CN203984765U - A PCB board with identification marks for patch - Google Patents

Abstract

The utility model relates to the technical field of PCB boards, and in particular to a PCB board with an identification mark for patch, which includes a substrate, on which an etched electronic circuit and an identification mark are arranged, the identification mark includes a first identification mark bar and a second identification mark bar, the first identification mark bar and the second identification mark bar intersect vertically to form a cross-shaped identification mark, the point where the first identification mark bar and the second identification mark bar intersect vertically is the intersection point, and a paste solder connection ring with the intersection point as a circle is arranged on the cross-shaped identification mark. The utility model has a simple structure, and the cross-shaped identification mark is clearer than the traditional dot-shaped identification mark, and the recognition accuracy is higher when photographing and identifying. The placement machine can quickly position and patch the PCB board, and the accuracy is improved, and the production efficiency is high; in addition, the paste solder connection ring enhances the identification of the identification mark, and further improves the recognition accuracy of the identification mark.

Description

A PCB board with identification marks for patch

technical field

The utility model relates to the technical field of PCB boards, in particular to a PCB board with identification marks for patches.

Background technique

With the rapid development of electronic technology, the trend of miniaturization and miniaturization of products is becoming more and more obvious, electronic components are becoming more and more sophisticated, and the corresponding surface mount technology (SMT) is becoming more and more mature. Surface mount technology (SMT) refers to the process of placing various types of surface mount chips such as SMC/SMD on the designated position of the PCB. Its characteristics are mainly reflected in high assembly density, low solder joint defects, and strong shock resistance. , high reliability, easy to realize automation, improve production efficiency, etc. With the development of lead-free high-density electronic assembly technology, the design process of printed circuit boards has become more and more important, and correspondingly, the requirements for substrate selection, component layout, pad design, and wiring have become higher and higher. Therefore, the design and production of PCB boards for displays must be based on surface mount technology, and try to meet the requirements of high precision, high efficiency, high reliability, and easy automation.

At present, in SMT, in order to mount these miniaturized devices such as 01005 components and CSP devices, there are usually Mark points on the PCB. The Mark point is also called a mark point (reference point or feature point), which is on the surface of the PCB. Provide a common measurable point for all steps in the surface mount process, which is used to correct PCB processing errors. Before mounting, take a standard image of the Mark point and store it in the image library, and enter the coordinates of the Mark point into the paste In the chip program, each time a PCB is mounted, the Mark point is first photographed, and compared with the standard image in the image library: first, to compare whether the image of each Mark point is correct, if the image is incorrect, the placement machine considers the model of the PCB If there is an error, the alarm will not work; the second is to compare whether the center coordinates of each mark point are consistent with the coordinates of the standard image. If there is an offset, the placement machine will automatically correct each The placement position of each mounted component is to ensure accurate placement of components. Therefore, the Mark point ensures that the SMT equipment can accurately locate the PCB board components, and the Mark point is very important for SMT production.

The current Mark point includes the Mark point and the open area. The Mark point is a solid circle with a diameter of 1mm, and the material is bare copper (it can also be tin-plated, nickel-plated, gold-plated, and OSP (Organic Solderability Preservatives, organic solder protection film, protective film, etc.) ), and the radius of the open area r≥2R (R is the radius of the Mark point). However, when using the traditional Mark point patch, there will be a phenomenon that the micro-components do not completely match the solder paste printed on the stencil, and the various components are increased after reflow. The probability of such defects. Therefore, the above problems need to be solved urgently.

Utility model content

The purpose of the utility model is to provide a PCB board with an identification mark for patching to improve the accuracy of surface mount devices in view of the deficiencies in the prior art.

The utility model is achieved through the following technical solutions.

A PCB board with identification marks for patching, including a substrate, on which are provided etched electronic circuits and identification marks, the identification marks include a first identification mark strip and a second identification mark strip, the first identification mark The vertical intersection of the strip and the second identification mark strip forms a cross-shaped identification mark. The point where the first identification mark strip and the second identification mark strip vertically intersect is the intersection point. Material connecting ring.

