CN112416587A - On-chip structure temperature control method and on-chip structure layout method - Google Patents

Abstract

The application provides a temperature control method of an on-chip structure and a layout method of the on-chip structure, wherein the on-chip structure comprises: the temperature control method of the on-chip structure comprises the following steps of simulating a calculation unit, a circuit unit and a temperature sensor, and based on the temperature control method of the on-chip structure: acquiring the temperature collected by the temperature sensor; wherein the temperature comprises at least one of: the temperature of the analog calculation unit and the temperature of the circuit unit; and controlling the operation states of the analog calculation unit and the circuit unit according to the comparison result of the temperature and the preset temperature range. Through the method and the device, the problem that in the prior art, the operation result error of the analog device is large or the operation result is not credible due to the fact that the temperature difference of the analog device is large is solved.

Description

On-chip structure temperature control method and on-chip structure layout method

technical field

The present application relates to the field of analog devices, and in particular, to a temperature control method of an on-chip structure and a layout method of the on-chip structure.

Background technique

The temperature has a great influence on the characteristics of the simulated device. Usually, as the temperature increases, the kinetic energy of the electrons increases, which will lead to changes in the characteristics of the device. As shown in Figure 1, Figure 1 is a schematic diagram of the influence of temperature on the characteristics of the diode in the prior art. . Since the analog device has the above temperature characteristics, for a single analog device, if the temperature difference of the analog device at different times is large, the difference in the operation result will be large, that is, the error in the operation result will be large. For multiple analog devices, the temperature difference of analog devices at different locations will also cause deviations in operations at different locations, and the results generated by analog devices at one location cannot be directly used for analog devices at another location, resulting in data cannot be trusted.

SUMMARY OF THE INVENTION

The embodiments of the present application provide an on-chip structure temperature control method and an on-chip structure layout method, so as to solve the problem that in the prior art, the large temperature difference of the analog device leads to a large error in the calculation result of the analog device or the calculation result is unreliable. question.

In order to solve the above technical problems, this application is implemented as follows:

In a first aspect, the present application provides a temperature control method for an on-chip structure, the on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor; the method includes: acquiring the analog calculation collected by the temperature sensor temperature of the unit; controlling the operation state of the analog computing unit and the circuit unit according to the comparison result between the temperature and a preset temperature range.

In a second aspect, the present application provides a layout method of an on-chip structure, the on-chip structure includes: an analog computing unit, a circuit unit and a temperature sensor; wherein the analog computing unit is arranged at a second target position of the on-chip structure The method includes: determining to set the circuit unit in a first range including the analog computing unit; determining to set the temperature sensor at a first target position of the on-chip structure; wherein, the temperature sensor uses The temperature of at least one of the following items is collected: the temperature of the analog computing unit and the temperature of the circuit unit.

In a third aspect, the present application provides an on-chip structure, including: an analog computing unit, a circuit unit, a temperature sensor, and a controller; wherein the controller is connected to the analog computing unit, the circuit unit, and the temperature sensor connected respectively; the temperature sensor is used to collect the temperature, wherein the temperature includes at least one of the following: the temperature of the analog computing unit and the temperature of the circuit unit; the controller is used to The comparison result between the temperature and the preset temperature range controls the operation state of the analog computing unit and the circuit unit.

In a fourth aspect, the present application provides an on-chip structure layout device, wherein the on-chip structure includes: an analog computing unit, a circuit unit and a temperature sensor; the analog computing unit is arranged on a second target position of the on-chip structure ; Based on this, the device includes: a first determination module for determining to set the circuit unit in a first range including the analog computing unit; The temperature sensor is set at a target position; wherein, the temperature sensor is used to collect the temperature of at least one of the following: the temperature of the analog computing unit and the temperature of the circuit unit.

In a fifth aspect, an embodiment of the present application further provides an electronic device, which is characterized by comprising a processor, a memory, and a program or instruction stored in the memory and executable on the processor, the program or The instructions, when executed by the processor, implement the steps of the method as described in the first aspect or the second aspect.

