CN203799605U - LED display unit module capable of restoring natural spectrum - Google Patents
LED display unit module capable of restoring natural spectrum Download PDFInfo
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- CN203799605U CN203799605U CN201420181306.7U CN201420181306U CN203799605U CN 203799605 U CN203799605 U CN 203799605U CN 201420181306 U CN201420181306 U CN 201420181306U CN 203799605 U CN203799605 U CN 203799605U
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- 238000001228 spectrum Methods 0.000 title claims abstract description 29
- 235000012431 wafers Nutrition 0.000 claims abstract description 82
- 238000004806 packaging method and process Methods 0.000 claims description 47
- 230000005496 eutectics Effects 0.000 claims description 19
- 230000009467 reduction Effects 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000003086 colorant Substances 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
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- 238000003786 synthesis reaction Methods 0.000 abstract 1
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- 238000013459 approach Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model relates to an LED display unit module capable of restoring a natural spectrum. The LED display unit module comprises a package substrate, a wafer support, a bonding layer, a connector device, a plurality of LED wafers, an application-specific integrated circuit core, a heat dissipation layer and a heat dissipation cover plate; the plurality of LED wafers particularly comprise a red LED wafer, a green LED wafer, a blue LED wafer and a corrective LED wafer. According to the LED display unit module capable of restoring the natural spectrum, the LED wafers of basic component lights are arranged in the display unit module to supplement missing spectrums compared with visible light during the synthesis of three primary colors, so that the synthesized spectrum can be improved to be close to a full spectrum within a visible light range as far as possible, thereby restoring a scene under the natural light to be displayed through a video as much as possible.
Description
Technical field
The utility model relates to semiconductor applications, relates in particular to a kind of LED display unit module of realizing the reduction of nature spectrum.
Background technology
Come from the shooting of the natural scene under natural light, in Digital Image Processing, just extracted the RGB in natural light (RGB) composition, that is to say in current video image record and the application of reduction display technique, all based on three primary colours, decompose and the synthetic original image of going back.
Under natural light, human eye perceives nature, comfortable, be because human eye has been accepted the general light of all-wave, in human eye organ, thousands of kinds of corresponding photosensory cells are all accepted stimulates and produces thus due to the balanced colourity of video scene and the sensitization vision of luminosity.And the synthetic spectrum of going back original image of LED three primary colours is not consistent with natural light spectrum, in visible region, lack a lot of POPs.The synthetic spectrum of going back original image of natural light spectrum and LED three primary colours relatively can be as shown in Figure 1.
In order to create abundanter Color Range, having watched better of user experienced, therefore need a kind of LED display device that can reduce the full spectrum of natural light.
Utility model content
The purpose of this utility model is to provide a kind of LED display unit module that can overcome above-mentioned defect.
The utility model provides a kind of LED display unit module of realizing the reduction of nature spectrum, it is characterized in that comprising: base plate for packaging, chip support, bonding coat, interface arrangement, a plurality of LED wafer, dedicated IC chip, heat dissipating layer and heat-dissipating cover plate;
Described a plurality of LED wafer specifically comprises:
Red LED wafer, green LED wafer, blue led wafer and rectification light LED wafer.
Preferably, described base plate for packaging is arranged in described chip support, and described a plurality of LED flip-chip are arranged at the end face of described base plate for packaging, by described bonding coat, is connected with described base plate for packaging; Described dedicated IC chip upside-down mounting is arranged at the bottom surface of described base plate for packaging, by described heat dissipating layer and heat-dissipating cover plate, is fixed in described chip support; Described interface arrangement is arranged in the bottom surface and the chip support between described heat-dissipating cover plate of described base plate for packaging, and exposes by the outward opening having on described heat-dissipating cover plate;
Described a plurality of LED wafer is electrically connected to described dedicated IC chip by described bonding coat and described base plate for packaging; Described base plate for packaging is electrically connected to external circuit by described interface arrangement.
Preferably, described LED display unit module also comprises:
Diaphragm, has optical grating structure, is covered on described a plurality of LED wafer.
Preferably, described LED display unit module also comprises:
Fixture, described heat-dissipating cover plate is anchored on described chip support by described fixture.
Preferably, described chip support specifically comprises:
A plurality of second grooves of the first groove of accommodating described dedicated IC chip and accommodating described a plurality of LED wafers.
Preferably, described rectification light LED wafer specifically comprises:
A plurality of LED purple wafers, the yellow wafer of a plurality of LED and a plurality of LED white wafer.
