CN203433750U - LED display unit module - Google Patents
LED display unit module Download PDFInfo
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- CN203433750U CN203433750U CN201320406916.8U CN201320406916U CN203433750U CN 203433750 U CN203433750 U CN 203433750U CN 201320406916 U CN201320406916 U CN 201320406916U CN 203433750 U CN203433750 U CN 203433750U
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- led
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- packaging
- display unit
- unit module
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- 235000012431 wafers Nutrition 0.000 claims abstract description 84
- 238000004806 packaging method and process Methods 0.000 claims abstract description 62
- 230000005496 eutectics Effects 0.000 claims description 19
- 238000004891 communication Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract 8
- 238000000034 method Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Abstract
The utility model relates to an LED display unit module which comprises a packaging substrate, a wafer support, a bonding layer, an interface device, a plurality of LED wafers, an application-specific integrated circuit chip, a radiating layer and a radiating cover plate. The packaging substrate is arranged in the wafer support, the LED wafers are inversely arranged on the top face of the packaging substrate and connected with the packaging substrate through the bonding layer, the application-specific integrated circuit chip is inversely arranged on the bottom face of the packaging substrate and fixed in the wafer support through the radiating layer and the radiating cover plate, the interface device is arranged at the position, between the bottom face of the packaging substrate and the radiating cover plate, in the wafer support and exposed out through an opening in the radiating cover plate, the LED wafers are electrically connected with the application-specific integrated circuit chip through the bonding layer and the packaging substrate, and the packaging substrate is electrically connected with an external circuit through the interface device. The high-density LED display unit module has good heat stability, strength and flatness.
Description
Technical field
The present invention relates to semiconductor applications, relate in particular to a kind of LED display unit module.
Background technology
In recent ten years, in demonstration field, there is the variation of twice directivity.Before and after 2000, cathode ray tube (CRT) industry faces alternative crisis.After that, main flow direction trends towards plasma demonstration (PDP) and tft liquid crystal demonstration (TFT-LCD).By development in more than 10 years, TFT-LCD became demonstration field main flow.Then, along with the progress of TFT-LCD and electroluminescence (EL) technology, active organic light emitting display (AMOLED) also starts industrialization.In addition, flexibility shows that the novel display techniques such as (Flexible Display), laser display (Laser Display) continue to bring out.At present, the arguement of the relevant display industries developing direction of a new round starts again.No matter, from TFT-LCD or AMOLED development angle, all can clearly see two large key driving force of semiconductor display industries development: the one, technical progress; The 2nd, market application.For this reason, people in the industry has proposed " semiconductor demonstration " this industry and has newly defined, and expectation can produce guiding and help to the development of next step display industries.
For example, the application of semiconductor light-emitting-diode (LED, Light Emitting Diode) has jumbo expansion in this year, and wherein, the market of the tool potentiality of growing up is at the soonest application backlight of LCDs (LCD).Between several years, white light-emitting diode is general gradually along with the application backlight of small display screen, and the color liquid crystal panel in current nearly all mobile phone all provides backlight by light emitting diode.Recently, white light-emitting diode more starts to march toward more high-performance and the display backlight application on knee of longer working time.Yet light emitting diode is entering large scale display screen, as not smooth on the road of PC display screen and TV applications.This situation is because except more best performance and longer off-the-job, large-scale liquid crystal panel need to be used as this class light emitting diode (LED) of red, green, blue (RGB) and create abundanter Color Range, just can provide than using cold cathode fluorescent lamp pipe (CCFL) better buying inducement backlight.
Yet there is bottleneck in high density field in traditional LED display technique.Because be limited by the traditional structure of LED light source, be limited by the related material structure of module of rear integrated processing simultaneously, driving capacity and structure that for example traditional constant current source encapsulates, thermal stability problems and the flatness strength problem of the integrated finished product that traditional loose material of FR4PCB plate is brought, and be spliced into the needed injection moulding face shield of giant-screen and mould shell etc. for installing, these are all seriously limiting LED display technique in high density field, particularly at pel spacing, are less than breakthrough and the application in 1.0mm demonstration.
