CN203788563U

CN203788563U - Circuit board packaging structure

Info

Publication number: CN203788563U
Application number: CN201420165923.8U
Authority: CN
Inventors: 黄柏雄; 杨伟雄; 石汉青; 林正峰
Original assignee: Tripod Wuxi Electronic Co Ltd
Current assignee: Tripod Wuxi Electronic Co Ltd
Priority date: 2013-11-27
Filing date: 2014-04-08
Publication date: 2014-08-20
Anticipated expiration: 2024-04-08

Abstract

The utility model discloses a circuit board packaging structure comprising a substrate, multiple annular magnetic elements, a supporting layer and multiple first conducting layers. The substrate is provided with a first surface and a second surface which are opposite to each other, and multiple first annular grooves and multiple first open grooves. The first annular grooves and the first open grooves are arranged on the first surface. Each first annular groove is communicated to another first annular groove via at least one first open groove, and at least two first annular grooves are communicated to the side surface of the substrate via the first open grooves so that at least two openings are formed. The annular magnetic elements are respectively arranged in the first annular grooves. The supporting layer is arranged on the first surface of the substrate and covers the first annular grooves and the first open grooves. The supporting layer and the substrate are provided with multiple penetrating holes. The first conducting layers are respectively arranged on the surfaces, which orient towards the penetrating holes, of the supporting layer and the substrate.

Description

Circuit board package structure

Technical field

The utility model relates to a kind of circuit board package structure.

Background technology

Generally speaking, in the manufacturing process of circuit board, specific element need be inserted in the default storage tank of circuit board, such as the copper billet of heat transmission, iron core etc.Wherein iron core, because having magnetic, can be applicable to the structure of transformer (transformer) or choke (power choke).

The circuit board of existing four layers of encapsulating structure is with copper clad laminate (Copper Clad Laminate; CCL) be substrate.When making circuit board, can utilize forming machine to form a plurality of mutual disconnected annular storage tanks in substrate front side.Then, insert annular iron core in storage tank, and in storage tank, insert epoxy resin secured core.Afterwards, the glass fibre of surperficial tool Copper Foil (FR4) can be pressed on to the tow sides of substrate, and via manufacture crafts such as boring, copper facing, the passage (via) that formation can conducting substrate tow sides Copper Foil.Finally, patterning Copper Foil covering with epoxy resin in substrate tow sides.

Forming machine is when substrate forms storage tank, and the cutter contact substrate that need first decline, then moves horizontally and cut out annular storage tank, and after a storage tank completes, cutter rises, and moves to the next substrate position top of estimating to form storage tank.Above-mentioned steps constantly repeats just at substrate, to form a plurality of storage tanks, can expend the time that a large amount of cutters vertically move (rise and decline).

In addition, after the viscose in storage tank solidifies, can produce stress, the inductance value of iron core is reduced, and circuit board is follow-up through surface laminating manufacture craft (Surface Mount Technology; SMT) time, although viscose can have heat sinking function, but the gas in storage tank still may be subject to high temperature and expand in infrared ray reflow stove (IR reflow), and pressure cannot be led off, therefore may cause the glass fibre of covered substrate and epoxy resin to damage.

Utility model content

The purpose of this utility model is to provide a kind of circuit board package structure, to address the above problem.

For reaching above-mentioned purpose, the utility model provides a kind of circuit board package structure to comprise substrate, a plurality of annular magnetic element, supporting layer and a plurality of the first conductive layer.Substrate has relative first surface and second surface, a plurality of first ring connected in star and a plurality of the first fluting.First ring connected in star and the first fluting are positioned at first surface.Each first ring connected in star is communicated to another first ring connected in star by least one the first fluting, and at least two first ring connected in stars are communicated to substrate side surfaces by the first fluting and form at least two openings.Annular magnetic element lays respectively in first ring connected in star.Supporting layer is positioned on the first surface of substrate, and covers first ring connected in star and the first fluting.Supporting layer and substrate have a plurality of perforation, and the adjacent first ring connected in star of boring a hole.The first conductive layer lays respectively at supporting layer and substrate on the surface of perforation.Each first conductive layer has relative first end and the second end, and first end extends on the surface of the relative substrate of supporting layer, and the second end extends on the second surface of substrate.

This circuit board package structure also comprises: a plurality of the first protective layers, lay respectively in those perforation.

This supporting layer also comprises: containing the glass layer of uncured epoxy resin, be positioned at the lower floor of this supporting layer, cover those annular grooves and those flutings; And contain the glass layer of cured epoxy resin, and be positioned at the upper strata of this supporting layer, cover the glass layer containing uncured epoxy resin of lower floor.

This circuit board package structure also comprises: the second protective layer, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on; And the 3rd protective layer or a reinforcing support layer, be covered on this second surface of this substrate on those the second ends with those the first conductive layers.

This circuit board package structure also comprises: first containing the glass layer of uncured epoxy resin, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on, second containing the glass layer of uncured epoxy resin, is covered on this second surface of this substrate on those the second ends with those the first conductive layers, a plurality of the second conductive layers, lay respectively at this first glass layer containing uncured epoxy resin, this second glass layer containing uncured epoxy resin, this supporting layer and this substrate are on the surface of those perforation, and relatively extend perpendicularly to this adjacent first end or extend perpendicularly to this adjacent the second end along this second surface of this substrate in the surface of this substrate along this supporting layer, each this second conductive layer has one the 3rd relative end and one the 4th end, and the 3rd end extends on the surface of relative this supporting layer of this first glass layer containing uncured epoxy resin, the 4th end extends on this second surface of this second glass layer containing uncured epoxy resin, one second protective layer, be covered in this first containing glass layer of uncured epoxy resin relatively on the surface of this substrate with those the 3rd ends of those the second conductive layers on, and one the 3rd protective layer or a reinforcing support layer, be covered in this second glass layer containing uncured epoxy resin relatively on the surface of this substrate with those the 4th ends of those the second conductive layers on.

This circuit board package structure also comprises: a plurality of the 4th protective layers, lay respectively in those perforation.

This circuit board package structure also comprises: the first glass layer containing uncured epoxy resin, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on, this first glass layer containing uncured epoxy resin has a plurality of districts of running through, and those run through district and are positioned on the surface of those first ends with respect to this supporting layer, extend perpendicularly on this first glass layer containing uncured epoxy resin surface with respect to this supporting layer; A plurality of the second conductive layers, laying respectively at this first glass layer containing uncured epoxy resin runs through on the surface in district towards those, each this second conductive layer has one the 3rd end, and the 3rd end extends on the surface of relative this supporting layer of this first glass layer containing uncured epoxy resin; Second containing the glass layer of uncured epoxy resin, is covered on this second surface of this substrate on those the second ends with those the first conductive layers; The second protective layer, be covered in this first containing glass layer of uncured epoxy resin relatively on the surface of this substrate with the side surface of those the 3rd ends of those the second conductive layers on, make those the 3rd ends of those the second conductive layers exposed from this second protective layer; And the 3rd protective layer or a reinforcing support layer, be covered in this second glass layer containing uncured epoxy resin relatively on the surface of this substrate.

