CN104684251B - Circuit board package structure and its manufacture method - Google Patents
Circuit board package structure and its manufacture method Download PDFInfo
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- CN104684251B CN104684251B CN201410138574.5A CN201410138574A CN104684251B CN 104684251 B CN104684251 B CN 104684251B CN 201410138574 A CN201410138574 A CN 201410138574A CN 104684251 B CN104684251 B CN 104684251B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 228
- 239000010410 layer Substances 0.000 claims description 492
- 239000011521 glass Substances 0.000 claims description 158
- 239000004593 Epoxy Substances 0.000 claims description 131
- 229920005989 resin Polymers 0.000 claims description 125
- 239000011347 resin Substances 0.000 claims description 125
- 239000011241 protective layer Substances 0.000 claims description 93
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 58
- 239000011889 copper foil Substances 0.000 claims description 50
- 239000003822 epoxy resin Substances 0.000 claims description 31
- 229920000647 polyepoxide Polymers 0.000 claims description 31
- 230000003014 reinforcing effect Effects 0.000 claims description 27
- 238000005520 cutting process Methods 0.000 claims description 21
- 238000000059 patterning Methods 0.000 claims description 18
- 239000003365 glass fiber Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000003860 storage Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 208000019300 CLIPPERS Diseases 0.000 description 7
- 208000021930 chronic lymphocytic inflammation with pontine perivascular enhancement responsive to steroids Diseases 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 229920000297 Rayon Polymers 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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Abstract
The present invention discloses a kind of circuit board package structure and its manufacture method.The circuit board package structure includes substrate, multiple annular magnetic elements, supporting layer and multiple first conductive layers.Substrate has relative first surface and second surface, multiple first annular grooves and the multiple first flutings.First annular groove and the first fluting are located at first surface.Each first annular groove is communicated to another first annular groove by least one first fluting, and at least two first annular grooves are communicated to substrate side surfaces by the first fluting and form at least two openings.Annular magnetic element is located in first annular groove respectively.Supporting layer is located on the first surface of substrate, and covers first annular groove and the first fluting.Supporting layer has multiple perforation with substrate.First conductive layer is located on the surface that supporting layer is perforated with substrate direction respectively.
Description
Technical field
The present invention relates to a kind of circuit board package structure and a kind of manufacture method of circuit board package structure.
Background technology
In general, in the manufacturing process of circuit board, specific element need to be inserted in the default storage tank of circuit board,
Copper billet, iron core such as heat transmission.Wherein iron core is because with magnetic, can be applied to transformer (transformer) or chokes
The structure of device (power choke).
The circuit board of existing four layers of encapsulating structure is with copper clad laminate (Copper Clad Laminate；CCL) it is substrate.
When making circuit board, multiple mutually disconnected annular storage tanks are formed in substrate front side using forming machine.Then, annular is inserted
Iron core in storage tank, and insert in storage tank epoxy resin secured core.Afterwards, surface can be had to the glass fibers of copper foil
Dimension (FR4) is pressed on the tow sides of substrate, and via manufacture crafts such as drilling, copper facing, formation can turn on substrate tow sides
The passage (via) of copper foil.Finally, pattern copper foil and covered in substrate tow sides with epoxy resin.
Forming machine is in substrate formation storage tank, and cutter need to fall before contact substrate, then move horizontally and cut out ring
Shape storage tank, after the completion of a storage tank, cutter rises, and moves to next it is expected that being formed on the substrate position of storage tank
Side.Above-mentioned steps constantly repeat just to form multiple storage tanks in substrate, can expend a large amount of cutters and vertically move (raising and lowering)
Time.
In addition, the viscose in storage tank can produce stress after solidifying, making the inductance value of iron core is reduced, and circuit board is subsequently passed through
Surface laminating manufacture craft (Surface Mount Technology；When SMT), although viscose can have heat sinking function, but hold
Putting the gas in groove may still be expanded in infrared ray reflow oven (IR reflow) by high temperature, pressure is not led off, therefore can
The glass fibre for covering substrate can be caused to be damaged with epoxy resin.
The content of the invention
It is an object of the invention to provide a kind of circuit board package structure, to solve the above problems.
According to an embodiment of the present invention, a kind of circuit board package structure includes substrate, multiple annular magnetic elements, support
Layer and multiple first conductive layers.Substrate has relative first surface and second surface, multiple first annular grooves and multiple the
One fluting.First annular groove and the first fluting are located at first surface.Each first annular groove is connected by least one first fluting
Pass to another first annular groove, and at least two first annular grooves by the first fluting are communicated to substrate side surfaces and form at least two and open
Mouthful.Annular magnetic element is located in first annular groove respectively.Supporting layer is located on the first surface of substrate, and the first ring of covering
Connected in star and the first fluting.Supporting layer has multiple perforation, and adjacent first annular groove of perforating with substrate.First conductive layer point
Not Wei Yu supporting layer and substrate towards on the surface of perforation.Every one first conductive layer has relative first end and the second end
Portion, and first end extended on the surface of supporting layer opposing substrate, the second end is extended on the second surface of substrate.
Another object of the present invention is to provide a kind of circuit board package structure, to solve the problem of prior art is present.
According to an embodiment of the present invention, a kind of circuit board package structure comprising substrate, annular magnetic element, supporting layer with
Multiple first conductive layers.Substrate has relative first surface and second surface, annular groove and multiple flutings.Annular groove with
Fluting is located at first surface.The side that annular groove is communicated to substrate by slotting forms at least two openings.Annular magnetic element position
In annular groove.Supporting layer is located on the first surface of substrate, and covering annular groove and fluting.Supporting layer has with substrate
Multiple perforation, and perforation adjacent annular groove.First conductive layer is located on the surface that supporting layer is perforated with substrate direction respectively.Often
One first conductive layer has relative first end and the second end, and first end extends to the surface of supporting layer opposing substrate
On, the second end is extended on the second surface of substrate.
In above-mentioned embodiment of the invention, because substrate has the first ring of the first fluting and accommodating annular magnetic element
Connected in star, and the first fluting is communicated in adjacent first annular groove, therefore when with the direction clipper circuit of the vertical first fluting
After plate encapsulating structure, the substrate side surfaces formation opening that the first fluting can be after dicing.Consequently, it is possible to the circuit board package after cutting
Structure through surface fit manufacture craft when, although gas in first annular groove can be expanded by high temperature in reflow oven, but
Gas can be flowed out by the first fluting, pressure is led off, can be omitted existing viscose, improve the inductance of annular magnetic element
Value.In addition, circuit board package structure is before cutting, the first fluting will not be exposed by supporting layer covering, can avoid clipper circuit plate
Manufacture craft liquid used in before encapsulating structure causes pollution by the first fluting into first annular groove.
Another object of the present invention is to provide a kind of manufacture method of circuit board package structure, deposited with solving prior art
The problem of.
According to an embodiment of the present invention, a kind of manufacture method of circuit board package structure is comprised the steps of：(a) provide
Substrate.(b) form multiple first annular grooves to slot in the first surface of substrate with multiple first, each of which is first annular recessed
Groove is communicated to another first annular groove by least one first fluting.(c) multiple annular magnetic elements are placed in first annular recessed
In groove.(d) attach supporting layer on the first surface of substrate, make first annular groove with first fluting covered by supporting layer.(e)
Multiple perforation are formed through supporting layer and substrate, and adjacent first annular groove of perforating.(f) formed multiple first conductive layers in
On the surface that supporting layer is perforated with substrate direction, on the surface of supporting layer opposing substrate and on the second surface of substrate.(g) pattern
Change on the surface of supporting layer opposing substrate with the first conductive layer on the second surface of substrate.