In a sixth aspect, an embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or instruction is executed by a processor, the implementation of the first aspect or the second aspect steps of the method described.

Through the present application, for the temperature of the analog computing unit in the on-chip structure, after the temperature collected by the temperature sensor is acquired, the operating state of the analog computing unit and the circuit unit can be controlled according to the comparison result between the temperature and the preset temperature range, so as to realize the control of the temperature of the analog computing unit. The temperature control of the on-chip structure can prevent the temperature difference of the analog computing unit from being too large, and improve the accuracy of the calculation result of the analog computing unit, thereby solving the problem of the large temperature difference of the analog device in the prior art. There is a problem that the result has a large error or the operation result is unreliable.

Description of drawings

FIG. 1 is a schematic diagram of the effect of temperature on diode characteristics in the prior art

2 is a flowchart of a temperature control method of an on-chip structure according to an embodiment of the present application;

3 is a flowchart of a layout method of an on-chip structure according to an embodiment of the present application;

4 is a schematic structural diagram of an on-chip structure according to an embodiment of the present application;

FIG. 5 is an optional structural schematic diagram 1 of an on-chip structure according to an embodiment of the present application;

FIG. 6 is a second optional structural schematic diagram of an on-chip structure according to an embodiment of the present application;

FIG. 7 is an optional structural schematic diagram 3 of an on-chip structure according to an embodiment of the present application;

FIG. 8 is a schematic diagram 4 of an optional structure of an on-chip structure according to an embodiment of the present application;

FIG. 9 is an optional structural schematic diagram 5 of an on-chip structure according to an embodiment of the present application;

10 is a schematic structural diagram of a layout device for an on-chip structure according to an embodiment of the present application;

FIG. 11 is a schematic diagram of an optional structure of an on-chip structure layout apparatus according to an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of this application, it should be understood that the terms "first" and "second" are only for the purpose of description, and cannot be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

The data processing method provided by the embodiments of the present application will be described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

An embodiment of the present application provides a temperature control method of an on-chip structure, wherein the on-chip structure includes: an analog computing unit, a circuit unit and a temperature sensor; FIG. 2 is a flowchart of the temperature control method of the on-chip structure according to the embodiment of the present application, as shown in FIG. As shown in Figure 2, the steps of the method include:

Step S202, acquiring a temperature collected by a temperature sensor, wherein the temperature includes at least one of the following: the temperature of the analog computing unit, and the temperature of the circuit unit;

Step S204, controlling the operation states of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range.

Through steps S202 and S204 in the embodiments of the present application, for the temperature of the analog computing unit in the on-chip structure, after acquiring the temperature collected by the temperature sensor, the analog computing unit and the circuit can be controlled according to the comparison result between the temperature and the preset temperature range The operating state of the unit is used to realize the temperature control of the on-chip structure, so as to avoid the excessive temperature difference of the analog computing unit, improve the accuracy of the calculation result of the analog computing unit, and solve the problem of the temperature of the analog device in the prior art. The large difference leads to the problem that the operation result of the analog device has a large error or the operation result is unreliable.

In an optional implementation of the embodiment of the present application, the on-chip structure in the embodiment of the present application may further include a controller, and the above steps S202 and S204 are performed by the controller, that is, the temperature of the on-chip structure may be controlled by the controller. control.

In an optional implementation manner of the embodiment of the present application, the method of controlling the operation state of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range involved in the above step S204 may further include:

Step S204-11, maintaining the current operating state of the analog computing unit and the circuit unit when the temperature is within the preset temperature range;

Step S204-12, when the temperature exceeds the highest temperature within the preset temperature range, control the analog computing unit and the circuit unit to stop running;

Step S204-13, when the temperature is lower than the lowest temperature within the preset temperature range, control the operation states of the simulation computing unit and the circuit unit according to whether the simulation computing unit needs to start the operation.

