CN207612458U - Motherboard and its circuit boards - Google Patents

Abstract

The utility model provides a mainboard and circuit board thereof, this mainboard includes a circuit board, a central processing unit and a debugging device. The circuit board comprises a main circuit board, at least one auxiliary board, a stamp hole structure and a plurality of conductive layers. The main circuit board is provided with a main circuit. The auxiliary board is connected to the main circuit board and has an auxiliary circuit. The stamp hole structure is positioned at the joint of the main circuit board and the auxiliary board. The conductive layers are respectively positioned in the holes of the stamp hole structure. The conducting layer is connected with the main circuit of the main circuit board and the auxiliary circuit of the auxiliary board. The central processing unit is provided with the main circuit board and is electrically connected with the main circuit. The debugging device is arranged on the auxiliary board and is electrically connected with the auxiliary circuit.

Description

Motherboard and its circuit boards

technical field

The utility model relates to a main board, in particular to a main board including an auxiliary board and a circuit board thereof.

Background technique

Generally speaking, the mainboards of computer equipment must be tested before formal mass production to ensure the quality of the produced mainboards. The method of testing is usually to set a debug connector and its related circuit components (debug header&related circuit) on the motherboard to debug the system, and to save the production cost, after the test phase is over, the debug connector and related circuit components will be removed. Circuit components removed.

However, no matter whether the debug connector is removed or not, the motherboard needs to reserve a space for the debug connector on the motherboard, so that the space for other electronic components on the motherboard is compressed, thereby increasing the design of the motherboard. difficulty. In addition, since there is still a need for debugging after the motherboard is mass-produced and when the customer returns the motherboard, it is necessary to re-solder the debug header to the preset space on the motherboard. However, re-soldering the debug header to the main board will not only damage the appearance of the original solder joints of the main board, but also the heavy rework of re-soldering and the high temperature used in the behavior of the parts will easily cause damage to the main board and the electronic components on the main board or make the function of the main board unstable. The probability of the increase, thus affecting the correctness of debugging.

Contents of the invention

The utility model is to provide a main board and its circuit board, so as to improve the design difficulty of the main board due to the debugging connector being arranged on the main board and the printed circuit board assembly (printed circuit board assembly (PCBA) appearance damage.

The mainboard disclosed by an embodiment of the utility model includes a circuit board, a central processing unit and a debugging device. The circuit board includes a main circuit board, at least one auxiliary board, a stamp hole structure and at least one conductive layer. The main circuit board has a main circuit. At least one auxiliary board is connected to the main circuit board and has an auxiliary circuit. The stamp hole structure is located at the junction of the main circuit board and the auxiliary board. At least one conductive layer is located within at least one hole of the stamp hole structure. At least one conductive layer connects the main circuit of the main circuit board and the auxiliary circuit of the auxiliary board. The CPU sets the main circuit board and is electrically connected to the main circuit. The debugging device is arranged on the auxiliary board and is electrically connected to the auxiliary circuit.

The circuit board disclosed in another embodiment of the present invention includes a main circuit board, at least one auxiliary board, a stamp hole structure and at least one conductive layer. The main circuit board has a main circuit. At least one auxiliary board is connected to the main circuit board and has an auxiliary circuit. The stamp hole structure is located at the junction of the main circuit board and the auxiliary board. At least one conductive layer is located within at least one hole of the stamp hole structure. At least one conductive layer connects the main circuit of the main circuit board and the auxiliary circuit of the auxiliary board.

According to the main board and its circuit board disclosed in the above embodiments, the debug device is disposed on the auxiliary board outside the main circuit board, and the auxiliary board is detachably connected to the side of the main circuit board. In this way, in addition to increasing the installation space of other electronic components on the main circuit board, thereby reducing the design difficulty of the circuit board, it is also possible to quickly separate from the main circuit board after the test phase is over.

In addition, due to the conductive layer attached to the stamp hole structure. Therefore, except during the testing phase, the debugging device and the auxiliary circuit on the auxiliary board can be electrically connected to the main circuit through the stamp hole structure attached to the conductive layer, so that the electronic components on the main circuit board can be debugged; stage, if there is a need for debugging, you can also re-solder the cut-off stamp hole on the auxiliary board to the cut-off semicircular stamp hole on the main circuit board, or use a special jig for non-soldering connection, so that the original The auxiliary circuit that has been separated from the main circuit can be electrically connected to the main circuit again, so that debugging can be performed quickly.

