JPH1051183A - Manufacture of translucent electromagnetic-wave shielding material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a translucent electromagnetic-wave shielding material in which a resist material in a wide range can be used for a black resist layer by a method wherein a metal layer, an exfoliation layer and the black resist layer are formed sequentially on a transparent base body, the exfoliation layer is removed and the metal layer in a part in which the black resist layer is removed is etched and removed. SOLUTION: A metal layer 2 is formed on a transparent base body 1, and a patterned exfoliation layer 3 is formed on it. Then, a black resist layer 4 is formed on the metal layer 2 and the exfoliation layer 3. Then, the exfoliation layer 3 is stripped by an exfoliation liquid, and the black resist layer 4 on it is removed. As a result, the black resist layer 4 becomes a pattern in which the pattern of the exfoliation layer 3 is reversed. Then, the metal layer 2 in a part in which the black resist layer 4 is removed is etched and removed. As a result, it is possible to obtain a translucent electromagnetic-wave shielding material in which the metal layer 2 is laminated on the transparent base body 1 to be a pattern shape and in which the black resist layer 4 agreeing with the metal layer 2 is laminated on the metal layer 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a light-transmitting electromagnetic wave shielding material which functions to shield electromagnetic waves and allows the opposite side of the material to be seen through.

[0002]

2. Description of the Related Art Electronic devices such as computers in which a large amount of ICs and LSIs are used are apt to generate electromagnetic waves, and these electromagnetic waves cause malfunctions such as malfunctions of peripheral devices. In recent years, with the spread of devices related to electromagnetic wave interference and the influence of electromagnetic waves on the human body has been discussed, the demand for electromagnetic wave shielding materials has been increasing.

Some electromagnetic wave shielding materials not only function to shield electromagnetic waves, but also, for example, can be used as a front panel of a display or a microwave oven window so that they can be used as a window of a microwave oven. Some are translucent so that the back of the material can be seen. In particular, when a front panel such as a display is used, a display screen is viewed through an electromagnetic wave shielding material. Therefore, a display screen having excellent visibility while maintaining electromagnetic wave shielding properties is desired.

The inventor of the present invention has previously invented a translucent electromagnetic wave shielding material having an excellent electromagnetic wave shielding effect and visibility and a method of manufacturing the same, and has filed a patent application (Japanese Patent Application No. 8-71149).
No.) That is, as this transmissive electromagnetic wave shielding material, there is a material in which a metal layer is laminated in a pattern on a transparent substrate, and a black resist layer which is in register with the metal layer is laminated on the metal layer.

[0005] Further, the method for producing such a translucent electromagnetic wave shielding material comprises a step of providing a metal layer over the entire surface of a transparent substrate;
A step of providing a black resist layer in a pattern on the metal layer,
A step of removing a portion of the metal layer that is not covered with the black resist layer by etching. In the present invention,
As a specific means for providing a black resist layer in a pattern on a metal layer, a photoresist material containing a black dye is roll-coated, spin-coated, full-surface printing, transfer method, etc. An offset printing method and a gravure printing method are employed by forming a solid, exposing and developing with a mask, and using a printing resist material containing a black dye and pigment.

[0006]

[Problems to be Solved by the Invention] An earlier patent application (Japanese Patent Application
The transparent electromagnetic wave shielding material according to No. 8-71149) has an excellent electromagnetic wave shielding effect and visibility, so that no new problem occurs. However, the manufacturing method has the following problems. That is, in the above-mentioned method for producing a translucent electromagnetic wave shielding material, since exposure, development and printing are performed, workability in a state where these black dyes and pigments are contained must be considered when selecting a resist material. However, there is a problem in that the range of use of the resist material is narrowed, and in some cases, the cost is increased.

Accordingly, an object of the present invention is to provide a method of manufacturing an inexpensive light-transmitting electromagnetic wave shielding material that can use a wide range of resist materials for the black resist layer 4.