In above-mentioned embodiment of the invention, due to when forming first annular groove and being slotted with first, cutter can first under
Drop enters substrate, then moves horizontally and cuts out first annular groove and the first fluting, and in the first annular groove being connected
After the completion of the first fluting, cutter just rises, therefore can save the time that cutter vertically moves (raising and lowering).
Brief description of the drawings
Fig. 1 illustrates the top view of circuit board package structure according to an embodiment of the present invention；
Fig. 2 illustrates sectional view of Fig. 1 circuit board package structure along line segment 2-2；
Fig. 3 is illustrated after Fig. 1 circuit board package structure cuts along line segment L2, the side view in terms of the D1 of direction；
Fig. 4 illustrates the flow chart of the manufacture method of circuit board package structure according to an embodiment of the present invention；
Fig. 5 illustrates the sectional view of Fig. 4 substrate；
The sectional view when substrate that Fig. 6 illustrates Fig. 5 forms first annular groove；
Fig. 7 illustrates the top view of Fig. 6 cutter mobile route；
The first annular groove that Fig. 8 illustrates Fig. 7 is placed after annular magnetic element, and supporting layer is attached at the section view after substrate
Figure；
Fig. 9 illustrates Fig. 8 supporting layer and the sectional view after substrate formation perforation；
Figure 10 illustrates Fig. 9 supporting layer and the sectional view after substrate formation conductive layer；
Figure 11 illustrates the top view of circuit board package structure according to an embodiment of the present invention；
Figure 12 is illustrated after Figure 11 circuit board package structure cuts along line segment L7, the side view in terms of the D2 of direction；
Figure 13 illustrates the sectional view of circuit board package structure according to an embodiment of the present invention, its profile position and Fig. 2
It is identical；
Figure 14 illustrates the sectional view of circuit board package structure according to an embodiment of the present invention, its profile position and Fig. 2
It is identical；
Figure 15 illustrates the sectional view of circuit board package structure according to an embodiment of the present invention, its profile position and Fig. 2
It is identical.
Symbol description
100：Circuit board package structure 100a：Circuit board package structure
100b：Circuit board package structure 100c：Circuit board package structure
100d：Circuit board package structure 110：Substrate
111：Surface 112：First surface
114：Second surface 115：Copper foil
115a：Contraposition part 116：First annular groove
117：Copper foil 118：First fluting
119：Opening 126：Second annular groove
128：Second fluting 129：Opening
130：Annular magnetic element 130a：Annular magnetic element
140：Supporting layer 141：Copper foil
142：Surface 144：Surface
145：The glass layer 146 of the resin containing Non-cured epoxy：Glass layer containing cured epoxy resin
147：The glass layer 148 of first resin containing Non-cured epoxy：The glass layer of second resin containing Non-cured epoxy
149：Through area 150：Perforation
150’：Long perforation 160：First conductive layer
162：First end 164：The second end
172：First protective layer 174：Second protective layer
176：3rd protective layer 178：4th protective layer
180：Second conductive layer 182：3rd end
184：4th end 210：Cutter
2-2：Line segment A1：Region
A2：Region D1：Direction
D2：Direction d1~d4：Depth
L1~L8：Line segment P1~P4：Path
S1~S7：Step S11~S17：Step
S21~S26：Step S31~S36：Step
W1~W4：Distance
Embodiment
Multiple embodiments of the present invention, as clearly stated, the details in many practices will be disclosed with accompanying drawing below
It will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.Also
It is to say, in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the sake of simplifying accompanying drawing, one
A little existing usual structures will illustrate it in the way of simply illustrating in the accompanying drawings with element.
Fig. 1 illustrates the top view of circuit board package structure 100 according to an embodiment of the present invention.Fig. 2 illustrates Fig. 1 electricity
Sectional view of the road plate encapsulating structure 100 along line segment 2-2.Simultaneously refering to Fig. 1 and Fig. 2, circuit board package structure 100 includes substrate
110th, multiple annular magnetic elements 130, supporting layer 140 and multiple first conductive layers 160.Wherein, substrate 110 has relative the
One surface 112 and second surface 114, multiple first annular grooves 116 and the multiple first flutings 118.First annular groove 116 with
First fluting 118 is located at the first surface 112 of substrate 110.Each first annular groove 116 is connected by least one first fluting 118
Pass to another first annular groove 116, and the length direction D1 all sames of the first fluting 118.
Annular magnetic element 130 is located in first annular groove 116 respectively.Supporting layer 140 is located at the first table of substrate 110
On face 112, and cover the first annular fluting of groove 116 and first 118.Supporting layer 140 has multiple perforation 150 with substrate 110,
And relative two walls of 150 adjacent first annular grooves 116 of perforation.In addition, the first conductive layer 160 is located at supporting layer 140 respectively
On towards surface 142 and the substrate 110 of perforation 150 towards the surface 111 of perforation 150.Every one first conductive layer 160 has relative
First end 162 and the second end 164, and first end 162 extends to the surface 144 of the opposing substrate 110 of supporting layer 140
On, the second end 164 is extended on the second surface 114 of substrate 110.
Supporting layer 140 may include that the glass layer (PP, b-stage) 145 of the resin containing Non-cured epoxy is cured with containing
The glass layer (FR4, c-stage) 146 of epoxy resin.Wherein, the glass layer 145 of the resin containing Non-cured epoxy is located at
The lower floor of supporting layer 140, and covering annular groove 116 and fluting 118.Glass layer containing cured epoxy resin 146
In the upper strata of supporting layer 140, and cover the glass layer 145 of the resin containing Non-cured epoxy of lower floor.
In the present embodiment, circuit board package structure 100 also includes multiple first protective layers 172, the second protective layer 174
With the 3rd protective layer 176.Wherein, the first protective layer 172 is located in perforation 150 respectively.Second protective layer 174 is covered in supporting layer
On the surface 144 of 140 opposing substrates 110 with the first end 162 of the first conductive layer 160.3rd protective layer 176 is covered in base
On the second surface 114 of plate 110 with the second end 164 of the first conductive layer 160.When cutter is cut along line segment L1, L2, L3, L4
Cut after circuit board package structure 100, region A1 circuit board package structure 100 can be considered a choke (power choke).
Fig. 3 is illustrated after Fig. 1 circuit board package structure 100 cuts along line segment L1, the side view in terms of the D1 of direction.Join simultaneously
Fig. 1 and Fig. 3 are read, because substrate 110 has the first annular groove 116 of the first fluting 118 and accommodating annular magnetic element 130,
And first the two ends of fluting 118 be communicated in two adjacent first annular grooves 118, therefore when with the side of the vertical first fluting 118
To after (such as along line segment L1, L2) clipper circuit plate encapsulating structure 100, the side of substrate 110 that the first fluting 118 can be after dicing
Opening 119 is formed, the intersection of the flutings of such as line segment L1 and first 118 can form opening 119, the flutings of line segment L2 and first 118
Intersection can also form opening 119.Consequently, it is possible to which the circuit board package structure 100 after cutting is making work through surface laminating
Skill (Surface Mount Technology；When SMT), although the gas in first annular groove 116 can be in infrared ray reflow
Stove (IR reflow) is expanded by high temperature, but gas can slot outside 118 outflow openings 119 by first, pressure is declared
Let out, existing viscose can be omitted, improve the inductance value of annular magnetic element 130.In addition, circuit board package structure 100 is in cutting
Before, the first fluting 118 will not be exposed by the covering of supporting layer 140, can avoid used system before clipper circuit plate encapsulating structure 100
Make process liquid and first annular groove 116 is entered by the first fluting 118.
In the present embodiment, the diameter all same of first annular groove 116.Each first annular groove 116 it is relative
It is identical apart from W2 and each first annular recessed between W1 two inwalls relative with every one first fluting 118 between two inwalls
The depth d1 of groove 116 is identical with the depth d2 of every one first fluting 118.Such design, when use forming machine is in the shape of substrate 110
During into first annular groove 116 and first fluting 118, because the cutter of forming machine can be fixed on vertical level movement just
Can be formed connection the fluting of first annular groove 116 and first 118 (such as first annular groove 116 between line segment L3, L4 with
118) first fluting, therefore can reduce the time for forming the first annular fluting of groove 116 and first 118.