Wherein, the method involved in step S204-13 according to whether the simulation calculation unit needs to start the operation to control the operation state of the simulation calculation unit and the circuit unit may further include:

Step S11, judging whether the simulation computing unit needs to start running;

Step S12, when the simulation computing unit needs to start running, control the simulation computing unit to start running, and control the computing unit to run;

Step S13, in the case that the simulation computing unit does not need to start running, maintain the current operating state of the simulation computing unit and the circuit unit.

Through the above steps S204-11 to S204-13, it can be known that when the temperature of the simulator exceeds the maximum temperature within the preset temperature range, the simulation calculation unit and the circuit unit are controlled to stop running, because the operation of the circuit unit will generate a large amount of The heat causes the temperature to be higher. Therefore, in this case, the analog computing unit and the circuit unit can be controlled to stop running to prevent the temperature from rising further, thereby effectively controlling the temperature difference. In this case, the operation of the analog computing unit The resulting error is large or unreliable, so it can also be controlled to stop running. When the temperature is within the preset temperature range, it indicates that the current temperature is in a relatively suitable range, and there is no need to control the operation state of the analog computing unit and the circuit unit, as long as the current state is maintained. When the temperature is lower than the minimum temperature within the preset temperature range, if the current simulation computing unit needs to work, it can be controlled to start running, and if no work is required, the current operating state can also be maintained.

It should be noted that the value of the above-mentioned preset temperature range can be set according to the actual situation. The setting of , and its specific value range is not limited in this application.

In an optional implementation manner of the embodiment of the present application, when the number of analog computing units is multiple, before acquiring the temperature of the analog computing unit collected by the temperature sensor, the method steps of the embodiment of the present application may further include:

Step S21, acquiring a first temperature value of each simulation computing unit, wherein the first temperature value includes at least one of the following: a historical temperature value and a predicted temperature value;

Step S22, determining the number of circuit units required by each analog computing unit according to the first temperature value and the mapping table; wherein the mapping table is used to indicate the mapping relationship between the first temperature value and the required number of circuit units .

Through the above steps S21 to S23, the historical temperature value is the measured temperature value of the analog computing unit at different historical times. If the historical temperature value is mostly high, a smaller number of circuit units can be set. If If the historical temperature value is mostly low, a relatively large number of circuit units can be set, and the predicted temperature value is handled in a similar manner. The specific setting can be determined according to the mapping relationship in the mapping table, because different temperature values in the mapping table can correspond to different numbers of circuit units, and the specific mapping relationship can be set according to the actual situation.

It should be noted that the circuit unit in the embodiment of the present application is arranged in the first range including the analog computing unit, and the temperature sensor is arranged at the first target position of the on-chip structure; wherein, the temperature sensor is used for collecting data including the first target The temperature of the simulated computing unit within the second range of locations.

Since the temperature sensor can collect the temperature of the analog computing unit in the second range including the first target position, that is to say, as long as the analog computing unit in the second range can be collected by the temperature sensor, based on this, in When the analog computing unit is within the second range including one temperature sensor, the temperature of the analog computing unit is the temperature collected by the temperature sensor; when the analog computing unit is within the second range including a plurality of temperature sensors, the simulation The temperature of the calculation unit is the average value of the temperatures collected by multiple temperature sensors.

Further, since the temperature sensor can collect the temperature of the analog computing units in the second range including the first target position, that is, one temperature sensor can collect the temperature of multiple analog computing units, so it is not necessary to configure one analog computing unit for each analog computing unit. Temperature Sensor.

In another embodiment of the present application, a method for laying out an on-chip structure is provided, wherein the on-chip structure includes: an analog computing unit, a circuit unit, a temperature sensor, and a controller; wherein, the analog computing unit is arranged on a second part of the on-chip structure On the target position, it should be noted that the second target position is a pre-determined position; as shown in FIG. 3 , the steps of the method include:

Step S302, determining to set circuit units within the first range including the analog computing unit;

Step S304 , it is determined that a temperature sensor is set at the first target position of the on-chip structure; wherein, the temperature sensor is used to collect the temperature of the analog computing unit within the second range including the first target position.

