CN207283902U - One kind heat dissipation pcb board - Google Patents
One kind heat dissipation pcb board Download PDFInfo
- Publication number
- CN207283902U CN207283902U CN201721093182.7U CN201721093182U CN207283902U CN 207283902 U CN207283902 U CN 207283902U CN 201721093182 U CN201721093182 U CN 201721093182U CN 207283902 U CN207283902 U CN 207283902U
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- CN
- China
- Prior art keywords
- pcb board
- lower floor
- layer
- upper strata
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses one kind heat dissipation pcb board,Including the reinforcing layer being bonded successively,Lower floor,Heat dissipating layer,Upper strata,Raised line staggeredly is both provided with the two sides of the lower floor,The reinforcing groove coincideing with raised line is provided with the reinforcing layer,The heat dissipating layer is laminated with to be bonded everywhere,The positioning groove coincideing with raised line is provided with the upper strata,The utility model, which has, to be set raised line staggeredly and coordinates with the groove of reinforcing on reinforcing layer with the positioning groove on upper strata in lower floor,So that lower floor and upper strata and the heat dissipating layer being clipped among the two have the contact area of bigger,Easy to be exported the heat on pcb board into external environment condition from the marginal position of heat dissipating layer,The reeded Rotating fields of setting of multilayer are because mutual contact area has the contact area of bigger compared to traditional plate Rotating fields,Therefore the effect with more powerful heat sinking function.
Description
Technical field
A kind of pcb board is the utility model is related to, more specifically it is related to a kind of heat dissipation pcb board.
Background technology
Pcb board, that is, printed circuit board, also known as printed circuit board (PCB), are the suppliers of electronic component electrical connection.Showing such as
Because the set electronics component number on pcb board is more and more on modern pcb board, therefore the heat dissipation performance change of pcb board
It is particularly important that.
At present, Authorization Notice No. is that the Chinese patent document of CN205902192U discloses a kind of heat radiating type in the prior art
Pcb board, it on heat-conducting layer by setting heat sink to form air passage, then, and the heat transfer by screw assembly layers of copper
Onto heat sink, and the strong convection wind formed by the first radiator fan with the second radiator fan takes away the heat of heat sink,
Promote the heat of pcb board body can be fast.
But PCB substrate thickness is smaller in actual conditions, to set fan component difficulty of processing larger in pcb board.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide one kind heat dissipation pcb board, its advantage exists
In easily processing and manufacturing.
To achieve the above object, the utility model provides following technical solution：One kind heat dissipation pcb board, including paste successively
The reinforcing layer of conjunction, lower floor, heat dissipating layer, upper strata, raised line staggeredly is both provided with the two sides of the lower floor, is set on the reinforcing layer
The reinforcing groove coincideing with raised line is equipped with, the heat dissipating layer is laminated with to be bonded everywhere, is provided with the upper strata and raised line
Identical positioning groove.
By using above-mentioned technical proposal, set in lower floor raised line staggeredly and with the reinforcing groove on reinforcing layer and upper strata
On positioning groove coordinate so that lower floor and upper strata and the heat dissipating layer for being clipped in the two centre have the contact area of bigger, heat dissipating layer
With good heat conductivility, the heat on pcb board can be exported into external environment condition from the marginal position of heat dissipating layer, multilayer
The reeded Rotating fields of setting because mutual contact area has bigger compared to traditional plate Rotating fields
Contact area, therefore there is more powerful heat sinking function.
The utility model is further arranged to：Insulation is both provided between the reinforcing layer, lower floor, heat dissipating layer and upper strata
Layer.
By using above-mentioned technical proposal, insulating layer is respectively provided between every two layers, can be kept between circuit and each layer
Insulating properties, prevent influencing each other between each layer.
The utility model is further arranged to：It is oblique on the upper strata to offer mounting hole, the mounting hole through upper strata,
Heat dissipating layer, lower floor and reinforcing layer, are provided with the fixed link coincideing with mounting hole in the mounting hole.