It will be understood that the element annexation described will not repeat to repeat, conjunction first chats bright.In the following description,
The manufacture method of circuit board package structure 100 will be illustrated.
Fig. 4 illustrates the flow chart of the manufacture method of circuit board package structure according to an embodiment of the present invention.Exist first
There is provided substrate in step S1.Then in step s 2, multiple first annular grooves are formed to slot in the of substrate with multiple first
One surface, the first annular groove of each of which is communicated to another first annular groove by least one first fluting.Afterwards in step
In S3, multiple annular magnetic elements are placed in first annular groove.Then in step s 4, supporting layer is attached in the of substrate
On one surface, first annular groove is slotted with first and covered by supporting layer.Afterwards in step s 5, multiple perforation are formed to run through
In supporting layer and substrate, and adjacent first annular groove of perforating.Then in step s 6, multiple first conductive layers are formed in support
On the surface that layer is perforated with substrate direction, on the surface of supporting layer opposing substrate and on the second surface of substrate.Finally in step
In S7, it is patterned on the surface of supporting layer opposing substrate and the first conductive layer on the second surface of substrate.
In the following description, each step of manufacture method of foregoing circuit plate encapsulating structure will be illustrated.
Fig. 5 illustrates the sectional view of Fig. 4 substrate 110.The first surface 112 of substrate 110 has respectively with second surface 114
Copper foil 115,117, can be copper clad laminate (the Copper Clad Laminate comprising glass fibre (FR4)；CCL).Substrate
110 copper foil 115 can be patterned into the contraposition part 115a of subsequent manufacturing processes board contraposition (see Fig. 6).Herein refer to
Patterning can be comprising steps such as exposure, development or etchings, but method described above is not limited.
The sectional view when substrate 110 that Fig. 6 illustrates Fig. 5 forms first annular groove 116.Fig. 7 illustrates Fig. 6 cutter 210
The top view of mobile route.Simultaneously refering to Fig. 6 and Fig. 7, then using the cutter 210 of forming machine in the first table of substrate 110
Face 112 forms multiple first annular grooves 116 and the multiple first flutings 118.Because cutter 210 is forming first annular groove
116 and first fluting 118 when, the first surface 112 of substrate 110 can be lowered into.Then cutter 210 can be in fixed vertical height
Sequentially prolong path P 1, P2, P3, P4 under degree to move horizontally, and then cut out that width distance W1, W2 is identical and depth d1, d2 is (see figure
3) the first annular fluting of groove 116 and first 118 of identical.
(such as institute between Fig. 1 line segments L3, L4 after the completion of the fluting of first annular groove 116 and first 118 to be connected
There is the first annular fluting of groove 116 and first 118), cutter 210 is just lifted off substrate 110.Consequently, it is possible to can not only save
Cutter 210 vertically moves the time of (raising and lowering) in substrate 110, and the two ends of every one first fluting 118 can be communicated in two
Adjacent first annular groove 116 (as shown in Figure 1).In addition, first annular groove 116 can also be used with the first fluting 118
Infrared laser cuts to be formed, it is adaptable to the more circuit board package structure 100 of circuit (see Fig. 1).
The first annular groove 116 that Fig. 8 illustrates Fig. 7 is placed after annular magnetic element 130, and supporting layer 140 is attached at base
Sectional view after plate 110.Simultaneously refering to Fig. 7 and Fig. 8, treat that first annular groove 116 is formed at first 118 (see Fig. 7) of fluting
After substrate 110, annular magnetic element 130 can be placed in first annular groove 116.Then supporting layer 140 can be attached at base
On the first surface 112 of plate 110, first annular groove 116 is set to be covered with the first fluting 118 by supporting layer 140.In this embodiment party
In formula, the surface of supporting layer 140 has copper foil 141.
Fig. 9 illustrates Fig. 8 supporting layer 140 and the sectional view after the formation of substrate 110 perforation 150.Simultaneously refering to Fig. 8 and Fig. 9,
Layer 140 to be supported is attached at after substrate 110, and multiple perforation 150 can be bored in supporting layer 140 and substrate 110 and are run through, and perforation 150
Relative two walls of adjacent first annular groove 116.
Figure 10 illustrates Fig. 9 supporting layer 140 and the sectional view after the first conductive layer 160 of formation of substrate 110.Simultaneously refering to figure
9 and Figure 10, layer 140 to be supported is formed after perforation 150 with substrate 110, using the mode of plating on copper foil 141, supporting layer
140 towards on the surface 142 of perforation 150, substrate 110 is with being formed on copper foil 117 towards first leading on the surface 111 of perforation 150
Electric layer 160.The material of first conductive layer 160 can be copper, can be combined with copper foil 117,141, make the first conductive layer 160 in branch
Support on the surface 144 of the opposing substrate 110 of layer 140 and on the second surface 114 of substrate 110.
Then, the first protective layer 172 can be formed in perforation 150, perforation 150 is filled up by the first protective layer 172.Afterwards
Just first conductive layer 160 of the patternable on the surface 144 of supporting layer 140 and the on the second surface 114 of substrate 110
One conductive layer 160, makes the first conductive layer 160 have first end 162 and the second end 164, and obtains Figure 10 structure.
Simultaneously refering to Fig. 2 and Figure 10, after the first conductive layer 160 to be patterned, the covering support of the second protective layer 174 can be formed
With the first end 162 of the first conductive layer 160 on the surface 144 of supporting layer 140 on the surface 144 of layer 140, and form the 3rd
With the first conductive layer 160 on the second surface 114 of substrate 110 on the second surface 114 of the covering substrate 110 of protective layer 176
The second end 164.In the present embodiment, the material of the first protective layer 172, the second protective layer 174 and the 3rd protective layer 176
It can include epoxy resin (epoxy), the green paint as usual used, but not to limit the present invention.In addition, the 3rd protective layer 176
It can be substituted by reinforcing support layer, reinforcing support layer can be copper foil layer, mould release membrance, epoxy resin or containing cured epoxy resin
Glass layer, but it is not limited to this.
Simultaneously refering to Fig. 1 and Fig. 2, after after the second protective layer 174 and the formation of the 3rd protective layer 176, it can be opened with vertical first
Cut the second protective layer 174, supporting layer 140, the protective layer of substrate 110 and the 3rd in the direction (such as along line segment L1, L2) of groove 118
176, every one first fluting 118 after cutting is formed 119 (see Fig. 3) of opening in the side of substrate 110.
Figure 11 illustrates the top view of circuit board package structure 100a according to an embodiment of the present invention.Figure 12 illustrates Figure 11
Circuit board package structure 100a along line segment L7 cut after, the side view in terms of the D2 of direction.Simultaneously refering to Figure 11 and Figure 12, with figure
1st, places different Fig. 3 is：Substrate 110 also has multiple second annular grooves 126 and the multiple second flutings 128.Second ring
The fluting of connected in star 126 and second 128 is located at the first surface 112 of substrate 110.The two ends of every one second fluting 128 are communicated in two
The second adjacent annular groove 126, and every one second fluting 128 interlocks and is communicated in the one of which of the first fluting 118.At this
In embodiment, second fluting 128 length direction D2 perpendicular to first fluting 118 length direction D1.Every one second annular
Between relative two inwalls of groove 126 apart from W3 be less than relative two inwalls of each first annular groove 116 between apart from W1, and
Annular magnetic element 130a in second annular groove 126 is less than annular magnetic element 130.
