CN204740554U - A kind of CPU cooling structure and terminal - Google Patents

Abstract

The utility model discloses a CPU heat radiation structure, this heat radiation structure install a side relative with CPU on the PCB who is equipped with CPU, heat radiation structure is including the heat absorption material, the heat absorption material is injectd in the heat dissipation box, the heat dissipation box is at least including a heat -conducting plate, the heat -conducting plate with PCB connects, the heat absorption material with heat -conducting plate direct contact. The utility model discloses still disclose a terminal that has CPU heat radiation structure. This scheme is through setting up the heat dissipation box that coefficient of heat conductivity is big to setting up the endothermic material that the specific heat capacity is big in that heat dissipation box is inside, making CPU's heat absorbed by the heat absorption material, guarantee that CPU is in lower operating temperature, in addition through box and the direct laminating of PCB of will dispelling the heat, the heat that makes CPU transmit to the PCB on is absorbed by the heat dissipation box rapidly, the heat transfer that avoids CPU other components and parts to the PCB on, the normal work of other components and parts on the assurance PCB.

Description

A kind of CPU cooling structure and terminal

technical field

The utility model relates to the technical field of communication equipment, and mainly relates to a heat dissipation structure and a terminal, in particular to a CPU heat dissipation structure and a terminal.

Background technique

In modern society, the pace of life of people is getting faster and faster, and the communication between people is getting closer and more frequent. People rely heavily on communication equipment. Among them, the mobile phone is one of the most widely used communication terminals. The mobile phone is favored and popularized by people because of its portability, simple operation and comprehensive functions. The mobile phone is a mobile terminal with a small size, but people have a high demand for the functions and processing capabilities of the mobile phone. Therefore, the integration of mobile phones is getting higher and higher, and the CPU cores of mobile phones are also increasing. At the same time, the frequency of the CPU is also increasing. Higher and higher. With such a high frequency and performance, the operating temperature of the CPU is getting higher and higher, and the temperature rise of the CPU will seriously affect its working performance. Therefore, effective heat dissipation of the CPU is very important.

In addition to mobile phone terminals, currently most electronic product terminals are equipped with highly integrated and high-performance CPUs, and the CPUs on these electronic product terminals also need to solve the problem of heat dissipation during use.

At present, there are many structures used to speed up the heat dissipation of the CPU, but basically the heat dissipation structure is in direct contact with the CPU. This type of heat dissipation structure can only reduce the operating temperature of the CPU, but cannot prevent the heat of the CPU from being transferred from the side of the CPU away from the heat dissipation structure. To the PCB, and passed through the PCB to other components on the PCB, affecting the normal operation of other components. Based on the above situation, it is necessary for us to design a heat dissipation structure that can not only reduce the operating temperature of the CPU, but also prevent the heat of the CPU from affecting the work of other components.

Utility model content

One purpose of this utility model is to provide a CPU heat dissipation structure. By setting a heat dissipation box with a large thermal conductivity and a heat-absorbing substance with a large specific heat capacity inside the heat dissipation box, the heat of the CPU can be quickly transferred to the outside when it is working. The absorption of heat-absorbing substances improves the heat dissipation efficiency of the CPU and ensures that the CPU is at a lower working temperature.

Another object of the present invention is to provide a CPU heat dissipation structure. By directly attaching the heat dissipation box to the PCB, the heat transferred from the CPU to the PCB is quickly absorbed by the heat dissipation box, preventing the heat from the CPU from being transferred to other components on the PCB. Components, to ensure the normal operation of other components on the PCB.

Another object of the present utility model is to provide a terminal with a CPU heat dissipation structure, so as to speed up the heat dissipation of the terminal, ensure long-term stable operation of the terminal, and increase the service life of the terminal.