Through the layout method of the on-chip structure in the above steps S302 to S304, the operation states of the analog computing unit and the circuit unit can be controlled according to the comparison result between the temperature and the preset temperature range, so as to realize the control of the temperature of the analog thermometer, so as to avoid The temperature difference of the analog computing unit is too large to affect the operation result of the analog computing unit, thereby solving the problems in the prior art that the large temperature difference of the analog device leads to a large error or unreliable operation result of the analog device.

It should be noted that the on-chip structure in the embodiment of the present application may further include a controller, and based on this, the method steps of the embodiment of the present application may further include:

Step S306, it is determined that the controller is connected to the analog computing unit, the circuit unit and the temperature sensor respectively, wherein the controller controls the operation states of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range.

In an optional implementation manner of the embodiment of the present application, when the number of analog computing units is multiple, before acquiring the temperature of the analog computing unit collected by the temperature sensor, the method steps of the embodiment of the present application may further include:

Step S31, obtaining a first temperature value of each simulation computing unit, wherein the first temperature value includes at least one of the following: a historical temperature value and a predicted temperature value;

Step S32, determining the number of circuit units required by each analog computing unit according to the first temperature value and the mapping table; wherein the mapping table is used to indicate the number of required circuit units corresponding to the first temperature value range;

Step S33, setting the determined circuit unit in the first range including the analog computing unit.

Through the above steps S31 to S33, the historical temperature value is the measured temperature value of the analog computing unit at different historical times. If the historical temperature value is mostly high, a smaller number of circuit units can be set. If If the historical temperature value is mostly low, a relatively large number of circuit units can be set, and the predicted temperature value is handled in a similar manner. The specific setting can be determined according to the mapping relationship in the mapping table, because different temperature values in the mapping table can correspond to different numbers of circuit units, and the specific mapping relationship can be set according to the actual situation.

In yet another embodiment of the present application, an on-chip structure is provided, as shown in FIG. 4 , the on-chip structure includes: an analog computing unit 42 , a circuit unit 44 , a temperature sensor 46 and a controller 48 ; the controller 48 and the analog computing The unit 42, the circuit unit 44 and the temperature sensor 46 are respectively connected; wherein,

The temperature sensor 46 is used to collect the temperature of the analog computing unit 42, wherein the temperature includes at least one of the following: the temperature of the analog computing unit and the temperature of the circuit unit;

The controller 48 is configured to acquire the temperature of the analog computing unit 42 collected by the temperature sensor 46, and control the operation states of the analog computing unit 42 and the circuit unit 44 according to the comparison result between the temperature and the preset temperature range.

It should be noted that the analog computing units involved in the embodiments of the present application may be: analog devices including resistors, capacitors, inductors, diodes, transistors, analog amplifiers, D/A, A/D, analog signal conditioners, integrated stabilizers Voltage circuits, sensors, audio and video circuits, etc.

Optionally, when the number of analog computing units is multiple, the controller 48 in this embodiment of the present application is further configured to acquire the temperature of each analog computing unit before acquiring the temperature of the analog computing unit collected by the temperature sensor. a first temperature value, wherein the first temperature value includes at least one of the following: a historical temperature value, a predicted temperature value; and,

The controller 48 in the embodiment of the present application is further configured to determine the number of circuit units required by each analog computing unit according to the first temperature value and the mapping table; wherein the mapping table is used to indicate the relationship between the first temperature value and the required The mapping relationship between the number of circuit units.

Optionally, when the analog computing unit is within the second range including one temperature sensor, the temperature of the analog computing unit is the temperature collected by the temperature sensor; when the analog computing unit is within the second range including a plurality of temperature sensors In the case of , the temperature of the analog computing unit is the average value of the temperatures collected by multiple temperature sensors.

