CN109994411A - Wafer transfer apparatus and wafer transfer method - Google Patents

Abstract

The invention discloses a wafer transfer device and a wafer transfer method. A first moving mechanism is used to move a substrate to a first preset position; and a second moving mechanism is used to move a wafer tray to a second preset position. , at this time, the wafer tray and the substrate are set correspondingly, that is, the wafers on the wafer tray are set corresponding to the crystal planting positions on the substrate; then, through the ejection mechanism, the wafers on the wafer tray are directly ejected to the on the substrate. In this way, the wafer transfer device directly transfers the wafer from the wafer tray to the substrate, eliminating the need for intermediate transfer links and greatly improving the wafer transfer efficiency. At the same time, during the wafer transfer process of the wafer transfer device, the corresponding positions of the wafer tray and the substrate are adjusted through the first moving mechanism and the second moving mechanism, so that the wafer is accurately positioned on the crystal planting position of the substrate, and the There is no need to pick up the wafer by the transfer arm and then locate the crystal placement position, which greatly improves the transfer accuracy of the wafer.

Description

Wafer transfer apparatus and wafer transfer method

technical field

The present invention relates to the technical field of semiconductor processing, in particular to a wafer transfer device and a wafer transfer method.

Background technique

In semiconductor processing, wafers need to be transferred from wafer platters to substrates. The traditional transfer method usually uses a transfer arm to pick up the wafer from the wafer tray and transfer it to the substrate. However, with the rapid development of the semiconductor industry, semiconductor products gradually tend to be highly integrated, and the smaller the wafer size requirement, the better, for example, miniLED and Micro LED. As wafers are getting smaller and smaller, it is difficult for traditional transfer methods to accurately and efficiently assemble wafers into target locations.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide a wafer transfer apparatus and a wafer transfer method, which can efficiently and accurately transfer wafers.

Its technical solutions are as follows:

A wafer transfer device, comprising: a first moving mechanism for mounting a substrate, and the first moving mechanism for moving the substrate; a second moving mechanism for A wafer tray is installed, and the second moving mechanism is used to move the wafer tray to a position corresponding to the substrate; and an ejection mechanism is used to remove the wafers on the wafer tray The dome pops out onto the substrate.

The above-mentioned wafer transfer device moves the substrate to the first preset position through the first moving mechanism; then moves the wafer tray to the second preset position through the second moving mechanism. At this time, the wafer tray and the substrate are moved to the second preset position. Corresponding setting, that is, the wafers on the wafer tray are set corresponding to the crystal planting positions on the substrate; then, the wafers on the wafer tray are directly ejected onto the substrate through the ejection mechanism. In this way, the wafer transfer device directly transfers the wafer from the wafer tray to the substrate, eliminating the need for intermediate transfer links and greatly improving the wafer transfer efficiency. At the same time, during the wafer transfer process of the wafer transfer device, the corresponding positions of the wafer tray and the substrate are adjusted through the first moving mechanism and the second moving mechanism, so that the wafer is accurately positioned on the crystal planting position of the substrate, and the There is no need to pick up the wafer by the transfer arm and then locate the crystal placement position, which greatly improves the transfer accuracy of the wafer.

In one embodiment, the wafer transfer device further includes a vision mechanism, which is used for taking images of the substrate and the wafer tray, and outputting the positions of the substrate and the wafer tray respectively. information.

In one embodiment, the ejection mechanism includes a first driving member, a mounting seat and a plug, the plug is mounted on the mounting seat, and the mounting seat is driven with the output end of the first driving member connected, and the first driving member is used for driving the plug to transfer the wafer onto the substrate.

In one embodiment, the ejection mechanism further includes a guide rail and a first sliding member slidably matched with the guide rail, and the mounting seat is mounted on the first sliding member.

In one of the embodiments, the first driving member is a voice coil motor.

In one embodiment, the first moving mechanism includes a first moving component, a second moving component, and a first carrier mounted on the second moving component, and the second moving component is mounted on the On the first moving assembly, the first moving assembly drives the second moving assembly to move along a first direction, the second moving assembly drives the first carrier to move along a second direction, and the first direction Provided across the second direction, the first carrier is used for mounting the substrate.