Summary of the invention
The object of this invention is to provide a kind of LED display unit module that can overcome above-mentioned defect.
The invention provides a kind of LED display unit module, it is characterized in that comprising: base plate for packaging, chip support, bonding coat, interface arrangement, a plurality of LED wafer, dedicated IC chip, heat dissipating layer and heat-dissipating cover plate;
Described chip support, for accommodating described a plurality of LED wafers and described dedicated IC chip;
Described base plate for packaging, is arranged in described chip support, and the end face of described base plate for packaging and bottom surface are respectively used to load described a plurality of LED wafers of upside-down mounting and the described dedicated IC chip of upside-down mounting; Wherein, described LED wafer is electrically connected to described base plate for packaging by described bonding coat; Described dedicated IC chip is electrically connected to described base plate for packaging by ball grid array BGA technique or described bonding coat; Described a plurality of LED wafer is electrically connected to described dedicated IC chip by described base plate for packaging;
Described heat-dissipating cover plate is fixed on described dedicated IC chip outside by described heat dissipating layer, for the heat radiation of described dedicated IC chip;
Described interface arrangement is arranged in the bottom surface and the chip support between described heat-dissipating cover plate of described base plate for packaging, and exposes by the outward opening having on described heat-dissipating cover plate, for being electrically connected between described base plate for packaging and external circuit.
Preferably, described LED display unit module also comprises:
Diaphragm, is covered on described a plurality of LED wafer;
Described diaphragm has optical grating structure, for eliminating LED, dazzles light and isolation ultraviolet ray.
Preferably, described LED display unit module also comprises:
Fixture, described heat-dissipating cover plate is anchored on described chip support by described fixture.
Preferably, described chip support specifically comprises:
A plurality of second grooves of the first groove of accommodating described dedicated IC chip and accommodating described a plurality of LED wafers.
Preferably, described base plate for packaging comprises at least two circuit layers and at least one insulating medium layer, isolates, and be electrically connected to by the through hole of described insulating medium layer between every two-layer described circuit layer by insulating medium layer.
Preferably, described base plate for packaging also comprises packaging solder ball.
Preferably, described a plurality of LED wafer is specially:
The red wafer of a plurality of LED, the green wafer of a plurality of LED and the blue wafer of a plurality of LED; The synthetic many group wafer cells of the red wafer of described a plurality of LED, the green wafer of a plurality of LED and the blue wafer set of a plurality of LED, each group wafer cell comprises the red wafer of one or more LED, the green wafer of one or more LED and the blue wafer of one or more LED.
Further preferably, the red wafer of described a plurality of LED, the green wafer of described a plurality of LED and the blue wafer of described a plurality of LED are LED eutectic wafer.
Further preferably, between the center of described many group wafer cells, be equally spaced.
Preferably, described interface arrangement is the USB interface of compatible power supply and data communication, by cementing and described base plate for packaging, is connected.
LED display unit module of the present invention by adopt by the upside-down mounting of LED wafer eutectic in the pixel sides of base plate for packaging and by dedicated IC chip upside-down mounting in the circuit side of base plate for packaging, by base plate for packaging, realize the electrical connection between them, thereby in limited arrangement space, realized the integrated of LED demonstration.Make LED display unit module there is good thermal stability and flatness, met high stability, image shows the demand of product large-scale production cheaply, and can carry out according to actual needs assembledly, meet the large screen display requirement of any size.
Accompanying drawing explanation
The sectional view of the LED display unit module that Fig. 1 provides for the embodiment of the present invention;
The chip support of LED display unit module and the diagrammatic cross-section of base plate for packaging that Fig. 2 provides for inventive embodiments;
The front elevation of the LED display unit module that Fig. 3 provides for the embodiment of the present invention;
The rear view of the LED display unit module that Fig. 4 provides for the embodiment of the present invention.