Optionally, as for the way in which the controller in the embodiment of the present application controls the operation state of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range, it may further be: when the temperature is within the preset temperature range. When the temperature exceeds the maximum temperature within the preset temperature range, the controller controls the analog computing unit and the circuit unit to stop running; when the temperature is lower than the preset temperature In the case of the lowest temperature within the range, the controller controls the operation state of the simulation calculation unit and the circuit unit according to whether the simulation calculation unit needs to start the operation.

Wherein, as for the way that the controller controls the operation state of the simulation calculation unit and the circuit unit according to whether the simulation calculation unit needs to start operation, the controller may further judge whether the simulation calculation unit needs to start operation; in the case that the simulation calculation unit needs to start operation The controller controls the simulation computing unit to start running, and controls the computing unit to run; when the simulation computing unit does not need to start running, the controller maintains the current operating state of the simulation computing unit and the circuit unit.

It should be noted that the circuit unit in the embodiment of the present application is arranged in the first range including the analog computing unit; the temperature sensor is arranged at the first target position of the on-chip structure; wherein, the temperature sensor is used to collect temperature; wherein, the temperature It includes at least one of the following: the temperature of the analog computing unit and the temperature of the circuit unit.

Since the temperature sensor can collect the temperature of the analog computing units in the second range including the first target position, that is, one temperature sensor can collect the temperature of multiple analog computing units, it is not necessary to configure a temperature sensor for each analog computing unit. As shown in Figure 5, the on-chip structure includes 8 analog computing units as an example, and one temperature sensor corresponds to one analog computing unit; as shown in Figure 6, the on-chip structure includes 8 analog computing units as an example, and each 2 analog computing units correspond to 1 temperature sensor, that is to say, 1 temperature sensor can collect the temperature of the corresponding 2 analog computing units; as shown in Figure 7, 1 temperature sensor can collect the surrounding 4 analog computing units The temperature value of the unit, in which the temperature of the 2 analog computing units on the left of the virtual box is collected by 2 temperature sensors (the first temperature sensor and the second temperature sensor), and the temperature of the 2 analog computing units on the right side of the virtual box is collected. It is also collected by two temperature sensors (the second temperature sensor and the third temperature sensor); therefore, the temperature values of the two analog computing units are the average values of the temperatures collected by the two temperature sensors.

Optionally, when the number of analog computing units is multiple, at least one circuit unit is set in the first range including the analog computing unit; wherein, the number corresponding to the at least one circuit unit is based on the first The temperature value is determined with a mapping table; the first temperature value includes at least one of the following: a historical temperature value and a predicted temperature value, and the mapping table is used to indicate the number of required circuit units corresponding to the temperature value range. That is, the number of circuit units of different analog computing units may be different, as shown in FIG. 8 and FIG. 9 . It should be noted that FIG. 8 and FIG. 9 are only examples, and in other optional implementation manners of the embodiments of the present application, the number of corresponding circuit units may be determined according to actual conditions.

In another optional implementation manner of the embodiment of the present application, an on-chip structure layout device is also provided, wherein, as shown in FIG. 4 , the on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor; The unit is arranged on the second target position of the on-chip structure; based on this, the device in the embodiment of the present application is shown in FIG. 10 and includes:

a first determining module 102, configured to determine to set a circuit unit within a first range including an analog computing unit;

The second determination module 104 is configured to determine that a temperature sensor is provided at the first target position of the on-chip structure; wherein, the temperature sensor is used to collect the temperature of the analog computing unit within the second range including the first target position.

Optionally, when the number of simulation computing units is multiple, the first determination module 102 includes: an obtaining unit configured to obtain the first temperature value of each simulation computing unit, wherein the first temperature value includes At least one of the following: a historical temperature value and a predicted temperature value; a first determining unit, configured to determine the number of circuit units required by each analog computing unit according to the first temperature value and the mapping table; wherein the mapping table is used to indicate the first A mapping relationship between a temperature value and the number of required circuit units; a second determination unit for determining that the circuit units are set in a first range including an analog computing unit.

