CN207706506U - A kind of wiring board and electronic equipment - Google Patents

Abstract

The utility model discloses a kind of wiring board and electronic equipments, and wherein the wiring board includes：The integrally formed underlay substrate for being bent into multiple antarafacials, the insulating layer and circuit element layer that insulating effect can be kept after can bending and bend repeatedly；Wherein, the insulating layer is set to the one side of the underlay substrate, and the circuit element layer is set to the one side backwards to the underlay substrate of the insulating layer.Script need not can be designed the circuit element on same wiring board and designed on multiple unit line plates by the utility model, simplify manufacturing process and follow-up assembling, to reduce manufacturing cost, and the underlay substrate of the utility model is integrally formed so that the heat dissipation area of underlay substrate does not reduce have preferable heat dissipation effect.

Description

Circuit board and electronic equipment

Technical Field

The utility model relates to a circuit board technical field especially relates to a circuit board and electronic equipment.

Background

At present, with the miniaturization and centralization development of electronic products, the demands on circuit boards with different shapes are increasingly strong. In the application of the different-surface structure design, the circuit board is usually designed into a plurality of independent planar circuit boards, and then the circuit boards are installed and combined into a different-surface body, so that the substrate, the insulating layer or the circuit are prevented from cracking or breaking when being bent, and the electrical performance is prevented from being influenced. The circuit board with the different-surface structure is applied to the fields of household appliances, LED illumination, automobile electronics, high-power device module packaging and the like, for example, in the current high-power LED illumination application, a lamp with the different-surface structure design is inevitably encountered, and a radiator needs to be arranged on different surfaces of the LED circuit board, which mutually form a certain angle, so that the radiator surface can be tightly attached to the LED circuit board. Because the size of the interface gap between the LED circuit board and the radiator mounting surface directly influences the conduction of the heat of the LED circuit board to the radiator, and further influences the service life of the LED lamp, the LED circuit board must be mounted tightly close to the radiator surface. If the LED circuit board is to be mounted on the heat sink mounting surface in a manner of closely attaching the LED circuit board to the heat sink mounting surface, the circuit board must be bent to a certain extent.

When an existing LED circuit board is designed, LEDs on the same circuit board can be designed generally, the LED circuit board is designed into a plurality of units in a careless split mode, and then the units are communicated with each other through electric wires. In the installation process, each unit needs to be independently installed and then is connected with a circuit through an electric wire, so that the difficulty and the manufacturing cost of an LED circuit board and an LED lamp are increased. Fig. 2 is a schematic partial structural diagram of a bendable multi-different-surface circuit board in the prior art, which is composed of a plurality of sub-circuit board units connected by wires, each sub-circuit board unit sequentially includes, from bottom to top, a substrate 11, an insulating layer 12, and an electronic element layer, where the electronic element layer includes a wire 13 and an element 14 connected thereto. As shown in fig. 3, a partial structural schematic diagram of another bendable multi-different-surface circuit board in the prior art includes a plurality of substrates 21, an insulating layer 22 and an electronic element layer, wherein the electronic element layer includes an electric wire 23 and an element 24 connected thereto, a through window 25 is further formed between the insulating layer 22 and the substrate 21, the insulating layer 22 of the circuit board can be bent at a certain angle during subsequent installation, but the circuit board itself cannot be made into a fixed bent different-surface body.

SUMMERY OF THE UTILITY MODEL

The utility model mainly provides a circuit board and electronic equipment to solve prior art, in the different face structural design uses, design into a plurality of solitary plane circuit boards with the circuit board usually, then the installation makes up into the different face body, not only makes for the LED circuit board and makes with LED lamps and lanterns and increase the degree of difficulty, has also increased the problem of cost of manufacture.

