JPH11297793A - Chip thrust-up device and die-bonding device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform thrust-up operation in a plurality of stages with a single drive means. SOLUTION: This chip thrust-up device is provided with a support arm 4, that is arranged at the reverse surface side of an adhesive sheet 15 where a chip 17 is applied, a mechanical drive means 3 for driving the support arm 4 upward, a thrust-up shaft 5 that is sealed to the support arm 4, a thrust-up cylinder 6 that is mounted to the support arm 4 via a spring 10, and a stopper 14 that mechanically stops the thrust-up cylinder 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip push-up device which pushes up a chip stuck on an adhesive sheet from below in a semiconductor assembling step and forcibly peels off the chip from the adhesive sheet, and uses the same as a chip push-up mechanism. The present invention relates to a die bonding apparatus (also referred to as a “die bonder”).

[0002]

2. Description of the Related Art A conventional die push-up mechanism of a die bonder has a plurality of push-up pins for pushing up a chip while keeping the chip horizontal, and a plurality of push-up pins from a peripheral portion of the chip to facilitate peeling of the chip from a wafer sheet. A method of sequentially pushing up is used.

FIG. 9 is a cross-sectional view of a main part of a conventional chip push-up mechanism disclosed in Japanese Patent Application Laid-Open No. 4-162445 for implementing such a push-up method. In FIG. 9, the center push-up needle holder 44 to which the center push-up needle 43 is fixed is driven by the up / down lever 45a,
Peripheral push-up needle holder 4 to which peripheral push-up needle 46 is fixed
7 is driven by another vertical lever 45b.

FIG. 10 is a cross-sectional view of a main part for explaining the operation of a conventional chip push-up mechanism having the configuration shown in FIG. The push-up operation is performed, as shown in FIG. 10A, in synchronization with the rise of the suction collet 48.
The tip 41 (= “pellet”) is uniformly pushed up from below by the center push-up needle 43 and the peripheral push-up needle 46 by driving a and 45b. Next, as shown in FIG. 10B, while pushing up the center push-up needle 43 while synchronizing with the rise of the collet 48, the peripheral push-up needle 46 is lowered, and the chip is pushed up by one center push-up needle, so that the chip is brought into the wafer sheet. Is to be efficiently peeled off.

[0005]

However, in the above-described conventional tip push-up mechanism, at least two actuators such as motors are required as drive means because the push-up needles of a plurality of stages are driven with different driving forces.

It is desirable to reduce the size of the entire die bonder in order to increase the production line density in order to increase the productivity. However, in the above-described push-up mechanism, the space occupied by the push-up mechanism is increased by at least the number of actuators. This is disadvantageous in making the entire die bonder smaller. In addition, since a plurality of actuators must be controlled, the control means becomes complicated, and the cost is increased by the amount required for the control means for the actuators.

[0007] The present invention has been made in view of the above points, and a chip pushing device capable of performing a plurality of stages of pushing operation by one driving means, and die bonding using the device as a chip pushing mechanism. It is intended to obtain a device.

[0008]

A chip push-up device according to the present invention is a chip push-up device for pushing up a chip attached to the surface of an adhesive film from the back side of the film. It is arranged on the back side,
A supporting means to which the first pushing means is fixed and the second pushing means is attached via an elastic body;
A driving means for driving the support means from the back side of the adhesive film in the chip direction, and a stopping means for stopping the second push-up means at a predetermined position;
After the push-up means is stopped by the stop means,
The first pushing-up means is driven by the driving means, and the tip pushing-up height of the first pushing-up means is higher than the tip pushing-up height of the second pushing-up means.

Further, the first push-up means is characterized in that it is arranged so as to push up a portion closer to the center of the chip as compared with the second push-up means.

Further, the second push-up means has a plurality of push-up members having different tip push-up heights due to different stop positions of the stop means.

Further, the plurality of push-up members are arranged such that a push-up member having a high chip push-up height pushes up the center side of the chip as compared with a push-up member having a low chip push-up height. Things.

Further, the invention is characterized in that a film adsorbing means for adsorbing the adhesive film is provided.

Further, the elastic body is a spring.