Preferably, between the center of described many group wafer cells, be equally spaced.
Preferably, described base plate for packaging comprises at least two circuit layers and at least one insulating medium layer, isolates, and be electrically connected to by the through hole of described insulating medium layer between every two-layer described circuit layer by insulating medium layer.
Preferably, described base plate for packaging also comprises packaging solder ball.
The LED display unit module of realizing the reduction of nature spectrum of the present utility model, by configured the LED wafer of other fundamental component light in display unit module, to supply three primary colours, compare the spectrum that visible ray is lacked when synthetic, the spectrum of synthetic light is improved, approach as far as possible the full spectrum in visible-range, thereby realize the scene of reducing as far as possible under natural light, carry out video demonstration.
Accompanying drawing explanation
Fig. 1 is that the synthetic spectrum of going back original image of natural light spectrum and LED three primary colours compares schematic diagram;
The sectional view of the LED display unit module that Fig. 2 the utility model embodiment provides;
The chip support of LED display unit module and the diagrammatic cross-section of base plate for packaging that Fig. 3 provides for utility model embodiment;
The front partial schematic diagram of the LED display unit module that Fig. 4 provides for the utility model embodiment;
The reduction spectrum comparison diagram that Fig. 5 provides for the utility model embodiment.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
The LED display unit module of realizing the reduction of nature spectrum of the present invention, is mainly used in LED display, Ultra fine pitch LED display, super-high density LED display, the just luminous TV of LED, the just luminous monitor of LED, LED video wall, LED indication, the display panel manufacture in the fields such as LED special lighting.
Fig. 2 is the sectional view of the LED display unit module of realizing nature spectrum reduction that provides of the utility model embodiment.As shown in Figure 2, LED display unit module comprises: base plate for packaging 4, chip support 3, bonding coat 11, interface arrangement 6, a plurality of LED wafer 2, dedicated IC chip 9, heat dissipating layer 8 and heat-dissipating cover plate 10;
Base plate for packaging 4 is arranged in chip support 3, and a plurality of LED wafers 2 directly weld (Direct Attach, DA) eutectic upside-down mounting and are arranged at the end face of base plate for packaging 4, by bonding coat 11, are connected with base plate for packaging 4; Dedicated IC chip 9 upside-down mountings are arranged at the bottom surface of base plate for packaging 4, by BGA technique or utilize bonding coat technique to be connected with base plate for packaging 4, and assist dedicated IC chips 9 heat radiations by heat dissipating layer 8 and heat-dissipating cover plate 10; Interface arrangement 6 is arranged in the bottom surface and the chip support 3 between heat-dissipating cover plate 10 of base plate for packaging 4, and by the opening 101 that has on heat-dissipating cover plate 10 to exposing outside;
A plurality of LED wafers 2 are electrically connected to dedicated IC chip 9 by bonding coat 11 and base plate for packaging 4; Base plate for packaging 4 is electrically connected to external circuit by interface arrangement 6.Interface arrangement 6 can be the USB interface of standard USB interface or compatible power supply and data communication.Interface arrangement 6 is connected with base plate for packaging 4 by cementing.
In conjunction with the diagrammatic cross-section of the chip support shown in Fig. 3 and base plate for packaging, chip support 3 is elaborated.
The silicones injection moulding that chip support 3 adopts high machinery and thermodynamic stability and has good dielectric properties is made, or uses other satisfactory die-casting material die casting to make.Specifically comprise: a plurality of the second grooves 32 and the packaging solder ball 33 of the first groove 31 of accommodating dedicated IC chip, accommodating a plurality of LED wafers.
Concrete, LED wafer of the present utility model comprises that described a plurality of LED wafer specifically comprises: red LED wafer, green LED wafer, blue led wafer and rectification light LED wafer.Wherein correct light LED wafer and can specifically include but not limited to a plurality of LED purple wafers, the yellow wafer of a plurality of LED and a plurality of LED white wafer.They are preferably LED eutectic wafer, are welded on the pixel sides of PCB multilayer printed circuit board by eutectic.Because LED eutectic wafer does not re-use the integrated operations of traditional LED such as die bond, routing welding in its production technology, therefore can adopt disposable its dress on base plate for packaging 4 that completes of die bond ultrasonic seamless bonding machine to paste and welding sequence.Meanwhile, because the dustproof transparence of protection against the tide that LED eutectic wafer has completed in the processing procedure of itself is processed, so also saved traditional LED packaging process.Therefore, adopt the LED display unit module of the present utility model of LED eutectic wafer can save a large amount of manufacturing costs, simultaneously also for display board yield rate, stability, non-maintaining in the long life provide good technology and technique to guarantee.
