly 121 . In this way, when the next wafer 320 needs to be transferred, only the first moving assembly 111 and the fourth moving assembly 122, or the second moving assembly 112 and the third moving assembly 121 need to be driven synchronously, and the next wafer 320 can be transferred to the next wafer 320. The next transfer position is set exactly corresponding to the plug 133 , which greatly facilitates the position adjustment of the substrate 200 and the wafer tray 300 . Specifically, in this embodiment, the first direction is perpendicular to the second direction, and the third direction is perpendicular to the fourth direction. It can be seen that the first moving assembly 111 and the second moving assembly 112 are vertically arranged, and the third The moving assembly 121 and the fourth moving assembly 122 are arranged vertically. Wherein, the parallel arrangement in this embodiment should be understood as including absolute parallel arrangement and approximately parallel arrangement, and the intersection angle of approximately parallel arrangement is 0°˜10°.

In another embodiment, the first direction is parallel to the third direction. The second direction is arranged parallel to the fourth direction. It can be seen that, in this embodiment, the first moving assembly 111 is arranged in parallel with the third moving assembly 121 , and the second moving assembly 112 is arranged in parallel with the fourth moving assembly 122 (the specific structure is not shown). In this way, when the next wafer 320 needs to be transferred, only the first moving assembly 111 and the third moving assembly 121, or the second moving assembly 112 and the fourth moving assembly 122 need to be driven synchronously, and the next wafer 320 can be transferred to the next wafer 320. The next transfer position is all set corresponding to the plug 133 . At the same time, when there are multiple first carrier parts 113 and multiple second carrier parts 123, since the second drive part 1111 and the fourth drive part 1211 are arranged in parallel, during the transfer process of the wafer 320, it can be ensured at the same time The plurality of wafer trays 300 are arranged in one-to-one correspondence with the plurality of substrates 200 , thus greatly improving the transfer efficiency of the wafer 320 . Wherein, the parallel arrangement in this embodiment should be understood as including absolute parallel arrangement and approximately parallel arrangement, and the intersection angle of approximately parallel arrangement is 0°˜10°.

In one embodiment, the first moving component 111 includes a second driving part 1111 and a second sliding part 1112 . The second sliding member 1112 is in transmission connection with the output end of the second driving member 1111 . The second moving assembly 112 is installed on the second sliding member 1112 . In this way, through the second driving member 1111 and the second sliding member 1112 , the second moving assembly 112 moves more stably along the first direction. Specifically in this embodiment, the second moving assembly 112 includes a third driving member 1121 and a third sliding member 1212 . The third sliding member 1212 is in transmission connection with the output end of the third driving member 1121 . The first bearing part 113 is mounted on the third sliding part 1212 . At the same time, both the first moving assembly 111 and the second moving assembly 112 include a limit switch 150 and a drag chain 160 , through the limit switch 150 , the moving range of the second moving assembly 112 and the first carrier 113 can be accurately controlled. Through the drag chain 160, the cables are effectively protected, and the cables are effectively prevented from being pinched during the movement. Wherein, both the second driving member 1111 and the third driving member 1121 can be hydraulic cylinders, air cylinders, electric cylinders, motors or other driving devices.

In one embodiment, the third moving assembly 121 includes a fourth driving element 1211 and a fourth sliding element. The fourth sliding member is in transmission connection with the output end of the fourth driving member 1211 . The fourth moving assembly 122 is installed on the fourth sliding member. In this way, through the fourth driving member 1211 and the fourth sliding member, the fourth moving assembly 122 moves more stably along the third direction. Specifically in this embodiment, the fourth moving assembly 122 includes a fifth driving member 1221 and a fifth sliding member. The fifth sliding member is in transmission connection with the output end of the fifth driving member 1221 . The second bearing part 123 is mounted on the fifth sliding part. At the same time, both the third moving assembly 121 and the fourth moving assembly 122 include a limit switch 150 and a drag chain 160 , through the limit switch 150 , the moving range of the fourth moving assembly 122 and the second carrier 123 can be accurately controlled. Through the drag chain 160, the cables are effectively protected, and the cables are effectively prevented from being pinched during the movement. Wherein, both the fourth driving member 1211 and the fifth driving member 1221 can be hydraulic cylinders, air cylinders, electric cylinders, motors or other driving devices.

In one embodiment, please refer to Fig. 1, Fig. 5 and Fig. 6, a kind of wafer transfer method comprises the following steps:

S10: moving the substrate 200 to place the substrate 200 at a first preset position;

S20: Move the wafer tray 300, place the wafer tray 300 at a second preset position, and set the wafer 320 on the wafer tray 300 and the implanting position on the substrate 200 corresponding to the plug 133;

S30 : Move the plug 133 , and push the wafer 320 from the side of the wafer plate 300 facing away from the wafer 320 to the corresponding implanting position.