Further, the die bonding apparatus according to the present invention has a chip suction mechanism in which a chip affixed to the surface of the adhesive film is suctioned from a surface side of the film by the chip suction means;
7. A chip push-up mechanism wherein the chip push-up means pushes up the chip from the back side of the film, wherein the chip push-up mechanism comprises the chip push-up device according to any one of claims 1 to 6. .

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a conceptual diagram showing a die bonding apparatus according to the present invention, and shows each mechanism of the die bonding apparatus and its role.

The flow of a semiconductor chip in this device will be described. First, a semiconductor chip is placed on a pressure-sensitive adhesive sheet on a wafer table 29 from a wafer cassette loader 28 in a wafer state, and is separated into a plurality of chips along a dicing line by extending the pressure-sensitive adhesive sheet in a planar direction.

Next, each of the chips on the adhesive sheet is individually pushed up by a chip pushing mechanism 30 (ie, a chip pushing device).
The chip is picked up using a chip suction mechanism 31, the chip is transferred to a pre-alignment and pre-heating mechanism 33 using a transfer mechanism 32, positioning and preheating are performed, and the chip is transferred using a bonding head 34. Die bonding to the lead frame.

Next, the flow of the lead frame in this device will be described. First, the lead frame is supplied from the frame loader 35 to the frame feeder 36, the lead frame is transported and heated by the frame feeder 36, and the adhesive is applied by the adhesive applying mechanism 37. Then, as described above, the bonding head 34
Is die-bonded. Then, the completed die-bonded product is carried out of the unloader 38 to the outside.

FIG. 2 is a sectional view of an essential part showing an embodiment of a chip lifting mechanism of the die bonding apparatus according to the present invention. The chip push-up mechanism 30 separates the chip 17 stuck on the adhesive sheet 15 by performing a multi-stage push-up.

As shown in FIG. 2, the adhesive sheet 15 to which the diced chips 17 are attached is disposed above the chip push-up mechanism 30. The tip lifting mechanism 30 is configured such that the center lifting pin 5b is
7 is located below the center. In addition, the suction collet 18, which is a component of the chip suction mechanism 31, is installed such that its center is located above the center of the chip 17.

The tip push-up mechanism 30 has its outer periphery covered by a frame 2 fixed on a base 1.
The tip push-up mechanism 30 includes a center push-up pin 5b that pushes up the center of the chip in the final stage, a push-up shaft 5 (i.e., first push-up means) that fixes the center push-up pin 5b to the upper end and transmits driving force. Push-up shaft 5
And a driving means 3 for driving the supporting arm 4 up and down.

Further, there are four peripheral push-up pins 6c for pushing up the peripheral portion of the chip before pushing up with the center push-up pin 5b, and a through hole at the upper end through which the center push-up pin 5b penetrates, and a peripheral push-up at the upper end. A push-up cylinder 6 (ie, a second push-up means) for fixing the pin 6c and transmitting the driving force; a stopper 5a of the push-up shaft 5 mounted between the push-up cylinder 6 and the support arm 4; And a spring 10 for pushing up the push-up cylinder 6 in the push-up direction so that the push-up tube 6a contacts the push-up tube 6a.

Here, the push-up cylinder 6 is attached to the support arm 4 via a spring 10 and is in contact with the push-up shaft 5 via a cylindrical linear guide 7.

Further, a center push-up pin 5b is provided on the upper surface.
And a plurality of through holes through which the peripheral push-up pins 6c penetrate, and a plurality of vacuum suction holes 11b for vacuum suction, and a vacuum suction stage 11 (that is, a film) capable of suction-fixing the adhesive sheet 15 to which the chip 17 is attached. Suction means), a vacuum suction stage 11 is fixed, a holder 8 for transmitting a driving force to the stage 11 is mounted between the holder 8 and the support arm 4, and a stopper 8a of the holder 8 and a stopper of the support arm 4 are provided. A spring 13 that pushes up the holder 8 in the push-up direction so as to bring the part 4a into contact therewith.

Here, the holder 8 is attached to the support arm 4 by the spring 1.
3, and is in contact with the push-up cylinder 6 via a cylindrical linear guide 9, and is in contact with the frame 2 via a cylindrical linear guide 12.