In one embodiment, the second moving mechanism includes a third moving component, a fourth moving component, and a second carrier mounted on the fourth moving component, and the fourth moving component is mounted on the On the third moving component, the third moving component drives the fourth moving component to move along the third direction, the fourth moving component drives the second carrier to move along the fourth direction, the third direction The second carrier is arranged to intersect with the fourth direction, and the second carrier is used for mounting the wafer tray.

In one embodiment, the first direction is arranged parallel to the fourth direction, and the second direction is arranged parallel to the third direction.

In one embodiment, the first direction is arranged parallel to the third direction, and the second direction is arranged parallel to the fourth direction.

In one of the embodiments, the first moving assembly includes a second driving member and a second sliding member, the second sliding member is drivingly connected with the output end of the second driving member, and the second moving assembly is installed on the on the second slider.

A wafer transfer method, comprising the steps of: moving a substrate, placing the substrate at a first preset position; moving a wafer tray, placing the wafer tray at a second preset position, and placing the wafer tray The wafer on the upper wafer and the crystal planting position on the substrate are set corresponding to the plug; move the plug, and place the plug from the side of the wafer tray facing away from the wafer. to the corresponding crystal planting position.

In the above-mentioned wafer transfer method, the substrate is moved to place the substrate at the first preset position; the wafer tray is moved again to place the wafer tray at the second preset position. The wafers on the disc are arranged corresponding to the crystal planting positions on the substrate; then, the wafers on the wafer disc are directly ejected onto the substrate through the ejector. In this way, the wafer transfer method directly transfers the wafer from the wafer tray to the substrate, eliminating the need for an intermediate transfer link and greatly improving the wafer transfer efficiency. At the same time, during the wafer transfer process, the wafer transfer method adjusts the corresponding positions of the wafer tray and the substrate, so that the wafer is accurately positioned on the crystal planting position of the substrate, without the need to pick up the wafer by the transfer arm and then position it. The seeding position, in this way, greatly improves the transfer accuracy of the wafer.

In one embodiment, the step further includes: moving the plug to separate the plug from the surface of the wafer tray; moving the substrate and the wafer tray respectively, to remove the plug on the wafer tray The next wafer and the next crystal-planting position on the substrate are set corresponding to the plug; the plug is moved to push the wafer to the corresponding crystal-planting position.

In one embodiment, the distance between the second preset position and the first preset position is 0.1 mm˜2 mm.

Description of drawings

FIG. 1 is a schematic structural diagram of a wafer transfer apparatus according to an embodiment of the present invention;

2 is a schematic diagram of an ejector mechanism according to an embodiment of the present invention;

Fig. 3 is the enlarged schematic diagram of the structure at the circle A in Fig. 2;

4 is a schematic diagram of the cooperation of the first moving mechanism and the second moving mechanism according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a wafer transfer process according to an embodiment of the present invention;

6 is a flowchart of a wafer transfer method according to an embodiment of the present invention;

FIG. 7 is a flowchart of a wafer transfer method according to another embodiment of the present invention.

Description of reference numbers:

100, wafer transfer device, 110, first moving mechanism, 111, first moving assembly, 1111, second driving member, 1112, second sliding member, 112, second moving assembly, 1121, third driving member, 113 , the first carrier, 120, the second moving mechanism, 121, the third moving assembly, 1211, the fourth driving member, 1212, the third sliding member, 122, the fourth moving assembly, 1221, the fifth driving member, 123, second carrier, 130, ejector mechanism, 131, first drive, 132, mounting seat, 133, plug, 1331, ejector surface, 1332, tapered structure, 134, guide rail, 135, first slide, 136 , grating sensor assembly, 137, bracket, 138, connector, 139, fixture, 140, vision mechanism, 150, limit switch, 160, drag chain, 200, substrate, 300, wafer disc, 310, blue film, 320. Wafer.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, and do not limit the protection scope of the present invention.

It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only and do not represent the only embodiment.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The "first" and "second" mentioned in the present invention do not represent a specific quantity and order, but are only used for the distinction of names.

In one embodiment, please refer to FIG. 1 , a wafer transfer apparatus 100 includes a first moving mechanism 110 , a second moving mechanism 120 and an ejecting mechanism 130 . The first moving mechanism 110 is used to mount the substrate 200 , and the first moving mechanism 110 is used to move the substrate 200 . The second moving mechanism 120 is used for installing the wafer tray 300 , and the second moving mechanism 120 is used for moving the wafer tray 300 to a position corresponding to the substrate 200 . The ejector mechanism 130 is used for ejecting the wafers 320 on the wafer tray 300 onto the substrate 200 .