In order to solve the technical problem, the utility model discloses a technical scheme as follows:

a circuit board comprises an integrally formed substrate, an insulating layer and a circuit element layer, wherein the substrate is bent into a plurality of different surfaces; the insulating layer is arranged on one surface of the substrate base plate, the circuit element layer is arranged on one surface of the insulating layer, which is opposite to the substrate base plate, the substrate base plate is made of a ductile material which can be repeatedly bent and can keep a fixed shape after being bent, and the ductile material has a heat conduction effect.

In order to solve the above technical problem, the utility model discloses an another technical scheme as follows:

an electronic device comprises the circuit board.

The utility model has the advantages that: be different from prior art's condition, the utility model discloses an use and have the heat conduction effect, can buckle repeatedly and can keep the ductility material preparation substrate base plate of fixed shape after buckling for circuit board integrated into one piece need not design the circuit component that originally can design on same circuit board on a plurality of unit circuit boards, has simplified manufacturing process and follow-up equipment, thereby has reduced manufacturing cost, and the utility model discloses a substrate base plate integrated into one piece makes substrate base plate's heat radiating area not reduce thereby and has better radiating effect.

Drawings

Fig. 1 is a schematic partial structural diagram of a circuit board according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a partial structure of a circuit board of the prior art;

FIG. 3 is a schematic diagram of a partial structure of a circuit board of the prior art;

fig. 4 is a partial frame structure diagram of an electronic device according to an embodiment of the present invention.

Detailed Description

Example one

Referring to fig. 1, it can be seen from fig. 1 that a circuit board according to an embodiment of the present invention includes an integrally formed substrate 1 bent into a plurality of different surfaces, an insulating layer 2 capable of being repeatedly bent and maintaining an insulating effect after being bent, and a circuit element layer; wherein, the different surfaces mean that two adjacent surfaces are not in one plane.

The insulating layer 2 is arranged on one surface of the substrate base plate 1, the insulating layer 2 covers the whole substrate base plate 1, the circuit element layer is arranged on one surface, back to the substrate base plate 1, of the insulating layer 2, the substrate base plate 1 is made of a high-ductility material which can be repeatedly bent and can keep a fixed shape after being bent, and the high-ductility material has a heat conduction effect. The bendable multi-different-surface circuit board can be bent into various shapes to form a plurality of (or a plurality of) different surfaces, and a new choice is provided for the design of different-surface structures.

In this embodiment, optionally, the number of the different surfaces is at least two, specifically, the number of the different surfaces is determined according to the design of the different surface structure, and the shape of the different surface structure matches with the specific shape of the heat sink. The heat sink is fixed to the surface of the substrate 1 facing away from the insulating layer 2, and is determined according to the specific shape of the heat sink.

In this embodiment, optionally, angles formed between two adjacent different surfaces are the same or different.

In this embodiment, optionally, the insulating layer 2 and the substrate base plate 1 are closely attached and fixed by a hot pressing method.

In this embodiment, optionally, the side end surfaces of the substrate base plate 1 and the insulating layer 2 are flush with each other, so that the appearance of the circuit board can be ensured.

In this embodiment, optionally, the edges of the substrate base plate 1 and the insulating layer 2 are both arc-shaped, so that the edge can be prevented from cutting workers.

In this embodiment, optionally, a surface of the substrate base plate 1 facing away from the insulating layer 2 is provided with an anti-slip pattern (not shown). Because the surface of the substrate base plate 1, which faces away from the insulating layer 2, is used for fixing the heat sink, the anti-slip threads can prevent the heat sink from slipping.

In this embodiment, the side end surfaces of the substrate base plate 1 and the insulating layer 2 are optionally smooth surfaces, which helps to enhance the feeling experience of workers.

In this embodiment, optionally, the circuit element layer includes an electronic circuit 3 and an electronic element 4 connected thereto, and the electronic circuit 3 and the electronic element 4 are fixed to the insulating layer 2 by electroplating.

In this embodiment, optionally, the high-ductility material is a metal material having high ductility.

