CN206525075U - Radiator with thin vapor chamber - Google Patents

Abstract

The utility model discloses a radiator with slim temperature-uniforming plate, including temperature-uniforming plate, backup pad, support frame and radiator. The supporting plate is arranged on one side face of the temperature-equalizing plate and comprises a frame plate, a hollow groove in the frame plate and a plurality of supporting lugs formed on the periphery of the frame plate, the supporting lugs are abutted against the periphery of the temperature-equalizing plate, and part of the temperature-equalizing plate is protruded to expose the hollow groove; the support frame is abutted against the other side surface of the temperature-equalizing plate relative to the support lug, and extends from one side edge of the temperature-equalizing plate to the other opposite side edge; the radiator is arranged on the support frame and is attached to the temperature equalizing plate, so that the temperature equalizing plate is prevented from deforming due to insufficient structural strength to generate a gap with the heating assembly, and a better heat conduction effect is kept.

Description

Radiator with thin vapor chamber

technical field

The utility model relates to a radiator, in particular to a radiator with a uniform temperature plate.

Background technique

With the advancement of semiconductor technology, the instruction cycle of components inside electronic products has increased significantly, and the heat generated by them has also increased significantly. Therefore, the heat generated by electronic components requires a radiator to control the operating temperature and maintain the normal operation of electronic components.

Furthermore, the vapor chamber is a high-performance heat dissipation component that can quickly conduct local heat sources to large-area flat panels. Due to its high heat transfer capacity, light weight, simple structure and multi-purpose, and can transfer a large amount of heat without consuming power, it has been widely used in the market of high-performance heat dissipation components, such as servers, communications, high-end Graphics cards, high-efficiency LED cooling components, etc.

On the other hand, in order to meet the demands of thin and light electronic equipment, the vapor chamber is gradually becoming thinner and thinner. Therefore, when the vapor chamber is locked, the vapor chamber is easily deformed due to insufficient strength, resulting in a gap between the vapor chamber and the object to be heat transferred, resulting in poor heat conduction effect.

Utility model content

The purpose of this utility model is to provide a radiator with a thin vapor chamber to provide support for the vapor chamber, avoid deformation of the vapor chamber due to insufficient structural strength and create a gap with the heating component, and maintain a better Thermal effect.

In order to achieve the above purpose, the utility model provides a radiator with a thin vapor chamber, including:

a vapor chamber;

A support plate is arranged on one side of the uniform temperature plate. The support plate includes a frame plate, a hollow groove located in the frame plate and a plurality of support protrusions formed on the periphery of the frame plate. The plurality of support protrusions The sheet abuts on the periphery of the vapor chamber, and a part of the vapor chamber protrudes from the hollow groove;

a support frame abutting against the other side of the chamber relative to the plurality of support tabs, the support frame extending from one side of the chamber to the opposite side; and

A heat sink is arranged on the supporting frame and attached to the uniform temperature plate.

Wherein the inside of the uniform temperature plate is provided with a plurality of support bodies.

Wherein the temperature chamber is step-shaped on one side affixed to the support plate, the side surface affixed to the support frame is a plane, the temperature chamber includes a first heat conducting part, and a frame surrounds the A second heat conduction part around the first heat conduction part and a fixing part located on the periphery of the temperature chamber, the first heat conduction part is exposed in the hollow groove, the second heat conduction part sticks to the frame plate, and the fixation part has Multiple piercings.

Wherein the peripheral edge of the support plate is provided with a plurality of first combination holes at positions corresponding to the plurality of through holes.

Wherein the peripheral edge of the support plate is respectively formed as a protrusion at the positions of the plurality of first combining holes.

Wherein the supporting lugs of the supporting plate are directly bent from the periphery of the frame plate and arranged at intervals.

Wherein the support frame is provided with a plurality of second combination holes corresponding to the plurality of perforations, the plurality of second combination holes include a plurality of circular holes and a plurality of elliptical holes, and one side of each of the elliptical holes has a broken hole. hole.

Wherein the support frame is an I-type support.

Wherein the heat dissipation body is a heat dissipation fin group, and the heat dissipation body is formed with a plurality of clearance spaces corresponding to the position of the supporting frame.

Wherein the cooling body is provided with a plurality of hollow parts at positions corresponding to the plurality of through holes.

Compared with the prior art, in the radiator of the present invention, the support plate and the support frame are relatively arranged on the two sides of the uniform temperature plate, wherein the support plate has support tabs abutting on the peripheral edge of the uniform temperature plate, and the support frame automatically One side of the vapor chamber extends to the opposite side to abut against the other side of the vapor chamber relative to the support tab, thereby increasing the support force of the vapor chamber through the support plate and the support frame; In addition, the radiator of the present invention can also add a support structure to the exposed hole, so that the screw will not be deformed and displaced due to weight pressure, and it will also prevent the deformation of the vapor chamber due to insufficient structural strength and create a gap with the heating component. Maintain better thermal conductivity.