This circuit board package structure also comprises: first containing the glass layer of uncured epoxy resin, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on; The second glass layer containing uncured epoxy resin, be covered on this second surface of this substrate on those the second ends with those the first conductive layers, this second glass layer containing uncured epoxy resin has a plurality of districts of running through, and those run through district and are positioned on the surface of those the second ends with respect to this substrate, extend perpendicularly on this second glass layer containing uncured epoxy resin surface with respect to this substrate; A plurality of the second conductive layers, laying respectively at this second glass layer containing uncured epoxy resin runs through on the surface in district towards those, each this second conductive layer has one the 3rd end, and the 3rd end extends on the surface of relative this substrate of this second glass layer containing uncured epoxy resin; The second protective layer, is covered on the surface of relative this substrate of this first glass layer containing uncured epoxy resin; And the 3rd protective layer or a reinforcing support layer; be covered in this second containing glass layer of uncured epoxy resin relatively on the surface of this substrate with the side surface of those the 3rd ends of those the second conductive layers on, make those the 3rd ends of those the second conductive layers exposed from the 3rd protective layer or this reinforcing support layer.

The diameter of those first ring connected in stars is all identical.

The length direction of those the first flutings is all identical.

Distance between relative two inwalls of this first fluting of distance and each between relative two inwalls of each this first ring connected in star is identical.

The degree of depth of this first fluting of the degree of depth and each of each this first ring connected in star is identical.

This substrate has a plurality of the second annular grooves and a plurality of the second fluting, and those second annular grooves and those the second flutings are positioned at this first surface of this substrate, and the two ends of each this second fluting are communicated in two those adjacent second annular grooves.

Those second slot staggered and be communicated in those first fluting wherein one.

The length direction of those the second flutings is perpendicular to the length direction of those the first flutings.

Distance between relative two inwalls of each this second annular groove is less than the distance between relative two inwalls of each this first ring connected in star.

Distance between relative two inwalls of this second fluting of distance and each between relative two inwalls of each this second annular groove is identical.

The degree of depth of this second fluting of the degree of depth and each of each this second annular groove is identical.

An object more of the present utility model is to provide another kind of circuit board package structure, to address the above problem.

For reaching above-mentioned purpose, the utility model provides a kind of circuit board package structure to comprise substrate, annular magnetic element, supporting layer and a plurality of the first conductive layer.Substrate has relative first surface and second surface, annular groove and a plurality of fluting.Annular groove and fluting are positioned at first surface.The side that annular groove is communicated to substrate by fluting forms at least two openings.Annular magnetic element is arranged in annular groove.Supporting layer is positioned on the first surface of substrate, and cover ring connected in star and fluting.Supporting layer and substrate have a plurality of perforation, and perforation adjacent annular groove.The first conductive layer lays respectively at supporting layer and substrate on the surface of perforation.Each first conductive layer has relative first end and the second end, and first end extends on the surface of the relative substrate of supporting layer, and the second end extends on the second surface of substrate.

This supporting layer also comprises: containing the glass layer of uncured epoxy resin, be positioned at the lower floor of this supporting layer, cover this annular groove and those flutings; And contain the glass layer of cured epoxy resin, and be positioned at the upper strata of this supporting layer, cover the glass layer containing uncured epoxy resin of lower floor.

This circuit board package structure also comprises: first containing the glass layer of uncured epoxy resin, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on, second containing the glass layer of uncured epoxy resin, is covered on this second surface of this substrate on those the second ends with those the first conductive layers, or a plurality of the second conductive layers, lay respectively at this first glass layer containing uncured epoxy resin, this second glass layer containing uncured epoxy resin, this supporting layer and this substrate are on the surface of those perforation, and relatively extend perpendicularly to this adjacent first end or extend perpendicularly to this adjacent the second end along this second surface of this substrate in the surface of this substrate along this supporting layer, each this second conductive layer has one the 3rd relative end and one the 4th end, and the 3rd end extends on the surface of relative this supporting layer of this first glass layer containing uncured epoxy resin, the 4th end extends on this second surface of this second glass layer containing uncured epoxy resin, the second protective layer, be covered in this first containing glass layer of uncured epoxy resin relatively on the surface of this substrate with those the 3rd ends of those the second conductive layers on, and the 3rd protective layer or a reinforcing support layer, be covered in this second glass layer containing uncured epoxy resin relatively on the surface of this substrate with those the 4th ends of those the second conductive layers on.

This circuit board package structure also comprises: the first glass layer containing uncured epoxy resin, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on, this first glass layer containing uncured epoxy resin has at least one district of running through, and this runs through on one that district is positioned at those first ends surface with respect to this supporting layer, extends perpendicularly on this first glass layer containing uncured epoxy resin surface with respect to this supporting layer; At least one the second conductive layer, being positioned at this first glass layer containing uncured epoxy resin runs through on the surface in district towards this, this second conductive layer has one the 3rd end, and the 3rd end extends on the surface of relative this supporting layer of this first glass layer containing uncured epoxy resin; Second containing the glass layer of uncured epoxy resin, is covered on this second surface of this substrate on those the second ends with those the first conductive layers; The second protective layer, be covered in this first containing glass layer of uncured epoxy resin relatively on the surface of this substrate with the side surface of the 3rd end of this second conductive layer on, make the 3rd end of this second conductive layer exposed from this second protective layer; And the 3rd protective layer or a reinforcing support layer, be covered in this second glass layer containing uncured epoxy resin relatively on the surface of this substrate.

This circuit board package structure also comprises: first containing the glass layer of uncured epoxy resin, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on; The second glass layer containing uncured epoxy resin, be covered on this second surface of this substrate on those the second ends with those the first conductive layers, this second glass layer containing uncured epoxy resin has at least one district of running through, and this runs through on one that district is positioned at those the second ends surface with respect to this substrate, extends perpendicularly on this second glass layer containing uncured epoxy resin surface with respect to this substrate; At least one the second conductive layer, being positioned at this second glass layer containing uncured epoxy resin runs through on the surface in district towards this, this second conductive layer has one the 3rd end, and the 3rd end extends on the surface of relative this substrate of this second glass layer containing uncured epoxy resin; The second protective layer, is covered on the surface of relative this substrate of this first glass layer containing uncured epoxy resin; And the 3rd protective layer or a reinforcing support layer; be covered in this second containing glass layer of uncured epoxy resin relatively on the surface of this substrate with the side surface of the 3rd end of this second conductive layer on, make the 3rd end of this second conductive layer exposed from the 3rd protective layer or this reinforcing support layer.

The length direction of those flutings is all identical.

Distance between relative two inwalls of those flutings of distance and each between relative two inwalls of this annular groove is identical.

The degree of depth of those flutings of the degree of depth and each of this annular groove is identical.