Wherein, the part of the first identification marking strip located in the connecting ring of cream solder is provided with two first sub-marking lines perpendicularly intersecting the first identification marking strip, and the two first sub-marking lines are respectively located on two sides of the intersection point. side and symmetrical to each other; the part of the second identification marking strip located in the connecting ring of cream solder is provided with two first sub-marking lines that are perpendicular to the second identification marking strip, and the two first sub-marking lines are respectively located on the The two sides of the intersection point are symmetrical to each other.

Wherein, two second sub-marking lines are provided at the two intersections of the first identification marking strip and the paste brazing material connecting ring, and the two second sub-marking lines are perpendicular to the first identification marking strip and are both connected to the paste. tangent to the connecting ring of brazing material; two second sub-marking lines are arranged at the two intersections of the second identification marking strip and the connecting ring of cream-like soldering material, and the two second sub-marking lines are all connected to the second identification mark The strips intersect perpendicularly and are all tangent to the ring of paste solder connection.

Wherein, the two ends of the first identification mark strip are provided with two third sub-mark lines, and the two third sub-mark lines are respectively perpendicular to the two ends of the first identification mark strip and symmetrical to each other; the two ends of the second identification mark strip Two third sub-mark lines are provided, and the two third sub-mark lines are respectively perpendicular to the two ends of the second identification mark strip and symmetrical to each other.

Among them, the cross-shaped identification mark is provided with a first sub-mark circle, a second sub-mark circle and a third sub-mark circle concentric with the cream solder connection circle, and the first sub-mark circle is arranged on the paste solder joint. Inside the circle, the second sub-marking circle and the third sub-marking circle are both arranged outside the connecting circle of cream solder, and the second sub-marking circle is located between the connecting circle of cream solder and the third sub-marking circle.

Wherein, the diameter of the connecting ring of cream brazing material is 1.4-2.4 mm.

Wherein, the periphery of the cross-shaped identification mark is provided with a protective ring.

Wherein, the width of the protective ring is 8-12mil.

The beneficial effects of the utility model are: the utility model has a simple structure, and since the identification mark is in the shape of a cross, the cross-shaped identification mark is clearer than the traditional dot-shaped identification mark, and the identification accuracy is higher when taking pictures for identification, and the placement machine can Fast positioning and placement of PCB boards, with improved accuracy and high production efficiency; in addition, since the cross-shaped identification mark is provided with a paste solder connection ring, the paste solder connection ring enhances the identification of the identification mark , which further improves the recognition accuracy of the identification mark.

Description of drawings

Fig. 1 is a schematic structural view of Embodiment 1 of the present utility model.

Fig. 2 is a structural schematic diagram of the identification mark and the connecting ring of cream solder in Embodiment 1 of the present utility model.

Fig. 3 is a schematic structural view of Embodiment 2 of the present utility model.

Fig. 4 is a structural schematic diagram of the identification mark and the connecting ring of cream solder in Embodiment 2 of the present invention.

Fig. 5 is a schematic structural view of Embodiment 3 of the present utility model.

FIG. 6 is a structural schematic diagram of the identification mark and the connecting ring of cream solder in Embodiment 3 of the present invention.

Reference signs include:

1—substrate, 2—identification mark, 21—first identification mark strip, 22—second identification mark strip, 23—first sub-mark line, 24—second sub-mark line, 25—third sub-mark line, 26 - the first sub-marking circle, 27 - the second sub-marking circle, 28 - the third sub-marking circle, 3 - the connecting circle of paste brazing material.

Detailed ways

Below in conjunction with accompanying drawing, the utility model is further described.

Embodiment one.

As shown in Figure 1 and Figure 2, a PCB board with identification marks for patching in this embodiment includes a substrate 1, which is provided with etched electronic circuits and identification marks 2, identification marks 2 Including a first identification mark strip 21 and a second identification mark strip 22, the first identification mark strip 21 and the second identification mark strip 22 vertically intersect to form a cross-shaped identification mark, the first identification mark strip 21 and the second identification mark strip 22 are vertical The intersecting point is an intersection point, and the cross-shaped identification mark is provided with a paste solder connecting ring 3 with the intersection point as a circle point.