By using above-mentioned technical proposal, fixed link is set to pass through monoblock pcb board, can be by each layer fix tightly in pcb board
Solid be secured together.
The utility model is further arranged to：Fixed link has good heat conductivility.
By using above-mentioned technical proposal, because fixed link has good heat conductivility, therefore can by fixed link
Heat in pcb board is conducted to the surface of pcb board and radiated because fixed link is set everywhere in pcb board, can uniformly by
Heat produced inside pcb board prevents somewhere from overheating to surface.
The utility model is further arranged to：The mounting hole is placed through the raised line between heat dissipating layer and lower floor.
By using above-mentioned technical proposal, mounting hole is placed through the raised line between heat dissipating layer and lower floor, can be by lower floor
Together with being more tightly secured to each layer.
The utility model is further arranged to：The fixed link end face is with one side of the upper strata away from heat dissipating layer positioned at same
Face, other end and one side of the reinforcing layer away from lower floor of the fixed link are located at the same face.
By using above-mentioned technical proposal, fixed link both ends end face is maintained at same plane, Neng Gouling with pcb board surface
Pcb board surface keeps smooth and is processed further beneficial to pcb board.
The utility model is further arranged to：The adjacent fixed link is arranged in a crossed manner.
By using above-mentioned technical proposal, fixation arranged in a crossed manner can make the stress direction between fixed link and pcb board
Different directions so that fixed link is not easy to come off from pcb board.
In conclusion the utility model has the advantages that：1st, heat dissipating layer has good heat dissipation performance, in lower floor
Reinforcing groove on the upper positioning groove for setting raised line and upper strata, reinforcing layer coordinates the contact surface for adding heat dissipating layer and each interlayer
Product, is conducive to pcb board and accelerates heat dissipation；2nd, fixed link is set to pass through pcb board, and fixed link is intersected obliquely through the raised line in lower floor
Strong bonded between each layer can be made.
Brief description of the drawings
Fig. 1 is the integral layer structure diagram of the present embodiment；
Fig. 2 is the schematic cross-sectional view of the present embodiment；
Fig. 3 is the fixed link and mounting hole cooperation schematic diagram of the present embodiment.
Description of reference numerals：1st, upper strata；2nd, heat dissipating layer；3rd, lower floor；4th, reinforcing layer；5th, raised line；6th, positioning groove；7th, reinforce
Groove；8th, insulating layer；9th, mounting hole；10th, fixed link.
Embodiment
The utility model is described in further detail below in conjunction with attached drawing.
Present embodiment discloses one kind radiate pcb board, as shown in Figure 1 and Figure 2, including set gradually upper strata 1, heat dissipating layer
2nd, lower floor 3 and reinforcing layer 4.It is both provided with the raised line 5 for being rendered as right-angled intersection on the two sides of lower floor 3, raised line 5 is by the table of lower floor 3
If face is separated into a grid.Opened up at the same time on upper strata 1 formed with the positioning groove 6 coincideing with raised line 5, it is same in reinforcing layer
Also opened up on 4 formed with the reinforcing groove 7 coincideing with raised line 5.Heat dissipating layer 2 is metal film and is clipped between lower floor 3 and upper strata 1 simultaneously
With good heat conductivility, the heat produced on pcb board can be passed through heat dissipating layer 2 and the edge of external contact by heat dissipating layer 2
Position distributes, to radiate to pcb board.Heat dissipating layer 2 fits in 3 surface of lower floor and 1 surface of upper strata completely because raised line 5 with
The setting of positioning groove 6, therefore there is larger contact area between heat dissipating layer 2 and upper strata 1 and lower floor 3, so as to more preferable
Radiate to pcb board.