For this purpose, the utility model adopts the following technical solutions:

On the one hand, a CPU heat dissipation structure is provided, and the heat dissipation structure is installed on the side opposite to the CPU on the PCB provided with the CPU;

The heat dissipation structure includes a heat-absorbing substance, and the heat-absorbing substance is limited in a heat-dissipating box, and the heat-dissipating box includes at least one heat conducting plate, and the heat conducting plate is connected to the PCB, and the heat-absorbing substance and the heat conducting boards in direct contact.

Preferably, a heat sink is provided on a side of the CPU away from the heat dissipation box.

Specifically, installing the heat dissipation box on the PCB at a position corresponding to the CPU can shorten the heat conduction distance between the CPU and the heat dissipation box and improve heat conduction efficiency.

Specifically, the heat conduction plate is attached to the PCB, which can increase the heat conduction area between the heat dissipation box and the PCB, thereby improving the heat conduction efficiency, and at the same time, the heat transferred from the CPU to the PCB is quickly absorbed by the heat dissipation box , to prevent the heat of the CPU from being transferred to other components on the PCB, and to ensure the normal operation of other components on the PCB.

Specifically, setting a heat-absorbing substance with a large specific heat capacity can absorb more heat, which is beneficial to reduce the operating temperature of the CPU.

As a preferred technical solution of the CPU heat dissipation structure, a plurality of heat conduction protrusions are arranged at intervals on the side of the heat conduction plate away from the PCB.

Preferably, the side of the heat conducting plate close to the PCB is plane.

Specifically, one side of the heat conduction plate is flat, which is beneficial to the effective bonding with the PCB, and the other side of the heat conduction plate is provided with the heat conduction protrusion, which can increase the contact between the heat conduction plate and the heat absorption. The heat conduction area of the material increases the heat conduction efficiency.

As a preferred technical solution of the CPU heat dissipation structure, the heat dissipation box adopts a box structure, including a heat conduction plate, a heat dissipation plate arranged in parallel with the heat conduction plate, and a heat dissipation plate arranged between the heat conduction plate and the heat dissipation plate A side plate for connecting the heat conduction plate and the heat dissipation plate, the heat conduction plate, the heat dissipation plate, and the side plate are all made of heat conduction materials.

As a preferred technical solution of the CPU heat dissipation structure, a number of heat conduction protrusions are arranged at intervals on the side of the heat dissipation plate close to the PCB;

And/or, a plurality of heat conduction protrusions are arranged at intervals on the side of the heat dissipation plate away from the PCB.

Specifically, by providing the heat conduction protrusions, the heat conduction area can be increased, and the heat conduction efficiency can be improved.

As a preferred technical solution of a CPU heat dissipation structure, the thermally conductive material is any one of silver, copper, gold, and aluminum, or a mixture of two or more of silver, copper, gold, and aluminum material, or an alloy material containing any one of silver, copper, gold, and aluminum.

Specifically, silver, copper, gold and aluminum are commonly used metals with high thermal conductivity among metal materials, and the selection of these metal materials can effectively improve the heat conduction efficiency.

As a preferred technical solution of the CPU heat dissipation structure, the contact area between the heat conducting plate and the PCB is not smaller than the contact area between the CPU and the PCB.

As a preferred technical solution of the CPU heat dissipation structure, the shape of the heat conducting plate is consistent with the shape of the CPU.

Preferably, the heat conducting plate and the CPU are both rectangular in shape.

As a preferred technical solution of the CPU heat dissipation structure, the heat dissipation box is fixed on the PCB by soldering.

As a preferred technical solution of a CPU cooling structure, the heat-absorbing substance is helium or water with a large specific heat capacity.

Specifically, both helium and water are substances with high thermal stability and large specific heat capacity, which can not only absorb more heat, but also ensure that the performance does not change after absorbing heat.

On the other hand, a terminal is provided, including a CPU and a PCB, the CPU is installed on one side of the PCB, and also includes the above-mentioned CPU heat dissipation structure, and the CPU heat dissipation structure is installed on the PCB opposite to the CPU side of the

Preferably, a heat dissipation hole is opened on the shell of the terminal, and the heat dissipation box in the CPU heat dissipation structure is located at one side of the heat dissipation hole.

