CN107768366A - A kind of COB encapsulation for filling Thermal protection IC and its method for packing - Google Patents

Abstract

The present invention relates to the improvement of LED packaging, in particular to a COB package for embedding a thermal protection IC and a packaging method thereof. The present invention adopts the following technical solutions: a COB package for embedding a thermal protection IC, LTCC substrate, thermal protection IC, The temperature sensor, LED chip, and LTCC substrate are made of more than two layers of green ceramic sheets, and the thermal protection IC and temperature sensor are set in the LTCC substrate, and the LED chip is fixed on the LTCC substrate. The temperature sensor and the LED chip are only separated A layer of green ceramic sheet, thermal protection IC, and temperature sensor are electrically connected. There is only a layer of green ceramic sheet between the temperature sensor and the LED chip. When the temperature of the substrate exceeds the limit temperature, the temperature sensor will feed back information to the thermal protection IC. The protection IC performs step-by-step regulation on the output current, which not only ensures timely reduction of the temperature of the LED light source, but also avoids the brightness change that can be detected by the human eye due to too fast reduction of the output current, and achieves the purpose of overheating protection unconsciously, fundamentally solving the problem. The chip temperature is too high.

Description

COB package for embedding thermal protection IC and package method thereof

technical field

The invention relates to the field of LED packaging, in particular to a COB package for embedding a thermal protection IC and a packaging method thereof.

Background technique

Light emitting diode (Light emitting diode), as an electroluminescent device, can directly convert electrical energy into light energy. It has a series of advantages such as green environmental protection, short response time, low cost, high luminous brightness, and long service life. It is known as Green lighting energy in the 21st century.

With the rapid development of small-pitch LEDs, COB (Chip On Board) packages are increasingly favored by the LED industry. Compared with the traditional SMD package, the COB packaged LED light source is an integrated packaged surface light source. The COB package adheres the LED chip to the PCB substrate with conductive or non-conductive silver glue, and then conducts wire bonding to realize electrical connection, eliminating the need for brackets and wire bonding processes, and does not need to face the technical difficulties of reflow soldering, which not only reduces cost, but also improves reliability. The existing COB packaging can divide one or two large chips into more than a dozen small chips, which can fully improve the uniformity of light distribution, but at the same time, the requirements for heat dissipation are also higher.

The power used by LED chips to emit light is only a small part of the input power, and most of the remaining electrical power is converted into heat energy. Only external heat dissipation cannot fundamentally solve the problem of excessive temperature of the LED chip. At present, the LED package with overheating protection function usually mounts PCB copper foil circuit layer on the metal substrate, the center is the LED array, and the periphery is equipped with a patch temperature sensor. The temperature sensor senses the temperature of the substrate. When the temperature exceeds the limited temperature, the signal is transmitted to the Thermal protection IC, so as to realize power-off protection for LED chips and reduce junction temperature.

Although the packaging method adopted in the above prior art can achieve the purpose of temperature control to a certain extent, because there is a certain distance between the temperature sensor and the LED chip, and there is a protective glue with low thermal conductivity between the two, it is not conducive to sensor induction. change in temperature. Moreover, when the temperature of the substrate is too high, taking power-off protection is not conducive to the application of LED light sources in daily life.

Contents of the invention

The object of the present invention is to provide a COB package for embedding a thermal protection IC and its packaging method. By embedding the thermal protection IC and the temperature sensor in the substrate, there is only a layer of thickness about 50um between the temperature sensor and the LED chip. The ceramic chip can sensitively and quickly sense the temperature change of the LED chip. When the temperature exceeds the limited temperature, the temperature sensor will transmit the signal to the thermal protection IC, and the thermal protection IC will reduce the output current in stages to ensure that the LED light source is reduced in time. temperature, and avoid excessively fast reduction of the output current, resulting in changes in brightness that can be detected by the human eye, resulting in a flickering sensation, achieving the purpose of overheating protection unconsciously, further prolonging the life of the LED, reducing light decay, and improving the reliability of the light source.