The above-mentioned wafer transfer device 100 moves the substrate 200 to the first preset position through the first moving mechanism 110 , and then moves the wafer tray 300 to the second preset position through the second moving mechanism 120 . The wafer tray 300 is arranged corresponding to the substrate 200 , that is, the wafers 320 on the wafer tray 300 are arranged corresponding to the crystal placement positions on the substrate 200 ; then, the ejection mechanism 130 is used to make the wafers 320 on the wafer tray 300 directly ejected onto the substrate 200 . In this way, the wafer transfer device 100 directly transfers the wafers 320 from the wafer tray 300 to the substrate 200 , eliminating the need for intermediate transfer links and greatly improving the transfer efficiency of the wafers 320 . At the same time, during the transfer process of the wafer 320, the wafer transfer apparatus 100 adjusts the corresponding positions of the wafer tray 300 and the substrate 200 through the first moving mechanism 110 and the second moving mechanism 120, so that the wafer 320 is accurately positioned on the substrate It is not necessary to pick up the wafer 320 by the transfer arm and then locate the crystal planting position, so that the transfer accuracy of the wafer 320 is greatly improved. Wherein, the corresponding arrangement of the wafer tray 300 and the substrate 200 in this embodiment should be understood that the wafer 320 on the wafer tray 300 is exactly corresponding to the crystal planting position on the substrate 200 , so that the accurate transfer of the wafer 320 to the substrate 200 is facilitated. .

Optionally, the distance between the first preset position and the second preset position is 0.1 mm˜2 mm, that is, the distance between the correspondingly arranged substrate 200 and the correspondingly arranged wafer tray 300 is 0.1 mm˜2 mm In this way, the correspondingly arranged substrate 200 and the wafer tray 300 are kept at a short distance, and the transfer distance of the wafer 320 is shortened, so that the wafer 320 is accurately transferred to the substrate 200, and the occurrence of the long-distance transfer of the wafer 320 is avoided. Offset, resulting in inaccurate transfer. At the same time, it is also beneficial to improve the transfer efficiency of the wafer 320 .

Specifically, the distance between the first preset position and the second preset position is 2 mm. In this embodiment, the first preset position and the second preset position are designed to be 2 mm. The purpose is not only to improve the transfer accuracy and efficiency of the wafer 320, but also to effectively avoid the problems caused by the first preset position and the second preset position. If the position is too close, the transferred wafer 320 will be re-adsorbed on the wafer tray 300 .

Further, the wafer transfer apparatus 100 further includes a vision mechanism 140 . The vision mechanism 140 is used for capturing images of the substrate 200 and the wafer tray 300 , and outputting position information of the substrate 200 and the wafer tray 300 respectively. In this way, the visual mechanism 140 can accurately locate the position information of the substrate 200 and the wafer tray 300 , so that the substrate 200 and the wafer tray 300 can be moved to the desired positions by the first moving mechanism 110 and the second moving mechanism 120 .

Optionally, the vision mechanism 140 may be provided on the ejector mechanism 130 , or may be provided on the ejector mechanism 130 . When the vision mechanism 140 is disposed on the ejector mechanism 130, the camera end of the vision mechanism 140 is aligned with the ejector end of the ejector mechanism 130, so that the vision mechanism 140 can more conveniently and accurately eject the ejector mechanism 130. The terminal acts on the wafer 320 .

In one embodiment, please refer to FIG. 2 and FIG. 5 , the ejection mechanism 130 includes a first driving member 131 , a mounting seat 132 and a plug 133 . The plug 133 is mounted on the mounting seat 132 . The mounting base 132 is in driving connection with the output end of the first driving member 131 , and the first driving member 131 is used for driving the plug 133 to transfer the wafer 320 to the substrate 200 . It can be seen from this that when the substrate 200 and the wafer tray 300 move to the desired positions, the first driving member 131 is activated, the mounting base 132 is driven to move, and the plug 133 is driven to move toward the wafer tray 300. At this time, the plug 133 moves from the The side of the wafer tray 300 facing away from the wafer 320 is pressed against the wafer 320 ; with the operation of the first driving member 131 , the plug 133 gradually pushes the wafer 320 away from the wafer tray 300 , and quickly pushes the wafer 320 Transferred to the substrate 200 , in this way, the transfer operation of the wafer 320 is effectively completed. In this embodiment, through the first driving member 131 and the plug 133 , the wafer 320 is quickly and accurately transferred on the substrate 200 , which greatly improves the transfer efficiency of the wafer 320 and the transfer accuracy of the wafer 320 . Wherein, the first driving member 131 may be a hydraulic cylinder, an air cylinder, an electric cylinder, a motor or other driving devices.