Furthermore, after the auxiliary board is separated from the main circuit board, the stamp hole structure is located at the side of the two, and the stamp hole structure is attached with a conductive layer. In this way, if the circuit board needs to be debugged again after mass production, it only needs to re-solder the stamp hole structure located on the side of the auxiliary board and the main circuit board to reconnect the auxiliary circuit on the auxiliary board and the main circuit board Connect with the main circuit or use a special fixture without soldering. In this way, due to the location of the electrical junction, because it is located at the edge of the main circuit board, it can avoid the high temperature during soldering in the central area of the main circuit board, which will affect the appearance of the circuit board or the correctness of debugging.

The above descriptions about the content of the utility model and the following descriptions of the embodiments are used to demonstrate and explain the spirit and principle of the utility model, and provide further explanation of the claims of the utility model.

Description of drawings

FIG. 1 is a schematic plan view of the motherboard according to the first embodiment of the present invention.

FIG. 2 is a schematic partial cross-sectional view of the motherboard of FIG. 1 .

FIG. 3 is a schematic plan view of reflowing the auxiliary board of FIG. 1 to the main circuit board.

Fig. 4 is a partial plan view of the main board according to the second embodiment of the present invention. Fig. 5 is a schematic plan view of the main board according to the third embodiment of the present invention.

FIG. 6 is a schematic plan view of the motherboard according to the fourth embodiment of the present invention.

Among them, reference signs:

1a motherboard

10, 10' circuit board

101, 101' main circuit board

1011 setting surface

1012 back

1013 main circuit

102 auxiliary board

1021 setting surface

1022 back

1023 auxiliary circuit

103 connecting board

1031 first side

1032 second side

104, 104'stamp hole structure

1041 first piercing

10411 ring wall

1042 second perforation

10421 ring wall

1043 long hole

105a, 105b, 105c conductive layer

106 milling groove

20 CPU

30 Debugging device

D1 milling groove width

D2 connecting plate width

D3 slot width

Detailed ways

The detailed features and advantages of the present utility model are described in detail below in the embodiment, and its content is enough to make any person skilled in the art understand the technical content of the present utility model and implement it accordingly, and according to the content disclosed in this specification, the claims are protected. With the scope and accompanying drawings, anyone skilled in the art can easily understand the related objects and advantages of the present invention. The following examples further describe the viewpoints of the present utility model in detail, but do not limit the scope of the present utility model in any way.

Please refer to Figure 1 and Figure 3. FIG. 1 is a schematic plan view of the motherboard according to the first embodiment of the present invention. FIG. 2 is a schematic partial cross-sectional view of the motherboard of FIG. 1 . FIG. 3 is a schematic plan view of reflowing the auxiliary board of FIG. 1 to the main circuit board.

In this embodiment, a motherboard 1 a is disclosed, including a circuit board 10 , a CPU 20 and a debugging device 30 . The circuit board 10 includes a main circuit board 101 , two auxiliary boards 102 , four connection boards 103 , a stamp hole structure 104 and a plurality of conductive layers 105 a.

The main circuit board 101 has a setting surface 1011 , a back surface 1012 and a main circuit 1013 . The installation surface 1011 is opposite to the rear surface 1012 . The main circuit 1013 is disposed on the installation surface 1011 .

Two auxiliary boards 102 are respectively located on two sides of the main circuit board 101 . Each auxiliary board 102 has an installation surface 1021 , a back surface 1022 and an auxiliary circuit 1023 . The installation surface 1021 is opposite to the rear surface 1022 . The installation surface 1021 of the auxiliary board 102 is located on the same side of the circuit board 10 as the installation surface 1011 of the main circuit board 101 . The auxiliary circuit 1023 is disposed on the installation surface 1021 of the auxiliary board 102 .

Two of the four connection boards 103 are connected between the main circuit board 101 and an auxiliary board 102 , and the other two connection boards 103 are connected between the main circuit board 101 and another auxiliary board 102 . In detail, each connecting plate 103 has a first side 1031 and a second side 1032 opposite to each other. The first side 1031 of the connection board 103 is connected to the main circuit board 101, and the second side 1032 of the connection board 103 is connected to the auxiliary board 102, so that the main circuit board 101 is separated from the auxiliary board 102 and separated from the main circuit board 101 and the auxiliary board. A milled slot 106 is formed between 102 . The width D1 of the milling groove 106 is substantially equal to the width D2 of the connecting plate 103 . The width D1 of the milling groove 106 must be designed according to the width of the drill bit of the board splitter (not shown), that is, the width D1 of the milling slot 106 is substantially equal to the width of the drill bit of the board splitter. The so-called substantially equal is equal to or close to equal due to processing errors. The purpose of defining the width of the milling groove 106 will be described later.