Optionally, in the case where the on-chip structure in this embodiment of the present application further includes a controller, the apparatus in this embodiment of the present application is shown in FIG. 11 , and the apparatus may further include: a third determination module 106 for determining the control The controller is respectively connected with the analog computing unit, the circuit unit and the temperature sensor, wherein the controller controls the operation state of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range.

Optionally, an embodiment of the present application further provides an electronic device, including a processor, a memory, a program or an instruction stored in the memory and executable on the processor, and the program or instruction is executed by the processor to implement the above. The various processes of the embodiments of the temperature control method of the on-chip structure or the layout method of the on-chip structure can achieve the same technical effect, and are not repeated here to avoid repetition.

It should be noted that the electronic devices in the embodiments of the present application include the aforementioned mobile electronic devices and non-mobile electronic devices.

An embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or instruction is executed by a processor, the above temperature control method of the on-chip structure or the layout method of the on-chip structure is implemented Each process of the embodiment can achieve the same technical effect, and to avoid repetition, it will not be repeated here.

Wherein, the processor is the processor in the electronic device described in the foregoing embodiments. The readable storage medium includes a computer-readable storage medium, such as a computer read-only memory (Read-Only Memory, ROM), a random access memory (Random Access Memory, RAM), a magnetic disk or an optical disk, and the like.

Obviously, those skilled in the art should understand that the above-mentioned modules or steps of the present application can be implemented by a general-purpose computing device, and they can be centralized on a single computing device, or distributed in a network composed of multiple computing devices Alternatively, they may be implemented in program code executable by a computing device, such that they may be stored in a storage device and executed by the computing device, and in some cases, in a different order than here The steps shown or described are performed either by fabricating them separately into individual integrated circuit modules, or by fabricating multiple modules or steps of them into a single integrated circuit module. As such, the present application is not limited to any particular combination of hardware and software.

The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims (15)