Further, the ejection mechanism 130 further includes a guide rail 134 and a first sliding member 135 slidably matched with the guide rail 134 . The mounting seat 132 is mounted on the first sliding member 135 . In this way, through the first sliding member 135 and the guide rail 134 , the movement of the plug 133 is more stable, so that the plug 133 more accurately transfers the wafer 320 to the crystal planting position of the substrate 200 , which is beneficial to improve the transfer accuracy of the wafer 320 . Specifically, in this embodiment, the ejection mechanism 130 further includes a bracket 137 and a connecting seat 138 installed on the bracket 137 . The guide rail 134 and the first driving member 131 are both disposed on the connecting seat 138 . At the same time, the connecting base 138 is also provided with a grating sensing assembly 136 , through which the moving distance of the plug 133 can be accurately measured.

In one embodiment, please refer to FIG. 2 , FIG. 3 and FIG. 5 , the plug 133 includes an ejection surface 1331 , and the ejection surface 1331 is configured to be attached to the surface of the wafer 320 . In this way, when the plug 133 is pressed against the wafer 320, since the ejection surface 1331 of the plug 133 is disposed in close contact with the surface of the wafer 320, the contact surface between the plug 133 and the wafer 320 is increased to avoid the transfer process. , leaving a mark on the surface of the wafer 320 . At the same time, since the ejection surface 1331 and the surface of the wafer 320 are attached to each other, during the transfer process, the force on the surface of the wafer 320 is relatively uniform, so that the wafer 320 is always in a stable state during the transfer process, thereby making the wafer 320 more stable. Stable and accurate transfer on the substrate 200 . Specifically, in this embodiment, one end of the plug 133 is provided with a tapered structure 1332 , so that the plug 133 can easily puncture the blue film 310 on the wafer disk 300 , so that the plug 133 can push the wafer 320 onto the substrate 200 . .

In one embodiment, the ejector mechanism 130 further includes a clamp 139 , and the plug 133 is mounted on the mounting seat 132 through the clamp 139 . In this way, the plug 133 is stably clamped by the clamp 139 , so that the plug 133 acts on the wafer 320 more accurately. At the same time, through the clamp 139 , the disassembly and assembly of the plug 133 is also greatly facilitated, which is beneficial to improve the assembly efficiency of the wafer transfer apparatus 100 .

Further, there are multiple plugs 133 , and the multiple plugs 133 are installed on the fixture 139 at intervals. During the transfer of the wafers 320 , the distance between the plugs 133 and the plugs 133 is adjusted in advance, so that the plurality of plugs 133 can simultaneously correspond to the plurality of wafers 320 on the wafer tray 300 . In this way, when the first driving member 131 is activated, the plurality of heads 133 push the plurality of wafers 320 onto the substrate 200 at the same time, which greatly improves the transfer efficiency of the wafers 320 .

In one embodiment, the first driving member 131 is a voice coil motor. When the first driving member 131 is a voice coil motor, the first driving member 131 can accurately control the output pressure acting on the ejector mechanism 130 , so that the ejector mechanism 130 can effectively eject the wafer 320 from the wafer tray 300 and transfer it On the substrate 200 , at the same time, the output pressure of the ejector mechanism 130 to press the wafer 320 on the substrate 200 can be accurately controlled, so as to prevent the ejector mechanism 130 from crushing the wafer 320 on the substrate 200 due to excessive output pressure. Meanwhile, the first driving member 131 is designed as a voice coil motor, and by sensing the current change of the voice coil motor, it can be accurately determined whether the plug 133 acts on the wafer disk 300 or the substrate 200 .