The stamp hole structure 104 includes a plurality of first through holes 1041 and a plurality of second through holes 1042 . The first through holes 1041 are arranged on the first side 1031 of the connecting board 103 , and the second through holes 1042 are arranged on the second side 1032 of the connecting board 103 . In detail, part of the first through hole 1041 is located on the main circuit board 101 , and another part of the first through hole 1041 is located on the connection board 103 . Part of the second through hole 1042 is located on the auxiliary board 102 , and the other part is located on the connection board 103 .

In addition, the number of the first through holes 1041 and the distance between them are also the same as the number of the second through holes 1042 and the distance between them, and the diameter and position of the first through hole 1041 and the diameter and position of the second through hole 1042 correspond to each other. It will be explained later.

These conductive layers 105a are made of copper, for example, and are respectively plated on the annular wall surfaces 10411, 10421 of the first through holes 1041 and the second through holes 1042 of the stamp hole structure 104, and are connected to the main circuit 1013 of the main circuit board 101. and the auxiliary circuit 1023 of the auxiliary board 102 . In addition, the conductive layer 105 a located in the first through hole 1041 respectively extends from one end of the first through hole 1041 located on the device surface 1011 , 1021 to one end located on the rear surface 1012 , 1022 . The conductive layer 105 a located in the second through hole 1042 respectively extends from one end of the second through hole 1042 located on the device surface 1011 , 1021 to one end located on the rear surface 1012 , 1022 .

In this embodiment, electronic components such as the CPU 20 are disposed on the installation surface 1011 of the main circuit board 101 and are electrically connected to the main circuit 1013 . The debug device 30 is disposed on the installation surface 1021 of the auxiliary board 102 and is electrically connected to the auxiliary circuit 1023 , and the main circuit 1013 is electrically connected to the auxiliary circuit 1023 through the conductive layer 105 a. In this way, the debug device 30 on the auxiliary board 102 can debug the main circuit 1013 and the electronic components on the main circuit 1013 during the testing phase of the circuit board 10 .

Then, at the end of the testing phase, the auxiliary board 102 can be retained or removed according to the requirements of the manufacturing process. For example, the auxiliary board 102 is reserved for edge detection during automatic transportation, or the auxiliary board 102 is cut off before packaging to reduce the volume of the circuit board 10 . Since the debug device 30 is disposed on the auxiliary board 102 , when the auxiliary board 102 is cut off, the debug device 30 is also removed, which simplifies the removal of the debug device 30 . In addition, since the debug device 30 is disposed on the auxiliary board 102 , it is possible to save the space reserved for the debug device 30 on the main circuit board 101 , thereby avoiding waste of space on the main circuit board 101 .

The procedure for cutting off the auxiliary board 102 is to place the drill of the board splitting machine in the milling slot 106 first, and then the drill of the board splitting machine can move along the milling slot 106 and cut off the connecting board 103 . In addition, since the width D1 of the milling groove 106 is equal to the width of the drill bit of the board splitter, the connection board 103 can be completely cut off, and after the connection board 103 is cut off, half parts can be left on the main circuit board 101 and the auxiliary board 102 respectively. stamp hole structure 104 .

After mass production, if there is a need for debugging again due to customer repair, it is only necessary to re-solder the auxiliary board 102 with the debugging device 30 to the main circuit board 101 to perform debugging. In detail, as shown in FIG. 3 , the sides of the main circuit board 101 and the auxiliary board 102 each have a half stamp hole structure 104, and because the size and position of the first through hole 1041 and the second through hole 1042 correspond, therefore, the second The first through hole 1041 and the second through hole 1042 can be reconnected by welding, so that the main circuit 1013 and the auxiliary circuit 1023 are conducted again. At this time, the debug device 30 on the auxiliary board 102 can debug the main circuit 1013 and electronic components on the main circuit board 101 again. In this way, it is possible to prevent the high temperature generated when the debug device 30 is re-soldered to the main circuit board 101 to damage the electronic components of the main circuit board 101, thus affecting the debugging results, or leaving tin slag or flux on the circuit board 101 and affect the appearance.

In addition, the conductive layer 105 a extends from the device surface 1011 , 1021 to the rear surface 1012 , 1022 . Therefore, when the auxiliary board 102 is reflowed to the main circuit board 101, it is only necessary to reflow the stamp hole structure 104 at one end of the installation surface 1011, 1021, without completely soldering the entire through hole, so that the main circuit 1013 and auxiliary The circuit 1023 is electrically connected, thereby improving the convenience of reflow.