Embodiment
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Fig. 1 is the sectional view of the LED display unit module that provides of the embodiment of the present invention.As shown in Figure 1, LED display unit module comprises: base plate for packaging 4, chip support 3, bonding coat 11, interface arrangement 6, a plurality of LED wafer 2, dedicated IC chip 9, heat dissipating layer 8 and heat-dissipating cover plate 10;
Base plate for packaging 4 is arranged in chip support 3, and a plurality of LED wafers 2 directly weld (Direct Attach, DA) eutectic upside-down mounting and are arranged at the end face of base plate for packaging 4, by bonding coat 11, are connected with base plate for packaging 4; Dedicated IC chip 9 upside-down mountings are arranged at the bottom surface of base plate for packaging 4, by BGA technique or utilize bonding coat technique to be connected with base plate for packaging 4, and assist dedicated IC chips 9 heat radiations by heat dissipating layer 8 and heat-dissipating cover plate 10; Interface arrangement 6 is arranged in the bottom surface and the chip support 3 between heat-dissipating cover plate 10 of base plate for packaging 4, and by the opening 101 that has on heat-dissipating cover plate 10 to exposing outside;
A plurality of LED wafers 2 are electrically connected to dedicated IC chip 9 by bonding coat 11 and base plate for packaging 4; Base plate for packaging 4 is electrically connected to external circuit by interface arrangement 6.Interface arrangement 6 can be the USB interface of standard USB interface or compatible power supply and data communication.Interface arrangement 6 is connected with base plate for packaging 4 by cementing.
In conjunction with the diagrammatic cross-section of the chip support shown in Fig. 2 and base plate for packaging, chip support 3 is elaborated.
The silicones injection moulding that chip support 3 adopts high machinery and thermodynamic stability and has good dielectric properties is made, or uses other satisfactory die-casting material die casting to make.Specifically comprise: a plurality of second grooves 32 of the first groove 31 of accommodating dedicated IC chip 9, accommodating a plurality of LED wafers 2;
Concrete, LED wafer of the present invention comprises the red wafer of LED, the green wafer of LED and the blue wafer of LED, they are preferably LED eutectic wafer, are welded on the pixel sides of PCB multilayer printed circuit board by eutectic.Because LED eutectic wafer does not re-use the integrated operations of traditional LED such as die bond, routing welding in its production technology, therefore can adopt disposable its dress on base plate for packaging 4 that completes of die bond ultrasonic seamless bonding machine to paste and welding sequence.Meanwhile, because the dustproof transparence of protection against the tide that LED eutectic wafer has completed in the processing procedure of itself is processed, so also saved traditional LED packaging process.Therefore, adopt the LED display unit module of the present invention of LED eutectic wafer can save a large amount of manufacturing costs, simultaneously also for display board yield rate, stability, non-maintaining in the long life provide good technology and technique to guarantee.
The accommodating one group of LED wafer set of each second groove 32.Concrete, above-mentioned the second groove 32 rules are arranged, preferred, are equidistant arrangement, and each group wafer at least comprises the red wafer of an eutectic LED, a green wafer of eutectic LED and a blue wafer of eutectic LED.In the front elevation shown in Fig. 3, provided the example that every group of wafer comprises the red wafer of an eutectic LED, a green wafer of eutectic LED and a blue wafer of eutectic LED.In other examples, also can have and comprise the redness of unnecessary or the possibility of green or blue led wafer, even can comprise the eutectic wafer of other color.Putting in order of LED eutectic wafer in every group of wafer can be identical with mode, can be also different.
Base plate for packaging 4 also has a plurality of packaging solder ball 33; Packaging solder ball 33 is the pads of dedicated IC chip 9 face-down bondings on base plate for packaging 4.
Base plate for packaging 4 comprises at least two circuit layer (not shown)s and at least one insulating medium layer (not shown), isolates, and be electrically connected to by the through hole of described insulating medium layer between every two-tier circuit layer by insulating medium layer.