The utility model has the advantage of, because substrate has the first ring connected in star of the first fluting and accommodating annular magnetic element, and the first fluting is communicated in adjacent first ring connected in star, therefore after the direction clipper circuit plate encapsulating structure with vertical the first fluting, the first fluting can the substrate side surfaces after cutting form opening.Thus, circuit board package structure after cutting is when through surface laminating manufacture craft, although the gas in first ring connected in star can be subject to high temperature and expand in reflow stove, but gas can flow out by the first fluting, pressure is led off, can omit existing viscose, improve the inductance value of annular magnetic element.In addition, circuit board package structure is before cutting, and the first fluting is not covered and can be exposed by supporting layer, can avoid the front manufacture craft liquid using of clipper circuit plate encapsulating structure to enter first ring connected in star by the first fluting and cause polluting.

The manufacture method that another technology aspect of the present utility model is a kind of circuit board package structure.

According to the utility model one execution mode, a kind of manufacture method of circuit board package structure comprises the following step: substrate (a) is provided.(b) form a plurality of first ring connected in stars and a plurality of first and slot in the first surface of substrate, wherein each first ring connected in star is communicated to another first ring connected in star by least one the first fluting.(c) place a plurality of annular magnetic elements in first ring connected in star.(d) attach supporting layer on the first surface of substrate, first ring connected in star and the first fluting are covered by supporting layer.(e) form a plurality of perforation through supporting layer and substrate, and the adjacent first ring connected in star of boring a hole.(f) form a plurality of the first conductive layers in supporting layer and substrate on the surface of perforation, on the surface of the relative substrate of supporting layer and on the second surface of substrate.(g) be patterned on the surface of the relative substrate of supporting layer the first conductive layer on the second surface with substrate.

In the above-mentioned execution mode of the utility model, due to when forming first ring connected in star and the first fluting, cutter can first decline and enter substrate, then move horizontally and cut out first ring connected in star and the first fluting, and after the first ring connected in star being connected and first has been slotted, cutter just rises, and therefore can save the time that cutter vertically moves (rise and decline).

Accompanying drawing explanation

Fig. 1 illustrates according to the top view of the circuit board package structure of the utility model one execution mode;

Fig. 2 illustrates the circuit board package structure of Fig. 1 along the cutaway view of line segment 2-2;

Fig. 3 illustrates the circuit board package structure of Fig. 1 after line segment L2 cutting, the end view of seeing from direction D1;

Fig. 4 illustrates according to the flow chart of the manufacture method of the circuit board package structure of the utility model one execution mode;

Fig. 5 illustrates the cutaway view of the substrate of Fig. 4;

The cutaway view when substrate that Fig. 6 illustrates Fig. 5 forms first ring connected in star;

Fig. 7 illustrates the top view of the cutter mobile route of Fig. 6;

Fig. 8 illustrates the first ring connected in star of Fig. 7 and places after annular magnetic element, and supporting layer is attached at the cutaway view after substrate;

Supporting layer and substrate that Fig. 9 illustrates Fig. 8 form the cutaway view after perforation;

Supporting layer and substrate that Figure 10 illustrates Fig. 9 form the cutaway view after conductive layer;

Figure 11 illustrates according to the top view of the circuit board package structure of the utility model one execution mode;

Figure 12 illustrates the circuit board package structure of Figure 11 after line segment L7 cutting, the end view of seeing from direction D2;

Figure 13 illustrates according to the cutaway view of the circuit board package structure of the utility model one execution mode, and its profile position is identical with Fig. 2;

Figure 14 illustrates according to the cutaway view of the circuit board package structure of the utility model one execution mode, and its profile position is identical with Fig. 2;

Figure 15 illustrates according to the cutaway view of the circuit board package structure of the utility model one execution mode, and its profile position is identical with Fig. 2.

Symbol description

100: circuit board package structure 100a: circuit board package structure

100b: circuit board package structure 100c: circuit board package structure

100d: circuit board package structure 110: substrate

111: surface 112: first surface

114: second surface 115: Copper Foil

115a: contraposition part 116: first ring connected in star

117: 118: the first flutings of Copper Foil

119: 126: the second annular grooves of opening

128: the second flutings 129: opening

130: annular magnetic element 130a: annular magnetic element

140: supporting layer 141: Copper Foil

142: surface 144: surface

145: the glass 146 that contains uncured epoxy resin: contain the glass of cured epoxy resin

Glass fibrage glass fibrage

Containing uncured epoxy resin 148: the second contain uncured epoxy resin at 147: the first

The glass layer of glass layer

149: run through district 150: perforation

150 ': 160: the first conductive layers of long perforation

162: first end 164: the second end

174: the second protective layers of 172: the first protective layers

178: the four protective layers of 176: the three protective layers

182: the three ends of 180: the second conductive layers

184: the four ends 210: cutter

2-2: line segment A1: region

A2: region D1: direction

D2: direction d1～d4: the degree of depth

L1～L8: line segment P1～P4: path

S1～S7: step S11～S17: step

S21～S26: step S31～S36: step

W1～W4: distance

Embodiment

Below will disclose a plurality of execution mode of the present utility model with accompanying drawing, as clearly stated, the details in many practices will be explained in the following description.Yet, should be appreciated that, the details in these practices does not apply to limit the utility model.That is to say, in the utility model part execution mode, the details in these practices is non-essential.In addition,, for the purpose of simplifying accompanying drawing, some existing habitual structures and element illustrate it by the mode simply to illustrate in the accompanying drawings.

Fig. 1 illustrates according to the top view of the circuit board package structure 100 of the utility model one execution mode.Fig. 2 illustrates the circuit board package structure 100 of Fig. 1 along the cutaway view of line segment 2-2.Consult Fig. 1 and Fig. 2, circuit board package structure 100 comprises substrate 110, a plurality of annular magnetic element 130, supporting layer 140 and a plurality of the first conductive layers 160 simultaneously.Wherein, substrate 110 has relative first surface 112 and second surface 114, a plurality of first ring connected in star 116 and a plurality of the first flutings 118.First ring connected in star 116 and the first fluting 118 are positioned at the first surface 112 of substrate 110.Each first ring connected in star 116 is communicated to another first ring connected in star 116 by least one the first fluting 118, and the length direction D1 of the first fluting 118 is all identical.

Annular magnetic element 130 lays respectively in first ring connected in star 116.Supporting layer 140 is positioned on the first surface 112 of substrate 110, and covers first ring connected in star 116 and the first fluting 118.Supporting layer 140 has a plurality of perforation 150 with substrate 110, and relative two walls of perforation 150 adjacent first ring connected in stars 116.In addition, the first conductive layer 160 lay respectively at supporting layer 140 towards perforation 150 surface 142 with substrate 110 on the surface 111 of perforation 150.Each first conductive layer 160 has relative first end 162 and the second end 164, and first end 162 extends on the surface 144 of supporting layer 140 relative substrates 110, and the second end 164 extends on the second surface 114 of substrate 110.

Supporting layer 140 can comprise containing the glass layer (PP, b-stage) 145 of uncured epoxy resin and contain the glass layer (FR4, c-stage) 146 of cured epoxy resin.Wherein, containing the glass layer 145 of uncured epoxy resin, be positioned at the lower floor of supporting layer 140, and cover ring connected in star 116 and fluting 118.Contain the glass layer 146 of cured epoxy resin and be positioned at the upper strata of supporting layer 140, and cover the glass layer 145 containing uncured epoxy resin of lower floor.