[0008]

In order to achieve the above object, a method for producing a light-transmitting electromagnetic wave shielding material according to the present invention comprises the steps of: providing a metal layer on a transparent substrate; A step of providing a layer, a step of providing a black resist layer on the metal layer and the release layer, a step of removing the black resist layer thereon by peeling the release layer, and etching the metal layer in a portion where the black resist layer is removed by etching. It comprised so that it might consist of the process of removing.

A step of providing a metal layer on the transparent substrate;
Providing a mask layer on a part of the metal layer, providing a patterned release layer on at least the metal layer, providing a black resist layer on at least the metal layer and the release layer, removing the release layer with a release liquid Removing the black resist layer thereon by etching, removing the black resist layer and the portion of the metal layer that is not covered by the mask layer by etching, removing the mask layer and removing the exposed portion of the metal layer to a ground portion. May be configured.

A step of providing a metal layer on the transparent substrate;
Providing a patterned release layer on the metal layer, providing a mask layer on part of the exposed metal layer, providing a black resist layer on at least the metal layer and the release layer, removing the release layer with a release liquid Removing the black resist layer thereon by etching, removing the black resist layer and the portion of the metal layer that is not covered by the mask layer by etching, removing the mask layer and removing the exposed portion of the metal layer to a ground portion. May be configured.

A step of providing a metal layer on the transparent substrate;
Providing a patterned release layer on the metal layer, providing a black resist layer on the metal layer and the release layer, removing the release layer with a release liquid to remove the black resist layer thereon, It may be configured to include a step of removing the metal layer in a portion where the layer is removed by etching, and a step of removing a part of the black resist layer to make an exposed part of the metal layer a ground part.

Further, the release layer is formed of a printing resist material or a photoresist material. The thickness of the black resist layer was 0.1 μm to 10 μm. The stripper was composed of water, an aqueous solution of sodium hydroxide, an aqueous solution of potassium hydroxide, acetone, and ethyl cellosolve acetate.

[0013]

Embodiments of the present invention will be described below in more detail with reference to the drawings. FIG. 1 is a schematic view showing an embodiment of a manufacturing process of the translucent electromagnetic wave shielding material of the present invention, FIGS. 2 to 5 are schematic views showing an embodiment of a pattern of a release layer, and FIGS. FIG. 10 is a schematic view showing an example of a pattern, FIG. 10 is a schematic view showing an example of a light-transmitting electromagnetic wave shielding material having a ground portion, and FIGS. It is a schematic diagram which shows an Example. Reference numeral 1 denotes a transparent substrate, 2 denotes a metal layer, 3 denotes a release layer, 4 denotes a black resist layer, 5 denotes a ground portion, 6 denotes a translucent electromagnetic wave shield portion, and 7 denotes a mask layer.

In the manufacturing process of the transparent electromagnetic wave shielding material shown in FIG. 1, first, a metal layer 2 is provided on a transparent substrate 1 (see FIG. 1A).

The material of the transparent substrate 1 includes glass, acrylic resin, polycarbonate resin, polyethylene resin, AS resin, vinyl acetate resin, polystyrene resin, polypropylene resin, polyester resin, polysulfone resin, polyethersulfone resin, and polychlorinated resin. What is necessary is just to be transparent like vinyl. Further, the transparent substrate 1 is a plate,
There are films.

The material of the metal layer 2 is, for example, gold,
Use a conductive material such as silver, copper, iron, aluminum, nickel, and chromium, which can sufficiently shield electromagnetic waves. Further, the metal layer 2 is not limited to a simple substance, but may be an alloy or a multilayer. As a method for forming the metal layer 2,
There are a method of depositing from a gas phase such as vapor deposition, sputtering, and ion plating, a method of bonding a metal foil, and a method of electroless plating the surface of the transparent substrate 1. The thickness of the metal layer 2 is preferably 0.1 μm to 50 μm. Five
If it exceeds 0 μm, it becomes difficult to finish the pattern with high accuracy, and if it is less than 0.1 μm, it becomes impossible to stably secure the minimum necessary conductivity for maintaining the electromagnetic wave shielding effect.

