CN206412347U - Liquid direct contact type cooler - Google Patents

Abstract

The utility model relates to a direct contact cooler, which comprises a cooler body, a heat exchange structure and a circulation pump. The periphery of the connection port of the cooler body is used to cooperate with power devices to seal a cooling cavity. The cooling of the cooler body The cavity and the heat exchange structure can make the cooling medium form a circulation loop through the circulation pump. When working, the cooling medium in the direct contact cooler of the utility model can directly contact with the heat dissipation surface of the power device to take away heat. The thermal contact resistance between the surface and the cooling plate of the cooler can significantly improve the heat transfer performance. On the other hand, through the circulating flow of the cooling medium, the heat exchange structure continuously removes heat, which greatly improves the heat dissipation efficiency of the power device as a whole. At the same time, the liquid direct contact cooler of the utility model can make the temperature of the heat dissipation surface of the power device uniform, and improve the service life of the power device.

Description

liquid direct contact cooler

technical field

The utility model relates to the technical field of cooling of power devices, in particular to a liquid direct contact cooler.

Background technique

In actual work, the heat generated by highly integrated high-power devices will increase the temperature of the chip. If the heat dissipation is slow, the temperature of the chip may rise to exceed the maximum allowable junction temperature, and the performance of the device will be significantly reduced, and It cannot work stably, and may even burn out directly. Therefore, controlling the heating rate of high-power devices to keep the internal temperature of the chip within the allowable junction temperature and ensure the stable operation of the machine has become the focus and difficult problem in the field of high-power device technology research.

Since power devices need insulation protection, the heat dissipation of power devices mostly adopts air-cooled heat dissipation mode and water-cooled plate radiator. When the air-cooled heat dissipation mode is adopted, the specific heat capacity of the air is small, and the heat taken away by the air is relatively small. Facing the power devices with increasingly compact structure and increasing power, the air-cooled heat dissipation mode cannot meet the heat dissipation requirements. When the water-cooled plate radiator is used, the high-power devices are directly attached to the surface of the water-cooled plate radiator, and the heat is dissipated through the circulating flow of cooling water. On the one hand, this heat dissipation method may cause liquid leakage to cause shutdown, and on the other hand, the water-cooled substrate The scale formed by the long-term use of the radiator will greatly reduce the thermal conductivity, and the contact thermal resistance is large, which cannot meet the heat dissipation requirements of high-power devices.

Utility model content

Based on this, it is necessary to provide a liquid direct contact cooler which improves the cooling effect.

A liquid direct contact cooler, used for heat dissipation of power devices, including a cooler body, a first heat exchange structure and a circulation pump;

The cooler body has a cooling cavity and a heat dissipation port communicating with the cooling cavity; the cooling cavity is used to fill the cooling medium, and is used to allow the cooling medium to directly contact the cooling medium through the heat dissipation port. a heat dissipation surface of a power device; the cooler body surrounds at least a peripheral portion of the heat dissipation opening for sealing fit with the heat dissipation wall;

The cooling channel of the first heat exchange structure communicates with the cooling cavity through a return pipe;

The circulating pump is arranged on the return pipeline, and is used to make the cooling medium flowing out of the cooling cavity flow back into the cooling cavity after being cooled by the first heat exchange structure.

In one of the embodiments, the heat dissipation opening is arranged in the middle of a side wall of the cooler body.

In one of the embodiments, the liquid circulation outlet of the cooler body is located at the bottom of the cooling chamber, and the liquid circulation outlet communicates with the return pipe.

In one of the embodiments, the circulation inlet of the cooler body is located at the top of the cooling cavity, and the circulation inlet is connected with the return pipe; when the cooler body is connected to the power When the components are hermetically fitted, in the cooling cavity, the filling amount of the cooling medium can at least submerge the cooling opening.