In the present embodiment, circuit board package structure 100 also comprises a plurality of the first protective layers 172, the second protective layer 174 and the 3rd protective layer 176.Wherein, the first protective layer 172 lays respectively in perforation 150.The second protective layer 174 is covered on the surface 144 of supporting layer 140 relative substrates 110 on the first end 162 with the first conductive layer 160.The 3rd protective layer 176 is covered on the second surface 114 of substrate 110 on the second end 164 with the first conductive layer 160.When cutter is after line segment L1, L2, L3, L4 clipper circuit plate encapsulating structure 100, the circuit board package structure 100 of region A1 can be considered a choke (power choke).

Fig. 3 illustrates the circuit board package structure 100 of Fig. 1 after line segment L1 cutting, the end view of seeing from direction D1.Consult Fig. 1 and Fig. 3 simultaneously, because substrate 110 has the first ring connected in star 116 of the first fluting 118 and accommodating annular magnetic element 130, and the two ends of the first fluting 118 are communicated in two adjacent first ring connected in stars 118, therefore after direction (for example, along line segment L1, L2) the clipper circuit plate encapsulating structure 100 with vertical the first fluting 118, the first fluting 118 can form opening 119 in substrate 110 sides after cutting, for example the intersection of line segment L1 and the first fluting 118 can form opening 119, and the intersection of line segment L2 and the first fluting 118 also can form opening 119.Thus, the circuit board package structure after cutting 100 is at manufacture craft (the Surface Mount Technology that fits through surface; SMT) time, although the gas in first ring connected in star 116 can be subject to high temperature and expand in infrared ray reflow stove (IR reflow), gas can flow out outside opening 119 by the first fluting 118, and pressure is led off, can omit existing viscose, improve the inductance value of annular magnetic element 130.In addition, circuit board package structure 100 is before cutting, and the first fluting 118 is covered and can not exposed by supporting layer 140, can avoid front the used manufacture craft liquid of clipper circuit plate encapsulating structure 100 to enter first ring connected in star 116 by the first fluting 118.

In the present embodiment, the diameter of first ring connected in star 116 is all identical.Distance W 1 between relative two inwalls of each first ring connected in star 116 is identical with the distance W 2 between each first fluting relative two inwall of 118, and the depth d 1 of each first ring connected in star 116 is identical with each first slot depth d 2 of 118.Such design, when using forming machine to form first ring connected in stars 116 and first at substrate 110, slot 118 time, because the cutter of forming machine can be fixed on a vertical level, move first ring connected in star 116 and first fluting 118 (for example the first ring connected in star 116 between line segment L3, L4 and the first fluting 118) that just can form connection, therefore can reduce formation first ring connected in star 116 and first and slot time of 118.

Should be appreciated that, the element annexation narrated will be not repeat repeating, close first chat bright.In the following description, by the manufacture method of explanation circuit board package structure 100.

Fig. 4 illustrates according to the flow chart of the manufacture method of the circuit board package structure of the utility model one execution mode.First in step S1, provide substrate.Then in step S2, form a plurality of first ring connected in stars and a plurality of first and slot in the first surface of substrate, wherein each first ring connected in star is communicated to another first ring connected in star by least one the first fluting.In step S3, place a plurality of annular magnetic elements in first ring connected in star afterwards.Then in step S4, attach supporting layer on the first surface of substrate, first ring connected in star and the first fluting are covered by supporting layer.In step S5, form a plurality of perforation through supporting layer and substrate afterwards, and the adjacent first ring connected in star of boring a hole.Then in step S6, form a plurality of the first conductive layers in supporting layer with substrate on the surface of boring a hole, on the surface of the relative substrate of supporting layer and on the second surface of substrate.Finally in step S7, be patterned on the surface of the relative substrate of supporting layer the first conductive layer on the second surface with substrate.

In the following description, by each step of manufacture method of explanation foregoing circuit plate encapsulating structure.

Fig. 5 illustrates the cutaway view of the substrate 110 of Fig. 4.First surface 112 and the second surface 114 of substrate 110 have respectively Copper Foil 115,117, can be copper clad laminate (the Copper Clad Laminate that comprises glass fibre (FR4); CCL).The contraposition part 115a (seeing Fig. 6) that the Copper Foil 115 of substrate 110 can the contraposition of the follow-up manufacture craft board of patterned formation be used.The patterning referring to herein can comprise the steps such as exposure, development or etching, but with said method, is not limited.

The cutaway view when substrate 110 that Fig. 6 illustrates Fig. 5 forms first ring connected in star 116.Fig. 7 illustrates the top view of cutter 210 mobile routes of Fig. 6.Consult Fig. 6 and Fig. 7 simultaneously, then can utilize the cutter 210 of forming machine to form a plurality of first ring connected in stars 116 and a plurality of the first flutings 118 in the first surface 112 of substrate 110.Because cutter 210 is forming first ring connected in star 116 and the first fluting 118 o'clock, can declines and enter the first surface 112 of substrate 110.Then cutter 210 can sequentially prolong path P 1, P2, P3, P4 and moves horizontally under fixing vertical height, so cut out the identical and depth d 1 of width distance W1, W2, first ring connected in star 116 that d2 (seeing Fig. 3) is identical slots 118 with first.

For example, after the first ring connected in star 116 being connected and the first fluting 118 complete (all first ring connected in stars 116 between Fig. 1 line segment L3, L4 and first slot 118), cutter 210 just rises and leaves substrate 110.Thus, can not only save cutter 210 and vertically move the time of (rise and decline) in substrate 110, and the two ends of each the first fluting 118 can be communicated in two adjacent first ring connected in stars 116 (as shown in Figure 1).In addition, also can forming with infrared laser cutting of first ring connected in star 116 and the first fluting 118, is applicable to the more circuit board package structure of circuit 100 (seeing Fig. 1).

Fig. 8 illustrates the first ring connected in star 116 of Fig. 7 and places after annular magnetic element 130, and supporting layer 140 is attached at the cutaway view after substrate 110.Consult Fig. 7 and Fig. 8 simultaneously, until first ring connected in star 116 and the first fluting 118 (seeing Fig. 7), be formed at after substrate 110, can place annular magnetic element 130 in first ring connected in star 116.Then supporting layer 140 can be attached on the first surface 112 of substrate 110, first ring connected in star 116 and the first fluting 118 are covered by supporting layer 140.In the present embodiment, the surface of supporting layer 140 has Copper Foil 141.

Fig. 9 illustrates the supporting layer 140 of Fig. 8 and the cutaway view that substrate 110 forms after perforation 150.Consult Fig. 8 and Fig. 9, layer 140 to be supported is attached at after substrate 110 simultaneously, and can bore a plurality of perforation 150 with substrate 110 in supporting layer 140 and run through, and relative two walls of perforation 150 adjacent first ring connected in stars 116.