Preferably, the terminal includes devices such as mobile phones, notebooks, tablet computers, desktop computers, vehicle-mounted computers, and POS machines.

The beneficial effects of the utility model are as follows: on the one hand, a CPU heat dissipation structure is provided, by setting a heat dissipation box with a large thermal conductivity, and setting a heat-absorbing substance with a large specific heat capacity inside the heat dissipation box, so that the heat of the CPU is quickly transferred to the outside , and absorbed by heat-absorbing substances, improve the heat dissipation efficiency of the CPU, and ensure that the CPU is at a lower operating temperature. By directly attaching the cooling box to the PCB, the heat transferred from the CPU to the PCB is quickly absorbed by the cooling box, preventing the heat from the CPU from being transferred to other components on the PCB, and ensuring the normal operation of other components on the PCB. On the other hand, a terminal with a CPU heat dissipation structure is provided to accelerate heat dissipation of the terminal, ensure long-term stable operation of the terminal, and improve the service life of the terminal.

Description of drawings

The utility model will be described in further detail below according to the accompanying drawings and embodiments.

FIG. 1 is a schematic diagram of the CPU cooling structure described in Embodiment 1;

2 is a schematic cross-sectional view of the heat dissipation box described in Embodiment 1;

FIG. 3 is a schematic diagram of the CPU cooling structure described in Embodiment 2;

4 is a schematic cross-sectional view of the heat dissipation box described in Embodiment 2;

5 is a schematic diagram of the CPU heat dissipation structure described in Embodiment 3;

Fig. 6 is a schematic cross-sectional view of the heat dissipation box described in the third embodiment;

7 is a schematic diagram of the CPU heat dissipation structure described in Embodiment 4;

FIG. 8 is a schematic cross-sectional view of the cooling box described in the fourth embodiment.

In Figure 1 to Figure 8:

1. PCB; 2. CPU; 3. Heat dissipation box; 31. Heat conduction plate; 32. Heat dissipation plate; 33. Side plate; 34. Heat conduction protrusion; 4. Helium; 5. Water.

detailed description

The technical scheme of the utility model will be further described below in conjunction with the accompanying drawings and through specific embodiments.

Embodiment one:

On the one hand, as shown in FIGS. 1 and 2 , the present embodiment provides a CPU cooling structure, which is installed on the side of the PCB 1 with the CPU 2 opposite to the CPU 2 . The heat dissipation structure includes a heat-absorbing substance, and the heat-absorbing substance is limited in the heat dissipation box 3, and the heat dissipation box 3 includes at least a heat conducting plate 31, and the heat conducting plate 31 is connected to the PCB1, and the heat-absorbing substance It is in direct contact with the heat conducting plate 31 . The heat dissipation box 3 is fixed on the PCB 1 by soldering. A heat sink is provided on a side of the CPU 2 away from the heat dissipation box 3 . Installing the heat dissipation box 3 on the position corresponding to the CPU 2 on the PCB 1 can shorten the heat conduction distance between the CPU 2 and the heat dissipation box 3 and improve the heat conduction efficiency. The heat conduction plate 31 is attached to the PCB1, which can increase the heat conduction area between the heat dissipation box 3 and the PCB1, thereby improving the heat conduction efficiency, so that the heat transferred from the CPU2 to the PCB1 is quickly absorbed by the heat dissipation box 3, Prevent the heat of CPU2 from being transferred to other components on PCB1, and ensure the normal operation of other components on PCB1.