Concrete, the circuit layer of base plate for packaging 4 is that multilayer vapor deposition forms, and can be two-layer, four layers, six layers or other numbers of plies, insulation course is preferably highly purified resin medium, insulate bonding between adjacent circuit layer by insulation course.Between each circuit layer by various guide hole (not shown)s of arranging in advance or the staggered electric connection of blind hole (not shown).After crimping moulding, a side of base plate for packaging 4 be pixel sides for welding LED wafer, opposite side is circuit side, for welding other necessary circuit, data-interface and processing module.In the present embodiment, be preferably the dedicated IC chip 9 that welding has video communication control circuit and power circuit function.The base plate for packaging 4 of the present embodiment is high-density integrated, has good bending resistance tensile strength and flatness.
Again as shown in Figure 1, in interface arrangement 6, there is the electric connection line (not shown) that connects external circuit, for example electric wire, contact pin or the other forms of electric connection line for being electrically connected to.A plurality of LED wafers 2 of upside-down mounting on base plate for packaging 4 are connected with the electric connection line in interface arrangement 6 by base plate for packaging 4 with dedicated IC chip 9, thereby realize and being electrically connected to of external circuit.
Between heat-dissipating cover plate 10 and dedicated IC chip 9, also have heat dissipating layer 8, preferred, heat dissipating layer 8 is made for silicon thermal paste; Heat-dissipating cover plate 10 is aluminium cover plate.
LED display unit module of the present invention also comprises fixture 7, preferred, and this fixture 7 can be that magnetic is installed inserts, can certainly adopt the installation inserts of other modes as fixture 7.Heat-dissipating cover plate 10 is anchored on chip support 3 by fixture 7.
LED display unit module of the present invention also comprises diaphragm 1, is covered on a plurality of LED wafers.
Concrete, protection mould 1 is preferably the diaphragm that has optical grating function concurrently.
When the above-mentioned LED display unit module of integrated the present invention, first on the chip support 3 that is cast with base plate for packaging 4, adopt surface mounting technology (Surface Mounted Technology burying, SMT) or adhesive bonding technique be pasted into a plurality of LED wafers 2 of eutectic upside-down mounting, replant into upside-down mounting dedicated IC chip 9, after electrical detection is confirmed, silicon-coating thermal paste on dedicated IC chip 9, forms heat dissipating layer 8, and heat-dissipating cover plate 10 is pasted in above-mentioned silicon thermal paste.Finally, after said modules is clean, in the one side with a plurality of LED wafers 2 and chip support 3, stick on the diaphragm 1 that has optical grating function concurrently.The front elevation of the LED display unit module after integrated and rear view are respectively as shown in Figure 3, Figure 4.
LED display unit module of the present invention by adopt by the upside-down mounting of LED wafer eutectic in the pixel sides of base plate for packaging and by dedicated IC chip upside-down mounting in the circuit side of base plate for packaging, by base plate for packaging, realize the electrical connection between them, thereby in limited arrangement space, realized the integrated of LED demonstration.Make LED display unit module there is good thermal stability and flatness, met high stability, image shows the demand of product large-scale production cheaply, and can carry out according to actual needs assembledly, meet the large screen display requirement of any size.
Above-described embodiment; object of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only the specific embodiment of the present invention; the protection domain being not intended to limit the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a LED display unit module, is characterized in that, comprising: base plate for packaging, chip support, bonding coat, interface arrangement, a plurality of LED wafer, special IC core, heat dissipating layer and heat-dissipating cover plate;
Described base plate for packaging is arranged in described chip support, and described a plurality of LED flip-chip are arranged at the end face of described base plate for packaging, by described bonding coat, is connected with described base plate for packaging; Described dedicated IC chip upside-down mounting is arranged at the bottom surface of described base plate for packaging, by described heat dissipating layer and described heat-dissipating cover plate, is fixed in described chip support; Described interface arrangement is arranged in the bottom surface and the chip support between described heat-dissipating cover plate of described base plate for packaging, and exposes by the outward opening having on described heat-dissipating cover plate;
Described a plurality of LED wafer is electrically connected to described dedicated IC chip by described bonding coat and described base plate for packaging; Described base plate for packaging is electrically connected to external circuit by described interface arrangement.
2. LED display unit module according to claim 1, is characterized in that, described LED display unit module also comprises:
Diaphragm, has optical grating structure, is covered on described a plurality of LED wafer.