In this embodiment, optionally, the metal material includes any one of a copper metal material, an aluminum metal material, a copper-aluminum alloy material, an iron metal and an alloy material thereof, and the above metal material can be bent at a large angle without causing the problems of cracking, breaking and the like, which reduce the electrical and thermal conductivity.

In this embodiment, optionally, the insulating layer 2 and the substrate base plate 1 are closely attached and fixed by a hot pressing method.

In this embodiment, optionally, the insulating layer 2 is a flexible layer, and the insulating layer 2 is formed of an insulating material having high ductility.

In this embodiment, optionally, the insulating material includes any one of a resin ceramic composite adhesive film, a resin glass fiber cloth, a pure resin adhesive film, a heat conductive silicone, a silicone, and a heat conductive double-sided adhesive tape. The insulating material can be bent at a large angle without generating cracks and breakage, so that the insulating and heat conducting properties of the circuit board are not influenced.

In this embodiment, the electronic circuit 3 is optionally formed by etching a conductive layer plated on the insulating layer 2.

In this embodiment, the electronic circuit 3 is optionally formed of a conductive material having high ductility.

In this embodiment, optionally, the conductive material includes any one of a copper foil, an aluminum foil, a gold foil, or a silver foil material. In addition, the conductive material may also be a high ductility conductive layer material that is prepared on the insulating layer 2 by a physicochemical method.

The utility model discloses an use and have the heat conduction effect, can buckle repeatedly and can keep the ductility material preparation substrate base plate 1 of fixed shape after buckling for circuit board integrated into one piece need not design the circuit component that originally can design on same circuit board on a plurality of unit circuit boards, has simplified manufacturing process and follow-up equipment, thereby has reduced manufacturing cost, and the utility model discloses a substrate base plate 1 integrated into one piece makes substrate base plate 1's heat radiating area not reduce thereby and has better radiating effect.

Example two

Referring to fig. 4, as can be seen from fig. 4, an electronic device 200 according to an embodiment of the present invention includes the circuit board 100 according to the first embodiment. Since the circuit board 100 has already been described in detail in the first embodiment, a repeated description thereof will not be provided.

The utility model discloses an electronic equipment 200, circuit board 100 that it includes have the heat conduction effect through the use, can buckle repeatedly and can keep the ductility material preparation substrate base plate of fixed shape after buckling for circuit board 100 integrated into one piece need not design the circuit component that originally can design on same circuit board on a plurality of unit circuit boards, has simplified manufacturing process and follow-up equipment, thereby has reduced manufacturing cost, and the utility model discloses a substrate base plate integrated into one piece makes the heat radiating area of substrate base plate not reduce thereby have better radiating effect.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims (10)

1. A circuit board is characterized by comprising a substrate base plate, an insulating layer and a circuit element layer, wherein the substrate base plate is integrally formed and bent into a plurality of different surfaces; wherein,

the insulating layer is arranged on one surface of the substrate base plate, and the circuit element layer is arranged on one surface of the insulating layer, which is back to the substrate base plate.

2. The wiring board of claim 1, wherein the number of the different surfaces is at least two.

3. The wiring board according to claim 1, wherein angles formed between two adjacent different surfaces are the same or different.

4. The wiring board of claim 1, wherein the insulating layer and the substrate base plate are closely attached and fixed by a hot pressing manner.

5. The wiring board of claim 1, wherein the substrate base plate and the side end face of the insulating layer are flush with each other.

6. The wiring board of claim 1, wherein the substrate base plate and the insulating layer have circular arc-shaped edges.

7. The circuit board according to claim 1, wherein the substrate base plate is provided with anti-slip patterns on a surface facing away from the insulating layer.

8. The wiring board of claim 1, wherein the side end surfaces of the substrate base plate and the insulating layer are smooth surfaces.

9. The wiring board according to claim 1, wherein the circuit element layer includes an electronic circuit and an electronic element connected thereto, and the electronic circuit and the electronic element are fixed to the insulating layer by plating.

10. An electronic device, characterized in that it comprises the wiring board of any one of claims 1 to 9.