The utility model has a simple structure, and since the identification mark 2 is in the shape of a cross, the cross-shaped identification mark is clearer than the traditional dot-shaped identification mark, and the identification accuracy is higher when taking pictures for identification, and can quickly position and patch the PCB board. , and the accuracy is improved, and the production efficiency is high; in addition, since the cross-shaped identification mark is provided with a cream solder connecting ring 3, the cream solder connecting ring 3 enhances the identification of the identification mark 2, and further improves the identification The recognition accuracy of marker 2.

In this embodiment, the diameter of the connecting ring 3 of cream solder is 1.4-2.4mm. The connecting ring 3 of paste brazing material with a diameter of 1.4-2.4 mm has a high identification rate, which ensures that the placement machine can accurately identify, so that the solder paste can be accurately applied to the PCB board.

Embodiment two.

As shown in Figures 3 and 4, the difference between this embodiment and Embodiment 1 is that in this embodiment, the part of the first identification mark strip 21 located in the connecting ring 3 of cream solder is provided with two equal The first sub-marking line 23 vertically intersecting the first identification marking strip 21, the two first sub-marking lines 23 are respectively located on both sides of the intersection point and are symmetrical to each other; The inner part is provided with two first sub-marking lines 23 perpendicularly intersecting with the second identification marking strip 22, and the two first sub-marking lines 23 are respectively located on two sides of the intersection point and are symmetrical to each other.

In this embodiment, two second sub-mark lines 24 are provided at the two intersections between the first identification mark strip 21 and the cream solder connection ring 3, and the two second sub-mark lines 24 are all connected to the first identification mark. The strips 21 intersect vertically and are all tangent to the connecting ring 3 of the cream solder; the two intersections of the second identification mark bar 22 and the connecting ring 3 of the cream solder are provided with two second sub-marking lines 24, two Each of the second sub-marking lines 24 perpendicularly intersects the second identification marking strip 22 and is tangent to the connecting ring 3 of cream solder.

In this embodiment, two third sub-mark lines 25 are provided at both ends of the first identification mark strip 21, and the two third sub-mark lines 25 are respectively perpendicular to the two ends of the first identification mark strip 21 and are symmetrical to each other; Two third sub-mark lines 25 are arranged at both ends of the second identification mark strip 22 , and the two third sub-mark lines 25 are respectively perpendicular to the two ends of the second identification mark strip 22 and symmetrical to each other.

The first identification marking strip 21 or the second identification marking strip 22 of the present embodiment all have the first sub-marking line 23, the second sub-marking line 24 and the third sub-marking line 25 perpendicularly intersecting with it, forming several mutually spaced The miniature sub-cross-shaped identification mark makes the entire cross-shaped identification mark in a grid shape, and the recognition rate is further improved, so that the placement machine can be more accurately aligned with the cross-shaped identification mark when taking pictures.

Other structures of this embodiment are the same as those of Embodiment 1, and will not be repeated here.

Embodiment three.

As shown in Figure 5 and Figure 6, the difference between this embodiment and Embodiment 1 is that in this embodiment, the cross-shaped identification mark is provided with a first sub-marking ring concentric with the connecting ring 3 of cream solder 26. The second sub-marking circle 27 and the third sub-marking circle 28, the first sub-marking circle 26 is set inside the paste solder connection circle 3, the second sub-marking circle 27 and the third sub-marking circle 28 are both set On the outside of the connecting ring 3 of cream solder, the second sub-marking ring 27 is located between the connecting ring 3 of cream solder and the third sub-marking ring 28 . The entire cross-shaped identification mark has three concentric circles, the first sub-mark circle 26, the second sub-mark circle 27 and the third sub-mark circle 28, which further improve the recognition rate and make the placement machine more accurately align with the cross-shaped identification when taking pictures. mark.

Other structures of this embodiment are the same as those of Embodiment 1, and will not be repeated here.

Embodiment four.