Figure 10 illustrates the supporting layer 140 of Fig. 9 and the cutaway view that substrate 110 forms after the first conductive layers 160.Consult Fig. 9 and Figure 10 simultaneously, layer to be supported 140 forms after perforation 150 with substrate 110, can utilize the mode of plating on Copper Foil 141, supporting layer 140 on the surface 142 of perforation 150, substrate 110 forms the first conductive layer 160 on the surface 111 of perforation 150 with on Copper Foil 117.The material of the first conductive layer 160 can be copper, can combine with Copper Foil 117,141, makes the first conductive layer 160 on the surface 144 of supporting layer 140 relative substrates 110 and on the second surface 114 of substrate 110.

Then, can form the first protective layer 172 in 150 in perforation, make to bore a hole and 150 by the first protective layer 172, filled up.After just first conductive layer 160 of patternable on the surface 144 of supporting layer 140 and the first conductive layer 160 on the second surface 114 of substrate 110, make the first conductive layer 160 there is first end 162 and the second end 164, and obtain the structure of Figure 10.

Consult Fig. 2 and Figure 10 simultaneously; after the first conductive layer 160 to be patterned; can form on the surface 144 that the second protective layer 174 covers supporting layers 140 first end 162 with the first conductive layer 160 on supporting layer 140 surfaces 144, and form on the second surface 114 of the 3rd protective layer 176 covered substrates 110 the second end 164 with the first conductive layer 160 on the second surface 114 of substrate 110.In the present embodiment, the material of the first protective layer 172, the second protective layer 174 and the 3rd protective layer 176 can comprise epoxy resin (epoxy), the green paint of use as usual, but not with restriction the utility model.In addition, the 3rd protective layer 176 can be substituted by reinforcing support layer, and reinforcing support layer can be copper foil layer, release film, epoxy resin or contains the glass layer of cured epoxy resin, but is not limited to this.

Consult Fig. 1 and Fig. 2 simultaneously; after the second protective layer 174 and the 3rd protective layer 176 formation; can, with direction (for example, along line segment L1, L2) cutting the second protective layer 174, supporting layer 140, substrate 110 and the 3rd protective layer 176 of vertical the first fluting 118, make each first fluting 118 side at substrate 110 after cutting form opening 119 (seeing Fig. 3).

Figure 11 illustrates according to the top view of the circuit board package structure 100a of the utility model one execution mode.Figure 12 illustrates the circuit board package structure 100a of Figure 11 after line segment L7 cutting, the end view of seeing from direction D2.Consult Figure 11 and Figure 12, the places different from Fig. 1, Fig. 3 are simultaneously: substrate 110 also has a plurality of the second annular grooves 126 and a plurality of the second flutings 128.The second annular groove 126 and the second fluting 128 are positioned at the first surface 112 of substrate 110.Each second fluting two ends of 128 is communicated in two the second adjacent annular grooves 126, and each second fluting 128 is staggered and be communicated in the wherein one of the first fluting 118.In the present embodiment, the length direction D2 of the second fluting 128 is perpendicular to the length direction D1 of the first fluting 118.Distance W 3 between relative two inwalls of each the second annular groove 126 is less than the distance W 1 between relative two inwalls of each first ring connected in star 116, and the annular magnetic element 130a in the second annular groove 126 is less than annular magnetic element 130.

When cutter is after line segment L5, L6, L7, L7 clipper circuit plate encapsulating structure 100a, the circuit board package structure 100 of region A2 can be considered a transformer for connector (transformer).

After direction (for example, along line segment L7, L8) the clipper circuit plate encapsulating structure 100a with vertical the second fluting 128, the second fluting 128 can form opening 129 in substrate 110 sides after cutting.Thus, the circuit board package structure 100a after cutting is at manufacture craft (the Surface Mount Technology that fits through surface; SMT) time, although the gas in the second annular groove 126 can be subject to high temperature and expand in infrared ray reflow stove (IR reflow), but gas can flow out outside opening 129 by the second fluting 128, pressure is led off, can omit existing viscose, improve the inductance value of annular magnetic element 130a.In addition, circuit board package structure 100a is before cutting, and the second fluting 128 is covered and can not exposed by supporting layer 140, can avoid the manufacture craft liquid using before clipper circuit plate encapsulating structure 100a to enter the second annular groove 126 by the second fluting 128.

In the present embodiment, distance W 3 between relative two inwalls of each the second annular groove 126 is identical with the distance W 4 between each second fluting relative two inwall of 128, and the depth d 3 of each the second annular groove 126 is identical with each second slot depth d 4 of 128.Such design, when using forming machine to form the second annular grooves 126 and second at substrate 110, slot 128 time, because the cutter of forming machine can be fixed on a vertical level, move the second annular groove 126 and second fluting 128 (for example the second annular groove 126 between line segment L5, L6 and the second fluting 128) that just can form connection, therefore can reduce formation the second annular groove 126 and second and slot time of 128.

When cutter is when the first surface 112 of substrate 110 forms first ring connected in stars 116 with the first fluting 118, the second annular groove 126 and second is slotted 128 also can first surface 112 formation at substrate 110 by cutter.Because the manufacture method of circuit board package structure 100a only increases than the manufacture method of circuit board package structure 100 (seeing Fig. 1) step that forms the second annular groove 126 and the second fluting 128, all the other steps are identical, so do not repeat to repeat.

Figure 13 illustrates according to the cutaway view of the circuit board package structure 100b of the utility model one execution mode, and its profile position is identical with Fig. 2.Circuit board package structure 100b also can have as the first ring connected in star 116 of Fig. 1 and the first fluting 118, also optionally has as the second annular groove 126 of Figure 11 and the second fluting 128.In the present embodiment; circuit board package structure 100b, except comprising substrate 110, annular magnetic element 130, supporting layer 140 and the first conductive layer 160, also comprises the first glass layer 147, the second glass layer 148, the second conductive layer 180, the second protective layer 174, the 3rd protective layer 176 and the 4th protective layer 178 containing uncured epoxy resin containing uncured epoxy resin.

First is covered on the surface of supporting layer 140 relative substrates 110 on the first end 162 with the first conductive layer 160 containing the glass layer 147 of uncured epoxy resin.Second is covered on the second surface 114 of substrate 110 on the second end 164 with the first conductive layer 160 containing the glass layer 148 of uncured epoxy resin.The second conductive layer 180 be positioned at the first glass layer 147 containing uncured epoxy resin, the second glass layer 148 containing uncured epoxy resin, supporting layer 140 with substrate 110 on the surface of long perforation 150 ', and the second conductive layer 180 extends perpendicularly to adjacent first end 162 (not illustrating) or extends perpendicularly to adjacent the second end 164 (as shown in figure 13) along the second surface 114 of substrate 110 along the surface of supporting layer 140 relative substrates 110.

Each second conductive layer 180 has the 3rd relative end 182 and the 4th end 184, and the 3rd end 182 extends on the surface of the first glass layer 147 relative supporting layers 140 containing uncured epoxy resin, and the 4th end 184 extends on the second surface 114 of the second glass layer 148 containing uncured epoxy resin.The second protective layer 174 be covered in first containing on the surface of the glass layer 147 relative substrates 110 of uncured epoxy resin with the 3rd end 182 of the second conductive layer 180 on.The 3rd protective layer 176 be covered in second containing on the surface of the glass layer 148 relative substrates 110 of uncured epoxy resin with the 4th end 184 of the second conductive layer 180 on.In addition, the 4th protective layer 178 lays respectively in long perforation 150 '.