The heat dissipation box 3 adopts a box structure, including a heat conduction plate 31, a heat dissipation plate 32 arranged parallel to the heat conduction plate 31, and a heat dissipation plate 32 arranged between the heat conduction plate 31 and the heat dissipation plate 32 for connecting the heat conduction plate 31. The plate 31 and the side plate 33 of the heat dissipation plate 32 , the heat conduction plate 31 , the heat dissipation plate 32 and the side plate 33 are all made of heat conduction materials. The side of the heat conducting plate 31 close to the PCB 1 is a plane, and the side of the heat conducting plate 31 away from the PCB 1 is provided with a plurality of heat conducting protrusions 34 at intervals. One side of the heat conduction plate 31 is a plane, which is beneficial to the effective bonding with the PCB1, and the other side of the heat conduction plate 31 is provided with the heat conduction protrusion 34, which can increase the contact between the heat conduction plate 31 and the absorber. The heat conduction area of the thermal material improves the heat conduction efficiency. The side of the heat dissipation plate 32 away from the PCB1 is flat, and the side of the heat dissipation plate 32 close to the PCB1 is provided with a plurality of heat conduction protrusions 34 at intervals to increase the heat conduction area and improve the heat conduction efficiency.

The shape of the heat conducting plate 31 is consistent with the shape of the CPU2. In this embodiment, the shapes of the heat conducting plate 31 and the CPU2 are both rectangular, and the contact area between the heat conducting plate 31 and the PCB1 is equal to the The contact area between the CPU2 and the PCB1.

In this embodiment, the heat conducting material is silver with high thermal conductivity, and the heat dissipation box 3 made of silver can effectively improve the heat conduction efficiency of the heat dissipation box 3 . The endothermic substance is helium 4 with a large specific heat capacity. Specifically, helium 4 is a substance with high thermal stability and large specific heat capacity, which can not only absorb more heat, but also ensure that the performance does not occur after absorbing heat. Change.

On the other hand, a terminal is provided, including a CPU2 and a PCB1, the CPU2 is installed on one side of the PCB1, and also includes the above-mentioned CPU heat dissipation structure, and the CPU heat dissipation structure is installed on the PCB1 opposite to the CPU2 On one side of the terminal, a heat dissipation hole is opened on the shell of the terminal, and the heat dissipation box 3 in the CPU heat dissipation structure is located on one side of the heat dissipation hole. In this embodiment, the terminal is a mobile phone.

Embodiment two:

On the one hand, as shown in FIGS. 3 and 4 , this embodiment provides a CPU cooling structure, which is mounted on the side of the PCB 1 with the CPU 2 opposite to the CPU 2 . The heat dissipation structure includes a heat-absorbing substance, and the heat-absorbing substance is limited in the heat dissipation box 3, and the heat dissipation box 3 includes at least one heat conducting plate 31, and the heat conducting plate 31 is connected to the PCB1, and the heat-absorbing substance It is in direct contact with the heat conducting plate 31 . The heat dissipation box 3 is fixed on the PCB 1 by soldering. A heat sink is provided on a side of the CPU 2 away from the heat dissipation box 3 . Installing the heat dissipation box 3 on the position corresponding to the CPU 2 on the PCB 1 can shorten the heat conduction distance between the CPU 2 and the heat dissipation box 3 and improve the heat conduction efficiency. The heat conduction plate 31 is attached to the PCB1, which can increase the heat conduction area between the heat dissipation box 3 and the PCB1, thereby improving the heat conduction efficiency, so that the heat transferred from the CPU2 to the PCB1 is quickly absorbed by the heat dissipation box 3, Prevent the heat of CPU2 from being transferred to other components on PCB1, and ensure the normal operation of other components on PCB1.

The heat dissipation box 3 adopts a box structure, including a heat conduction plate 31, a heat dissipation plate 32 arranged parallel to the heat conduction plate 31, and a heat dissipation plate 32 arranged between the heat conduction plate 31 and the heat dissipation plate 32 for connecting the heat conduction plate 31. The plate 31 and the side plate 33 of the heat dissipation plate 32 , the heat conduction plate 31 , the heat dissipation plate 32 and the side plate 33 are all made of heat conduction materials. The side of the heat conducting plate 31 close to the PCB 1 is a plane, and the side of the heat conducting plate 31 away from the PCB 1 is provided with a plurality of heat conducting protrusions 34 at intervals. One side of the heat conduction plate 31 is a plane, which is beneficial to the effective bonding with the PCB1, and the other side of the heat conduction plate 31 is provided with the heat conduction protrusion 34, which can increase the contact between the heat conduction plate 31 and the absorber. The heat conduction area of the thermal material improves the heat conduction efficiency. The side of the heat dissipation plate 32 away from the PCB1 is provided with a number of heat conduction protrusions 34 at intervals, and the side of the heat dissipation plate 32 close to the PCB1 is provided with a number of heat conduction protrusions 34 at intervals to increase the heat conduction area and improve heat conduction. efficiency.