In one of the embodiments, the liquid direct contact cooler further includes an injection structure, the injection structure is located in the cooling cavity and arranged toward the heat dissipation port, the liquid storage cavity of the injection structure is connected to the first The cooling passages of a heat exchange structure are connected; the cooling cavity is located below the heat dissipation opening and is a liquid accumulation part for filling the cooling medium.

In one of the embodiments, the spraying structure includes a spraying plate, and the spraying plate is covered with spraying holes for spraying the cooling medium flowing back from the cooling channel to the heat dissipation port.

In one of the embodiments, the injection structure includes a nozzle, and the nozzle is arranged toward the heat dissipation port so that the cooling medium cooled from the cooling channel is sprayed toward the heat dissipation port in an atomized form.

In one of the embodiments, there are multiple nozzles, and the multiple nozzles are arranged in an array.

In one of the embodiments, the liquid direct contact cooler further includes a second heat exchange structure, the second heat exchange structure has a condensation channel, and the condensation channel communicates with the cooling cavity for The cooling medium volatilized by the liquid accumulation part is condensed and flowed back into the cooling cavity.

In one of the embodiments, the second heat exchange structure is disposed on the cooler body and located at the top of the cooling cavity.

The above-mentioned direct contact cooler includes a cooler body, a heat exchange structure and a circulating pump, the cooling cavity is used to fill the cooling medium, and at least the peripheral part around the heat dissipation port is used to seal fit with the heat dissipation wall, the The circulation pump is arranged between the cooler body and the heat exchange structure to form a circulation loop. The cooling medium in the above-mentioned direct contact cooler can directly contact the heat dissipation surface of the power device to take away heat. On the one hand, compared with the heat dissipation method with a smaller specific heat capacity of air, the heat dissipation between the heat dissipation surface of the traditional power device and the cooler is eliminated. The contact thermal resistance of the board can significantly improve the heat transfer performance; on the other hand, through the circulating flow of the cooling medium, the heat exchange structure continuously removes heat, which greatly improves the heat dissipation efficiency of the power device as a whole. At the same time, when the above-mentioned liquid direct contact cooler works, the temperature of the heat dissipation surface of the power device can be made uniform, and the service life of the power device can be improved.

Further, the heat dissipation efficiency of the power device can be further improved by setting the injection structure to directly spray the cooling medium onto the heat dissipation surface of the power device or atomizing the cooling medium to undergo a phase change to absorb heat.

Description of drawings

Fig. 1 is the structural representation of the liquid direct contact cooler of embodiment 1;

Fig. 2 is the structural representation of the liquid direct contact cooler of embodiment 2;

FIG. 3 is a schematic structural diagram of the liquid direct contact cooler of Embodiment 3. FIG.

detailed description

In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. Preferred embodiments of the utility model are provided in the accompanying drawings. However, the invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present utility model more thorough and comprehensive.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

A liquid direct contact cooler in one embodiment is used for heat dissipation of power devices, including a cooler body, a first heat exchange structure and a circulation pump. Among them, power devices are often used to refer to devices with relatively large power, including power semiconductor devices, such as IGBT, IGCT, thyristor, rectifier bridge or relay, etc. The timely heat dissipation of power devices during operation is the key to maintaining their long-term normal operation.

In this embodiment, the cooler body has a cooling cavity and a cooling port communicating with the cooling cavity. The cooling cavity is used for filling the cooling medium, and for making the cooling medium directly contact the heat dissipation surface of the power device through the heat dissipation opening. The cooler body surrounds at least a peripheral portion of the heat dissipation port for sealing engagement with the heat dissipation wall.

Specifically, an insulating sealant layer can be used to seal the connection between at least the peripheral part of the cooler body around the heat dissipation port and the heat dissipation surface of the power device, so that the cooling medium directly contacts the heat dissipation surface of the power device to transfer heat and improve heat transfer efficiency. . It can be understood that the cooling medium requires insulation and heat conduction, and commonly used silicone oil, mineral oil or vegetable oil can be used. Preferably, the heat dissipation opening is arranged in the middle of a side wall of the cooler body.