Therefore, after the circuit that each second conductive layer 180 forms with one or more first conductive layer 160 is connected, the second conductive layer 180 is positioned at the 3rd end 182 and the 4th end 184 on encapsulating structure 100b surface, at follow-up manufacture craft (the Surface Mount Technology that fits through surface; SMT) time, can be used for being electrically connected with electronic component (IC), the circuit forming to save each first conductive layer 160, extends with the required space that is electrically connected in encapsulating structure 100b surface.

The manufacture method of circuit board package structure 100b also comprises the following step: step S11 compared to Fig. 4, attach the first glass layer containing uncured epoxy resin and the first copper foil layer in supporting layer on the surface with respect to substrate, supporting layer is covered by the first glass layer containing uncured epoxy resin, and the first glass layer containing uncured epoxy resin is covered by the first copper foil layer.Step S12, attach the second glass layer containing uncured epoxy resin and the second copper foil layer on the second surface of substrate, the second surface of substrate is covered by the second glass layer containing uncured epoxy resin, and the second glass layer containing uncured epoxy resin is covered by the second copper foil layer.Step S13, forms one or more long perforation through copper foil layer, containing glass layer, supporting layer and the substrate of uncured epoxy resin, and the first conductive layer of the patterning of long perforation connected diagram 4 step S7.Step S14, forms the first conductive layer on the surface of the long perforation of step S13, on the surface of the relative substrate of copper foil layer.Step S15, forms a plurality of the 4th protective layers in long perforation.Step S16, the copper foil layer of patterning step S11 and S12 and form the first conductive layer.Step S17, forms the first conductive layer that the second protective layer and the 3rd protective layer cover the patterning of step S16.

In addition; the manufacture method of circuit board package structure 100b also can comprise with the direction of vertical the first fluting cut the second protective layer, containing glass layer, supporting layer, substrate and the 3rd protective layer of uncured epoxy resin, make each the first side formation opening that is recessed at substrate after cutting.

Figure 14 illustrates according to the cutaway view of the circuit board package structure 100c of the utility model one execution mode, and its profile position is identical with Fig. 2.Circuit board package structure 100c comprises the first glass layer 147 containing uncured epoxy resin, a plurality of the second conductive layer 180, the second glass layer 148, the second protective layer 174 and the 3rd protective layer 176 containing uncured epoxy resin.First is covered on the surface 144 of supporting layer 140 relative substrates 110 on the first end 162 with the first conductive layer 160 containing the glass layer 147 of uncured epoxy resin.First has and a plurality ofly runs through district 149 containing the glass layer 147 of uncured epoxy resin, and runs through district 149 and be positioned on the surface of first end 162 with respect to supporting layer 140.Running through district 149 extends perpendicularly on the surface of the first glass layer 147 containing uncured epoxy resin with respect to supporting layer 140.The second conductive layer 180 lays respectively at the first glass layer 147 containing uncured epoxy resin towards running through on the surface in district 149.Each second conductive layer 180 has the 3rd end 182, and the 3rd end 182 extends on the surface of the first glass layer 147 relative supporting layers 140 containing uncured epoxy resin.

In addition second containing the glass layer 148 of uncured epoxy resin, be covered on the second surface 114 of substrate 110 on the second end 164 with the first conductive layer 160.The second protective layer 174 be covered in first containing on the surface of the glass layer 147 relative substrates 110 of uncured epoxy resin with the side surface of the 3rd end 182 of the second conductive layer 180 on, make the 3rd end 182 of the second conductive layer 180 exposed from the second protective layer 174.The 3rd protective layer 176 is covered on the surface of the second glass layer 148 relative substrates 110 containing uncured epoxy resin.

When circuit board package structure 100c is after cutting manufacture craft, circuit board package structure 100c after cutting can only have single district 149 and single the second conductive layer 180 of running through, and wherein runs through the quantity of district 149 and the second conductive layer 180 not in order to limit the utility model.In the present embodiment, the surface of the first glass layer 147 containing uncured epoxy resin can have copper foil layer.The surface of the second glass layer 148 containing uncured epoxy resin can have reinforcing support layer.

The manufacture method of circuit board package structure 100c also comprises the following step: step S21 compared to Fig. 4, attach the first glass layer containing uncured epoxy resin and copper foil layer in supporting layer on the surface with respect to substrate, supporting layer is covered by the first glass layer containing uncured epoxy resin, and the first glass layer containing uncured epoxy resin is covered by copper foil layer.Step S22, attach the second glass layer containing uncured epoxy resin and reinforcing support layer on the second surface of substrate, the second surface of substrate is covered by the second glass layer containing uncured epoxy resin, and the second glass layer containing uncured epoxy resin is covered by reinforcing support layer.Step S23, forms one or more and runs through district through the copper foil layer of step S21 and this first glass layer containing uncured epoxy resin, and runs through patterning the first conductive layer of district's connected diagram 4 step S7.Step S24, forms on the second conductive layer runs through district surface in each of step S23 and on the surface of the relative substrate of copper foil layer of step S21.Step S25, the copper foil layer of patterning step S21 and form the first conductive layer.Step S26, forms the first conductive layer that the second protective layer covers step S25 patterning.

Wherein the reinforcing support layer of step S22 can be copper foil layer, release film, epoxy resin or contains the glass layer of cured epoxy resin, but is not limited to this, also can after completing steps S22, remove reinforcing support layer and cover the 3rd protective layer to substitute.

In addition; the manufacture method of circuit board package structure 100c also can comprise with the direction of vertical the first fluting cut the second protective layer, containing glass layer, supporting layer, substrate and the reinforcing support layer of uncured epoxy resin; or cutting the second protective layer, containing glass layer, supporting layer, substrate and the 3rd protective layer of uncured epoxy resin, make each the first side formation opening that is recessed at substrate after cutting.

Figure 15 illustrates according to the cutaway view of the circuit board package structure 100d of the utility model one execution mode, and its profile position is identical with Fig. 2.Circuit board package structure 100d comprises the first glass layer 147, the second glass layer 148, a plurality of the second conductive layer 180, the second protective layer 174 and the 3rd protective layer 176 containing uncured epoxy resin containing uncured epoxy resin.First is covered on the surface 144 of supporting layer 140 relative substrates 110 on the first end 162 with the first conductive layer 160 containing the glass layer 147 of uncured epoxy resin.