The accommodating one group of LED wafer set of each second groove 32.Concrete, above-mentioned the second groove 32 rules are arranged, preferred, are equidistant arrangement, and each group wafer at least comprises the red wafer of an eutectic LED, a green wafer of eutectic LED, a blue wafer of eutectic LED and one or more rectification light LED wafer.In the partial elevation view shown in Fig. 4, provided the example that every group of wafer comprises the red wafer of an eutectic LED, a green wafer of eutectic LED, a blue wafer of eutectic LED, an eutectic LED purple wafer, an eutectic LED white wafer and a yellow wafer of eutectic LED.The eutectic wafer that can also comprise other color in other examples.Putting in order of LED eutectic wafer in every group of wafer can be identical with mode, can be also different.
Base plate for packaging 4 also has a plurality of packaging solder ball 33; Packaging solder ball 33 is the pad of dedicated IC chip face-down bonding on base plate for packaging 4.
Base plate for packaging 4 comprises at least two circuit layer (not shown)s and at least one insulating medium layer (not shown), isolates, and be electrically connected to by the through hole of described insulating medium layer between every two-tier circuit layer by insulating medium layer.
Concrete, the circuit layer of base plate for packaging 4 is that multilayer vapor deposition forms, and can be two-layer, four layers, six layers or other numbers of plies, insulation course is preferably highly purified resin medium, insulate bonding between adjacent circuit layer by insulation course.Between each circuit layer by various guide hole (not shown)s of arranging in advance or the staggered electric connection of blind hole (not shown).After crimping moulding, a side of base plate for packaging 4 be pixel sides for welding LED wafer, opposite side is circuit side, for welding other necessary circuit, data-interface and processing module.In the present embodiment, be preferably the dedicated IC chip that welding has video communication control circuit and power circuit function.The base plate for packaging 4 of the present embodiment is high-density integrated, has good bending resistance tensile strength and flatness.
Again as shown in Figure 2, in interface arrangement 6, there is the electric connection line (not shown) that connects external circuit, for example electric wire, contact pin or the other forms of electric connection line for being electrically connected to.A plurality of LED wafers 2 of upside-down mounting on base plate for packaging 4 are connected with the electric connection line in interface arrangement 6 by base plate for packaging 4 with dedicated IC chip 9, thereby realize and being electrically connected to of external circuit.
Between heat-dissipating cover plate 10 and dedicated IC chip 9, also have heat dissipating layer 8, preferred, heat dissipating layer 8 is made for silicon thermal paste; Heat-dissipating cover plate 10 is aluminium cover plate.
The utility model LED display unit module also comprises fixture 7, preferred, and this fixture 7 can be that magnetic is installed inserts, can certainly adopt the installation inserts of other modes as fixture 7.Heat-dissipating cover plate 10 is anchored on chip support 3 by fixture 7.
The utility model LED display unit module also comprises diaphragm 1, is covered on a plurality of LED wafers.
Concrete, protection mould 1 is preferably the diaphragm that has optical grating function concurrently.
When the above-mentioned LED display unit module of integrated the present invention, first on the chip support 3 that is cast with base plate for packaging 4, adopt surface mounting technology (Surface Mounted Technology burying, SMT) or adhesive bonding technique be pasted into a plurality of LED wafers 2 of eutectic upside-down mounting, replant into upside-down mounting dedicated IC chip 9, after electrical detection is confirmed, silicon-coating thermal paste on dedicated IC chip 9, forms heat dissipating layer 8, and heat-dissipating cover plate 10 is pasted in above-mentioned silicon thermal paste.Finally, after said modules is clean, in the one side with a plurality of LED wafers 2 and chip support 3, stick on the diaphragm 1 that has optical grating function concurrently.
The LED display unit module of realizing the reduction of nature spectrum of the present utility model, by configured the LED wafer of other fundamental component light in display unit module, to supply three primary colours, compare the spectrum that visible ray is lacked when synthetic, the spectrum of synthetic light is improved, approach as far as possible the full spectrum in visible-range, thereby realize the scene of reducing as far as possible under natural light, carry out video demonstration.Reduction spectrum comparison diagram specifically can be as shown in Figure 5.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only embodiment of the present utility model; and be not used in and limit protection domain of the present utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (10)
1. a LED display unit module of realizing the reduction of nature spectrum, is characterized in that, comprising: base plate for packaging, chip support, bonding coat, interface arrangement, a plurality of LED wafer, special IC core, heat dissipating layer and heat-dissipating cover plate;
Described a plurality of LED wafer specifically comprises:
Red LED wafer, green LED wafer, blue led wafer and rectification light LED wafer.