As shown in Figure 1 and Figure 2, insulating layer 8 is both provided between reinforcing layer 4, lower floor 3, heat dissipating layer 2 and upper strata 1, is set exhausted
Edge layer 8 can keep the insulating properties between each layer of circuit.It is also oblique on pcb board that to offer an opening be circular mounting hole 9,
Mounting hole 9 is through upper strata 1, heat dissipating layer 2, lower floor 3 and reinforcing layer 4., metallic copper identical with it is inserted into mounting hole 9 at the same time
Manufactured fixed link 10.The both ends of fixed link 10 and the surface of pcb board are maintained at same plane so that pcb board surface keeps whole
It is clean not influence follow-up process operation.Because fixed link 10 is made of copper material, therefore has excellent heat conductivility, fixed link
10 with pcb board interior contact, the heat inside pcb board can be exported into external environment condition by fixed link 10, so as to PCB
Plate plays uniformly comprehensive cooling effect.
As shown in Figure 1, Figure 3, adjacent fixed link 10 is arranged in a crossed manner, i.e. fixed link 10 is towards different directions.Intersection is set
The fixed link 10 put so that stress direction between fixed link 10 and pcb board towards multiple directions so that between each layer of pcb board by
To the restraining force of all directions, so as to be combined between making each layer more firm.As shown in Figure 1, reinforcing layer 4 is higher for intensity
Material is made, and can be that the more preferable intensity that pcb board improves is supported, make it be not easy to be bent over destroying.
The above is only the preferred embodiment of the present invention, is not intended to limit the present invention, all in this practicality
Within new design concept, any modification, equivalent replacement, improvement and so on, should be included in the protection of the utility model
Within the scope of.
Claims (7)
1. one kind heat dissipation pcb board, including be bonded successively reinforcing layer (4), lower floor (3), heat dissipating layer (2), upper strata (1), its feature
It is：Raised line (5) staggeredly is both provided with the two sides of the lower floor (3), is provided with the reinforcing layer (4) and raised line (5)
Identical reinforcing groove (7), the heat dissipating layer (2) and lower floor (3) one side are bonded everywhere, be provided with the upper strata (1) with it is convex
The identical positioning groove (6) of bar (5).
A kind of 2. heat dissipation pcb board according to claim 1, it is characterised in that：The reinforcing layer (4), lower floor (3), heat dissipation
Insulating layer (8) is both provided between layer (2) and upper strata (1).
A kind of 3. heat dissipation pcb board according to claim 1, it is characterised in that：It is oblique on the upper strata (1) to offer fixation
Hole (9), the mounting hole (9) set in upper strata (1), heat dissipating layer (2), lower floor (3) and reinforcing layer (4), the mounting hole (9)
It is equipped with the fixed link (10) coincideing with mounting hole (9).
A kind of 4. heat dissipation pcb board according to claim 3, it is characterised in that：Fixed link (10) has good thermal conductivity
Energy.
A kind of 5. heat dissipation pcb board according to claim 3, it is characterised in that：The mounting hole (9) is placed through heat dissipating layer
(2) raised line (5) between lower floor (3).
A kind of 6. heat dissipation pcb board according to claim 5, it is characterised in that：Fixed link (10) end face and upper strata
(1) one side away from heat dissipating layer (2) is located at the same face, other end and the remote lower floor of reinforcing layer (4) of the fixed link (10)
(3) one side is located at the same face.
A kind of 7. heat dissipation pcb board according to claim 5, it is characterised in that：The adjacent fixed link (10), which is intersected, to be set
Put.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721093182.7U CN207283902U (en) | 2017-08-29 | 2017-08-29 | One kind heat dissipation pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721093182.7U CN207283902U (en) | 2017-08-29 | 2017-08-29 | One kind heat dissipation pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207283902U true CN207283902U (en) | 2018-04-27 |
Family
ID=61983894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721093182.7U Expired - Fee Related CN207283902U (en) | 2017-08-29 | 2017-08-29 | One kind heat dissipation pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207283902U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115284692A (en) * | 2022-08-26 | 2022-11-04 | 张志成 | A multi-layer anti-deformation sheet |
-
2017
- 2017-08-29 CN CN201721093182.7U patent/CN207283902U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115284692A (en) * | 2022-08-26 | 2022-11-04 | 张志成 | A multi-layer anti-deformation sheet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180427 Termination date: 20200829 |