In one embodiment, please refer to FIG. 1 and FIG. 4 , the first moving mechanism 110 includes a first moving element 111 , a second moving element 112 and a first carrier 113 mounted on the second moving element 112 . The second moving assembly 112 is mounted on the first moving assembly 111 , the first moving assembly 111 drives the second moving assembly 112 to move along the first direction, and the second moving assembly 112 drives the first carrier 113 to move along the second direction , the first direction and the second direction are intersected, and the first carrier 113 is used for mounting the substrate 200 . It can be seen from this that the substrate 200 disposed on the first carrier 113 can be moved along the first direction and the second direction through the first moving component 111 and the second moving component 112, so that the substrate 200 can be accurately and conveniently Move to the desired location. Specifically, in this embodiment, the first direction and the second direction are vertically arranged, so that the position adjustment of the substrate 200 becomes more convenient. Specifically, in this embodiment, there are a plurality of first carriers 113 , and the plurality of first carriers 113 are arranged on the second moving component 112 at intervals. In this way, when the transfer operation of the wafer 320 on the previous substrate 200 is completed, the The second moving component 112 moves the current substrate 200 to a desired position, so as to avoid the need to replace the substrate 200 multiple times, which may reduce the transfer efficiency of the wafer 320 . Wherein, in order to facilitate understanding of the first direction and the second direction in this embodiment, taking FIG. 4 as an example, the first direction and the second direction are the directions indicated by S ₁ and S ₂ in FIG. 4 , respectively.

Further, the second moving mechanism 120 includes a third moving component 121 , a fourth moving component 122 and a second carrier 123 mounted on the fourth moving component 122 . The fourth moving assembly 122 is mounted on the third moving assembly 121 . The third moving assembly 121 drives the fourth moving assembly 122 to move along the third direction. The fourth moving component 122 drives the second carrier 123 to move along the fourth direction. The third direction intersects with the fourth direction. The second carrier 123 is used for mounting the wafer tray 300 . It can be seen from this that when the substrate 200 is moved to a desired position by the first moving component 111 and the second moving component 112, the third moving component 121 and the fourth moving component 122 are used to make the crystals disposed on the second carrier 123 The disc 300 can move along the third direction and the fourth direction, so that the wafer disc 300 can be moved to a desired position accurately and conveniently. Specifically, in this embodiment, there are a plurality of second carriers 123 , and the plurality of second carriers 123 are arranged on the fourth moving component 122 at intervals. In this way, when the wafer 320 transfer operation of the previous wafer tray 300 is completed, , the current wafer tray 300 is moved to a desired position by the fourth moving component 122 , so as to avoid the need to replace the wafer tray 300 multiple times and reduce the transfer efficiency of the wafers 320 . Wherein, in order to facilitate understanding of the third direction and the fourth direction in this embodiment, taking FIG. 4 as an example, the third direction and the fourth direction are the directions indicated by S ₃ and S ₄ in FIG. 4 , respectively.

Further, the first direction is arranged parallel to the fourth direction, and the second direction is arranged parallel to the third direction. It can be seen from this that the first moving element 111 and the fourth moving element 122 in this embodiment are arranged in parallel, and the second moving element 112 and the third moving element 121 are arranged in parallel. In this way, when the next wafer 320 needs to be transferred, the next wafer 320 can be transferred to the The next transfer positions are all set corresponding to the plugs 133 , which greatly facilitates the position adjustment of the substrate 200 and the wafer tray 300 . Specifically, in this embodiment, the first direction is perpendicular to the second direction, the third direction is perpendicular to the fourth direction, it can be seen that the first moving component 111 and the second moving component 112 are vertically arranged, and the third The moving component 121 and the fourth moving component 122 are arranged vertically. The parallel arrangement in this embodiment should be understood as including absolute parallel arrangement and approximately parallel arrangement, and the intersection angle of the approximately parallel arrangement is 0°˜10°.

In another embodiment, the first direction and the third direction are arranged in parallel. The second direction is arranged in parallel with the fourth direction. It can be seen from this that the first moving component 111 and the third moving component 121 in this embodiment are arranged in parallel, and the second moving component 112 and the fourth moving component 122 are arranged in parallel (the specific structure is not shown). In this way, when the next wafer 320 needs to be transferred, the next wafer 320 can be transferred to the The next transfer positions are all set corresponding to the plug 133 . At the same time, when there are multiple first carriers 113 and multiple second carriers 123, since the second driving member 1111 and the fourth driving member 1211 are arranged in parallel, during the transfer process of the wafer 320, it can be ensured at the same time The multiple wafer trays 300 are arranged in a one-to-one correspondence with the multiple substrates 200 , so that the transfer efficiency of the wafers 320 is greatly improved. The parallel arrangement in this embodiment should be understood as including absolute parallel arrangement and approximately parallel arrangement, and the intersection angle of the approximately parallel arrangement is 0°˜10°.