The shape of the heat conducting plate 31 is consistent with the shape of the CPU2. In this embodiment, the shapes of the heat conducting plate 31 and the CPU2 are circular, and the contact area between the heat conducting plate 31 and the PCB1 is larger than The contact area between the CPU2 and the PCB1, the diameter of the heat conducting plate 31 is 6mm larger than the diameter of the CPU2.

In this embodiment, the heat conducting material is aluminum alloy with high thermal conductivity, and the heat dissipation box 3 made of aluminum alloy can effectively improve the heat conduction efficiency of the heat dissipation box 3 . The endothermic substance is helium 4 with a large specific heat capacity. Specifically, helium 4 is a substance with high thermal stability and large specific heat capacity, which can not only absorb more heat, but also ensure that the performance does not occur after absorbing heat. Change.

On the other hand, a terminal is provided, including a CPU2 and a PCB1, the CPU2 is installed on one side of the PCB1, and also includes the above-mentioned CPU heat dissipation structure, and the CPU heat dissipation structure is installed on the PCB1 opposite to the CPU2 On one side of the terminal, a heat dissipation hole is opened on the shell of the terminal, and the heat dissipation box 3 in the CPU heat dissipation structure is located on one side of the heat dissipation hole. In this embodiment, the terminal is a notebook computer.

Embodiment three:

On the one hand, as shown in FIGS. 5 and 6 , this embodiment provides a CPU heat dissipation structure, which is installed on the side of the PCB1 with the CPU2 opposite to the CPU2. The heat dissipation structure includes a heat-absorbing substance, and the heat-absorbing substance is limited in the heat dissipation box 3, and the heat dissipation box 3 includes at least one heat conducting plate 31, and the heat conducting plate 31 is connected to the PCB1, and the heat-absorbing substance It is in direct contact with the heat conducting plate 31 . The heat dissipation box 3 is fixed on the PCB 1 by soldering. A heat sink is provided on a side of the CPU 2 away from the heat dissipation box 3 . Installing the heat dissipation box 3 on the position corresponding to the CPU 2 on the PCB 1 can shorten the heat conduction distance between the CPU 2 and the heat dissipation box 3 and improve the heat conduction efficiency. The heat conduction plate 31 is attached to the PCB1, which can increase the heat conduction area between the heat dissipation box 3 and the PCB1, thereby improving the heat conduction efficiency, so that the heat transferred from the CPU2 to the PCB1 is quickly absorbed by the heat dissipation box 3, Prevent the heat of CPU2 from being transferred to other components on PCB1, and ensure the normal operation of other components on PCB1.

The heat dissipation box 3 adopts a box structure, including a heat conduction plate 31, a heat dissipation plate 32 arranged parallel to the heat conduction plate 31, and a heat dissipation plate 32 arranged between the heat conduction plate 31 and the heat dissipation plate 32 for connecting the heat conduction plate 31. The plate 31 and the side plate 33 of the heat dissipation plate 32 , the heat conduction plate 31 , the heat dissipation plate 32 and the side plate 33 are all made of heat conduction materials. The side of the heat conducting plate 31 close to the PCB 1 is a plane, and the side of the heat conducting plate 31 away from the PCB 1 is provided with a plurality of heat conducting protrusions 34 at intervals. One side of the heat conduction plate 31 is a plane, which is beneficial to the effective bonding with the PCB1, and the other side of the heat conduction plate 31 is provided with the heat conduction protrusion 34, which can increase the contact between the heat conduction plate 31 and the absorber. The heat conduction area of the thermal material improves the heat conduction efficiency. The side of the heat dissipation plate 32 close to the PCB1 is flat, and the side of the heat dissipation plate 32 away from the PCB1 is provided with a plurality of heat conduction protrusions 34 at intervals to increase the heat conduction area and improve the heat conduction efficiency.