Next, a patterned release layer 3 is provided on the metal layer 2 (see FIG. 1B). As a material of the release layer 3, a printing resist material or a photoresist material which is generally commercially available is used. The release layer 3 may be formed in a pattern on the metal layer 2 by a screen printing method using a printing resist material or by a roll coating method, a spin coating method using a photoresist material, or the like.
A solid pattern is formed on the metal layer 2 by a dip coating method, a full-surface printing method, a transfer method, or the like, is exposed using a mask, is developed, and is formed into a pattern. In this case, since black dyes and pigments are not contained, workability at the time of exposure / development and printing does not matter much. The pattern of the release layer 3 includes, for example, an inverted lattice shape (see FIG. 2), an inverted honeycomb shape (see FIG. 3), an inverted ladder shape (see FIG. 4), a polka dot shape (see FIG. 5), and the like.

Next, a black resist layer 4 is provided on the metal layer 2 and the release layer 3 (see FIG. 1C). The black resist layer 4 is a layer for suppressing the reflection on the surface of the metal layer 2 to enhance the visibility, and is used as an etching resist for patterning the metal layer 2 in the process of manufacturing the translucent electromagnetic wave shielding material. Layer. As a material of the black resist layer 4, for example, a material in which a black dye or pigment is contained in a resin such as polyester is used. Black resist layer 4
Examples of the method for forming include a roll coating method and a dip coating method. The thickness of the black resist layer 4 is
The thickness is preferably 0.1 μm to 10 μm. If it exceeds 10 μm, it becomes difficult to peel off the release layer 3. If it is less than 0.1 μm, sufficient light-shielding properties cannot be maintained and it becomes difficult to suppress reflection on the surface of the metal layer 2.

Further, the peeling layer 3 is peeled off by a peeling liquid to remove the black resist layer 4 thereon (see FIG. 1D). As a result, the black resist layer 4 has a pattern obtained by inverting the pattern of the release layer 3. For example, the pattern is a lattice (see FIG. 6), a honeycomb (see FIG. 7), a ladder (see FIG. 8), a reverse polka dot (see FIG. 9), or the like. As the stripping solution used in this step, a different type is used depending on the material of the stripping layer 3. For example, if the release layer 3 is of an alkaline release type, an aqueous solution of potassium hydroxide, an aqueous solution of sodium hydroxide or the like is used. Further, when the release layer 3 is a water release type, water is used. When the release layer 3 is a solvent release type, ethyl cellosolve acetate, acetone or the like is used.

In the method of patterning the black resist layer 4 by peeling the peeling layer 3 as described above, since the black resist layer 4 is simply formed, there is no need to consider workability during exposure, development and printing. In addition, the range of use of the resist material is wide, and it is possible to obtain a translucent electromagnetic wave shielding material at low cost.

Finally, the portion of the metal layer 2 where the black resist layer 4 has been removed is removed by etching (see FIG. 1e). As a result, a translucent electromagnetic wave shielding material is obtained in which the metal layer 2 is laminated on the transparent substrate 1 in a pattern and the black resist layer 4 which is in register with the metal layer 2 is laminated on the metal layer 2. The translucent electromagnetic wave shielding material has translucency in a portion where the metal layer 2 is removed, and the reflection on the surface of the metal layer 2 is suppressed by the black resist layer 4 which is in register with the metal layer 2. The etching solution is selected according to the material of the metal layer 2. For example, if the material of the metal layer 2 is gold, use aqua regia, use silver for an aqueous ferric nitrate solution, use copper for a ferric chloride or cupric chloride aqueous solution, use chromium for a cerium nitrate aqueous solution, or the like. Good to do.

The translucent electromagnetic wave shielding material needs to be grounded. There are various means, but it is easiest to partially expose the metal layer 2 on the surface on which the black resist layer 4 of the shielding material is formed. It is. That is, the transparent substrate 1
The translucent electromagnetic wave shielding material is configured such that the metal layer 2 is laminated on the metal layer 2 in a pattern, and the black resist layer 4 that coincides with the metal layer 2 is laminated on the metal layer 2 except for the ground portion 5. . The grounding portion 5 includes, for example, a frame portion (see FIG. 10) surrounding the translucent electromagnetic wave shield portion 6 and a rod-shaped portion adjacent to an end of the translucent electromagnetic wave shield portion 6.