The cooling channel of the first heat exchange structure communicates with the cooling cavity through a return pipe. The circulation pump is arranged on the return pipeline, and is used to make the cooling medium flowing out of the cooling cavity flow back into the cooling cavity after being cooled by the first heat exchange structure.

Preferably, the pipe connecting the first heat exchange structure and the cooler body may be connected by a rigid pipe or a flexible pipe. The rigid pipeline can be a relatively hard pipeline such as a metal pipe, and the flexible connecting pipeline can be a plastic pipe, etc., and the structure is simple and easy to install. It can be understood that the first heat exchange structure in this embodiment is externally connected to the cooler body, which can adopt the conventional forced air cooling method and water cooling heat exchange method, so that the hot fluid flowing out of the cooling cavity can be cooled and recycled ,Improve efficiency.

In this embodiment, preferably, the liquid circulation outlet of the cooler body is located at the bottom of the cooling cavity, and the liquid circulation outlet communicates with the return pipe.

Specifically, the liquid circulation inlet of the cooler body is located at the top of the cooling cavity, and the liquid circulation inlet is connected with the return pipeline. When the cooler body is tightly fitted with the power device, in the cooling cavity, the filling amount of the cooling medium can at least submerge the heat dissipation port.

Further, the liquid direct contact cooler may further include an injection structure, the injection structure is located in the cooling cavity and is disposed toward the heat dissipation port, and the liquid storage chamber of the injection structure communicates with the cooling channel of the first heat exchange structure. Below the heat dissipation openings in the cooling cavity is a liquid accumulation part for filling the cooling medium.

Specifically, the injection structure includes an injection plate, and the injection plate is covered with injection holes for spraying the cooling medium flowing back from the cooling channel to the heat dissipation port through the liquid storage cavity, so as to prevent the cooling medium from colliding with the higher temperature at the bottom of the cooling cavity. The cooling medium is mixed, which can greatly improve the heat dissipation efficiency of the power device. In other embodiments, the injection plate may be further replaced by nozzles. The nozzle is arranged toward the heat dissipation port for spraying the cooling medium cooled from the cooling channel to the heat dissipation port in an atomized form through the liquid storage cavity. In order to further improve the heat dissipation effect, there may be multiple nozzles, and the multiple nozzles are arranged in an array.

Further, the liquid direct contact cooler also includes a second heat exchange structure, the second heat exchange structure has a condensation channel, and the condensation channel communicates with the cooling cavity for condensing and returning the cooling medium volatilized from the liquid accumulation part to the cooling unit. inside the cavity. Preferably, the second heat exchange structure is provided on the cooler body and located at the top of the cooling cavity. The cooling medium volatilized from the cooling cavity undergoes a phase change, which can further take away heat and improve heat dissipation efficiency. It can be understood that the second heat exchange structure in this embodiment is externally connected to the cooler body or integrally formed with the cooler body, which can adopt conventional forced air cooling or water cooling heat exchange to improve efficiency.

The liquid direct contact cooler of the present invention will be further described below in conjunction with specific embodiments.

Example 1

Please refer to FIG. 1 , this embodiment provides a liquid immersion cooler 10 for heat dissipation of a power device 1 , including a cooler body 100 , a heat exchange structure 110 and a circulation pump 120 .

The cooler body 100 has a cooling cavity 101 and a cooling port communicating with the cooling cavity 101 . The heat dissipation opening is disposed at a middle portion of a side wall of the cooler body 100 . The cooling cavity 101 is used for filling the insulating and heat-conducting liquid, and for making the insulating and heat-conducting liquid directly contact the heat-dissipating surface of the power device through the heat dissipation opening. The cooler body 100 at least surrounds the peripheral portion of the heat dissipation opening and is sealingly fitted with the heat dissipation wall through an insulating sealant layer.