The shape of the heat conducting plate 31 is consistent with the shape of the CPU2. In this embodiment, the shapes of the heat conducting plate 31 and the CPU2 are both triangular, and the contact area between the heat conducting plate 31 and the PCB1 is larger than the The contact area between the CPU2 and the PCB1, the side length of the heat conducting plate 31 is 3 mm longer than the side length of the CPU2.

In this embodiment, the heat conducting material is gold with high thermal conductivity, and the heat dissipation box 3 made of gold can effectively improve the heat conduction efficiency of the heat dissipation box 3 . The heat-absorbing substance is water 5 with a large specific heat capacity. Specifically, the water 5 is a substance with high thermal stability and large specific heat capacity, which can absorb more heat and ensure that the performance does not change after absorbing heat.

On the other hand, a terminal is provided, including a CPU2 and a PCB1, the CPU2 is installed on one side of the PCB1, and also includes the above-mentioned CPU heat dissipation structure, and the CPU heat dissipation structure is installed on the PCB1 opposite to the CPU2 On one side of the terminal, a heat dissipation hole is opened on the shell of the terminal, and the heat dissipation box 3 in the CPU heat dissipation structure is located on one side of the heat dissipation hole. In this embodiment, the terminal is a vehicle-mounted computer.

Embodiment four:

On the one hand, as shown in FIGS. 7 and 8 , the present embodiment provides a CPU cooling structure, which is installed on the side of the PCB 1 with the CPU 2 opposite to the CPU 2 . The heat dissipation structure includes a heat-absorbing substance, and the heat-absorbing substance is limited in the heat dissipation box 3, and the heat dissipation box 3 includes at least one heat conducting plate 31, and the heat conducting plate 31 is connected to the PCB1, and the heat-absorbing substance It is in direct contact with the heat conducting plate 31 . The heat dissipation box 3 is fixed on the PCB 1 by soldering. A heat sink is provided on a side of the CPU 2 away from the heat dissipation box 3 . Installing the heat dissipation box 3 on the position corresponding to the CPU 2 on the PCB 1 can shorten the heat conduction distance between the CPU 2 and the heat dissipation box 3 and improve the heat conduction efficiency. The heat conduction plate 31 is attached to the PCB1, which can increase the heat conduction area between the heat dissipation box 3 and the PCB1, thereby improving the heat conduction efficiency, so that the heat transferred from the CPU2 to the PCB1 is quickly absorbed by the heat dissipation box 3, Prevent the heat of CPU2 from being transferred to other components on PCB1, and ensure the normal operation of other components on PCB1.

The heat dissipation box 3 adopts a box structure, including a heat conduction plate 31, a heat dissipation plate 32 arranged parallel to the heat conduction plate 31, and a heat dissipation plate 32 arranged between the heat conduction plate 31 and the heat dissipation plate 32 for connecting the heat conduction plate 31. The plate 31 and the side plate 33 of the heat dissipation plate 32 , the heat conduction plate 31 , the heat dissipation plate 32 and the side plate 33 are all made of heat conduction materials. The side of the heat conducting plate 31 close to the PCB 1 is a plane, and the side of the heat conducting plate 31 away from the PCB 1 is provided with a plurality of heat conducting protrusions 34 at intervals. One side of the heat conduction plate 31 is a plane, which is beneficial to the effective bonding with the PCB1, and the other side of the heat conduction plate 31 is provided with the heat conduction protrusion 34, which can increase the contact between the heat conduction plate 31 and the absorber. The heat conduction area of the thermal material improves the heat conduction efficiency. The side of the heat dissipation plate 32 away from the PCB1 is a plane, and the side of the heat dissipation plate 32 close to the PCB1 is also a plane.