In one embodiment, the first moving component 111 includes a second driving member 1111 and a second sliding member 1112 . The second sliding member 1112 is in driving connection with the output end of the second driving member 1111 . The second moving assembly 112 is mounted on the second sliding member 1112 . In this way, through the second driving member 1111 and the second sliding member 1112, the second moving component 112 can move more stably along the first direction. Specifically, in this embodiment, the second moving assembly 112 includes a third driving member 1121 and a third sliding member 1212 . The third sliding member 1212 is in driving connection with the output end of the third driving member 1121 . The first bearing member 113 is mounted on the third sliding member 1212 . Meanwhile, the first moving assembly 111 and the second moving assembly 112 both include limit switches 150 and drag chains 160 , through which the limit switches 150 can accurately control the movement range of the second moving assembly 112 and the first carrier 113 . Through the drag chain 160, the cables are effectively protected, and the cables are effectively prevented from being pinched off during the movement. Wherein, both the second driving member 1111 and the third driving member 1121 can be hydraulic cylinders, air cylinders, electric cylinders, motors or other driving devices.

In one embodiment, the third moving component 121 includes a fourth driving member 1211 and a fourth sliding member. The fourth sliding member is in driving connection with the output end of the fourth driving member 1211 . The fourth moving assembly 122 is mounted on the fourth sliding member. In this way, through the fourth driving member 1211 and the fourth sliding member, the fourth moving component 122 can move more stably along the third direction. Specifically, in this embodiment, the fourth moving component 122 includes a fifth driving member 1221 and a fifth sliding member. The fifth sliding member is in driving connection with the output end of the fifth driving member 1221 . The second bearing member 123 is mounted on the fifth sliding member. Meanwhile, the third moving element 121 and the fourth moving element 122 both include limit switches 150 and drag chains 160 , through which the limit switches 150 can accurately control the moving ranges of the fourth moving element 122 and the second carrier 123 . Through the drag chain 160, the cables are effectively protected, and the cables are effectively prevented from being pinched off during the movement. Wherein, the fourth driving member 1211 and the fifth driving member 1221 can both be hydraulic cylinders, air cylinders, electric cylinders, motors or other driving devices.

In one embodiment, please refer to FIG. 1 , FIG. 5 and FIG. 6 , a wafer transfer method includes the following steps:

S10: moving the substrate 200 to locate the substrate 200 at the first preset position;

S20: moving the wafer tray 300, placing the wafer tray 300 at the second preset position, and setting the wafer 320 on the wafer tray 300 and the crystal planting positions on the substrate 200 to correspond to the plug 133;

S30: Move the plug 133, and push the plug 133 from the side of the wafer tray 300 away from the wafer 320 to push the wafer 320 to the corresponding crystal-planting position.

In the above wafer transfer method, the substrate 200 is moved to place the substrate 200 at the first preset position; the wafer tray 300 is then moved to place the wafer tray 300 at the second preset position. At this time, the wafer tray 300 and the substrate 200 Correspondingly arranged, that is, the wafers 320 on the wafer tray 300 are set corresponding to the crystal planting positions on the substrate 200 ; In this way, the wafer transfer method directly transfers the wafers 320 from the wafer tray 300 to the substrate 200 , eliminating the need for intermediate transfer links and greatly improving the transfer efficiency of the wafers 320 . At the same time, during the transfer process of the wafer 320, the wafer transfer method adjusts the corresponding positions of the wafer tray 300 and the substrate 200, so that the wafer 320 is accurately positioned on the crystal planting position of the substrate 200, without the need to pick up the wafer through the transfer arm. The wafer 320 is then positioned to position the wafer, so that the transfer accuracy of the wafer 320 is greatly improved.

Further, please refer to FIG. 7 , the steps further include: moving the plug 133 to separate the plug 133 from the surface S40 of the wafer tray 300 ; moving the substrate 200 and the wafer tray 300 respectively to separate the next wafer 320 on the wafer tray 300 from the wafer tray 300 . The next crystal-planting position on the substrate 200 is set corresponding to the plug 133 S50 ; the plug 133 is moved to push the wafer 320 to the corresponding crystal-planting position S60 . In this way, all the wafers 320 on the wafer tray 300 are transferred quickly and accurately.

