CN208175114U - A kind of anti-ghost welding resistance mechanism of two-sided equity windowing pcb board - Google Patents
A kind of anti-ghost welding resistance mechanism of two-sided equity windowing pcb board Download PDFInfo
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- CN208175114U CN208175114U CN201820628097.4U CN201820628097U CN208175114U CN 208175114 U CN208175114 U CN 208175114U CN 201820628097 U CN201820628097 U CN 201820628097U CN 208175114 U CN208175114 U CN 208175114U
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- windowing
- pcb board
- equity
- ghost
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- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The utility model discloses a kind of anti-ghost welding resistance mechanisms of two-sided equity windowing pcb board, including silk-screen halftone and exposure film, it is shading region at the reciprocity windowing of pcb board that the exposure film, which corresponds to, and it is infiltration area at the reciprocity windowing of pcb board that the silk-screen halftone, which corresponds to,.It is infiltration area at the reciprocity windowing of pcb board that silk-screen halftone, which corresponds to, substrate surface in photosensitive-ink covering equity windowing keeps it completely opaque, and light can not penetrate substrate, avoids having photosensitive-ink solidification residual in reciprocity open a window, to eliminate ghost, do not need return washing.
Description
Technical field
The utility model relates to pcb board manufacturing technology fields, and in particular to a kind of anti-ghost of two-sided equity windowing pcb board
Welding resistance mechanism.
Background technique
The route on pcb board surface is formed through processing such as heavy copper → plating → outer layer processing → graphic plating → welding resistances, wherein
Welding resistance includes passing through silk-screen halftone for photosensitive-ink（Solder resist）The part of welding is not needed coated in pcb board, then passes through exposure
The film, which blocks, needs the part welded, then the irradiation photosensitive-ink that makes pcb board surface not be blocked of exposed light source occurs to gather
Reaction solidification is closed, the photosensitive-ink that polymerization reaction does not occur is rinsed out finally by developer solution, exposes substrate or layers of copper.
There is a kind of pcb board to open a window as shown in Figure 2 in two-sided setting equity at present, structure includes substrate 1, and attachment
Layers of copper 2 on 1 two sides of substrate, 2 relative position of layers of copper on 1 two sides of substrate are provided with equity windowing 3 and expose substrate 1, according to
Prior art, it is blocked area 8 at equity windowing 3 that silk-screen halftone 4, which corresponds to, and it is shading that exposure film 5, which corresponds at equity windowing 3,
Area 7, for ensure equity windowing 3 dimensional accuracy, the prior art be make blocked area 8 be dimensioned slightly smaller than equity windowing 3, shading region
7 size is consistent with equity windowing 3, such as：The size of equity windowing 3 is 5mm*5mm, and blocked area 8 is 4.9mm*4.9mm, is hidden
Light area 7 is 5mm*5mm；But due to substrate 1 have certain translucency, when being exposed, have a small amount of light pass through pair
Deng exposed substrate 1 in windowing 3, will lead to across the light of substrate 1 has micro photosensitive-ink solidification residual to form ghost on substrate 1
Shadow, the prior art are that removing ghost is to carry out developing to return washing, and the edge that will cause equity windowing 3, which is surveyed, to be lost, and influence product quality, and
And it returns and washes the cost that will lead to product.
Summary of the invention
The technical problem to be solved by the present invention is to provide a kind of anti-ghost welding binders of two-sided equity windowing pcb board
Structure can solve welding resistance mechanism used by the prior art and have a small amount of light across equity windowing, causes to have on substrate micro-
The problem of photosensitive-ink solidification residual of amount forms ghost.
The utility model is achieved through the following technical solutions：
A kind of anti-ghost welding resistance mechanism of two-sided equity windowing pcb board, including silk-screen halftone and exposure film, the exposure
It is shading region at the reciprocity windowing of pcb board that the film, which corresponds to, and the silk-screen halftone corresponds at the reciprocity windowing of pcb board for infiltration
Area.
The utility model compared with prior art the advantages of be：
It is infiltration area at the reciprocity windowing of pcb board that silk-screen halftone, which corresponds to, the substrate in photosensitive-ink covering equity windowing
Surface keeps it completely opaque, and light can not penetrate substrate, avoids having photosensitive-ink solidification residual in equity windowing, to eliminate
Ghost does not need return washing.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the welding resistance mechanism structural schematic diagram of existing two-sided equity windowing pcb board.
Specific embodiment
The anti-ghost welding resistance mechanism of the two-sided equity windowing pcb board of one kind as shown in Figure 1, including silk-screen halftone 4 and exposure
The film 5, the exposure film 5 correspond to for shading region 7 at the equity windowing 3 of pcb board, and the silk-screen halftone 4 is corresponding to pcb board
Equity windowing 3 at be infiltration area 6.
By taking the size of equity windowing 3 is 5mm*5mm as an example, the size of shading region 7 and infiltration area 6 is also 5mm*5mm；First with
Silk-screen halftone 4 covers pcb board and prints photosensitive-ink, and photosensitive-ink passes through infiltration area 6 and covers equity windowing 3；Then again with exposure
The film 5 covers pcb board and is exposed, and shading region 7 makes the photosensitive-ink in equity windowing 3 that polymerization reaction will not occur, and is developing
In flushing process, the photosensitive-ink of covering equity windowing 3 is rinsed the substrate 1 in exposing equity windowing 3.
Claims (1)
1. a kind of anti-ghost welding resistance mechanism of two-sided equity windowing pcb board, including silk-screen halftone（4）And exposure film（5）, described
Exposure film（5）Equity windowing corresponding to pcb board（3）Place is shading region（7）, it is characterised in that：The silk-screen halftone（4）It is right
It should be in the equity windowing of pcb board（3）Place is infiltration area（6）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820628097.4U CN208175114U (en) | 2018-04-28 | 2018-04-28 | A kind of anti-ghost welding resistance mechanism of two-sided equity windowing pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820628097.4U CN208175114U (en) | 2018-04-28 | 2018-04-28 | A kind of anti-ghost welding resistance mechanism of two-sided equity windowing pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208175114U true CN208175114U (en) | 2018-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201820628097.4U Active CN208175114U (en) | 2018-04-28 | 2018-04-28 | A kind of anti-ghost welding resistance mechanism of two-sided equity windowing pcb board |
Country Status (1)
| Country | Link |
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| CN (1) | CN208175114U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109729651A (en) * | 2019-01-09 | 2019-05-07 | 深圳市江霖电子科技有限公司 | It is a kind of to reduce white core material wiring board and the welding resistance technique of ghost occur |
| CN115087223A (en) * | 2022-07-01 | 2022-09-20 | 湖北龙腾电子科技股份有限公司 | Process method for solving PCB solder mask ghost and PCB |
-
2018
- 2018-04-28 CN CN201820628097.4U patent/CN208175114U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109729651A (en) * | 2019-01-09 | 2019-05-07 | 深圳市江霖电子科技有限公司 | It is a kind of to reduce white core material wiring board and the welding resistance technique of ghost occur |
| CN115087223A (en) * | 2022-07-01 | 2022-09-20 | 湖北龙腾电子科技股份有限公司 | Process method for solving PCB solder mask ghost and PCB |
| CN115087223B (en) * | 2022-07-01 | 2024-03-29 | 湖北龙腾电子科技股份有限公司 | Process method for solving PCB solder mask ghosting and PCB |
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