In order to manufacture a light-transmitting electromagnetic wave shielding material having the ground portion 5, a process as shown in FIGS.

In the manufacturing process of the translucent electromagnetic wave shielding material shown in FIG. 11, first, a metal layer 2 is provided on a transparent substrate 1 (see FIG. 11A).

Next, a mask layer 7 is provided on a part of the metal layer 2 (see FIG. 11B). The mask layer 7 is a layer that protects a portion of the metal layer 2 serving as the ground portion 5 from being etched when the metal layer 2 is patterned, and that is removed after patterning is completed. For the mask layer 7, a printing resist or a photoresist material which is generally commercially available is used. The mask layer 7 may be formed on a part of the metal layer 2 by a screen printing method using a printing resist material,
Using a photoresist material, a solid coating is formed on the metal layer 2 by a roll coating method, a spin coating method, a full-surface printing method, a transfer method, and the like, and is exposed using a photomask,
It is partially formed by development.

Next, after providing a patterned release layer 3 on at least the metal layer 2 (see FIG. 11c), a black resist layer 4 is provided on at least the metal layer 2 and the release layer 3 (see FIG. 11d).

Next, the peeling layer 3 is peeled off by a peeling liquid to remove the black resist layer 4 thereon (FIG. 11).
e), portions of the metal layer 2 not covered with the black resist layer 4 and the mask layer 7 are removed by etching (see FIG. 11f). At this time, even if there is a slight gap between the mask layer 7 and the black resist layer 4, the grounding portion 5 and the transmissive electromagnetic wave shielding portion 6 are disconnected by etching. It is preferable to form the release layer 3 so that the resist layer 4 partially overlaps the mask layer 7.

Finally, the mask layer 7 is removed, and the exposed portion of the metal layer 2 is used as the ground portion 5 (see FIG. 11g). As a result, a translucent electromagnetic wave shield in which the metal layer 2 is laminated on the transparent substrate 1 in a pattern and the black resist layer 4 which coincides with the metal layer 2 except for the ground portion 5 is laminated on the metal layer 2. The material is obtained. As a method for removing the mask layer 7, for example, there is a method for dissolving and removing with a stripping solution.

In the manufacturing process of the translucent electromagnetic wave shielding material having the ground portion 5 shown in FIG. 12, the formation of the release layer 3 is performed before the formation of the mask layer 7. That is, after the metal layer 2 is provided on the transparent substrate 1 (see FIG. 12A), the patterned release layer 3 is provided on the metal layer 2 (see FIG. 1).
2b), a mask layer 7 is provided on a part of the exposed metal layer 2 (see FIG. 12c), and a black resist layer 4 is provided on at least the metal layer 2 and the release layer 3 (see FIG. 12d). After the black resist layer 4 thereon is removed by stripping with a stripper (see FIG. 12e), the metal layer 2 not covered by the black resist layer 4 and the mask layer 7 is removed by etching (FIG. 12f). ), Mask layer 7
Is removed to make the exposed portion of the metal layer 2 a ground portion 5 (see FIG. 12G).

In the manufacturing process of the translucent electromagnetic wave shielding material having the ground portion 5 shown in FIG. 13, the ground portion 5 is formed without using the mask layer 7. That is, a metal layer 2 is provided on a transparent substrate 1 (see FIG. 13A), a patterned release layer 3 is provided on the metal layer 2 (see FIG. 13B), and a black resist layer 4 is provided on the metal layer 2 and the release layer 3. Is provided (see FIG. 13C), the peeling layer 3 is peeled with a peeling liquid to remove the black resist layer 4 thereon (FIG. 1).
3d), and furthermore, the metal layer 2 in the portion where the black resist layer 4 has been removed is removed by etching (see FIG. 13e).
A part of the black resist layer 4 is removed and an exposed part of the metal layer 2 is used as a ground part 5 (see FIG. 13F). As a method of removing a part of the black resist layer 4, for example, there is a method of peeling off by attaching to an adhesive tape or the like, a method of mechanically shaving off, or the like.