In order to achieve the above object, the present invention adopts the following technical scheme: including LTCC substrate, thermal protection IC, temperature sensor, LED chip, the LTCC substrate is formed by lamination and bonding of more than two layers of green ceramic sheets, the thermal protection IC, temperature The sensor is arranged in the LTCC substrate, the LED chip is fixed on the LTCC substrate, there is only one green ceramic sheet between the temperature sensor and the LED chip, and the thermal protection IC is electrically connected to the LED chip and the temperature sensor respectively .

Further, the LTCC substrate is printed with electrical interconnection wires made of conductive paste, and the LED chips are electrically connected to the electrical interconnection wires on the surface of the LTCC substrate through gold wires.

Further, the LTCC substrate is provided with component placement through holes and conductive through holes, and conductive materials are injected into the conductive through holes.

Preferably, the thickness of the top green ceramic sheet is 40-60um.

Further, the surface of the LED chip is covered with protective glue and fluorescent powder glue.

Further, the LTCC substrate includes a top-layer green ceramic sheet, a first functional green ceramic sheet, and a second functional green ceramic sheet arranged in sequence from top to bottom, the top-layer green ceramic sheet is provided with at least one first conductive through hole, and the ceramic sheet is placed At least one second conductive through hole and the component placement through hole are provided, and at least one third conductive through hole is provided on the second functional green ceramic sheet, and the component placement through hole can accommodate the thermal protection IC and the temperature sensor.

Further, a third functional green ceramic sheet is further included between the first functional green ceramic sheet and the second functional green ceramic sheet, and the third functional green ceramic sheet is provided with at least four fourth conductive vias, two second functional green ceramic sheets The four conductive vias are electrically connected to the positive and negative poles of the thermal protection IC and matched with the position of the third conductive via, and the other two fourth conductive vias are electrically connected to the current output and input ends of the thermal protection IC and are connected to the second conductive via position match.

Further, the upper and lower surfaces of the top green ceramic sheet are printed with electrical interconnection wires made of conductive paste, and the thermal protection IC and temperature sensor are placed on the lower surface of the top green ceramic sheet, fixed with crystal glue, and electrically interconnected. The wires are sequentially connected to the power input terminal and power output terminal of the thermal protection IC, the first conductive via connection, and the second conductive via, and the second conductive vias and the third conductive vias are in the same number and matched in position.

The present invention proposes a packaging method, including:

Steps of placing through holes and conducting through holes for components obtained by punching green ceramic sheets by using laser technology or mechanical punching technology;

A step of aligning the conductive through holes of the upper and lower adjacent green ceramic sheets;

The step of using mechanical axial pressure or liquid isostatic pressure to firmly paste the green ceramic sheet to obtain a prefabricated substrate;

A step of electrically connecting the current output terminal and input terminal of the thermal protection IC to the electrical interconnection wire through a conductive path;

The step of electrically connecting the positive and negative poles of the thermal protection IC to an external power supply through a conductive path;

The step of printing conductive paste on the top green ceramic sheet and/or the lower surface by screen printing or mask printing to make electrical interconnection wires;

A step of placing and curing the component placement through-holes filled with insulation and heat conduction into the prefabricated substrate;

Using mechanical axial pressure or liquid isostatic pressure to firmly paste the prefabricated substrate and the top layer of green ceramic sheet to obtain the LTCC substrate;

The step of interconnecting the positive and negative poles of the LED chip with the electrical interconnection wires through gold wires;

A step of sequentially coating protective glue and phosphor glue on the surface of the LED chip by spin coating, spray coating or printing;

The LTCC substrate mounts the peripheral optical components to get the step of COB package where the thermal protection IC is buried.

Further, the step of using mechanical axial pressure or liquid isostatic pressure to firmly paste the functional green ceramic sheet to obtain the prefabricated substrate includes:

The step of placing the thermal protection IC and the temperature sensor on the lower surface of the top green ceramic sheet, fixing it with a die-bonding glue, and electrically connecting the thermal protection IC and the temperature sensor;

The step of filling the conductive via hole with a conductive material to form a conductive path;

Using mechanical axial pressure or liquid isostatic pressure to firmly paste the first functional green ceramic sheet and the second functional green ceramic sheet to obtain a prefabricated substrate.