After cutter is along line segment L5, L6, L7, L7 clipper circuit plate encapsulating structure 100a, region A2 circuit board package knot
Structure 100 can be considered that is used for a transformer (transformer) for connector.
After direction (such as along line segment L7, L8) clipper circuit plate encapsulating structure 100a with the vertical second fluting 128, the
Two fluting 128 can be after dicing substrates 110 is formed sideways be open 129.Consequently, it is possible to the circuit board package structure after cutting
100a is through surface laminating manufacture craft (Surface Mount Technology；When SMT), although the second annular groove 126
In gas can be expanded in infrared ray reflow oven (IR reflow) by high temperature, but gas can by second fluting 128 outflow open
Outside mouth 129, pressure is led off, existing viscose can be omitted, improve annular magnetic element 130a inductance value.In addition, electric
Before cutting, the second fluting 128 will not be exposed road plate encapsulating structure 100a by the covering of supporting layer 140, can avoid clipper circuit plate
Manufacture craft liquid used in before encapsulating structure 100a enters the second annular groove 126 by the second fluting 128.
In the present embodiment, being opened apart from W3 with every 1 second between relative two inwalls of every one second annular groove 126
It is identical apart from W4 between relative two inwalls of groove 128, and the depth d3 of every one second annular groove 126 and every one second fluting
128 depth d4 is identical.Such design, is slotted when using forming machine in second annular groove of the formation of substrate 110 126 and second
When 128, the second annular groove 126 of connection just can be formed because the cutter of forming machine can be fixed on vertical level movement
With the second fluting 128 (such as the second annular grooves 126 between line segment L5, L6 with second slot 128), therefore formation can be reduced
The time of second annular groove 126 and the second fluting 128.
When cutter forms the first annular fluting of groove 116 and first 118 in the first surface 112 of substrate 110, the second ring
Connected in star 126 with second fluting 128 also can be by cutter in substrate 110 first surfaces 112 formed.Due to circuit board package knot
Structure 100a manufacture method only increases to form the second annular groove 126 than the manufacture method of circuit board package structure 100 (see Fig. 1)
The step of with the second fluting 128, remaining step duplicates, therefore does not repeat to repeat.
Figure 13 illustrates the sectional view of circuit board package structure 100b according to an embodiment of the present invention, its profile position with
Fig. 2 is identical.Circuit board package structure 100b can also have the fluting of first annular groove 116 and first 118 such as Fig. 1, also optional
Have to selecting property such as Figure 11 the second annular groove 126 and the second fluting 128.In the present embodiment, circuit board package structure
100b is in addition to comprising substrate 110, annular magnetic element 130, the conductive layer 160 of supporting layer 140 and first, also comprising first containing non-
The glass layer 147 of cured epoxy resin, glass layer 148, the second conductive layer of the second resin containing Non-cured epoxy
180th, the second protective layer 174, the 3rd protective layer 176 and the 4th protective layer 178.
The glass layer 147 of first resin containing Non-cured epoxy is covered on the surface of the opposing substrate 110 of supporting layer 140
With on the first end 162 of the first conductive layer 160.The glass layer 148 of second resin containing Non-cured epoxy is covered in substrate
On 110 second surface 114 with the second end 164 of the first conductive layer 160.Second conductive layer 180 is located at first containing non-solid
Change glass layer 147, glass layer 148, supporting layer 140 and the substrate of the second resin containing Non-cured epoxy of epoxy resin
On 110 surfaces for perforating 150 ' towards length, and surface of second conductive layer 180 along the opposing substrate 110 of supporting layer 140 is extended vertically
To adjacent first end 162 (not illustrating) or extend perpendicularly to adjacent the second end along the second surface 114 of substrate 110
164 (as shown in figure 13).
Every one second conductive layer 180 has relative the 3rd end 182 and the 4th end 184, and the 3rd end 182 extends
To the surface of the relative support of glass layer 147 layer 140 of the first resin containing Non-cured epoxy, the 4th end 184 is extended to
On the second surface 114 of the glass layer 148 of second resin containing Non-cured epoxy.Second protective layer 174 is covered in first and contained
The 3rd end 182 on the surface of the opposing substrate 110 of glass layer 147 of Non-cured epoxy resin with the second conductive layer 180
On.3rd protective layer 176 is covered on the surface of the opposing substrate 110 of glass layer 148 of the second resin containing Non-cured epoxy
With on the 4th end 184 of the second conductive layer 180.In addition, the 4th protective layer 178 is located in long perforation 150 ' respectively.
Therefore, after every one second conductive layer 180 is connected with the circuit that one or more first conductive layers 160 are formed, second
Conductive layer 180 is located at the 3rd end 182 and the 4th end 184 on encapsulating structure 100b surfaces, is made subsequently being fitted through surface
Technique (Surface Mount Technology；When SMT), it is electrically connected available for electronic component (IC), to save each
The circuit of one conductive layer 160 formation, extends in encapsulating structure 100b surfaces with the required space that is electrically connected.
Circuit board package structure 100b preparation method is also comprised the steps of compared to Fig. 4：Step S11, attaches first
The glass layer and the first copper foil layer of the resin containing Non-cured epoxy on surface of the supporting layer relative to substrate, make supporting layer by
First resin containing Non-cured epoxy glass layer covering, and the first resin containing Non-cured epoxy glass layer by first
Copper foil layer is covered.Step S12, attaches the glass layer and the second copper foil layer of the second resin containing Non-cured epoxy in the of substrate
On two surfaces, the second surface of substrate is set to be covered by the glass layer of the second resin containing Non-cured epoxy, and second contains non-solid
The glass layer for changing epoxy resin is covered by the second copper foil layer.Step S13, forms one or more length perforation through copper foil
Layer, glass layer, supporting layer and the substrate of the resin containing Non-cured epoxy, and long perforation connected diagram 4 step S7 patterning
First conductive layer.Step S14, formed the first conductive layer on the surface of step S13 long perforation, the table of copper foil layer opposing substrate
On face.Step S15, forms multiple 4th protective layers in long perforation.Step S16, patterning step S11 and S12 copper foil
Layer and formed the first conductive layer.Step S17, the second protective layer of formation and the 3rd protective layer covering step S16 patterning
First conductive layer.
In addition, circuit board package structure 100b preparation method can also include the direction cutting second with the vertical first fluting
Protective layer, the glass layer of the resin containing Non-cured epoxy, supporting layer, substrate and the 3rd protective layer, make every 1 after cutting
One side for being recessed at substrate forms opening.
Figure 14 illustrates the sectional view of circuit board package structure 100c according to an embodiment of the present invention, its profile position with
Fig. 2 is identical.Glass layers 147 of the circuit board package structure 100c comprising the first resin containing Non-cured epoxy, multiple second are led
Electric layer 180, the glass layer 148 of the second resin containing Non-cured epoxy, the second protective layer 174 and the 3rd protective layer 176.First
The glass layer 147 of the resin containing Non-cured epoxy is covered on the surface 144 of the opposing substrate 110 of supporting layer 140 leads with first
On the first end 162 of electric layer 160.The glass layer 147 of first resin containing Non-cured epoxy runs through area 149 with multiple,
And be located at through area 149 on surface of the first end 162 relative to supporting layer 140.First is extended perpendicularly to containing non-through area 149
On surface of the glass layer 147 relative to supporting layer 140 of cured epoxy resin.Second conductive layer 180 is located at first respectively
The glass layer 147 of the resin containing Non-cured epoxy is towards on the surface through area 149.Every one second conductive layer 180 has the
Three ends 182, and the 3rd end 182 extends to the relative support of glass layer 147 layer 140 of the first resin containing Non-cured epoxy
Surface on.