2. LED display unit module according to claim 1, it is characterized in that, described base plate for packaging is arranged in described chip support, and described a plurality of LED flip-chip are arranged at the end face of described base plate for packaging, by described bonding coat, is connected with described base plate for packaging; Described dedicated IC chip upside-down mounting is arranged at the bottom surface of described base plate for packaging, by described heat dissipating layer and described heat-dissipating cover plate, is fixed in described chip support; Described interface arrangement is arranged in the bottom surface and the chip support between described heat-dissipating cover plate of described base plate for packaging, and exposes by the outward opening having on described heat-dissipating cover plate;
Described a plurality of LED wafer is electrically connected to described dedicated IC chip by described bonding coat and described base plate for packaging; Described base plate for packaging is electrically connected to external circuit by described interface arrangement.
3. LED display unit module according to claim 1, is characterized in that, described LED display unit module also comprises:
Diaphragm, has optical grating structure, is covered on described a plurality of LED wafer.
4. LED display unit module according to claim 1, is characterized in that, described LED display unit module also comprises:
Fixture, described heat-dissipating cover plate is anchored on described chip support by described fixture.
5. LED display unit module according to claim 1, is characterized in that, described chip support specifically comprises:
A plurality of second grooves of the first groove of accommodating described dedicated IC chip and accommodating described a plurality of LED wafers.
6. LED display unit module according to claim 1, is characterized in that, described rectification light LED wafer specifically comprises:
A plurality of LED purple wafers, the yellow wafer of a plurality of LED and a plurality of LED white wafer.
7. LED display unit module according to claim 1, is characterized in that, the red wafer of described a plurality of LED, the green wafer of described a plurality of LED, the blue wafer of described a plurality of LED and described a plurality of rectification light LED wafer are LED eutectic wafer.
8. LED display unit module according to claim 1, is characterized in that, between the center of described many group wafer cells, is equally spaced.
9. LED display unit module according to claim 1, it is characterized in that, described base plate for packaging comprises at least two circuit layers and at least one insulating medium layer, isolates, and be electrically connected to by the through hole of described insulating medium layer between every two-layer described circuit layer by insulating medium layer.
10. LED display unit module according to claim 1, is characterized in that, described base plate for packaging also comprises packaging solder ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420181306.7U CN203799605U (en) | 2014-04-15 | 2014-04-15 | LED display unit module capable of restoring natural spectrum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420181306.7U CN203799605U (en) | 2014-04-15 | 2014-04-15 | LED display unit module capable of restoring natural spectrum |
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| Publication Number | Publication Date |
|---|---|
| CN203799605U true CN203799605U (en) | 2014-08-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420181306.7U Expired - Lifetime CN203799605U (en) | 2014-04-15 | 2014-04-15 | LED display unit module capable of restoring natural spectrum |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229312A (en) * | 2016-08-30 | 2016-12-14 | 厦门华联电子有限公司 | A kind of full spectrum CSP packaged light source and manufacture method thereof |
| CN107134244A (en) * | 2017-03-27 | 2017-09-05 | 利亚德光电股份有限公司 | Display device and display system |
-
2014
- 2014-04-15 CN CN201420181306.7U patent/CN203799605U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229312A (en) * | 2016-08-30 | 2016-12-14 | 厦门华联电子有限公司 | A kind of full spectrum CSP packaged light source and manufacture method thereof |
| CN107134244A (en) * | 2017-03-27 | 2017-09-05 | 利亚德光电股份有限公司 | Display device and display system |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160815 Address after: 214100, Jiangsu, Wuxi Province, high road, Binhu District No. 999 (software R & D building) Patentee after: HUANSHI ADVANCED DIGITAL DISPLAY WUXI CO.,LTD. Address before: 100097 room B1F, unit four, building No. three, Far East Road, Haidian District, Beijing Patentee before: Cheng Jun Patentee before: Yan Min Patentee before: Zhou Mingbo |
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| CX01 | Expiry of patent term |
Granted publication date: 20140827 |
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| CX01 | Expiry of patent term |