In the wafer transfer method described above, the substrate 200 is moved to place the substrate 200 at a first preset position; the wafer tray 300 is then moved to place the wafer tray 300 at a second preset position. Corresponding setting, that is, the wafer 320 on the wafer tray 300 is set correspondingly to the planting position on the substrate 200 ; then, the wafer 320 on the wafer tray 300 is directly ejected onto the substrate 200 through the plug 133 . In this way, the wafer transfer method directly transfers the wafer 320 from the wafer tray 300 to the substrate 200 , which saves the intermediate transfer process and greatly improves the transfer efficiency of the wafer 320 . At the same time, the wafer transfer method adjusts the corresponding positions of the wafer plate 300 and the substrate 200 during the transfer process of the wafer 320, so that the wafer 320 is accurately positioned on the crystal planting position of the substrate 200 without picking up the wafer by the transfer arm. After the round 320, the position of the crystal planting is positioned, so that the transfer accuracy of the wafer 320 is greatly improved.

Further, please refer to FIG. 7 , the steps further include: moving the plug 133, separating the plug 133 from the surface S40 of the wafer tray 300; moving the substrate 200 and the wafer tray 300 respectively, and placing the next wafer 320 on the wafer tray 300 with the The next crystal planting position on the substrate 200 is set corresponding to the plug 133 S50 ; the plug 133 is moved to push the wafer 320 to the corresponding crystal planting position S60 . In this way, all the wafers 320 on the wafer tray 300 are transferred quickly and accurately.

In one embodiment, the distance between the second preset position and the first preset position is 0.1 mm˜2 mm. It can be seen from this that the distance between the correspondingly installed substrate 200 and the correspondingly installed wafer tray 300 is 0.1 mm to 2 mm. The transfer distance of the circle 320 enables the accurate transfer of the wafer 320 to the substrate 200 , avoiding that the wafer 320 is shifted during the long-distance transfer process and cannot be transferred accurately. At the same time, it is also beneficial to improve the transfer efficiency of the wafer 320 . Specifically, in this embodiment, the distance between the first preset position and the second preset position is 2 mm. In this embodiment, the first preset position and the second preset position are designed to be 2mm. The purpose is not only to improve the transfer accuracy and efficiency of the wafer 320, but also to effectively avoid the If the location is too close, the transferred wafer 320 will be re-adsorbed on the wafer tray 300 .

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the utility model, and the description thereof is relatively specific and detailed, but it should not be understood as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (10)

1. a kind of wafer transfer device characterized by comprising

First movement mechanism, the first movement mechanism is used for installation base plate, and the first movement mechanism is used for moving substrate；

Second mobile mechanism, second mobile mechanism is for installing wafer disks, and second mobile mechanism will be for will be described Wafer disks are moved to be correspondingly arranged with the substrate；And

Ejecting mechanism, the ejecting mechanism is for ejecting the wafer in the wafer disks to the substrate.

2. wafer transfer device according to claim 1, which is characterized in that it further include visual mechanisms, the visual mechanisms For carrying out capture to the substrate and the wafer disks, and the location information of the substrate Yu the wafer disks is exported respectively.

3. wafer transfer device according to claim 1, which is characterized in that the ejecting mechanism include the first actuator, Mounting base and top, the top are installed in the mounting base, and the output end of the mounting base and first actuator passes Dynamic connection, first actuator is for driving the top that the wafer is transferred to the substrate.

4. wafer transfer device according to claim 3, which is characterized in that the ejecting mechanism further include guide rail and with institute The first sliding part that guide rail is slidably matched is stated, the mounting base is installed on first sliding part.

5. wafer transfer device according to claim 3, which is characterized in that first actuator is voice coil motor.

6. wafer transfer device according to claim 1, which is characterized in that the first movement mechanism includes first movement Component, the second moving assembly and the first load-bearing part being installed on second moving assembly, the second moving assembly installing On the first movement component, the first movement component drives second moving assembly to move along a first direction, institute Stating the second moving assembly drives the first load-bearing part to move along second direction, and the first direction intersects with the second direction to be set It sets, first load-bearing part is for installing the substrate.

7. wafer transfer device according to claim 6, which is characterized in that second mobile mechanism includes that third is mobile Component, the 4th moving assembly and the second load-bearing part being installed on the 4th moving assembly, the 4th moving assembly installing On the third moving assembly, the third moving assembly drives the 4th moving assembly to move along third direction, institute Stating the 4th moving assembly drives the second load-bearing part to move along fourth direction, and the third direction intersects with the fourth direction to be set It sets, second load-bearing part is for installing the wafer disks.

8. wafer transfer device according to claim 7, which is characterized in that the first direction and the fourth direction are flat Row setting, the second direction are arranged in parallel with the third direction.

9. wafer transfer device according to claim 7, which is characterized in that the first direction and the third direction are flat Row setting, the second direction are arranged in parallel with the fourth direction.

10. according to wafer transfer device described in claim 6-9 any one, which is characterized in that first movement component includes The output end of second actuator and the second sliding part, second sliding part and second actuator is sequentially connected, and described the Two moving assemblies are installed on second sliding part.