The liquid inlet of the heat exchange structure 110 is connected with the liquid outlet of the cooler body 100, the liquid outlet of the heat exchange structure 110 is connected with the liquid inlet of the cooler body 100, and the heat exchange structure 110 is used for cooling the secondary cooling cavity. The insulating and heat-conducting liquid flowing out of the body 101. The heat exchange structure 110 exchanges heat through air cooling.

The circulation pump 120 is arranged on the pipeline between the liquid storage port of the cooler body 100 and the liquid inlet port of the heat exchange structure 110 so that the insulating heat transfer liquid forms a circulation loop between the cooler body 100 and the heat exchange structure 110 .

When the power device 1 is working, the pre-filled insulating and heat-conducting liquid directly contacts the heat-dissipating surface through the heat dissipation port, absorbs heat, and then enters the heat exchange channel of the heat exchange structure 110 under the power of the circulation pump 120 to cool, and then circulates Return to the cooling cavity 101 to continuously circulate and take away the heat generated by the power device 1 .

Example 2

Please refer to FIG. 2 , this embodiment provides a liquid spray cooler 20 for heat dissipation of the power device 1 , including a cooler body 200 , a heat exchange structure 210 , a circulation pump 220 and a spray structure 230 .

The cooler body 200 has a cooling cavity 201 and a cooling port communicating with the cooling cavity 201 . The heat dissipation opening is arranged in the middle of a side wall of the cooler body 200, and the cooler body 200 at least surrounds the peripheral portion of the heat dissipation opening for sealing fit with the heat dissipation wall through an insulating sealant layer. The cooling channel of the heat exchange structure 210 communicates with the cooling cavity 201 through a return pipe. The heat exchange structure 210 exchanges heat through water cooling. The circulation pump 220 is arranged on the return pipeline, and is used to make the cooling medium 2 flowing out of the cooling cavity 201 flow back into the cooling cavity 201 after being cooled by the first heat exchange structure. The liquid circulation outlet of the cooler body 200 is located at the bottom of the cooling cavity 201 , and the liquid circulation outlet is connected with the return pipe.

The injection structure 230 is located in the cooling cavity 201 and is disposed toward the heat dissipation port, and the liquid storage cavity of the injection structure 230 communicates with the cooling channel of the heat exchange structure 210 . The cooling cavity 201 is located below the heat dissipation port as a liquid accumulation part for filling the cooling medium 2 . The spray plate is covered with spray holes for spraying the cooling medium 2 flowing back from the cooling passage to the heat dissipation port, so as to prevent mixing with the high temperature cooling medium at the bottom of the cooling cavity 201, which can greatly improve the heat dissipation of the power device 1 efficiency.

When the power device 1 is working, the circulating pump 220 draws the cooling medium 2 pre-filled in the liquid accumulation part into the cooling channel of the heat exchange structure 210 to cool, and then circulates back to the cooling cavity 201 after cooling, and continues to circulate and bring Take the heat generated by power device 1.

Example 3

Please refer to FIG. 3 , this embodiment provides a liquid spray cooler 30 for heat dissipation of power devices 1, including a cooler body 300, a first heat exchange structure 310, a circulating pump 320, a spray structure 330 and a second heat exchange structure 340 .

The cooler body 300 has a cooling cavity 301 and a cooling port communicating with the cooling cavity 301 . The heat dissipation opening is disposed in the middle of a side wall of the cooler body 300 , and the cooler body 300 at least surrounds the peripheral portion of the heat dissipation opening for sealing fit with the heat dissipation wall through an insulating sealant layer. The cooling channel of the first heat exchange structure 310 communicates with the cooling cavity 301 through a return pipe. The heat exchange structure 310 exchanges heat through water cooling. The circulation pump 320 is arranged on the return pipeline, and is used to make the cooling medium 2 flowing out of the cooling cavity 301 flow back into the cooling cavity 301 after being cooled by the first heat exchange structure 310 . The liquid circulation outlet of the cooler body 300 is located at the bottom of the cooling cavity 301 , and the liquid circulation outlet is connected with the return pipe.