In this embodiment, the material of the conductive layer 105a is copper, but it is not limited thereto. In other embodiments, the conductive layer can also be made of other materials with good conductivity, such as silver.

In addition, in this embodiment, the perforations 1041 and 1042 of the stamp hole structure 104 are circular in shape, but it is not limited thereto, and may be in any other shape.

Furthermore, the auxiliary board 102 is reconnected to the main circuit board 101 by soldering for debugging, but it is not limited thereto. In other embodiments, special fixtures can also be used to connect the auxiliary board 102 and the main circuit board 101 .

It should be noted that, in this embodiment, the debug device 30 is a debug header and is directly disposed on the auxiliary board 102 , but it is not limited thereto. In other embodiments, the debugging device can also be a light-emitting diode (LED) signal for judging the debugging result, or a third device or circuit board is indirectly installed on the auxiliary board through the debugging connector.

Furthermore, identification marks (not shown) can be printed on the installation surface 1021 of the auxiliary board 102 . The identification mark can be, for example, silk screen. It can help automatic equipment identify the direction of components or printed circuit board (PCB) during the process, or ensure that the auxiliary board 102 can be reflowed to the main circuit board 101 in the correct direction.

In the foregoing embodiments, the conductive layer 105a is hollowly attached to the annular wall surfaces 10411 and 10421 of the first through hole 1041 and the second through hole 1042 , but the present invention is not limited thereto. Please refer to FIG. 4 . FIG. 4 is a partial plan view of the motherboard according to the second embodiment of the present invention. In this embodiment, the conductive layer 105 b is solidly filled in the first through hole 1041 and the second through hole 1042 of the stamp hole structure 104 .

In the foregoing embodiments, the number of auxiliary boards 102 is two, but it is not limited thereto. Please refer to FIG. 5 . FIG. 5 is a schematic plan view of a motherboard according to a third embodiment of the present invention. In this embodiment, the circuit board 10' is not a miniature circuit board, and the area of the main circuit board 101' has enough space for edge finding, so only an auxiliary board 102 can be included.

In the foregoing embodiments, the perforations 1041 and 1042 of the stamp hole structure 104 are circular perforations formed on both sides of the connecting plate 103 , but the present invention is not limited thereto. Please refer to FIG. 6 . FIG. 6 is a schematic plan view of a motherboard according to a fourth embodiment of the present invention. In this embodiment, the stamp hole structure 104' includes a plurality of elongated holes 1043. The elongated hole 1043 intersects both the first side 1031 and the second side 1032 of the connecting plate 103 . The width D3 of each elongated hole 1043 between the first side 1031 and the second side 1032 is the same. That is to say, except that the width of each elongated hole 1043 on the first side 1031 is equal to the width on the second side 1032 , the width of each elongated hole 1043 on the connecting plate 103 is also the same. The conductive layer 105c is respectively located in the elongated holes 1043 and attached to the annular wall 10431 surrounding the elongated holes 1043 . The advantage of the elongated hole 1043 is that the width D1 of the milling slot 106 does not need to be exactly equal to the width of the drill of the splitter (not shown), and the designed width D1 of the milling slot 106 only needs to be greater than or equal to the drill of the splitter (not shown) width. In detail, if the width of the drill bit is smaller than the width D1 of the milling slot 106 , the drill bit will only cut off part of the connection board 103 , resulting in remaining part of the connection board 103 on the main circuit board 101 and the auxiliary board 102 . And because the width of the elongated hole 1043 on the connecting plate 103 is equal, so even if the connecting plate 103 is not completely cut off, the remaining connecting plate 103 on the main circuit board 101 and the remaining connecting plate 103 on the auxiliary board 102 can still be docked with reflow.

According to the main board and its circuit board of the above-mentioned embodiment, since the debugging device is arranged on the auxiliary board outside the main circuit board or a third device or circuit board is connected to the auxiliary board by a debug connector, and the auxiliary board Detachably connected to the side of the main circuit board. In this way, in addition to increasing the installation space of other electronic components on the main circuit board, thereby reducing the design difficulty of the circuit board, it is also possible to quickly separate from the main circuit board after the test phase is over.