In one embodiment, the distance between the second preset position and the first preset position is 0.1 mm˜2 mm. From this, it can be seen that the distance between the correspondingly arranged substrate 200 and the correspondingly arranged wafer tray 300 is 0.1 mm˜2 mm. In this way, the correspondingly arranged substrate 200 and the wafer tray 300 are kept at a relatively short distance, and the wafer tray 300 is shortened. The transfer distance of the circle 320 enables the wafer 320 to be accurately transferred to the substrate 200 , so as to prevent the wafer 320 from being shifted during the long-distance transfer process, resulting in inaccurate transfer. At the same time, it is also beneficial to improve the transfer efficiency of the wafer 320 . Specifically in this embodiment, the distance between the first preset position and the second preset position is 2 mm. In this embodiment, the first preset position and the second preset position are designed to be 2 mm. The purpose is not only to improve the transfer accuracy and efficiency of the wafer 320, but also to effectively avoid the problems caused by the first preset position and the second preset position. If the position is too close, the transferred wafer 320 will be re-adsorbed on the wafer tray 300 .

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can also be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims (10)

1. a kind of wafer transfer device characterized by comprising

First movement mechanism, the first movement mechanism is used for installation base plate, and the first movement mechanism is used for moving substrate；

Second mobile mechanism, second mobile mechanism is for installing wafer disks, and second mobile mechanism will be for will be described Wafer disks are moved to be correspondingly arranged with the substrate；And

Ejecting mechanism, the ejecting mechanism is for ejecting the wafer in the wafer disks to the substrate.

2. wafer transfer device according to claim 1, which is characterized in that it further include visual mechanisms, the visual mechanisms For carrying out capture to the substrate and the wafer disks, and the location information of the substrate Yu the wafer disks is exported respectively.

3. wafer transfer device according to claim 1, which is characterized in that the ejecting mechanism include the first actuator, Mounting base and top, the top are installed in the mounting base, and the output end of the mounting base and first actuator passes Dynamic connection, first actuator is for driving the top that the wafer is transferred to the substrate.

4. wafer transfer device according to claim 3, which is characterized in that the ejecting mechanism further include guide rail and with institute The first sliding part that guide rail is slidably matched is stated, the mounting base is installed on first sliding part.

5. wafer transfer device according to claim 1, which is characterized in that the first movement mechanism includes first movement Component, the second moving assembly and the first load-bearing part being installed on second moving assembly, the second moving assembly installing On the first movement component, the first movement component drives second moving assembly to move along a first direction, institute Stating the second moving assembly drives the first load-bearing part to move along second direction, and the first direction intersects with the second direction to be set It sets, first load-bearing part is for installing the substrate.

6. wafer transfer device according to claim 5, which is characterized in that second mobile mechanism includes that third is mobile Component, the 4th moving assembly and the second load-bearing part being installed on the 4th moving assembly, the 4th moving assembly installing On the third moving assembly, the third moving assembly drives the 4th moving assembly to move along third direction, institute Stating the 4th moving assembly drives the second load-bearing part to move along fourth direction, and the third direction intersects with the fourth direction to be set It sets, second load-bearing part is for installing the wafer disks.

7. wafer transfer device according to claim 6, which is characterized in that the first direction and the fourth direction are flat Row setting, the second direction are arranged in parallel with the third direction；Or the first direction is parallel with the third direction Setting, the second direction are arranged in parallel with the fourth direction.

8. a kind of wafer transfer method, which comprises the steps of:

The substrate is located at the first predeterminated position by moving substrate；

The wafer disks are located at the second predeterminated position by mobile wafer disks, and by the wafer and the substrate in the wafer disks On plant crystalline substance position be correspondingly arranged with top；

The mobile top, by the top from the wafer disks from the one side of the wafer by the wafer top to right On the plant crystalline substance position answered.

9. wafer transfer method according to claim 8, which is characterized in that the step further include:

The top is detached from the wafer panel surface by the mobile top；

Move the substrate and the wafer disks respectively, by the wafer disks next wafer with it is next on the substrate The brilliant position of a plant is correspondingly arranged with the top；

The mobile top, will be on the wafer top to the brilliant position of corresponding plant.

10. wafer transfer method according to claim 8 or claim 9, which is characterized in that second predeterminated position and described the Spacing between one predeterminated position is 0.1mm~2mm.