In addition, the glass layer 148 of the second resin containing Non-cured epoxy is covered on the second surface 114 of substrate 110
With on the second end 164 of the first conductive layer 160.Second protective layer 174 is covered in the glass of the first resin containing Non-cured epoxy
With on the side surface of the 3rd end 182 of the second conductive layer 180, making the second conduction on the surface of the opposing substrate 110 of fibrous layer 147
3rd end 182 of layer 180 is exposed from the second protective layer 174.3rd protective layer 176 is covered in the second resin containing Non-cured epoxy
The opposing substrate 110 of glass layer 148 surface on.
After circuit board package structure 100c cleaved manufacture crafts, the circuit board package structure 100c after cutting can only have
Have single through area 149 and single second conductive layer 180, wherein not being used to through area 149 and the quantity of the second conductive layer 180
The limitation present invention.In the present embodiment, the surface of the glass layer 147 of the first resin containing Non-cured epoxy can have copper foil
Layer.The surface of the glass layer 148 of second resin containing Non-cured epoxy can have reinforcing support layer.
Circuit board package structure 100c preparation method is also comprised the steps of compared to Fig. 4：Step S21, attaches first
The glass layer and copper foil layer of the resin containing Non-cured epoxy make supporting layer by first on surface of the supporting layer relative to substrate
The glass layer of the resin containing Non-cured epoxy is covered, and the glass layer of the first resin containing Non-cured epoxy is covered by copper foil layer
Lid.Step S22, attaches the glass layer and reinforcing support layer of the second resin containing Non-cured epoxy in the second surface of substrate
On, the second surface of substrate is covered by the glass layer of the second resin containing Non-cured epoxy, and second contains Non-cured epoxy
The glass layer of resin is covered by reinforcing support layer.Step S23, forms one or more and runs through area through step S21 copper
Layers of foil and the glass layer of first resin containing Non-cured epoxy, and led through the step S7 of area's connected diagram 4 patterning first
Electric layer.Step S24, formed the second conductive layer in step S23 it is each on the surface in area and step S21 copper foil layer it is relative
On the surface of substrate.Step S25, patterning step S21 copper foil layer and form the first conductive layer.Step S26, forms second and protects
First conductive layer of sheath covering step S25 patternings.
Wherein step S22 reinforcing support layer can be copper foil layer, mould release membrance, epoxy resin or containing cured epoxy resin
Glass layer, but be not limited to this, reinforcing support layer can be also removed after step S22 is completed and the 3rd protective layer is covered and replaced
Generation.
In addition, circuit board package structure 100c preparation method can also include the direction cutting second with the vertical first fluting
Protective layer, the glass layer of the resin containing Non-cured epoxy, supporting layer, substrate and reinforcing support layer, or the second protective layer of cutting,
Glass layer, supporting layer, substrate and the 3rd protective layer of the resin containing Non-cured epoxy, make every 1 first after cutting to be recessed at
The side of substrate forms opening.
Figure 15 illustrates the sectional view of circuit board package structure 100d according to an embodiment of the present invention, its profile position with
Fig. 2 is identical.Glass layers 147, second of the circuit board package structure 100d comprising the first resin containing Non-cured epoxy is containing non-solid
Change glass layer 148, multiple second conductive layers 180, the second protective layer 174 and the 3rd protective layer 176 of epoxy resin.First
The glass layer 147 of the resin containing Non-cured epoxy is covered on the surface 144 of the opposing substrate 110 of supporting layer 140 leads with first
On the first end 162 of electric layer 160.
In addition, the glass layer 148 of the second resin containing Non-cured epoxy is covered on the second surface 114 of substrate 110
With on the second end 164 of the first conductive layer 160.The glass layer 148 of second resin containing Non-cured epoxy has multiple pass through
Area 149 is worn, and is located at through area 149 on surface of the second end 164 relative to substrate 110.Is extended perpendicularly to through area 149
On 148 surface relative to substrate 110 of glass layer of two resins containing Non-cured epoxy.Second conductive layer 180 is located at respectively
The glass layer 148 of second resin containing Non-cured epoxy is towards on the surface through area 149.Every one second conductive layer 180 has
There is the 3rd end 182, and the 3rd end 182 extends to the opposing substrate of glass layer 148 of the second resin containing Non-cured epoxy
On 110 surface.Second protective layer 174 is covered in the opposing substrate 110 of glass layer 147 of the first resin containing Non-cured epoxy
Surface on.3rd protective layer 176 is covered in the opposing substrate 110 of glass layer 148 of the second resin containing Non-cured epoxy
With on the side surface of the 3rd end 182 of the second conductive layer 180, making the 3rd end 182 of the second conductive layer 180 from surface
Three protective layers 176 are exposed.
After circuit board package structure 100d cleaved manufacture crafts, the circuit board package structure 100d after cutting can only have
Have single through area 149 and single second conductive layer 180, wherein not being used to through area 149 and the quantity of the second conductive layer 180
The limitation present invention.In the present embodiment, the surface of the glass layer 147 of the first resin containing Non-cured epoxy can have reinforcement
Supporting layer.The surface of the glass layer 148 of second resin containing Non-cured epoxy can have copper foil layer.
Circuit board package structure 100d preparation method is also comprised the steps of compared to Fig. 4：Step S31, attaches first
The resin containing Non-cured epoxy glass layer and reinforcing support layer on surface of the supporting layer relative to substrate, make supporting layer by
First resin containing Non-cured epoxy glass layer covering, and the first resin containing Non-cured epoxy glass layer by reinforcement
Supporting layer is covered.Step S32, attaches the glass layer and copper foil layer of the second resin containing Non-cured epoxy in the second table of substrate
On face, the second surface of substrate is set to be covered by the glass layer of the second resin containing Non-cured epoxy, and second contains uncured ring
The glass layer of oxygen tree fat is covered by copper foil layer.Step S33, forms one or more and runs through area through step S32 copper foil
The glass layer of layer and the second resin containing Non-cured epoxy, and the first conduction of the patterning through the step S7 of area's connected diagram 4
Layer.Step S34, formed the second conductive layer in step S33 it is each through the surface in area on and step S32 copper foil layer relatively base
On the surface of plate.Step S35, patterning step S32 copper foil layer and form the first conductive layer.Step S36, forms second and protects
First conductive layer of layer covering step S35 patternings.
Wherein step S31 reinforcing support layer can be copper foil layer, mould release membrance, epoxy resin or containing cured epoxy resin
Glass layer, but be not limited to this, reinforcing support layer can be also removed after step S31 is completed and the 3rd protective layer is covered and replaced
Generation.
In addition, circuit board package structure 100d preparation method can also be included cuts reinforcement with the direction of the vertical first fluting
Supporting layer, the glass layer of the resin containing Non-cured epoxy, supporting layer, substrate and the second protective layer, or the 3rd protective layer of cutting,
Glass layer, supporting layer, substrate and the second protective layer of the resin containing Non-cured epoxy, make every 1 first after cutting to be recessed at
The side of substrate forms opening.
Figure 14 circuit board package structure 100c and preparation method thereof, Figure 15 circuit board package structure 100d and its making
The advantage of method is as follows：Protective layer (such as green paint) can be on artificial, when coat protective layer, due to having below containing non-
The glass layer (PP) of cured epoxy resin, therefore green paint can be relatively thin, reduce causes reliability to decline because green paint is uneven.
In addition, the glass layer of Non-cured epoxy resin can also be such that overall structure more consolidates, reliability can be made to increase.
Although disclosing the present invention with embodiment, but it is not limited to the present invention, any skilled person,
Without departing from the spirit and scope of the present invention, it can be used for a variety of modifications and variations, therefore protection scope of the present invention should be with
What the claim enclosed was defined is defined.