As another embodiment, the step of using mechanical axial pressure or liquid isostatic pressure to firmly paste the functional green ceramic sheet to obtain the prefabricated substrate includes:

a step of aligning the two ends of the conductive through holes of the first functional green ceramic sheet, the third functional green ceramic sheet, and the second functional green ceramic sheet, and filling the conductive material to form a conductive path;

A step of firmly adhering the first functional green ceramic sheet, the third functional green ceramic sheet, and the second functional green ceramic sheet by mechanical axial pressure or liquid isostatic pressure;

The thermal protection IC and the temperature sensor are placed in the component placement through hole, the thermal protection IC is electrically connected to the temperature sensor, and the temperature sensor is located around the thermal protection IC.

The advantages of the present invention are as follows: 1. The encapsulation method of the embedding method is adopted, so that there is only a layer of green ceramic sheet (about 50 um in thickness) between the temperature sensor and the LED chip, which can sensitively sense the change of the chip temperature, and the temperature of the chip Conducted into the substrate, the temperature sensor can sensitively sense the temperature of the substrate. When the temperature of the substrate exceeds the limit temperature, the temperature sensor will feed back the information to the thermal protection IC, and the thermal protection IC will reduce the output current in stages to ensure timely reduction of the LED light source. Temperature, and avoid the brightness change that human eyes can detect due to excessively low output current reduction, achieve the purpose of overheating protection unconsciously, and fundamentally solve the problem of excessive chip temperature;

2. The LTCC substrate preparation process is mature, and the simultaneous installation of thermal protection ICs, temperature sensors and filled metal wires during the production process can reduce process difficulty and production costs.

Description of drawings

Accompanying drawing 1 is embodiment 1 structure sectional view;

Accompanying drawing 2 is the exploded view of embodiment 1 LTCC substrate;

Accompanying drawing 3 a, b are the sectional view of the prefabricated substrate of embodiment 1, plan view;

Accompanying drawing 4 is the component installation schematic diagram of embodiment 1;

Accompanying drawing 5 is the electrical connection schematic diagram of embodiment 1;

Accompanying drawing 6 a, b, c are embodiment 1 LTCC substrate sectional view, substrate upper surface, substrate lower surface;

Accompanying drawing 7 is embodiment 1 LTCC substrate upper surface printed circuit and LED chip layout schematic diagram;

Accompanying drawing 8 is the overall sectional view of LED light source COB package of embodiment 1;

Accompanying drawing 9 is the exploded view of the LTCC substrate of embodiment 2;

Accompanying drawing 10a, b are the upper surface, lower surface of embodiment 2 top layer green ceramic sheet;

Accompanying drawing 11 is the schematic diagram of the installation of components on the lower surface of the top green ceramic sheet in Embodiment 2;

Accompanying drawing 12 is the structural sectional view of embodiment 2.

1. LTCC substrate, 2. Thermal protection IC, 3. Temperature sensor, 4. LED chip, 5. Electrical interconnection wire, 6. Protective glue, 7. Phosphor powder glue, 8. Conductive material, 9. Optical components, 10. Gold wire, 11. top green chip, 12. first function green chip, 13. second function green chip, 14. third function green chip, 91. first conductive via, 92. second conductive Through hole, 93. third conductive through hole, 94. component placement through hole, 95. fourth conductive through hole, 121. insulating thermal conductive resin.

Detailed ways

Example 1:

Embodiment 1 of the present invention, as shown in Figures 1-8, is a COB package that embeds thermal protection IC2, including LTCC substrate 1, thermal protection IC2, temperature sensor 3, and LED chip 4. The LTCC substrate 1 includes from top to bottom The top green ceramic sheet 11, the first functional green ceramic sheet 12, the third functional green ceramic sheet 14, and the second functional green ceramic sheet 13 are arranged in sequence, and the upper and lower surfaces of the top layer green ceramic sheet 11 are printed with conductive The electrical interconnection wire 5 made of slurry, the thermal protection IC2 and the temperature sensor 3 are placed on the lower surface of the green ceramic sheet 11 on the top layer, fixed with crystal glue, and the electrical interconnection wire 5 is connected to the power input terminal of the thermal protection IC2 and the power supply in turn. The output terminal is connected to the first conductive via 91, the second conductive via 92, the number of the second conductive via 92 and the third conductive via 93 are the same and the positions match the thermal protection IC2 and the temperature sensor 3. In the LTCC substrate 1, the LED chip 4 is fixed on the LTCC substrate 1, and is connected to the surface circuit of the LTCC substrate 1 through a gold wire 10. The surface of the LED chip 4 is covered with protective glue 6 and fluorescent powder glue 7. The temperature sensor 3 There is only one green ceramic sheet between the LED chip 4 and the thermal protection IC2 is electrically connected to the LED chip 4 and the temperature sensor 3 respectively.

The third functional green ceramic sheet 14 is provided with four fourth conductive through holes 95, two fourth conductive through holes 95 are electrically connected to the positive and negative electrodes of the thermal protection IC2 and aligned with the third conductive through holes 93, and the other two fourth conductive through holes 95 The through hole 95 is electrically connected with the current output end and the input end of the thermal protection IC 2 and is aligned with the second conductive through hole 92 .

The component placement through hole 94 and the conductive through hole can be punched on the green ceramic sheet by mechanical punching technology or laser drilling technology, and the shape of the through hole can be one of circular, rectangular, circular, etc. or There are many kinds of holes, and the laser technology can ensure the through-hole accuracy of the green ceramic sheet, and prevent the phenomenon of uneven slurry hanging on the wall of the through hole, residual slurry on the back, and hole plugging.

The temperature sensor 3 senses the temperature of the LTCC substrate 1. When the temperature of the LTCC substrate 1 exceeds the limit temperature, it transmits the signal to the thermal protection IC2. The temperature sensor 3 can be a patch temperature sensor, a magnetic temperature sensor or a threaded temperature sensor, etc. one or more of

Further, the LTCC substrate 1 is printed with electrical interconnection wires 5 made of conductive paste, and the arrangement of the electrical interconnection wires 5 is specifically adjusted according to the arrangement of the LED chips 4. The gold wire 10 is electrically connected to the electrical interconnection wire 5 on the surface of the LTCC substrate 1; the LTCC substrate 1 is provided with a component placement through hole 94 and a conductive through hole, and a conductive material 8 is injected into the conductive through hole; The material 8 is used as a vertical path between the green ceramic sheets, and the conductive material 8 is copper, aluminum, gold or alloy metal liquid.

Furthermore, the above-mentioned thermal protection IC2 can carry out step-by-step reduction regulation on the output current, while ensuring timely reduction of the temperature of the LED chip 4, it also avoids excessively fast reduction of the output current to cause changes in brightness that can be detected by the human eye, and overheating is achieved unconsciously. purpose of protection.

The protective glue 6 is epoxy resin or silica gel, and the phosphor powder glue 7 is a composite material obtained by mixing silica gel and phosphor in a certain proportion, and the two are coated on the chip sequentially by spraying, spin coating or deposition, etc. A layer of phosphor away from the coating is obtained. Using epoxy resin or silica gel as the protective glue 6 has high refractive index and high light transmittance, which can increase the luminous flux of LED, low viscosity, easy to defoam, suitable for potting and molding, so that LED has better durability and reliability With this method, the same effect of phosphor powder remote coating as other complex remote coating technologies can be achieved by simple methods such as spraying, spin coating or deposition, and at the same time, the LED can achieve uniformity of illumination, high light extraction efficiency, and color temperature. Optical requirements such as control and color uniformity control.

Preferably, the top layer of green ceramic sheet 11 has a thickness of 40-60um, preferably 50um, and is packaged by the embedding method, so that there is only a layer of 50um green ceramic sheet between the temperature sensor 3 and the LED chip 4, which can sensitively respond When the temperature of the LED chip 4 changes, when the temperature exceeds the limit temperature, the temperature sensor 3 transmits the signal to the thermal protection IC2, and the thermal protection IC2 performs step-by-step regulation on the output current, which not only ensures that the temperature of the LED light source is lowered in time, but also avoids too fast Reducing the output current leads to changes in brightness that can be detected by the human eye, and achieves the purpose of overheating protection unconsciously, further prolonging the life of the LED, reducing light decay, and improving the reliability of the light source.