Description of drawings

Fig. 1 is a three-dimensional appearance schematic diagram of a radiator with a thin vapor chamber of the present invention.

Fig. 2 is a partially exploded perspective view of a radiator with a thin vapor chamber of the present invention.

Fig. 3 is a perspective exploded view of another part of the radiator with a thin vapor chamber of the present invention in one side direction.

Fig. 4 is a three-dimensional exploded schematic view of another part of the radiator with a thin vapor chamber of the present invention in the other side direction.

Fig. 5 is a schematic perspective view of another part of the radiator with a thin vapor chamber of the present invention.

Fig. 6 is a combined sectional view of another part of the radiator with a thin vapor chamber of the present invention.

Fig. 7 is a combined cross-sectional view of one side of the radiator with a thin vapor chamber of the present invention.

Fig. 8 is a cross-sectional view of the other side of the radiator with a thin vapor chamber of the present invention.

In the picture:

1…radiator;

10...Vapor chamber;

100 ... support body;

11...the first heat conduction part;

12...the second heat conduction part;

13... fixed part;

130 ... perforation;

20 ... support plate;

21... frame plate;

210...the first binding hole;

22... hollow groove;

23 ... supporting tabs;

30 ... supporting frame;

31...the second binding hole;

311...round hole;

312...Oval hole;

3120… broken holes;

40... radiator;

41...hollowout part;

42… Make room.

detailed description

The utility model will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the utility model and implement it, but the examples given are not intended to limit the utility model.

Please refer to FIG. 1 and FIG. 2 , which are respectively a three-dimensional appearance schematic diagram and a partial three-dimensional exploded schematic diagram of the radiator provided by the utility model with a thin vapor chamber. As shown in the figure, the radiator 1 with a thin vapor chamber of the present invention includes a vapor chamber (Vapor Chamber) 10 , a support plate 20 , a support frame 30 and a radiator 40 . The support plate 20 and the support frame 30 are respectively disposed on two opposite sides of the chamber 10 , and the radiator 40 is combined with the support frame 30 . In addition, a portion of the vapor chamber 10 protrudes from the support plate 20 , and is attached to a heating element (not shown in the figure) to dissipate heat.

Accordingly, the heat generated by the heating element can be quickly and uniformly conducted to the radiator 40 through the temperature chamber 10, and dissipated through the large-scale heat dissipation area of the radiator 40; preferably, the The vapor chamber 10 is a thin vapor chamber, but it is not limited thereto. The radiator 1 is described in more detail later. It should be noted that the structure of the chamber 10 belongs to the prior art, and is not the design focus of the present invention, so it will not be repeated here.

Please continue to refer to Fig. 3 to Fig. 6, which are respectively a two-side perspective exploded view of another part of the radiator with a thin vapor chamber of the present invention, a three-dimensional appearance schematic view of another part, and a combined sectional view. The support plate 20 is arranged on one side of the chamber 10, the support frame 30 is arranged on the other side of the chamber 10; the radiator 40 is arranged on the support frame 30 and attached to the chamber 10 .

The support plate 20 includes a frame plate 21 , a hollow groove 22 in the frame plate 21 , and a plurality of support tabs 23 formed around the frame plate 21 . The multiple supporting fins 23 abut on the peripheral edge of the temperature chamber 10, accordingly, the multiple supporting fins 23 can provide better supporting force for the peripheral edge of the thermal chamber 10, avoiding the temperature chamber The periphery of 10 is deformed. In this embodiment, the plurality of supporting tabs 23 are directly bent from the periphery of the frame plate 21 , and the plurality of supporting tabs 23 are arranged at intervals.

It should be noted that a part of the temperature chamber 10 protrudes from the hollow groove 23 so as to be attached to the heating element.

Moreover, the support frame 30 abuts against the other side of the temperature chamber 10 relative to the plurality of support tabs 23 , and the support frame 30 extends from one side of the temperature chamber 10 to the opposite side. . In this embodiment, the support frame 30 is an I-shaped frame, but it is not limited thereto, and the support frame 30 can also be set in various shapes such as H-shaped.

As shown in FIG. 3 and FIG. 4 , the temperature chamber 10 has a stepped shape on one side affixed to the supporting plate 20 , and a plane on the one side affixed to the support frame 30 of the temperature chamber 10 . The temperature chamber 10 includes a first heat conduction portion 11 , a second heat conduction portion 12 surrounding the first heat conduction portion 11 , and a fixing portion 13 located around the temperature chamber 10 .

Specifically, the first heat conduction portion 11 is exposed in the hollow groove 23 of the support plate 20 to be attached to the heating element. The vapor chamber 10 conducts heat to the radiator 40 through the first heat conducting portion 11 . In addition, the vapor chamber 10 conducts heat to the supporting plate 20 through the second heat conducting portion 12 . The fixing portion 13 has a plurality of through holes 130 for passing through a plurality of locking components (not shown), so as to fix the temperature chamber 10 . In this embodiment, the radiator 40 is a heat dissipation fin set, and the radiator 40 is provided with a plurality of hollowed out parts 41 at positions corresponding to the through holes 130 of the temperature chamber 10 (see FIG. 2 ).