Claims (40)
1. a kind of circuit board package structure, comprising：
Substrate, with relative first surface and second surface, multiple first annular grooves and the multiple first flutings, those first
Annular groove is located at the first surface with those first flutings, and each first annular groove is communicated to another by least one first fluting
One first annular groove, and at least two first annular grooves are communicated to substrate side surfaces and are formed at least two and opened by those first flutings
Mouthful：
Multiple annular magnetic elements, respectively in those first annular grooves；
Supporting layer, on the first surface of the substrate, and covers those first annular grooves and those the first flutings, the branch
Support layer has multiple perforation, and those those adjacent first annular grooves of perforating with the substrate；And
On multiple first conductive layers, the surface perforated respectively positioned at the supporting layer and the substrate towards those, each this first is led
Electric layer has relative first end and the second end, and the first end extends to surface of the supporting layer with respect to the substrate
On, the second end is extended on the second surface of the substrate.
2. circuit board package structure as claimed in claim 1, is also included：
Multiple first protective layers, respectively in those perforation.
3. circuit board package structure as claimed in claim 1, the wherein supporting layer are also included：
The glass layer of the resin containing Non-cured epoxy, positioned at the lower floor of the supporting layer, covers those annular grooves and is opened with those
Groove；And
Glass layer containing cured epoxy resin, positioned at the upper strata of the supporting layer, covers the tree containing Non-cured epoxy of lower floor
The glass layer of fat.
4. circuit board package structure as claimed in claim 1, is also included：
Second protective layer, is covered in the supporting layer with respect to those first ends on the surface of the substrate with those the first conductive layers
On；And
3rd protective layer or reinforcing support layer, be covered on the second surface of the substrate with those the first conductive layers those the
On two ends.
5. circuit board package structure as claimed in claim 1, is also included：
The glass layer of first resin containing Non-cured epoxy, be covered in the supporting layer with respect on the surface of the substrate with those
On those first ends of one conductive layer；
The glass layer of second resin containing Non-cured epoxy, is covered on the second surface of the substrate and those the first conductions
On those the second ends of layer；
Multiple second conductive layers, glass layer respectively positioned at first resin containing Non-cured epoxy, this is second containing uncured
On the surface that the glass layer of epoxy resin, the supporting layer and the substrate are perforated towards those, and along the supporting layer is relative should
The surface of substrate extend perpendicularly to the adjacent first end or along the substrate the second surface extend perpendicularly to it is adjacent should
The second end, each second conductive layer has one the 3rd relative end and one the 4th end, and the 3rd end is extended to
The glass layer of first resin containing Non-cured epoxy with respect on the surface of the supporting layer, the 4th end extend to this second
On the second surface of the glass layer of the resin containing Non-cured epoxy；
Second protective layer, is covered on the surface of the relative substrate of the glass layer of first resin containing Non-cured epoxy with being somebody's turn to do
On those the 3rd ends of a little second conductive layers；And
3rd protective layer or reinforcing support layer, are covered in the glass layer of second resin containing Non-cured epoxy with respect to the substrate
Surface on on those the 4th ends of those the second conductive layers.
6. circuit board package structure as claimed in claim 5, is also included：
Multiple 4th protective layers, respectively in those perforation.
7. circuit board package structure as claimed in claim 1, is also included：
The glass layer of first resin containing Non-cured epoxy, be covered in the supporting layer with respect on the surface of the substrate with those
On those first ends of one conductive layer, the glass layer of first resin containing Non-cured epoxy have it is multiple run through area, and
Those through area be located at those first ends relative on the surface of the supporting layer, extend perpendicularly to this first contain Non-cured epoxy
The glass layer of resin is relative on the surface of the supporting layer；
Multiple second conductive layers, respectively positioned at first resin containing Non-cured epoxy glass layer towards those through area
On surface, each second conductive layer has one the 3rd end, and the 3rd end extends to first tree containing Non-cured epoxy
The glass layer of fat is with respect on the surface of the supporting layer；
The glass layer of second resin containing Non-cured epoxy, is covered on the second surface of the substrate and those the first conductions
On those the second ends of layer；
Second protective layer, is covered on the surface of the relative substrate of the glass layer of first resin containing Non-cured epoxy with being somebody's turn to do
On the side surface of those the 3rd ends of a little second conductive layers, those the 3rd ends of those the second conductive layers are made second to be protected from this
Sheath is exposed；And
3rd protective layer or reinforcing support layer, are covered in the glass layer of second resin containing Non-cured epoxy with respect to the base
On the surface of plate.
8. circuit board package structure as claimed in claim 1, is also included：
The glass layer of first resin containing Non-cured epoxy, be covered in the supporting layer with respect on the surface of the substrate with those
On those first ends of one conductive layer；
The glass layer of second resin containing Non-cured epoxy, is covered on the second surface of the substrate and those the first conductions
On those the second ends of layer, the glass layer of second resin containing Non-cured epoxy have it is multiple run through area, and those are passed through
Area is worn positioned at those the second ends relative to the glass on the surface of the substrate, extending perpendicularly to second resin containing Non-cured epoxy
Glass fibrous layer is relative on the surface of the substrate；
Multiple second conductive layers, respectively positioned at second resin containing Non-cured epoxy glass layer towards those through area
On surface, each second conductive layer has the 3rd end, and the 3rd end extends to second resin containing Non-cured epoxy
Glass layer with respect on the surface of the substrate；
Second protective layer, is covered in the glass layer of first resin containing Non-cured epoxy with respect on the surface of the substrate；With
And
3rd protective layer or reinforcing support layer, are covered in the glass layer of second resin containing Non-cured epoxy with respect to the substrate
Surface on on the side surface of those the 3rd ends of those the second conductive layers, making those the 3rd ends of those the second conductive layers
Portion is exposed from the 3rd protective layer or reinforcing support layer.
9. the diameter all same of circuit board package structure as claimed in claim 1, wherein those first annular grooves.
10. the length direction all same of circuit board package structure as claimed in claim 1, wherein those the first flutings.
11. between circuit board package structure as claimed in claim 1, relative two inwalls of each of which first annular groove
Distance between distance and relative two inwalls of each first fluting is identical.
12. circuit board package structure as claimed in claim 1, the depth of each of which first annular groove with it is each this
The depth of one fluting is identical.
13. circuit board package structure as claimed in claim 1, the wherein substrate have multiple second annular grooves and multiple the
Two flutings, those second annular grooves are located at the first surface of the substrate with those second flutings, each second fluting
Two ends are communicated in two those adjacent second annular grooves.
14. circuit board package structure as claimed in claim 13, wherein those second it is slot staggered and be communicated in those first
The one of which of fluting.
15. circuit board package structure as claimed in claim 13, wherein the length direction of those the second flutings is perpendicular to those
The length direction of first fluting.
16. between circuit board package structure as claimed in claim 13, relative two inwalls of each of which second annular groove
Distance be less than distance between relative two inwalls of each first annular groove.
17. between circuit board package structure as claimed in claim 13, relative two inwalls of each of which second annular groove
Distance it is identical with the distance between relative two inwalls of each second fluting.
18. circuit board package structure as claimed in claim 13, the depth of each of which second annular groove is somebody's turn to do with each
The depth of second fluting is identical.
19. a kind of circuit board package structure, comprising：
Substrate, with relative first surface and second surface, annular groove and multiple flutings, the annular groove is slotted with those
Positioned at the first surface, the side that annular groove is communicated to the substrate by those flutings forms at least two openings：
Annular magnetic element, in the annular groove；
Supporting layer, on the first surface of the substrate, and covers the annular groove and those flutings, the supporting layer and the base
Plate has multiple perforation, and those adjacent annular grooves of perforating；And
On multiple first conductive layers, the surface perforated respectively positioned at the supporting layer and the substrate towards those, each this first is led
Electric layer has a relative first end and a second end, and the first end extends to table of the supporting layer with respect to the substrate
On face, the second end is extended on the second surface of the substrate.