The present invention also discloses a COB package encapsulation method for embedding thermal protection IC2, comprising the following steps:

Using laser technology or mechanical punching technology to punch green ceramic sheets to obtain component placement through holes 94 and conductive through holes; align the conductive through holes of the upper and lower adjacent layers of green ceramic sheets, and fill the conductive through holes with conductive material 8, Metal liquids such as copper, aluminum, gold or alloys form a vertical conductive path after cooling, and the component placement through hole 94 is used to place the thermal protection IC 2 and the temperature sensor 3 , so the through hole is not filled with conductive material 8 .

The first functional green ceramic sheet 12, the third functional green ceramic sheet 14, and the second functional green ceramic sheet 13 are firmly pasted by mechanical axial pressure or liquid isostatic pressure to obtain a prefabricated substrate, and the thermal protection IC2 and the temperature sensor 3 are placed on the prefabricated substrate. The components of the substrate are placed in the through hole 94, wherein the thermal protection IC2 is located in the center of the component placement through hole 94, and the temperature sensor 3 is located around it. The positions of the protection IC and the temperature sensor 3 can be adjusted accordingly according to the requirements. One or more, the positive and negative poles of the thermal protection IC2 are electrically connected to the external power supply through a conductive path, and the insulating and thermally conductive resin 121 is filled into the component placement through hole 94 of the prefabricated substrate and cured, using mechanical axial pressure or liquid isostatic pressure. The top-layer green ceramic sheet 11 is firmly pasted with the prefabricated substrate to obtain the LTCC substrate 1 .

Using screen printing or mask printing, the conductive paste is printed on the upper surface of the LTCC substrate 1 to make electrical interconnection wires 5, wherein the arrangement of the electrical interconnection wires 5 is specifically adjusted according to the arrangement of the LED chips 4 , and finally the positive and negative poles of the LED chip 4 are electrically connected to the electrical interconnection wire 5 through the gold wire 10 .

The surface of the LED chip 4 is coated with protective glue 6 and fluorescent powder glue 7 sequentially by spin coating, spray coating or printing, and finally the peripheral optical element 9 is installed to complete a COB package in which the thermal protection IC2 is buried.

Example 2:

This embodiment is basically the same as Embodiment 1, except that: as shown in Figures 9-12, the LTCC substrate 1 includes a top-layer green ceramic sheet 11, a first functional green ceramic sheet 12, The second functional green ceramic sheet 13, the top green ceramic sheet 11 is provided with at least one first conductive through hole 91, the placed ceramic sheet is provided with at least one second conductive through hole 92 and the element placement through hole 94, the second functional green ceramic sheet 13. At least one third conductive through hole 93 is provided, and the thermal protection IC2 and the temperature sensor 3 are placed on the lower surface of the top green ceramic sheet 11. The component placement through hole 94 can accommodate the thermal protection IC2 and the temperature sensor 3.

In this embodiment, electrical interconnection wires 5 made of conductive paste are printed on the upper and lower surfaces of the top layer of green ceramic sheet 11, wherein the arrangement of the electrical interconnection wires 5 on the upper surface of the top layer of green ceramic sheet 11 is specifically based on the LED chip 4 Finally, the positive and negative poles of the LED chip 4 are interconnected with the electrical interconnection wire 5 through the gold wire 10; the arrangement of the electrical interconnection wire 5 on the lower surface of the top green ceramic sheet 11 is adjusted according to the position of the thermal protection IC2 , the thermal protection IC2 and the temperature sensor 3 are placed on the lower surface of the green ceramic sheet 11 on the top layer, fixed with a die-bonding glue, and the thermal protection IC2 and the temperature sensor 3 are interconnected through gold wires 10 .