In addition second containing the glass layer 148 of uncured epoxy resin, be covered on the second surface 114 of substrate 110 on the second end 164 with the first conductive layer 160.Second has and a plurality ofly runs through district 149 containing the glass layer 148 of uncured epoxy resin, and runs through district 149 and be positioned on the surface of the second end 164 with respect to substrate 110.Running through district 149 extends perpendicularly on the surface of the second glass layer 148 containing uncured epoxy resin with respect to substrate 110.The second conductive layer 180 lays respectively at the second glass layer 148 containing uncured epoxy resin towards running through on the surface in district 149.Each second conductive layer 180 has the 3rd end 182, and the 3rd end 182 extends on the surface of the second glass layer 148 relative substrates 110 containing uncured epoxy resin.The second protective layer 174 is covered on the surface of the first glass layer 147 relative substrates 110 containing uncured epoxy resin.The 3rd protective layer 176 be covered in second containing on the surface of the glass layer 148 relative substrates 110 of uncured epoxy resin with the side surface of the 3rd end 182 of the second conductive layer 180 on, make the 3rd end 182 of the second conductive layer 180 exposed from the 3rd protective layer 176.

When circuit board package structure 100d is after cutting manufacture craft, circuit board package structure 100d after cutting can only have single district 149 and single the second conductive layer 180 of running through, and wherein runs through the quantity of district 149 and the second conductive layer 180 not in order to limit the utility model.In the present embodiment, the surface of the first glass layer 147 containing uncured epoxy resin can have reinforcing support layer.The surface of the second glass layer 148 containing uncured epoxy resin can have copper foil layer.

The manufacture method of circuit board package structure 100d also comprises the following step: step S31 compared to Fig. 4, attach the first glass layer containing uncured epoxy resin and reinforcing support layer in supporting layer on the surface with respect to substrate, supporting layer is covered by the first glass layer containing uncured epoxy resin, and the first glass layer containing uncured epoxy resin is covered by reinforcing support layer.Step S32, attach the second glass layer containing uncured epoxy resin and copper foil layer on the second surface of substrate, the second surface of substrate is covered by the second glass layer containing uncured epoxy resin, and the second glass layer containing uncured epoxy resin is covered by copper foil layer.Step S33, forms one or more and runs through district through copper foil layer and the second glass layer containing uncured epoxy resin of step S32, and runs through the first conductive layer of the patterning of district's connected diagram 4 step S7.Step S34, forms on the second conductive layer runs through district surface in each of step S33 and on the surface of the relative substrate of copper foil layer of step S32.Step S35, the copper foil layer of patterning step S32 and form the first conductive layer.Step S36, forms the first conductive layer that the second protective layer covers step S35 patterning.

Wherein the reinforcing support layer of step S31 can be copper foil layer, release film, epoxy resin or contains the glass layer of cured epoxy resin, but is not limited to this, also can after completing steps S31, remove reinforcing support layer and cover the 3rd protective layer to substitute.

In addition; the manufacture method of circuit board package structure 100d also can comprise direction cutting reinforcing support layer with vertical the first fluting, containing glass layer, supporting layer, substrate and second protective layer of uncured epoxy resin; or cutting the 3rd protective layer, containing glass layer, supporting layer, substrate and second protective layer of uncured epoxy resin, make each the first side formation opening that is recessed at substrate after cutting.

The advantage of circuit board package structure 100d of circuit board package structure 100c of Figure 14 and preparation method thereof, Figure 15 and preparation method thereof is as follows: protective layer (for example green paint) can be artificial on; when coating protective layer; because there is the glass layer (PP) containing uncured epoxy resin its below; therefore green paint can be thinner, reduces and because green paint is inhomogeneous, cause reliability to decline.In addition, the glass layer of uncured epoxy resin also can make overall structure comparatively firm, can make reliability increase.

Claims

1. a circuit board package structure, is characterized in that, this circuit board package structure comprises:

Substrate, there is relative first surface and second surface, a plurality of first ring connected in star and a plurality of the first fluting, those first ring connected in stars and those the first flutings are positioned at this first surface, each first ring connected in star is communicated to another first ring connected in star by least one the first fluting, and at least two first ring connected in stars are communicated to substrate side surfaces and are formed at least two openings by those first flutings:

A plurality of annular magnetic elements, lay respectively in those first ring connected in stars;

Supporting layer, is positioned on this first surface of this substrate, and covers those first ring connected in stars and those the first flutings, and this supporting layer and this substrate have a plurality of perforation, and adjacent those first ring connected in stars of those perforation; And

A plurality of the first conductive layers, lay respectively at this supporting layer and this substrate on the surface of those perforation, each this first conductive layer has relative first end and the second end, and this first end extends on the surface of relative this substrate of this supporting layer, and this second end extends on this second surface of this substrate.

2. circuit board package structure as claimed in claim 1, is characterized in that, this circuit board package structure also comprises:

A plurality of the first protective layers, lay respectively in those perforation.

3. circuit board package structure as claimed in claim 1, is characterized in that, this supporting layer also comprises:

Containing the glass layer of uncured epoxy resin, be positioned at the lower floor of this supporting layer, cover those annular grooves and those flutings; And

Contain the glass layer of cured epoxy resin, be positioned at the upper strata of this supporting layer, cover the glass layer containing uncured epoxy resin of lower floor.

4. circuit board package structure as claimed in claim 1, is characterized in that, this circuit board package structure also comprises:

The second protective layer, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on; And

The 3rd protective layer or reinforcing support layer, be covered on this second surface of this substrate on those the second ends with those the first conductive layers.

5. circuit board package structure as claimed in claim 1, is characterized in that, this circuit board package structure also comprises:

First containing the glass layer of uncured epoxy resin, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on;

Second containing the glass layer of uncured epoxy resin, is covered on this second surface of this substrate on those the second ends with those the first conductive layers;

A plurality of the second conductive layers, lay respectively at this first glass layer containing uncured epoxy resin, this second glass layer containing uncured epoxy resin, this supporting layer and this substrate are on the surface of those perforation, and relatively extend perpendicularly to this adjacent first end or extend perpendicularly to this adjacent the second end along this second surface of this substrate in the surface of this substrate along this supporting layer, each this second conductive layer has the 3rd relative end and the 4th end, and the 3rd end extends on the surface of relative this supporting layer of this first glass layer containing uncured epoxy resin, the 4th end extends on this second surface of this second glass layer containing uncured epoxy resin,

The second protective layer, be covered in this first containing glass layer of uncured epoxy resin relatively on the surface of this substrate with those the 3rd ends of those the second conductive layers on; And

The 3rd protective layer or reinforcing support layer, be covered in this second containing glass layer of uncured epoxy resin relatively on the surface of this substrate with those the 4th ends of those the second conductive layers on.

6. circuit board package structure as claimed in claim 5, is characterized in that, this circuit board package structure also comprises:

A plurality of the 4th protective layers, lay respectively in those perforation.

7. circuit board package structure as claimed in claim 1, is characterized in that, this circuit board package structure also comprises:

The first glass layer containing uncured epoxy resin, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on, this first glass layer containing uncured epoxy resin has a plurality of districts of running through, and those run through district and are positioned on the surface of those first ends with respect to this supporting layer, extend perpendicularly on this first glass layer containing uncured epoxy resin surface with respect to this supporting layer;

A plurality of the second conductive layers, laying respectively at this first glass layer containing uncured epoxy resin runs through on the surface in district towards those, each this second conductive layer has one the 3rd end, and the 3rd end extends on the surface of relative this supporting layer of this first glass layer containing uncured epoxy resin;

The second protective layer, be covered in this first containing glass layer of uncured epoxy resin relatively on the surface of this substrate with the side surface of those the 3rd ends of those the second conductive layers on, make those the 3rd ends of those the second conductive layers exposed from this second protective layer; And

The 3rd protective layer or a reinforcing support layer, be covered on the surface of relative this substrate of this second glass layer containing uncured epoxy resin.