1. A temperature control method of an on-chip structure, wherein the on-chip structure comprises: an analog computing unit, a circuit unit and a temperature sensor; the method comprises: Acquire the temperature collected by the temperature sensor; wherein, the temperature includes at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit; The operating states of the analog computing unit and the circuit unit are controlled according to the comparison result between the temperature and a preset temperature range. 2 . The method according to claim 1 , wherein, when the number of the analog computing units is multiple, before acquiring the temperature of the analog computing unit collected by the temperature sensor, the Methods also include: acquiring a first temperature value of each simulation computing unit, wherein the first temperature value includes at least one of the following: a historical temperature value and a predicted temperature value; The number of circuit units required by each of the analog computing units is determined according to the first temperature value and the mapping table; wherein the mapping table is used to indicate the difference between the first temperature value and the required number of circuit units mapping relationship between. 3. The method of claim 2, wherein The circuit unit is arranged in a first range including the analog computing unit; The temperature sensor is arranged on a first target position of the on-chip structure; wherein, the temperature sensor is used to collect the temperature of the analog computing unit within a second range including the first target position. 4. The method of claim 3, wherein When the analog computing unit is within the second range including one temperature sensor, the temperature of the analog computing unit is the temperature collected by the temperature sensor; When the analog computing unit is within the second range including a plurality of temperature sensors, the temperature of the analog computing unit is an average value of the temperatures collected by the plurality of temperature sensors. 5 . The method according to claim 1 , wherein the controlling the operation state of the analog computing unit and the circuit unit according to the comparison result between the temperature and a preset temperature range comprises: 5 . In the case that the temperature is within the preset temperature range, maintaining the current operating state of the analog computing unit and the circuit unit; When the temperature exceeds the maximum temperature within the preset temperature range, controlling the analog computing unit and the circuit unit to stop running; When the temperature is lower than the lowest temperature within the preset temperature range, the operation states of the analog computing unit and the circuit unit are controlled according to whether the analog computing unit needs to start operation. 6 . The method according to claim 5 , wherein the controlling the operation state of the simulation computing unit and the circuit unit according to whether the simulation computing unit needs to start operation, comprising: 6 . Judging whether the simulation computing unit needs to start running; When the simulation computing unit needs to start running, controlling the simulation computing unit to start running, and controlling the computing unit to run; Under the condition that the simulation computing unit does not need to start running, the current operating states of the simulation computing unit and the circuit unit are maintained. 7. A layout method of an on-chip structure, wherein the on-chip structure comprises: an analog computing unit, a circuit unit and a temperature sensor; wherein the analog computing unit is arranged on a second target position of the on-chip structure; The method includes: determining that the circuit unit is provided within a first range including the analog computing unit; It is determined that the temperature sensor is arranged at the first target position of the on-chip structure; wherein, the temperature sensor is used to collect the temperature of at least one of the following: the temperature of the analog computing unit and the temperature of the circuit unit. 8 . The method according to claim 7 , wherein, when the number of the analog computing units is multiple, setting the circuit units in a first range including the analog computing units includes: 9 . acquiring a first temperature value of each simulation computing unit, wherein the first temperature value includes at least one of the following: a historical temperature value and a predicted temperature value; The number of circuit units required by each of the analog computing units is determined according to the first temperature value and the mapping table; wherein the mapping table is used to indicate the difference between the first temperature value and the required number of circuit units Mapping relations; The determined circuit unit is arranged in a first range including the analog computing unit. 9. An on-chip structure applied to the method according to any one of claims 1-6, wherein the on-chip structure comprises: an analog computing unit, a circuit unit, a temperature sensor and a controller; wherein the control The device is respectively connected with the analog computing unit, the circuit unit and the temperature sensor; The temperature sensor is used to collect the temperature, wherein the temperature includes at least one of the following: a temperature generated by the analog computing unit in a working state, and a temperature generated by the circuit unit in a working state; The controller is configured to control the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and a preset temperature range. 10. The structure-on-chip of claim 9, wherein: the circuit unit is arranged in a first range including the analog computing unit; The temperature sensor is disposed at a first target location of the on-chip structure. 11 . The on-chip structure according to claim 10 , wherein when the number of the analog computing units is plural, at least one of the circuit units is provided in a first range including the analog computing units. 12 . ; wherein, the number corresponding to at least one of the circuit units is determined according to the first temperature value and the mapping table of the analog computing unit, and the first temperature value includes at least one of the following: a historical temperature value, a predicted temperature value; The mapping table is used to indicate the required number of circuit units corresponding to the temperature range. 12. A layout device of an on-chip structure, wherein the on-chip structure comprises: an analog computing unit, a circuit unit and a temperature sensor; wherein the analog computing unit is arranged on a second target position of the on-chip structure; The device includes: a first determining module, configured to determine to set the circuit unit within a first range including the analog computing unit; The second determination module is configured to determine to set the temperature sensor at the first target position of the on-chip structure; wherein, the temperature sensor is used to collect the temperature of at least one of the following: the temperature of the analog computing unit, the temperature of the The temperature of the circuit unit. 13. The apparatus according to claim 12, characterized in that, when the number of the simulation computing units is multiple, the first determination module comprises: an obtaining unit, configured to obtain a first temperature value of each simulation computing unit, wherein the first temperature value includes at least one of the following: a historical temperature value and a predicted temperature value; a first determining unit, configured to determine the number of circuit units required by each of the analog computing units according to the first temperature value and the mapping table; wherein the mapping table is used to indicate the first temperature value and the required The mapping relationship between the number of circuit units; The second determination unit is configured to determine that the circuit unit is arranged in a first range including the analog calculation unit. 14. An electronic device, characterized in that it comprises a processor, a memory, and a program or instruction stored on the memory and executable on the processor, and the program or instruction is implemented when executed by the processor A method step as claimed in any one of claims 1-6 is included, or a method step as claimed in claim 7 or 8 is included. 15. A readable storage medium, characterized in that, a program or an instruction is stored on the readable storage medium, and when the program or instruction is executed by a processor, the implementation comprises the method described in any one of claims 1-6. Method steps, or implementations, include method steps as claimed in claim 7 or 8 .

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