The shape of the heat conducting plate 31 is consistent with the shape of the CPU2. In this embodiment, the shapes of the heat conducting plate 31 and the CPU2 are both square, and the contact area between the heat conducting plate 31 and the PCB1 is larger than the The contact area between the CPU2 and the PCB1, the side length of the heat conducting plate 31 is 2mm longer than the side of the CPU2.

In this embodiment, the heat conducting material is copper with high thermal conductivity, and the heat dissipation box 3 made of copper can effectively improve the heat conduction efficiency of the heat dissipation box 3 . The heat-absorbing substance is water 5 with a large specific heat capacity. Specifically, the water 5 is a substance with high thermal stability and large specific heat capacity, which can absorb more heat and ensure that the performance does not change after absorbing heat.

On the other hand, a terminal is provided, including a CPU2 and a PCB1, the CPU2 is installed on one side of the PCB1, and also includes the above-mentioned CPU heat dissipation structure, and the CPU heat dissipation structure is installed on the PCB1 opposite to the CPU2 On one side of the terminal, a heat dissipation hole is opened on the shell of the terminal, and the heat dissipation box 3 in the CPU heat dissipation structure is located on one side of the heat dissipation hole. In this embodiment, the terminal is a tablet computer.

It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present utility model and the applied technical principles. Within the technical scope disclosed in the present utility model, any changes or changes that are easily conceivable by those skilled in the art Replacement should be covered within the protection scope of the present utility model.

Claims (10)

1. a CPU radiator structure, is characterized in that, this radiator structure be installed on be provided with CPU PCB on a side relative with CPU;

Described radiator structure comprises heat absorption material, and described heat absorption material is defined in heat dissipation box, and described heat dissipation box at least comprises a heat-conducting plate, and described heat-conducting plate is connected with described PCB, and described heat absorption material directly contacts with described heat-conducting plate.

2. a kind of CPU radiator structure according to claim 1, is characterized in that, described heat-conducting plate is arranged at intervals with some heat conduction projection away from the side of described PCB.

3. a kind of CPU radiator structure according to claim 1, it is characterized in that, described heat dissipation box adopts box body structure, the heat sink comprising heat-conducting plate, be arranged in parallel with described heat-conducting plate, and being arranged at for being connected the side plate of described heat-conducting plate and described heat sink between described heat-conducting plate with described heat sink, described heat-conducting plate, described heat sink, described side plate are made by Heat Conduction Material.

4. a kind of CPU radiator structure according to claim 3, is characterized in that, described heat sink is arranged at intervals with some heat conduction near the side of described PCB protruding;

And/or described heat sink is arranged at intervals with some heat conduction projection away from the side of described PCB.

5. a kind of CPU radiator structure according to claim 3, is characterized in that, described Heat Conduction Material adopt in silver, copper, gold, aluminium any one, or, any one the alloy material that employing comprises in silver, copper, gold, aluminium.

6. a kind of CPU radiator structure according to claim 1, is characterized in that, the contact area of described heat-conducting plate and described PCB is not less than the contact area of described CPU and described PCB.

7. a kind of CPU radiator structure according to claim 1, is characterized in that, the shape of described heat-conducting plate is consistent with the shape of described CPU.

8. a kind of CPU radiator structure according to claim 1, is characterized in that, described heat dissipation box is fixing on the pcb by soldering.

9. a kind of CPU radiator structure according to any one of claim 1 to 8, is characterized in that, described heat absorption material is helium or the water with large specific heat capacity.

10. a terminal, comprise CPU and PCB, described CPU is installed on a side of described PCB, it is characterized in that, also comprise the CPU radiator structure as described in any one of claim 1 to 9, described CPU radiator structure is installed on a side relative with described CPU on described PCB.