The difference between this embodiment and Embodiment 1 lies in that: in this embodiment, a protective ring is provided on the periphery of the cross-shaped identification mark. The protective ring can effectively prevent the damage to the identification mark 2 caused by the pool effect and the flow of alkaline etching solution in the alkaline etching process of PCB board production, thereby ensuring that the alignment mark of the identification mark 2 is clear during the exposure process of the sealing cover plate mask , complete, reducing the unnecessary scrapping of PCB boards and reducing the production cost of enterprises.

In this embodiment, the width of the protective ring is 8-12mil. The width of the protective ring of 8-10mil is enough to deal with the pool effect in the alkaline etching process, and it will not increase the cost. In this way, even if the pool effect and alkaline etching solution flow during the alkaline etching process, only the protective ring will be damaged. , can completely avoid the identification mark 2 from being damaged.

Other structures of this embodiment are the same as those of Embodiment 1, and will not be repeated here.

The above-described embodiments are only preferred embodiments of the present utility model, and are not intended to limit the scope of implementation of the present utility model, so all equivalent changes or modifications made according to the structure, features and principles described in the scope of the patent application of the present utility model , should be included in the utility model patent application scope.

Claims (8)

1. the pcb board having for the identification mark of paster, comprise substrate, it is characterized in that: on substrate, be provided with electronic circuit and identification mark that etching forms, identification mark comprises the first identification mark bar and the second identification mark bar, the first identification mark bar and the second identification mark bar intersect vertically and form cross identification mark, the point that the first identification mark bar and the second identification mark bar intersect vertically is intersection point, is provided with the paste soldering material clamping ring taking intersection point as round dot in cross identification mark.

2. a kind of pcb board having for the identification mark of paster according to claim 1, it is characterized in that: the part that the first identification mark bar is positioned at paste soldering material clamping ring is provided with two the first sub-mark lines that all intersect vertically with the first identification mark bar, and two the first sub-mark lines lay respectively at the both sides of intersection point and symmetrical mutually; The part that the second identification mark bar is positioned at paste soldering material clamping ring is provided with two the first sub-mark lines that all intersect vertically with the second identification mark bar, and two the first sub-mark lines lay respectively at the both sides of intersection point and symmetrical mutually.

3. a kind of pcb board having for the identification mark of paster according to claim 2, it is characterized in that: two intersections of the first identification mark bar and paste soldering material clamping ring are provided with two the second sub-mark lines, two the second sub-mark lines all intersect vertically with the first identification mark bar and are all tangent with paste soldering material clamping ring; Two intersections of the second identification mark bar and paste soldering material clamping ring are provided with two the second sub-mark lines, and two the second sub-mark lines all intersect vertically with the second identification mark bar and be all tangent with paste soldering material clamping ring.

4. a kind of pcb board having for the identification mark of paster according to claim 3, it is characterized in that: the two ends of the first identification mark article are provided with two the 3rd sub-mark lines, two the 3rd sub-mark lines are respectively perpendicular to the two ends of the first identification mark article and symmetrical mutually; The two ends of the second identification mark article are provided with two the 3rd sub-mark lines, and two the 3rd sub-mark lines are respectively perpendicular to the two ends of the second identification mark article and symmetrical mutually.

5. a kind of pcb board having for the identification mark of paster according to claim 1, it is characterized in that: in cross identification mark, be provided with the first sub-mark circle concentric with paste soldering material clamping ring, the second sub-mark circle and the 3rd sub-mark circle, the first sub-mark circle is arranged at the inside of paste soldering material clamping ring, the second sub-mark circle and the 3rd sub-mark circle are all arranged at the outside of paste soldering material clamping ring, and the second sub-mark circle is between paste soldering material clamping ring and the 3rd sub-mark circle.

6. a kind of pcb board having for the identification mark of paster according to claim 1, is characterized in that: the diameter of paste soldering material clamping ring is 1.4-2.4mm.

7. a kind of pcb board having for the identification mark of paster according to claim 1, is characterized in that: the periphery of cross identification mark is provided with guard circle.

8. a kind of pcb board having for the identification mark of paster according to claim 7, is characterized in that: the width of guard circle is 8-12mil.