20. circuit board package structure as claimed in claim 19, is also included：
Multiple first protective layers, respectively in those perforation.
21. circuit board package structure as claimed in claim 19, the wherein supporting layer are also included：
The glass layer of the resin containing Non-cured epoxy, positioned at the lower floor of the supporting layer, covers the annular groove and is slotted with those；
And
Glass layer containing cured epoxy resin, positioned at the upper strata of the supporting layer, covers the tree containing Non-cured epoxy of lower floor
The glass layer of fat.
22. circuit board package structure as claimed in claim 19, is also included：
Second protective layer, is covered in the supporting layer with respect to those first ends on the surface of the substrate with those the first conductive layers
On；And
3rd protective layer or reinforcing support layer, be covered on the second surface of the substrate with those the first conductive layers those the
On two ends.
23. circuit board package structure as claimed in claim 19, is also included：
The glass layer of first resin containing Non-cured epoxy, be covered in the supporting layer with respect on the surface of the substrate with those
On those first ends of one conductive layer；
The glass layer of second resin containing Non-cured epoxy, is covered on the second surface of the substrate and those the first conductions
On those the second ends of layer；
One or more second conductive layers, glass layer respectively positioned at first resin containing Non-cured epoxy, this is second containing non-
On the surface that the glass layer of cured epoxy resin, the supporting layer and the substrate are perforated towards those, and along the supporting layer phase
The surface of the substrate is extended perpendicularly to the adjacent first end or along the substrate the second surface extend perpendicularly to it is adjacent
The second end, each second conductive layer has one the 3rd relative end and one the 4th end, and the 3rd end is prolonged
The glass layer of first resin containing Non-cured epoxy is extended with respect on the surface of the supporting layer, the 4th end extends to this
On the second surface of the glass layer of second resin containing Non-cured epoxy；
Second protective layer, is covered on the surface of the relative substrate of the glass layer of first resin containing Non-cured epoxy with being somebody's turn to do
On those the 3rd ends of a little second conductive layers；And
3rd protective layer or reinforcing support layer, are covered in the glass layer of second resin containing Non-cured epoxy with respect to the substrate
Surface on on those the 4th ends of those the second conductive layers.
24. circuit board package structure as claimed in claim 19, is also included：
The glass layer of first resin containing Non-cured epoxy, be covered in the supporting layer with respect on the surface of the substrate with those
On those first ends of one conductive layer, the glass layer of first resin containing Non-cured epoxy has at least one to run through area,
And one of those first ends should be located at through area relative on the surface of the supporting layer, extending perpendicularly to this first containing non-solid
Change the glass layer of epoxy resin relative on the surface of the supporting layer；
At least one second conductive layer, the glass layer direction positioned at first resin containing Non-cured epoxy should run through the surface in area
On, second conductive layer has one the 3rd end, and the 3rd end extends to the glass of first resin containing Non-cured epoxy
Fibrous layer is with respect on the surface of the supporting layer；
The glass layer of second resin containing Non-cured epoxy, is covered on the second surface of the substrate and those the first conductions
On those the second ends of layer；
Second protective layer, is covered on the surface of the relative substrate of the glass layer of first resin containing Non-cured epoxy with being somebody's turn to do
On the side surface of 3rd end of the second conductive layer, make the 3rd end of second conductive layer naked from second protective layer
Dew；And
3rd protective layer or reinforcing support layer, are covered in the glass layer of second resin containing Non-cured epoxy with respect to the substrate
Surface on.
25. circuit board package structure as claimed in claim 19, is also included：
The glass layer of first resin containing Non-cured epoxy, be covered in the supporting layer with respect on the surface of the substrate with those
On those first ends of one conductive layer；
The glass layer of second resin containing Non-cured epoxy, is covered on the second surface of the substrate and those the first conductions
On those the second ends of layer, the glass layer of second resin containing Non-cured epoxy has at least one to run through area, and this is passed through
Area is worn positioned at one of those the second ends relative on the surface of the substrate, extending perpendicularly to second tree containing Non-cured epoxy
The glass layer of fat is relative on the surface of the substrate；
At least one second conductive layer, the glass layer direction positioned at second resin containing Non-cured epoxy should run through the surface in area
On, second conductive layer has the 3rd end, and the 3rd end extends to the glass fibers of second resin containing Non-cured epoxy
Layer is tieed up with respect on the surface of the substrate；
Second protective layer, is covered in the glass layer of first resin containing Non-cured epoxy with respect on the surface of the substrate；With
And
3rd protective layer or reinforcing support layer, are covered in the glass layer of second resin containing Non-cured epoxy with respect to the substrate
Surface on on the side surface of the 3rd end of second conductive layer, make the 3rd end of second conductive layer from this
Three protective layers or reinforcing support layer are exposed.
26. the length direction all same of circuit board package structure as claimed in claim 19, wherein those flutings.
27. distance between relative two inwalls of circuit board package structure as claimed in claim 19, the wherein annular groove with
Distance between relative two inwalls of those each flutings is identical.
28. the depth of circuit board package structure as claimed in claim 19, the wherein annular groove and those each flutings
Depth is identical.
29. a kind of manufacture method of circuit board package structure, is comprised the steps of：
(a) substrate is provided；
(b) form multiple first annular grooves to slot in the first surface of the substrate with multiple first, each of which is first annular
Groove is communicated to another first annular groove by least one first fluting；
(c) multiple annular magnetic elements are placed in those first annular grooves；
(d) attach a supporting layer on the first surface of the substrate, make those first annular grooves with those first fluting by
The supporting layer is covered；
(e) multiple perforation are formed through the supporting layer and the substrate, and those those adjacent first annular grooves of perforating；
(f) formed on the surface that multiple first conductive layers are perforated towards those in the supporting layer and the substrate, the supporting layer it is relative
On the surface of the substrate and on the second surface of the substrate；And
(g) be patterned in the supporting layer with respect on the surface of the substrate with the second surface of the substrate those are first conductive
Layer.
30. the supporting layer of the manufacture method of circuit board package structure as claimed in claim 29, wherein step (d) is also included：
The glass layer of the resin containing Non-cured epoxy, positioned at the lower floor of the supporting layer, covers those annular grooves and is opened with those
Groove；And
Glass layer containing cured epoxy resin, positioned at the upper strata of the supporting layer, covers the tree containing Non-cured epoxy of lower floor
The glass layer of fat.
31. the manufacture method of circuit board package structure as claimed in claim 29, is also included：
Multiple first protective layers are formed in those perforation.
32. the manufacture method of circuit board package structure as claimed in claim 29, is also included：
Formed one second protective layer cover the supporting layer with respect on the surface of the substrate with the table in the relative substrate of the supporting layer
Those first conductive layers on face；And
Formed one the 3rd protective layer cover on the second surface of the substrate with the second surface of the substrate those the
One conductive layer.
33. the manufacture method of circuit board package structure as claimed in claim 32, is also included：
Second protective layer, the supporting layer, the substrate and the 3rd protective layer are cut with the direction of those vertical the first flutings, made
Each first side for being recessed at the substrate after cutting forms an opening.
34. the manufacture method of circuit board package structure as claimed in claim 29, is also included：
(h) attach one first resin containing Non-cured epoxy glass layer and one first copper foil layer in the supporting layer relative to base
On the surface of plate, the supporting layer is set to be covered by the glass layer of first resin containing Non-cured epoxy, and this is first containing non-solid
The glass layer for changing epoxy resin is covered by first copper foil layer；
(i) glass layer and one second copper foil layer of one second resin containing Non-cured epoxy are attached in the second surface of the substrate
On, the second surface of the substrate is covered by the glass layer of second resin containing Non-cured epoxy, and this is second containing non-solid
The glass layer for changing epoxy resin is covered by second copper foil layer；
(j) one or more length are formed to perforate through those copper foil layers, the glass layer of those resins containing Non-cured epoxy, be somebody's turn to do
Supporting layer and the substrate, and first conductive layers of those patternings of those connected steps (g) of length perforation；
(k) formed those first conductive layers on surfaces of those length perforation of step (j), those copper foil layers are with respect to the substrate
On surface；
(l) multiple 4th protective layers are formed in those length perforation；
(m) patterning step (h) and (i) those copper foil layers and form those the first conductive layers；And
(n) those first conductive layers of one second protective layer and one the 3rd protective layer covering step (m) patterning are formed.