3. LED display unit module according to claim 1, is characterized in that, described LED display unit module also comprises:
Fixture, described heat-dissipating cover plate is anchored on described chip support by described fixture.
4. LED display unit module according to claim 1, is characterized in that, described chip support specifically comprises:
A plurality of second grooves of the first groove of accommodating described dedicated IC chip and accommodating described a plurality of LED wafers.
5. LED display unit module according to claim 1, is characterized in that, described a plurality of LED wafers are specially:
The red wafer of a plurality of LED, the green wafer of a plurality of LED and the blue wafer of a plurality of LED; The synthetic many group wafer cells of the red wafer of described a plurality of LED, the green wafer of a plurality of LED and the blue wafer set of a plurality of LED, each group wafer cell comprises the red wafer of one or more LED, the green wafer of one or more LED and the blue wafer of one or more LED.
6. LED display unit module according to claim 5, is characterized in that, the red wafer of described a plurality of LED, the green wafer of described a plurality of LED and the blue wafer of described a plurality of LED are LED eutectic wafer.
7. LED display unit module according to claim 5, is characterized in that, between the center of described many group wafer cells, is equally spaced.
8. LED display unit module according to claim 1, it is characterized in that, described base plate for packaging comprises at least two circuit layers and at least one insulating medium layer, isolates, and be electrically connected to by the through hole of described insulating medium layer between every two-layer described circuit layer by insulating medium layer.
9. LED display unit module according to claim 1, is characterized in that, described base plate for packaging also comprises packaging solder ball.
10. LED display unit module according to claim 1, is characterized in that, described interface arrangement is the USB interface of compatible power supply and data communication, by cementing and described base plate for packaging, is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320406916.8U CN203433750U (en) | 2013-07-09 | 2013-07-09 | LED display unit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320406916.8U CN203433750U (en) | 2013-07-09 | 2013-07-09 | LED display unit module |
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| Publication Number | Publication Date |
|---|---|
| CN203433750U true CN203433750U (en) | 2014-02-12 |
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| CN201320406916.8U Expired - Lifetime CN203433750U (en) | 2013-07-09 | 2013-07-09 | LED display unit module |
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| CN (1) | CN203433750U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103366647A (en) * | 2013-07-09 | 2013-10-23 | 严敏 | LED display unit module |
| CN105679914A (en) * | 2014-11-21 | 2016-06-15 | 程君 | Manufacturing method for LED composite glass substrate |
| RU2601922C1 (en) * | 2015-10-15 | 2016-11-10 | Алексей Викторович Шторм | Device and method for creating protective shell of led lamella |
| US10229630B2 (en) | 2014-05-14 | 2019-03-12 | The Hong Kong University Of Science And Technology | Passive-matrix light-emitting diodes on silicon micro-display |
-
2013
- 2013-07-09 CN CN201320406916.8U patent/CN203433750U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103366647A (en) * | 2013-07-09 | 2013-10-23 | 严敏 | LED display unit module |
| CN103366647B (en) * | 2013-07-09 | 2014-09-10 | 严敏 | LED display unit module |
| US10229630B2 (en) | 2014-05-14 | 2019-03-12 | The Hong Kong University Of Science And Technology | Passive-matrix light-emitting diodes on silicon micro-display |
| CN105679914A (en) * | 2014-11-21 | 2016-06-15 | 程君 | Manufacturing method for LED composite glass substrate |
| CN105679914B (en) * | 2014-11-21 | 2018-02-23 | 环视先进数字显示无锡有限公司 | A kind of manufacture method of LED compound glasses substrate |
| RU2601922C1 (en) * | 2015-10-15 | 2016-11-10 | Алексей Викторович Шторм | Device and method for creating protective shell of led lamella |
| WO2017065636A1 (en) * | 2015-10-15 | 2017-04-20 | Алексей Викторович ШТОРМ | Device and method for producing a protective cladding of a light-emitting-diode lamella |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140212 Effective date of abandoning: 20140910 |
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| RGAV | Abandon patent right to avoid regrant |