Further, one mechanical drive means 3 for vertically moving the support arm 4 and the stopper 6b of the push-up tube formed on the holder 8 contact the peripheral push-up pin 6c of the vacuum suction stage 11. The stop means 14 made of, for example, an adjusting screw that determines the height of the chip to be pushed up from the upper surface, and the vacuum suction stage 1 formed on the frame 2 and abutting against the stopper 8 b of the holder 8.
1 determines the height at which the adhesive sheet 15 is fixed by vacuum suction,
For example, a stop means 16 including an adjusting screw is provided.

Next, the tip lifting mechanism 30 according to the present invention.
Will be described. FIG. 2 corresponds to a standby state. In this state, the push-up cylinder 6 is pushed up by a spring 10 loaded between the push-up cylinder 6 and the support arm 4 so that the stopper 5a of the push-up shaft and the stopper 6a of the push-up shaft come into contact with each other. Stopped at the specified position. Also, the holder 8 is a support arm 4
Is stopped at a position where the stopper portion 4a of the support arm and the stopper portion 8a of the holder are pushed up by the spring 13 loaded therebetween.

Here, the spring 10 has a peripheral push-up pin 6c.
The spring 13 uses a spring sufficient to transmit a driving force to push up the chip 17, and the spring 13 uses a spring sufficient to transmit a driving force to move the vacuum suction stage 11 up and down.

In this standby state, the upper end of the peripheral push-up pin 6c is positioned at the same height as or slightly below the upper surface of the vacuum suction stage 11, and
Is the upper end of b the same height as the upper end of the peripheral push-up pin 6c?
Or it is located slightly below.

Next, when the support arm 4 is raised by the driving means 3, the center push-up shaft 5 connected to the support arm 4 is raised, as shown in FIG.
The push-up cylinder 6 attached to the support arm 4 via the support arm 4 and the holder 8 attached to the support arm 4 via the spring 13 rise.

The stopper 16 of the holder 8 is provided with a stopper 16 which is adjusted so that the holder 8 stops at a height at which the upper surface of the vacuum stage 11 contacts the adhesive sheet 17.
At the position where b contacts, the lifting of the vacuum suction stage 11 stops.

At this time, the upper surface of the vacuum suction stage 11 is in contact with the adhesive sheet 17, and the gas in the vacuum suction stage is evacuated from the exhaust port 11a to thereby provide a vacuum suction stage having a plurality of vacuum suction holes 11b. The pressure-sensitive adhesive sheet 17 can be fixed on the upper surface of the vacuum chuck 11 by vacuum suction.
At this time, at the same time, the collet 18 is lowered to a position in contact with the upper surface of the chip 17, and the chip 17 is vacuum-sucked.

Next, when the support arm 4 is further raised by the driving means 3, the center push-up pin 5b connected to the support arm 4 is raised, as shown in FIG. The push-up cylinder 6 attached to the arm 4 moves up. At the same time, collet 18
Also, the chip 17 rises in synchronization with the support arm 4 while holding the chip 17 in vacuum.

At this time, the peripheral push-up pins 6c push up the peripheral portion of the chip 17, and peel off the adhesive sheet 15 on the outer edge of the chip 17. Since the stopper 8b of the holder 8 and the stopper 16 fixed to the frame 2 are in contact with each other, the driving force from the driving means 3 is absorbed by the spring 13, and the vacuum suction stage 11 holds the pressure-sensitive adhesive sheet 15 in a state of vacuum suction and fixation. It remains stopped.

Then, at the position where the stopper 6b of the push-up cylinder comes into contact with the stopper 14 adjusted so that the push-up height of the push-up pin 6c from the upper surface of the vacuum suction stage 11 is optimized, the push-up cylinder 6 The ascent stops.

Further, when the support arm 4 is raised by the driving means 3, as shown in FIG.
1 is stopped as described above, and since the stopper portion 6b is in contact with the stopper 14, the driving force from the driving means 3 is absorbed by the spring 10 and the peripheral push-up pin 6c
Also remains stopped.