Since the thermal protection IC2 and the temperature sensor 3 are placed on the lower surface of the top green ceramic sheet 11, there is no need to add a third functional green ceramic sheet 14, which saves production costs and manufacturing processes; at the same time, the heat emitted by the LED chip 4 is along the direction perpendicular to the wall surface. Transfer, the temperature sensor 3 installed on the lower surface of the top layer of green ceramic sheet 11 can directly sense the temperature change of the LED chip 4 more sensitively through heat conduction. When the temperature exceeds the limited temperature, the temperature sensor 3 transmits the signal to the thermal protection IC2. The thermal protection IC2 adjusts the output current in stages, which not only ensures timely reduction of the temperature of the LED light source, but also avoids the brightness change that can be detected by the human eye due to the excessive reduction of the output current, and achieves the purpose of overheating protection unconsciously, further prolonging the life of the LED light source. Long life, reduce light decay, improve the reliability of the light source.

The packaging method of this embodiment is basically the same as that of Embodiment 1, the difference is that:

The steps of using mechanical axial pressure or liquid isostatic pressure to firmly paste the functional green ceramic sheets to obtain the prefabricated substrate include:

Use screen printing or mask printing to print conductive paste on the upper and lower surfaces of the top green ceramic sheet 11 to make electrical interconnection wires 5; place the thermal protection IC2 and temperature sensor 3 under the top green ceramic sheet 11 The surface is fixed with crystal glue, and the thermal protection IC2 is electrically connected to the temperature sensor 3; the conductive through hole is filled with a conductive material 8 to form a conductive path; mechanical axial pressure or liquid isostatic pressure is used to make the first functional green ceramic sheet 12, the second The functional green ceramic sheet 13 is pasted firmly to obtain a prefabricated substrate.

Of course, the above are only preferred implementation modes of the present invention, and are not intended to limit the scope of application of the present invention. Therefore, all equivalent changes based on the principle of the present invention shall be included in the protection scope of the present invention.

Claims (10)

1. a kind of COB encapsulation for filling Thermal protection IC, including ltcc substrate（1）, Thermal protection IC（2）, temperature sensor（3）、LED Chip（4）, it is characterised in that：The ltcc substrate（1）Laminate to connect by more than two layers ceramic chips and form, the Thermal protection IC（2）、 Temperature sensor（3）It is arranged on the ltcc substrate（1）In, the LED chip（4）It is fixed on ltcc substrate（1）On, the temperature Spend sensor（3）With LED chip（4）Between an alternating floor ceramic chips, the Thermal protection IC（2）Respectively with LED chip（4）And temperature Spend sensor（3）Electrical connection.

A kind of 2. COB encapsulation for filling Thermal protection IC according to claim 1, it is characterised in that：The ltcc substrate（1） It is printed with the electrical interconnection wire made of electrocondution slurry（5）, the LED chip（4）With ltcc substrate（1）Surface it is electric mutually Join wire（5）Electrical connection.

A kind of 3. COB encapsulation for filling Thermal protection IC according to claim 2, it is characterised in that：The ltcc substrate（1） It is provided with element and places through hole (94), conductive through hole, injects conductive material in conductive through hole（8）.

4. encapsulated according to a kind of any described landfill Thermal protection IC of claim 1-3 COB, it is characterised in that：The LTCC Substrate（1）Including the top layer ceramic chips set gradually from top to bottom（11）, the first function ceramic chips（12）, the second function ceramic chips (13), top layer ceramic chips（11）At least one first conductive through hole (91) is set, places ceramics and at least one second conduction is set Through hole (92) and the element place through hole (94), the second function ceramic chips (13) set at least one 3rd conductive through hole (93), the element, which places through hole (94), can house the Thermal protection IC（2）And temperature sensor（3）.

5. encapsulated according to a kind of any described landfill Thermal protection IC of claim 4 COB, it is characterised in that：First work( Can ceramic chips（12）And second also include the 3rd function ceramic chips (14), the 3rd function green between function ceramic chips (13) Piece (14) sets at least four the 4th conductive through holes（95）, two the 4th conductive through holes（95）With Thermal protection IC（2）Both positive and negative polarity electricity Connect and with the 3rd conductive through hole（93）Location matches, two other the 4th conductive through hole（95）Thermal protection IC（2）Electric current is defeated Go out end, input electrical connection and with the second conductive through hole（92）Location matches.