8. circuit board package structure as claimed in claim 1, is characterized in that, this circuit board package structure also comprises:

The second glass layer containing uncured epoxy resin, be covered on this second surface of this substrate on those the second ends with those the first conductive layers, this second glass layer containing uncured epoxy resin has a plurality of districts of running through, and those run through district and are positioned on the surface of those the second ends with respect to this substrate, extend perpendicularly on this second glass layer containing uncured epoxy resin surface with respect to this substrate;

A plurality of the second conductive layers, laying respectively at this second glass layer containing uncured epoxy resin runs through on the surface in district towards those, each this second conductive layer has one the 3rd end, and the 3rd end extends on the surface of relative this substrate of this second glass layer containing uncured epoxy resin;

The second protective layer, is covered on the surface of relative this substrate of this first glass layer containing uncured epoxy resin; And

The 3rd protective layer or reinforcing support layer; be covered in this second containing glass layer of uncured epoxy resin relatively on the surface of this substrate with the side surface of those the 3rd ends of those the second conductive layers on, make those the 3rd ends of those the second conductive layers exposed from the 3rd protective layer or this reinforcing support layer.

9. circuit board package structure as claimed in claim 1, is characterized in that, the diameter of those first ring connected in stars is all identical.

10. circuit board package structure as claimed in claim 1, is characterized in that, the length direction of those the first flutings is all identical.

11. circuit board package structures as claimed in claim 1, is characterized in that, the distance between relative two inwalls of this first fluting of distance and each between relative two inwalls of each this first ring connected in star is identical.

12. circuit board package structures as claimed in claim 1, is characterized in that, the degree of depth of this first fluting of the degree of depth and each of each this first ring connected in star is identical.

13. circuit board package structures as claimed in claim 1, it is characterized in that, this substrate has a plurality of the second annular grooves and a plurality of the second fluting, those second annular grooves and those the second flutings are positioned at this first surface of this substrate, and the two ends of each this second fluting are communicated in two those adjacent second annular grooves.

14. circuit board package structures as claimed in claim 13, is characterized in that, those second slot staggered and be communicated in those first fluting wherein one.

15. circuit board package structures as claimed in claim 13, is characterized in that, the length direction of those the second flutings is perpendicular to the length direction of those the first flutings.

16. circuit board package structures as claimed in claim 13, is characterized in that, the distance between relative two inwalls of each this second annular groove is less than the distance between relative two inwalls of each this first ring connected in star.

17. circuit board package structures as claimed in claim 13, is characterized in that, the distance between relative two inwalls of this second fluting of distance and each between relative two inwalls of each this second annular groove is identical.

18. circuit board package structures as claimed in claim 13, is characterized in that, the degree of depth of this second fluting of the degree of depth and each of each this second annular groove is identical.

19. 1 kinds of circuit board package structures, is characterized in that, this circuit board package structure comprises:

Substrate, has relative first surface and second surface, an annular groove and a plurality of fluting, and this annular groove and those flutings are positioned at this first surface, and the side that annular groove is communicated to this substrate by those flutings forms at least two openings:

Annular magnetic element, is arranged in this annular groove;

Supporting layer, is positioned on this first surface of this substrate, and covers this annular groove and those flutings, and this supporting layer and this substrate have a plurality of perforation, and adjacent this annular groove of those perforation; And

20. circuit board package structures as claimed in claim 19, is characterized in that, this circuit board package structure also comprises:

21. circuit board package structures as claimed in claim 19, is characterized in that, this supporting layer also comprises:

Containing the glass layer of uncured epoxy resin, be positioned at the lower floor of this supporting layer, cover this annular groove and those flutings; And

22. circuit board package structures as claimed in claim 19, is characterized in that, this circuit board package structure also comprises:

23. circuit board package structures as claimed in claim 19, is characterized in that, this circuit board package structure also comprises:

One or more second conductive layer, lay respectively at this first glass layer containing uncured epoxy resin, this second glass layer containing uncured epoxy resin, this supporting layer and this substrate are on the surface of those perforation, and relatively extend perpendicularly to this adjacent first end or extend perpendicularly to this adjacent the second end along this second surface of this substrate in the surface of this substrate along this supporting layer, each this second conductive layer has one the 3rd relative end and one the 4th end, and the 3rd end extends on the surface of relative this supporting layer of this first glass layer containing uncured epoxy resin, the 4th end extends on this second surface of this second glass layer containing uncured epoxy resin,

24. circuit board package structures as claimed in claim 19, is characterized in that, this circuit board package structure also comprises:

The first glass layer containing uncured epoxy resin, be covered in this supporting layer relatively on the surface of this substrate with those first ends of those the first conductive layers on, this first glass layer containing uncured epoxy resin has at least one district of running through, and this runs through on one that district is positioned at those first ends surface with respect to this supporting layer, extends perpendicularly on this first glass layer containing uncured epoxy resin surface with respect to this supporting layer;

At least one the second conductive layer, being positioned at this first glass layer containing uncured epoxy resin runs through on the surface in district towards this, this second conductive layer has one the 3rd end, and the 3rd end extends on the surface of relative this supporting layer of this first glass layer containing uncured epoxy resin;

The second protective layer, be covered in this first containing glass layer of uncured epoxy resin relatively on the surface of this substrate with the side surface of the 3rd end of this second conductive layer on, make the 3rd end of this second conductive layer exposed from this second protective layer; And

25. circuit board package structures as claimed in claim 19, is characterized in that, this circuit board package structure also comprises:

The second glass layer containing uncured epoxy resin, be covered on this second surface of this substrate on those the second ends with those the first conductive layers, this second glass layer containing uncured epoxy resin has at least one district of running through, and this runs through on one that district is positioned at those the second ends surface with respect to this substrate, extends perpendicularly on this second glass layer containing uncured epoxy resin surface with respect to this substrate;

At least one the second conductive layer, being positioned at this second glass layer containing uncured epoxy resin runs through on the surface in district towards this, this second conductive layer has one the 3rd end, and the 3rd end extends on the surface of relative this substrate of this second glass layer containing uncured epoxy resin;

The 3rd protective layer or a reinforcing support layer; be covered in this second containing glass layer of uncured epoxy resin relatively on the surface of this substrate with the side surface of the 3rd end of this second conductive layer on, make the 3rd end of this second conductive layer exposed from the 3rd protective layer or this reinforcing support layer.

26. circuit board package structures as claimed in claim 19, is characterized in that, the length direction of those flutings is all identical.

27. circuit board package structures as claimed in claim 19, is characterized in that, the distance between relative two inwalls of those flutings of distance and each between relative two inwalls of this annular groove is identical.

28. circuit board package structures as claimed in claim 19, is characterized in that, the degree of depth of those flutings of the degree of depth and each of this annular groove is identical.