The injection structure 330 is located in the cooling cavity 301 and is disposed toward the heat dissipation port, and the liquid storage cavity of the injection structure 330 is connected with the cooling channel of the first heat exchange structure 310 . The cooling cavity 301 is located below the cooling vents and serves as a liquid reservoir for filling the cooling medium. The injection structure 330 includes a plurality of nozzles, which are arranged in an array, and the plurality of nozzles are arranged toward the heat dissipation port for spraying the cooling medium 2 cooled from the cooling channel to the heat dissipation port through the liquid storage chamber in an atomized form, which can further improve heat radiation.

The second heat exchange structure 340 has a condensation channel, which communicates with the cooling cavity 301 , and is used to condense and flow back the cooling medium 2 volatilized from the liquid accumulation part into the cooling cavity 301 . The second heat exchange structure 340 is disposed on the cooler body 300 and located at the top of the cooling cavity 301 . The cooling medium 2 volatilized from the cooling cavity 301 undergoes a phase change, which can further take away heat and improve heat dissipation efficiency.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the utility model, and the description thereof is relatively specific and detailed, but it should not be interpreted as a limitation on the patent scope of the utility model. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (10)

1. A liquid direct contact cooler, used for heat dissipation of power devices, is characterized in that it includes a cooler body, a first heat exchange structure and a circulation pump; The cooler body has a cooling cavity and a heat dissipation port communicating with the cooling cavity; the cooling cavity is used to fill the cooling medium, and is used to allow the cooling medium to directly contact the cooling medium through the heat dissipation port. a heat dissipation surface of a power device; the cooler body surrounds at least a peripheral portion of the heat dissipation opening for sealing fit with the heat dissipation wall; The cooling channel of the first heat exchange structure communicates with the cooling cavity through a return pipe; The circulating pump is arranged on the return pipeline, and is used to make the cooling medium flowing out of the cooling cavity flow back into the cooling cavity after being cooled by the first heat exchange structure. 2 . The liquid direct contact cooler according to claim 1 , characterized in that, the heat dissipation opening is arranged in the middle of a side wall of the cooler body. 3 . 3. The liquid direct contact cooler according to claim 2, characterized in that, the circulation outlet of the cooler body is located at the bottom of the cooling cavity, and the circulation outlet and the return pipe connected. 4. The liquid direct contact cooler according to claim 3, characterized in that, the liquid circulation inlet of the cooler body is located at the top of the cooling chamber, and the circulation liquid inlet and the return pipe connected; when the cooler body and the power device are in sealing fit, in the cooling cavity, the filling amount of the cooling medium can at least submerge the heat dissipation port. 5. The liquid direct contact cooler according to claim 3, further comprising an injection structure, the injection structure is located in the cooling cavity and arranged toward the heat dissipation port, the liquid storage of the injection structure The cavity communicates with the cooling channel of the first heat exchange structure; the cooling cavity is located below the heat dissipation port and serves as a liquid accumulation part for filling the cooling medium. 6. The liquid direct contact cooler according to claim 5, characterized in that, the injection structure comprises an injection plate, and the injection plate is covered with injection holes for making all the cooling backflow from the cooling channel The cooling medium is sprayed to the heat dissipation port. 7. The liquid direct contact cooler according to claim 5, wherein the injection structure comprises a nozzle, and the nozzle is arranged toward the heat dissipation port so that the cooling medium cooled from the cooling passage is Spray toward the heat dissipation port in atomized form. 8. The liquid direct contact cooler according to claim 7, characterized in that there are multiple nozzles, and the multiple nozzles are arranged in an array. 9. The liquid direct contact cooler according to any one of claims 5 to 8, further comprising a second heat exchange structure, the second heat exchange structure has a condensation channel, and the condensation channel is connected to The cooling cavity is communicated for condensing and returning the cooling medium volatilized from the liquid accumulation part into the cooling cavity. 10 . The liquid direct contact cooler according to claim 9 , wherein the second heat exchange structure is arranged on the cooler body and is located at the top of the cooling cavity. 11 .