A kind of 6. COB encapsulation for filling Thermal protection IC according to claim 4, it is characterised in that：The top layer ceramic chips （11）Above and below surface printing have the electrical interconnection wire made of electrocondution slurry（5）, Thermal protection IC（2）, TEMP Device（3）It is placed on top layer ceramic chips（11）Lower surface, fixed using crystal-bonding adhesive, electrical interconnection wire（5）It is sequentially communicated the heat Protect IC（2）Power input and power output end, the first conductive through hole (91) connection, the second conductive through hole (92), it is described Second conductive through hole (92) is identical with the 3rd conductive through hole (93) number and location matches.

A kind of 7. COB encapsulation for filling Thermal protection IC according to claim 4, it is characterised in that：The LED chip（4） Surface covering protection glue（6）, phosphor gel（7）.

A kind of 8. method for packing for the COB encapsulation for filling Thermal protection IC, it is characterised in that：Comprise the following steps：

1. element places through hole (94) and conduction obtained by being punched using laser technology or mechanical punching techniques to ceramic chips The step of through hole；

2. the step of conductive through hole of neighbouring two layers of ceramic chips is alignd；

3. the step of making function ceramic chips firm pasting obtain Prefabricated substrate using mechanical axis pressure or liquid isostatic pressed, includes:

Thermal protection IC（2）Current output terminal, input pass through conductive path and electrical interconnection wire（5）The step of electrical connection；

Thermal protection IC（2）The step of both positive and negative polarity is electrically connected by conductive path with external power source；

The step of insulating heat-conductive is filled into the element placement through hole (94) of Prefabricated substrate and solidified；

Using silk-screen printing or mask print process, electrocondution slurry is printed on top layer ceramic chips（11）Above and/or under surface, to Make electrical interconnection wire（5）The step of；

Prefabricated substrate and top layer ceramic chips are made using mechanical axis pressure or liquid isostatic pressed（11）Firm pasting obtains ltcc substrate（1） The step of；

4. LED chip（4）Both positive and negative polarity passes through gold thread（10）With electrical interconnection wire（5）The step of interconnection；

5. the methods of using spin coating, spraying or printing is in LED chip（4）Surface coats Protection glue successively（6）, phosphor gel（7） The step of；

6. ltcc substrate（1）Peripheral optical element is installed（9）Obtain filling Thermal protection IC（2）COB encapsulation the step of.

A kind of 9. method for packing of COB encapsulation for filling Thermal protection IC according to claim 8, it is characterised in that：Using The step of mechanical axis is pressed or liquid isostatic pressed makes function ceramic chips firm pasting obtain Prefabricated substrate includes：

By Thermal protection IC（2）And temperature sensor（3）It is placed on top layer ceramic chips（11）Lower surface, fixed using crystal-bonding adhesive, will Thermal protection IC（2）With temperature sensor（3）The step of electrical connection；

Conductive through hole fills conductive material（8）The step of forming conductive path；

First function ceramic chips are made using mechanical axis pressure or liquid isostatic pressed（12）, second function ceramic chips (13) firm pasting Step.

A kind of 10. method for packing of COB encapsulation for filling Thermal protection IC according to claim 8, it is characterised in that：Using The step of mechanical axis is pressed or liquid isostatic pressed makes function ceramic chips firm pasting obtain Prefabricated substrate includes：

By the first function ceramic chips（12）, the 3rd function ceramic chips (14), the conductive through hole both ends of the second function ceramic chips (13) Alignment, fill conductive material（8）The step of forming conductive path；

By Thermal protection IC（2）And temperature sensor（3）It is placed on element to place in through hole (94), Thermal protection IC（2）Passed with temperature Sensor（3）Electrical connection, wherein temperature sensor（3）Positioned at Thermal protection IC（2）The step of surrounding position；

First function ceramic chips are made using mechanical axis pressure or liquid isostatic pressed（12）, the 3rd function ceramic chips (14), the second function The step of ceramic chips (13) firm pasting.