Furthermore, the peripheral edge of the support plate 20 is provided with a plurality of first combining holes 210 at positions corresponding to the through holes 130 of the temperature chamber 10 , preferably, the peripheral edge of the supporting plate 20 is provided with a plurality of first combining holes 210 The positions are respectively formed into a convex part. In addition, the supporting frame 30 is provided with a plurality of second combining holes 31 at positions corresponding to the plurality of through holes 130 . In this embodiment, the plurality of second combining holes 31 includes a plurality of circular holes 311 and a plurality of elliptical holes 312 , and one side of each of the elliptical holes 312 has a hole 3120 , which is not limited in actual implementation.

It should be noted that when the heat sink 1 is assembled, the through hole 130 of the temperature chamber 10 , the first joint hole 210 of the support plate 20 , the second joint hole 31 of the support frame 30 and the hollow of the radiator 40 The parts 41 are aligned so as to be combined and fixed by passing through the locking components.

Please refer to FIG. 7 and FIG. 8 , which are combined cross-sectional views of two side directions of the radiator with a thin vapor chamber of the present invention, respectively. In this embodiment, the cooling body 40 is a cooling fin group, and the cooling body 40 is formed with a plurality of relief spaces 42 corresponding to the position of the supporting frame 30, so that the temperature chamber 10 is directly attached to the cooling body 40 . Accordingly, the heat of the heating component can be quickly transferred to the radiator 40 through the vapor chamber 10 , so as to improve the heat dissipation efficiency of the radiator 1 .

It should be noted that, in this embodiment, the inside of the chamber 10 is provided with a plurality of supports 100 (this embodiment is set as a cylinder, which is not limited to this type in actual implementation), and the plurality of supports The provision of 100 is used to support the chamber 10 to prevent deformation of the chamber 10; in addition, the arrangement of the plurality of supports 100 is also conducive to accelerating or averaging thermal energy conduction to increase the heat of the chamber 10. transmission efficiency.

The above-mentioned embodiments are only preferred embodiments for fully illustrating the utility model, and the protection scope of the utility model is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present utility model are all within the protection scope of the present utility model. The scope of protection of the utility model shall be determined by the claims.

Claims (10)

1. A radiator with a thin vapor chamber, characterized in that it comprises: a vapor chamber; A support plate is arranged on one side of the uniform temperature plate. The support plate includes a frame plate, a hollow groove located in the frame plate and a plurality of support protrusions formed on the periphery of the frame plate. The plurality of support protrusions The sheet abuts on the periphery of the vapor chamber, and a part of the vapor chamber protrudes from the hollow groove; a support frame abutting against the other side of the chamber relative to the plurality of support tabs, the support frame extending from one side of the chamber to the opposite side; and A heat sink is arranged on the supporting frame and attached to the uniform temperature plate. 2 . The radiator with a thin temperature chamber according to claim 1 , wherein a plurality of supports are arranged inside the chamber. 3 . 3. The heat sink with a thin temperature chamber according to claim 1, wherein the temperature chamber has a stepped shape on one side affixed to the support plate, and the chamber is in the shape of a ladder when it is attached to the support frame One side of the chamber is a plane, the temperature chamber includes a first heat conduction part, a second heat conduction part framed around the first heat conduction part and a fixing part located at the periphery of the temperature chamber, the first heat conduction part Exposed in the hollow groove, the second heat conduction portion is attached to the frame plate, and the fixing portion has a plurality of through holes. 4 . The heat sink with a thin-type temperature chamber according to claim 3 , wherein a plurality of first coupling holes are formed on a peripheral edge of the support plate at positions corresponding to the plurality of through holes. 5 . 5 . The heat sink with a thin-type temperature chamber according to claim 4 , wherein a peripheral edge of the support plate is formed as a protrusion at the positions of the plurality of first coupling holes. 5 . 6 . The radiator with a thin vapor chamber according to claim 1 , wherein the supporting tabs of the supporting plate are directly bent from the periphery of the frame plate and arranged at intervals. 7 . 7. The radiator with a thin-type temperature chamber according to claim 4, wherein the support frame is provided with a plurality of second combination holes at positions corresponding to the plurality of perforations, and the plurality of second combination holes The holes include a plurality of circular holes and a plurality of elliptical holes, and one side of each of the elliptical holes has a broken hole. 8. The radiator with a thin vapor chamber according to claim 1, wherein the support frame is an I-shaped support. 9 . The heat sink with a thin vapor chamber according to claim 1 , wherein the radiator is a heat dissipation fin set, and the radiator is formed with a plurality of clearance spaces corresponding to the position of the supporting frame. 10 . 10 . The heat sink with a thin vapor chamber according to claim 1 , wherein the heat dissipation body is provided with a plurality of hollow parts at positions corresponding to the plurality of through holes. 11 .