On the other hand, the center push-up pin 5b rises,
The chip 17 is pushed up and completely removed from the adhesive sheet 15. At this time, the tip pushing-up height of the center pushing-up pin 5b is optimally controlled by the driving means 3.

At this time, the suction collet 18 rises in synchronization with the support arm 4, picks up the chip 17, and transports the chip 17 to the pre-alignment and pre-heating mechanism 33 in the next step by the transport mechanism 32. In this manner, the tip pushing-up mechanism 30 of the present invention realizes the pushing-up operation in a plurality of stages by one driving unit 3. At that time, by adjusting the heights of the stoppers 14 and 16, it is possible to optimally set the chip push-up height at each stage.

In the present embodiment, with the above-described configuration, it is possible to perform the push-up operation in a plurality of stages by one driving means. At that time, the stop positions of the vacuum suction stage 11 and the peripheral push-up pins 6c can be optimally set by the mechanical stop means 14 and 16.

The gist of the present invention is that a plurality of push-up means are driven by one drive means, and the push-up height of each push-up means is limited by a plurality of mechanical stopping means to perform a plurality of steps of push-up operation. The mechanical stop means is not limited to the adjusting screw, but may be a fine adjustment mechanism such as a micrometer head. The push-up means such as the push-up shaft 5 and the push-up cylinder 6 have upper ends as shown in FIG. Even if the pins are all sharp pins, as shown in FIG.
Alternatively, a configuration in which these are mixed may be used.

The number of movable parts is not limited to three, but is
As shown in the figure, the movable part may be composed of four movable parts 5, 6, 8, and 19, or may be composed of more movable parts.
Here, reference numeral 19 denotes a push-up cylinder (that is, a push-up member) attached to the support arm 4 via a spring 21 outside the push-up cylinder 6, and a stopper for stopping the push-up cylinder 6 (ie, the push-up member). 20.

The push-up means is not limited to the coaxial configuration shown in FIG. 1, but may be a configuration arranged parallel to each other as shown in FIG. The upper end of the push-up means may be a sharp pin, a rod having a smooth upper end, a cylindrical shape having a smooth upper end, or a plate having a smooth upper end. In FIG. 8, reference numerals 22, 23, and 24 denote push-up shafts (ie, push-up members) attached to the support arm 4 via elastic bodies 25, 26, and 27, respectively.

As described above, in the push-up mechanism according to the present invention, a single drive means drives a plurality of push-up means, so that only one mechanical actuator such as a motor may be used.
This has the advantages that the size of the device can be reduced and the control can be simplified, and the cost of manufacturing the device can be reduced by reducing the number of actuators.

[0044]

The tip lifting device according to the present invention comprises:
In a chip push-up device that pushes up a chip attached to the surface of an adhesive film from the back side of the film, the chip is placed on the back side of the film to which the chip is attached, and the first push-up means is fixed, (2) a support means to which the push-up means is attached via an elastic body; a drive means for driving the support means from the back surface side of the adhesive film in the chip direction; And stopping means for stopping the second push-up means. After the stop means stops the second push-up means, the drive means drives the first push-up means to determine the chip push-up height of the second push-up means. Since the chip pushing-up height by the first pushing-up means is increased, a plurality of stages of pushing-up operations can be performed by one driving means. . Therefore, the size of the device can be reduced. In addition, it is possible to reduce the cost of pushing up the chip and the tip using the same.

The first push-up means is arranged so as to push up a portion closer to the center of the chip as compared with the second push-up means. In step (1), the first push-up means is driven, and the thin film attached to the portion near the center of the chip is pushed up higher than the thin film attached to the peripheral portion. Since the film is peeled faster than the adhesive film attached to the portion near the center, the chip can be more easily peeled from the adhesive film.

Further, the second push-up means is characterized by having a plurality of push-up members having different chip push-up heights due to different stop positions of the stop means, so that the push-up operation in more stages is performed. And the chip can be more easily separated from the adhesive film.

Further, the plurality of push-up members are arranged such that a push-up member having a high chip push-up height pushes up the center side of the chip as compared with a push-up member having a low chip push-up height. Therefore, the chip can be more easily separated from the adhesive film.