[0031]

【Example】

Example 1 A methacryl sheet having a thickness of 1 mm was used as a transparent substrate.
A copper layer having a thickness of 18 μm was attached to the upper surface with an acrylic resin to provide a metal layer. Next, using an aqueous printing resist ink, a release layer was formed on the metal layer by screen printing with a grid width of 10
μm, a reciprocal lattice pattern having an eye size of 100 μm × 100 μm. Next, using a black carbon ink, the thickness of 1 μm was formed on the metal layer and the release layer by roll coating.
Was provided. Next, water was used as a peeling liquid, and the peeling layer was peeled off to remove the black resist layer thereon. Finally, the metal layer where the black resist layer was removed was removed by etching with an aqueous ferric chloride solution.

Example 2 A polycarbonate sheet having a thickness of 2 mm was used as a transparent substrate, and nickel was sputtered on its upper surface to form a sheet having a thickness of 0.3 mm.
A μm metal layer was provided. Next, roll coating an alkali developing type photoresist material on the metal layer,
After the pre-baking, exposure and development were performed using a photomask, and a release layer was provided in a reciprocal lattice pattern having a lattice width of 10 μm and a mesh size of 100 μm × 100 μm. Next, a black resist layer having a thickness of 1 μm was formed on the upper surface of the metal layer and the release layer by a roll coating method using black carbon ink. Next, an aqueous solution of potassium hydroxide was used as a stripping solution, and the stripping layer was stripped to remove the black resist layer thereon. Finally, the portion of the metal layer from which the black resist layer was removed was removed by etching with a nitric acid aqueous solution.

Example 3 An acrylic sheet having a thickness of 2 mm was used as a transparent substrate, and a transparent ink composed of cellulose acetate propionate was roll-coated on the upper surface thereof to form an anchor layer. A metal layer having a thickness of 0.2 μm was provided. Next, a release layer was formed on the metal layer by screen printing using a water-based printing resist ink in a reciprocal lattice pattern having a lattice width of 10 μm and a mesh size of 100 μm × 100 μm. Next, a black resist layer having a thickness of 1 μm was formed on the upper surface of the metal layer and the release layer by a roll coating method using black carbon ink. Next, water was used as a peeling liquid, and the peeling layer was peeled off to remove the black resist layer thereon. Finally, the metal layer where the black resist layer was removed was removed by etching with an aqueous ferric chloride solution.

Example 4 A 1 mm thick methacryl sheet was used as a transparent substrate.
A copper layer having a thickness of 18 μm was attached to the upper surface with an acrylic resin to provide a metal layer. Next, a printing resist MA830 is formed on this metal layer in a strip shape having a width of 10 mm from the four edges of the film.
(Manufactured by Taiyo Ink) by screen printing.
After drying at 0 ° C. for 30 minutes, a mask layer was formed. Next, using an aqueous printing resist ink, a release layer is formed on at least the metal layer by screen printing at a grid width of 10 μm and an eye size of 100 μm.
It was provided in a reciprocal lattice pattern of μm × 100 μm. Next, a black resist layer having a thickness of 1 μm was formed on the upper surface of the metal layer and the release layer by a roll coating method using black carbon ink. Next, water was used as a peeling liquid, and the peeling layer was peeled off to remove the black resist layer thereon. Finally, the metal layer where the black resist layer was removed was removed by etching with an aqueous ferric chloride solution. Next, the mask layer was dissolved and removed with butyl cellosolve to form an earth portion where the metal layer was exposed at the end.

[0035]

The method for producing a light-transmitting electromagnetic wave shielding material of the present invention has the following effects because of the above configuration.