In addition, due to the conductive layer attached to the stamp hole structure. Therefore, except during the testing phase, the debugging device and the auxiliary circuit on the auxiliary board can be electrically connected to the main circuit through the stamp hole structure attached to the conductive layer, so that the electronic components on the main circuit board can be debugged; stage, if there is a need for debugging, you can also re-solder the cut-off stamp hole on the auxiliary board to the cut-off semicircular stamp hole on the main circuit board, or use a special jig for non-soldering connection, so that the original The auxiliary circuit that has been separated from the main circuit can be electrically connected to the main circuit again, so that debugging can be performed quickly.

Furthermore, after the auxiliary board is separated from the main circuit board, the stamp hole structure is located at the side of the two, and the stamp hole structure is attached with a conductive layer. In this way, if the circuit board needs to be debugged again after mass production, it only needs to re-solder the stamp hole structure located on the side of the auxiliary board and the main circuit board to reconnect the auxiliary circuit on the auxiliary board and the main circuit board Connect with the main circuit or use a special fixture without soldering. In this way, due to the location of the electrical junction, because it is located at the edge of the main circuit board, it can avoid the high temperature during soldering in the central area of the main circuit board, which will affect the appearance of the circuit board or the correctness of debugging.

Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.

Claims (12)

1. A circuit board, characterized in that the circuit board comprises: a main circuit board with a main circuit; At least one auxiliary board, the at least one auxiliary board is connected to the main circuit board and has an auxiliary circuit; a stamp hole structure located at the junction of the main circuit board and the at least one auxiliary board; and At least one conductive layer is respectively located in at least one hole of the stamp hole structure, and the at least one conductive layer connects the main circuit of the main circuit board and the auxiliary circuit of the auxiliary board. 2. The circuit board according to claim 1, further comprising at least one connection board, the at least one connection board has a first side and a second side opposite to each other, the at least one connection board has a The first side is connected to the main circuit board, and the second side of the at least one connection board is connected to the at least one auxiliary board. The stamp hole structure includes a plurality of first through holes and a plurality of second through holes, and the first The through holes are arranged on the first side, the second through holes are arranged on the second side, and the number of the at least one conductive layer is multiple, and the conductive layers are respectively located in the first through holes and the second inside the piercing. 3. The circuit board according to claim 2, wherein the number and spacing of the first through holes are the same as the number and spacing of the second through holes, and the distance between the first through holes and the second through holes is The aperture and the position correspond to each other. 4. The circuit board according to claim 3, wherein the conductive layers are respectively attached to a plurality of annular walls surrounding the first through holes and the second through holes. 5. The circuit board according to claim 4, wherein the conductive layers located in the first through holes respectively extend from one end of the first through holes to the other end of the first through holes, and are located in the first through holes. The conductive layers of the second through holes respectively extend from one end of the second through holes to the other end of the second through holes. 6. The circuit board according to claim 1, further comprising at least one connection board, the at least one connection board has a first side and a second side opposite to each other, the at least one connection board has a The first side is connected to the main circuit board, and the second side of the at least one connection board is connected to the at least one auxiliary board. The stamp hole structure includes a plurality of elongated holes, and the elongated holes are connected to the first side. Both sides and the second side are intersected, and the quantity of the at least one conductive layer is multiple, and the conductive layers are respectively located in the elongated holes. 7. The circuit board according to claim 6, wherein each of the elongated holes has the same width between the first side and the second side. 8 . The circuit board according to claim 1 , further comprising an identification mark disposed on the at least one auxiliary board. 9. The circuit board according to claim 2 or 6, wherein the number of the at least one connection board and the at least one auxiliary board is two, and the two first sides of the two connection boards are respectively connected On opposite sides of the main circuit board, the two auxiliary boards are respectively connected to the two second sides of the two connection boards. 10. A mainboard, characterized in that the mainboard comprises: A circuit board, comprising: a main circuit board with a main circuit; At least one auxiliary board, the at least one auxiliary board is connected to the main circuit board and has an auxiliary circuit; a stamp hole structure located at the junction of the main circuit board and the at least one auxiliary board; and at least one conductive layer located in at least one hole of the stamp hole structure, and the at least one conductive layer connects the main circuit of the main circuit board and the auxiliary circuit of the auxiliary board; a central processing unit, disposed on the main circuit board and electrically connected to the main circuit; and A debugging device is arranged on the at least one auxiliary board and is electrically connected to the auxiliary circuit. 11. The motherboard according to claim 10, wherein the debug device is directly disposed on the at least one auxiliary board. 12. The motherboard according to claim 10, wherein the debug device is indirectly disposed on the at least one auxiliary board.