35. the manufacture method of circuit board package structure as claimed in claim 34, is also included：
The glass fibre of second protective layer, those resins containing Non-cured epoxy is cut with the direction of those vertical the first flutings
Layer, the supporting layer, the substrate and the 3rd protective layer, make each first side for being recessed at the substrate after cutting form one
Opening.
36. the manufacture method of circuit board package structure as claimed in claim 29, is also included：
(h) attach one first resin containing Non-cured epoxy glass layer and a copper foil layer in the supporting layer relative to substrate
On surface, make the supporting layer by first resin containing Non-cured epoxy glass layer cover, and this first contain uncured ring
The glass layer of oxygen tree fat is covered by the copper foil layer；
(i) glass layer and reinforcing support layer of one second resin containing Non-cured epoxy are attached in the second surface of the substrate
On, the second surface of the substrate is covered by the glass layer of second resin containing Non-cured epoxy, and this is second containing non-solid
The glass layer for changing epoxy resin is covered by reinforcing support layer；
(j) one or more are formed and runs through area through the copper foil layer of step (h) and the glass of first resin containing Non-cured epoxy
Glass fibrous layer, and those first conductive layers of patterning of those steps (g) that are connected through area；
(k) formed one second conductive layer in step (j) it is each those through area surface on and step (h) the copper foil layer phase
To on the surface of the substrate；
(l) copper foil layer of patterning step (h) and form those the first conductive layers；And
(m) those first conductive layers of one second protective layer covering step (l) patterning are formed.
37. the manufacture method of circuit board package structure as claimed in claim 36, is also included：
The glass fibre of second protective layer, those resins containing Non-cured epoxy is cut with the direction of those vertical the first flutings
Layer, the supporting layer, the substrate and reinforcing support layer, or cut the glass of second protective layer, those resins containing Non-cured epoxy
Glass fibrous layer, the supporting layer, the substrate and one the 3rd protective layer, make each first side for being recessed at the substrate after cutting
One is formed to be open.
38. the manufacture method of circuit board package structure as claimed in claim 29, is also included：
(h) attach one first resin containing Non-cured epoxy glass layer and a reinforcing support layer in the supporting layer relative to this
On the surface of substrate, the supporting layer is set to be covered by the glass layer of first resin containing Non-cured epoxy, and this is first containing non-
The glass layer of cured epoxy resin is covered by reinforcing support layer；
(i) glass layer and a copper foil layer of one second resin containing Non-cured epoxy are attached on the second surface of the substrate,
The second surface of the substrate is set to be covered by the glass layer of second resin containing Non-cured epoxy, and this second contains uncured ring
The glass layer of oxygen tree fat is covered by the copper foil layer；
(j) one or more are formed and runs through area through the copper foil layer of step (i) and the glass of second resin containing Non-cured epoxy
Glass fibrous layer, and those first conductive layers patterned of those steps (g) that are connected through area；
(k) formed one second conductive layer in step (j) it is each those through area surface on and step (i) the copper foil layer phase
To on the surface of the substrate；
(l) copper foil layer of patterning step (i) and form those the first conductive layers；And
(m) those first conductive layers of one second protective layer covering step (l) patterning are formed.
39. the manufacture method of circuit board package structure as claimed in claim 38, is also included：
The glass fibre of reinforcing support layer, those resins containing Non-cured epoxy is cut with the direction of those vertical the first flutings
Layer, the supporting layer, the substrate and second protective layer, or one the 3rd protective layer of cutting, the glass of those resins containing Non-cured epoxy
Glass fibrous layer, the supporting layer, the substrate and second protective layer, make each first side for being recessed at the substrate after cutting
One is formed to be open.
40. the manufacture method of circuit board package structure as claimed in claim 29, wherein step (b) are also included：
Multiple second annular grooves are formed to slot in the first surface of the substrate, each of which second fluting with multiple second
Two ends be communicated in two those adjacent second annular grooves, and each this is second slot staggered and be communicated in those the first flutings
One of which.
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| JP7432001B2 (en) | 2021-02-05 | 2024-02-15 | チャンシン メモリー テクノロジーズ インコーポレイテッド | A package substrate and a semiconductor structure including the package substrate |
| CN112951799B (en) * | 2021-02-05 | 2022-03-11 | 长鑫存储技术有限公司 | Packaging substrate and semiconductor structure with same |
| US12224244B2 (en) | 2021-02-05 | 2025-02-11 | Changxin Memory Technologies, Inc. | Package substrate and semiconductor structure with same |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03252111A (en) * | 1990-02-28 | 1991-11-11 | Hitachi Chem Co Ltd | Core for rotary transformer and manufacture thereof |
| US5959846A (en) * | 1996-12-26 | 1999-09-28 | Citizen Electronics, Co., Ltd. | Modular surface mount circuit device and a manufacturing method thereof |
| CN201651620U (en) * | 2010-03-31 | 2010-11-24 | 傅炳煌 | Fluid rotating joint |
| CN102065637A (en) * | 2009-11-12 | 2011-05-18 | 平面磁性有限公司 | Packaging structure with magnetic element and forming method of the packaging structure |
| CN102316675A (en) * | 2010-06-30 | 2012-01-11 | 相互股份有限公司 | Circuit board and method for manufacturing the same |
| CN202503818U (en) * | 2012-01-12 | 2012-10-24 | 东莞森玛仕格里菲电路有限公司 | Buried magnetic core PCB |
| CN202841710U (en) * | 2012-08-10 | 2013-03-27 | 深南电路有限公司 | Printed circuit board |
| CN203788563U (en) * | 2013-11-27 | 2014-08-20 | 健鼎（无锡）电子有限公司 | Circuit board packaging structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01158707A (en) * | 1987-12-15 | 1989-06-21 | Toshiba Corp | Rotary transformer and manufacture thereof |
-
2014
- 2014-04-08 CN CN201410138574.5A patent/CN104684251B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03252111A (en) * | 1990-02-28 | 1991-11-11 | Hitachi Chem Co Ltd | Core for rotary transformer and manufacture thereof |
| US5959846A (en) * | 1996-12-26 | 1999-09-28 | Citizen Electronics, Co., Ltd. | Modular surface mount circuit device and a manufacturing method thereof |
| CN102065637A (en) * | 2009-11-12 | 2011-05-18 | 平面磁性有限公司 | Packaging structure with magnetic element and forming method of the packaging structure |
| CN201651620U (en) * | 2010-03-31 | 2010-11-24 | 傅炳煌 | Fluid rotating joint |
| CN102316675A (en) * | 2010-06-30 | 2012-01-11 | 相互股份有限公司 | Circuit board and method for manufacturing the same |
| CN202503818U (en) * | 2012-01-12 | 2012-10-24 | 东莞森玛仕格里菲电路有限公司 | Buried magnetic core PCB |
| CN202841710U (en) * | 2012-08-10 | 2013-03-27 | 深南电路有限公司 | Printed circuit board |
| CN203788563U (en) * | 2013-11-27 | 2014-08-20 | 健鼎（无锡）电子有限公司 | Circuit board packaging structure |
Non-Patent Citations (1)
| Title |
|---|
| 埋磁芯多层印制电路板制作工艺探讨;范思维;《印刷电路信息》;20131115(第S1期);第370-374页 * |
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