That is, since the black resist layer is patterned by peeling off the peeling layer after the solid formation of the black resist layer, there is no need to select a resist material suitable for printing, exposure and development, and the range of use of the resist material is reduced. Become wider.
Therefore, a translucent electromagnetic wave shielding material can always be obtained at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic view showing one embodiment of a manufacturing process of a translucent electromagnetic wave shielding material of the present invention.

FIG. 2 is a schematic view showing one example of a pattern of a release layer.

FIG. 3 is a schematic view showing one example of a pattern of a release layer.

FIG. 4 is a schematic view showing one example of a pattern of a release layer.

FIG. 5 is a schematic view showing one example of a pattern of a release layer.

FIG. 6 is a schematic view showing one embodiment of a pattern of a metal layer.

FIG. 7 is a schematic view showing one embodiment of a pattern of a metal layer.

FIG. 8 is a schematic view showing one embodiment of a pattern of a metal layer.

FIG. 9 is a schematic view showing one embodiment of a pattern of a metal layer.

FIG. 10 is a schematic view showing one example of a translucent electromagnetic wave shielding material having a ground portion.

FIG. 11 is a schematic view showing one embodiment of a manufacturing process of the translucent electromagnetic wave shielding material of the present invention.

FIG. 12 is a schematic view showing one embodiment of a manufacturing process of the translucent electromagnetic wave shielding material of the present invention.

FIG. 13 is a schematic view showing one embodiment of a manufacturing process of the translucent electromagnetic wave shielding material of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transparent substrate 2 Metal layer 3 Release layer 4 Black resist layer 5 Ground part 6 Transparent electromagnetic wave shield part 7 Mask layer

Claims (7)

[Claims] 1. A step of providing a metal layer on a transparent substrate, a step of providing a patterned release layer on the metal layer, a step of providing a black resist layer on the metal layer and the release layer, and removing the release layer with a release liquid. A step of removing the black resist layer thereover, and a step of etching away the metal layer in a portion where the black resist layer has been removed. 2. A step of providing a metal layer on a transparent substrate, a step of providing a mask layer on a part of the metal layer, a step of providing a patterned release layer on at least the metal layer, and at least a step of providing a patterned release layer on the metal layer. A step of providing a black resist layer, a step of removing the black resist layer thereon by peeling the peeling layer off with a peeling liquid, a step of etching away the metal layer in a portion not covered by the black resist layer and the mask layer, A method for manufacturing a light-transmitting electromagnetic wave shielding material, comprising a step of removing a mask layer to make an exposed portion of a metal layer an earth portion. 3. A step of providing a metal layer on a transparent substrate, a step of providing a patterned release layer on the metal layer, a step of providing a mask layer on a part of the exposed metal layer, and at least on the metal layer and the release layer. A step of providing a black resist layer, a step of removing the black resist layer thereon by peeling the peeling layer off with a peeling liquid, a step of etching away the metal layer in a portion not covered by the black resist layer and the mask layer, A method for manufacturing a light-transmitting electromagnetic wave shielding material, comprising a step of removing a mask layer to make an exposed portion of a metal layer an earth portion. 4. A step of providing a metal layer on a transparent substrate, a step of providing a patterned release layer on the metal layer, a step of providing a black resist layer on the metal layer and the release layer, and removing the release layer with a release liquid. Removing the black resist layer thereon, etching the metal layer of the portion where the black resist layer has been removed, and removing the portion of the black resist layer to expose the exposed portion of the metal layer as a ground portion. A method for producing a light-transmitting electromagnetic wave shielding material, comprising the steps of: 5. The method for producing a light-transmitting electromagnetic wave shielding material according to claim 1, wherein the release layer comprises a printing resist material or a photoresist material. 6. The black resist layer has a thickness of 0.1 μm to 10 μm.
The method for producing a light-transmitting electromagnetic wave shielding material according to claim 1. 7. The stripping solution is water, an aqueous sodium hydroxide solution,
The method for producing a light-transmitting electromagnetic wave shielding material according to any one of claims 1 to 6, which is an aqueous solution of potassium hydroxide, acetone, or ethyl cellosolve acetate.