Further, since the apparatus is provided with a film adsorbing means for adsorbing the adhesive film, the deformation of the adhesive film is suppressed, and the chip is efficiently separated from the adhesive film. Can be done.

Further, since the elastic body is a spring, the push-up device can be manufactured easily and at low cost.

Further, the die bonding apparatus according to the present invention includes a chip suction mechanism in which the chip attached to the surface of the adhesive film is suctioned by the chip suction means from the surface side of the film.
The chip push-up means comprises a chip push-up mechanism for pushing up the chip from the back side of the film, and the chip push-up mechanism comprises the chip push-up device according to any one of claims 1 to 6. The chip can be easily separated from the thin film. Further, the size of the apparatus can be reduced, and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing one embodiment of a die bonding apparatus according to the present invention.

FIG. 2 is a cross-sectional view of a main part showing an embodiment of a chip lifting mechanism of the die bonding apparatus according to the present invention.

FIG. 3 is a sectional view of a main part showing an operation of the embodiment of the chip pushing-up mechanism of the die bonding apparatus according to the present invention;

FIG. 4 is a fragmentary cross-sectional view showing the operation of the embodiment of the die pushing-up mechanism of the die bonding apparatus according to the present invention;

FIG. 5 is a fragmentary cross-sectional view showing the operation of the embodiment of the chip lifting mechanism of the die bonding apparatus according to the present invention;

FIG. 6 is a cross-sectional view of a main part showing the shape of the tip of the push-up means in one embodiment of the chip push-up mechanism of the die bonding apparatus according to the present invention.

FIG. 7 is a cross-sectional view of a principal part showing another embodiment of the chip pushing-up mechanism of the die bonding apparatus according to the present invention.

FIG. 8 is a cross-sectional view of a principal part showing another embodiment of the chip pushing-up mechanism of the die bonding apparatus according to the present invention.

FIG. 9 is a sectional view of a main part showing a chip pushing-up mechanism of a conventional die bonding apparatus.

FIG. 10 is a cross-sectional view of a main part showing an operation of a chip push-up mechanism of a conventional die bonding apparatus.

[Explanation of symbols]

3 drive means, 4 support means, 5 first push-up means, 6 second push-up means, 10, 21,
25, 26, 27 elastic body, 11 membrane adsorption means, 1
4, 20 stopping means, 15 adhesive film, 17 chips, 19, 22, 23, 24 (, 6) push-up member, 30 chip push-up device (chip push-up mechanism).

Claims (7)

[Claims] 1. A chip push-up device for pushing up a chip attached to the surface of an adhesive film from the back side of the film, wherein the chip is placed on the back side of the film to which the chip is attached, and a first push-up means is fixed. And a driving means for driving the supporting means in the direction of the chip from the back side of the adhesive film; and a second driving means for driving the supporting means from the back side of the adhesive film to the chip. And stopping means for stopping the means at a predetermined position. After the second pushing means is stopped by the stopping means, the first pushing means is driven by the driving means, and the second pushing means is driven. A tip pushing-up height by the first pushing-up means, which is higher than a tip pushing-up height by the first pushing-up means. 2. The chip push-up device according to claim 1, wherein the first push-up means is arranged to push up a portion closer to the center of the chip as compared with the second push-up means. 3. The chip push-up device according to claim 1, wherein the second push-up means has a plurality of push-up members having different tip push-up heights due to different stop positions of the stop means. 4. The plurality of push-up members are arranged such that a push-up member having a high chip push-up height pushes up a center side of a chip as compared with a push-up member having a low chip push-up height. Item 3. The chip push-up device according to Item 3. 5. The chip push-up device according to claim 1, further comprising a film adsorbing means for adsorbing an adhesive film. 6. The tip push-up device according to claim 1, wherein the elastic body is a spring. 7. A chip suction mechanism in which a chip affixed to a surface of an adhesive film is suctioned by a chip suction means from a surface side of the film, and a chip push-up means in which the chip push-up means pushes the chip from a back side of the film. A die bonding apparatus, comprising: a chip lifting mechanism according to any one of claims 1 to 6.