CN211210024U - High heat dissipation, low-loss PCB board - Google Patents
High heat dissipation, low-loss PCB board Download PDFInfo
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- CN211210024U CN211210024U CN201921997542.5U CN201921997542U CN211210024U CN 211210024 U CN211210024 U CN 211210024U CN 201921997542 U CN201921997542 U CN 201921997542U CN 211210024 U CN211210024 U CN 211210024U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 25
- 230000005611 electricity Effects 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 230000004927 fusion Effects 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- -1 polytetrafluoroethylene Polymers 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000003292 glue Substances 0.000 abstract description 6
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 6
- 238000003801 milling Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a high heat dissipation, low-loss PCB board, including the high frequency core and the conventional core of laminating each other, first through-hole has been seted up to the face of high frequency core, the second through-hole has been seted up to the face of conventional core, first through-hole forms the shoulder hole with second through-hole intercommunication, the heat conduction component of echelonment is matched in the shoulder hole, heat conduction component include the basic unit and protruding in the ladder layer on basic unit's surface, the ladder layer matches the second through-hole, the basic unit matches first through-hole, the shoulder hole is formed with the gap with heat conduction component, be provided with heat conduction glue film in the gap. The heat conducting element is arranged in a penetrating mode, the circuit board has a grounding function, so that the performance of the circuit board is more stable, the heat conducting and electricity conducting adhesive is filled more fully, the production requirement is reduced, the production process is simplified, the working time is saved, and the efficiency is improved.
Description
Technical Field
The utility model relates to a PCB board system board field especially relates to high heat dissipation, low-loss PCB board.
Background
Along with the development of electronic technology, the more practical novel demonstration that high densification, components and parts miniaturization and surface mounting of product are especially in high frequency electronic circuit, and radio frequency components and parts's dominant frequency is big more, and the heat that its work produced is big more, influences electronic circuit and normally works, and it is ageing to accelerate work device.
The heat conducting element is embedded in the circuit board, so that the heat dissipation of the high-power component can be effectively accelerated. The existing heat dissipation technology mainly has two modes of an external heat conduction element and an internal heat conduction element. The external heat conducting element increases the design space. The heat dissipation block is arranged in the embedded heat conduction element in an embedded mode, and the embedded heat conduction element comprises the following two arrangement modes:
the first one is: the heat dissipation piece is solidified by prepreg melt flow glue, and is pressed, fixed and molded at one time. The heat conduction buried block is not grounded, and the dielectric constant is larger.
The second method is as follows: the conductive and heat-conducting adhesive is additionally attached between the heat-conducting embedded block and the circuit board during pressing, so that heat dissipation is improved, medium loss is reduced, and the heat-conducting block is embedded into the embedded hole in the circuit board by arranging the embedded hole.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the utility model adopts the following technical scheme: the utility model provides a high heat dissipation, low-loss PCB board, includes the high frequency core and the conventional core of laminating each other, first through-hole has been seted up to the face of high frequency core, the second through-hole has been seted up to the face of conventional core, first through-hole forms the shoulder hole with second through-hole intercommunication, the heat conduction component of echelonment is matched with in the shoulder hole, heat conduction component include the basic unit and protruding in the ladder layer on basic unit surface, the ladder layer matches the second through-hole, the basic unit matches first through-hole, the shoulder hole is formed with the gap with heat conduction component, be provided with heat conduction rubber layer in the gap.
Furthermore, the high-frequency core board and the conventional core board are connected in a pressing mode through prepregs.
Furthermore, the high-frequency core board, the prepreg and the conventional core board are fixed in a fusion mode.
Furthermore, the high-frequency core board, the prepreg and the conventional core board are fixed in a riveting mode.
Further, the gaps are filled with heat-conducting and electric-conducting silver glue or resin.
Furthermore, the high-frequency core plate comprises a high-frequency medium layer formed by filling thermosetting materials with non-ceramic and copper foil layers arranged on two sides of the high-frequency medium layer.
Furthermore, the high-frequency core plate comprises a high-frequency medium layer made of polytetrafluoroethylene materials and copper foil layers arranged on two sides of the high-frequency medium layer.
Furthermore, the conventional core board comprises a conventional medium layer formed by resin and glass fiber cloth and copper foil layers arranged on two sides of the conventional medium layer.
Further, the heat conducting element is a red copper block.
Furthermore, a third through hole is formed in the surface of the heat and electricity conducting adhesive layer, and the third through hole is matched with the first through hole in position.
The utility model discloses a theory of operation does: the heat conducting element penetrates through the circuit board, and the exposed ground plane enhances the stability of the whole circuit board. Meanwhile, the gap between the heat conducting element and the preset hole can be exposed on the surface through the penetrating arrangement, and the gap can be supplemented and filled in a secondary filling mode, so that the problem that the performance of the plate is reduced due to the fact that a gap is reserved between the heat conducting element and a stepped hole of a circuit board is solved. Meanwhile, the heat conducting elements are arranged in a penetrating mode, so that the cutting preparation process of the high-frequency core plate, the conventional core plate, the prepreg and the heat and electricity conducting adhesive layer is simplified, and complex procedures of manufacturing buried holes, accurately calculating the filling amount, filling the heat and electricity conducting adhesive and the like are avoided. The production process is optimized, the processing time is shortened, and the production efficiency is improved.
The utility model has the advantages that: the heat conducting element is arranged in a penetrating mode, the circuit board has a grounding function, so that the performance of the circuit board is more stable, the heat conducting and electricity conducting adhesive is filled more fully, the production requirement is reduced, the production process is simplified, the working time is saved, and the efficiency is improved.
Drawings
The figures further illustrate the invention, but the embodiments in the figures do not constitute any limitation of the invention.
Fig. 1 is a schematic diagram of a high heat dissipation and low loss PCB board structure according to an embodiment of the present invention.
Fig. 2 is an assembly manner diagram of the third through hole having a size larger than the cross-sectional size of the stepped layer of the heat conducting element according to an embodiment of the present invention.
Fig. 3 is a schematic view of an assembly manner in which the size of the third through hole is smaller than the cross-sectional size of the stepped layer of the heat conducting element according to an embodiment of the present invention.
Legend:
1, a high-frequency core board; 2, a conventional core board; 3, a stepped hole; 4 a heat conducting element; 5, a gap; 6, a heat-conducting and electric-conducting adhesive layer; 7 a prepreg; 8 a copper foil layer;
11 a first through-hole; 12 high-frequency dielectric layer;
21 a second via hole; 22 a conventional dielectric layer;
41 a base layer; a 42 step layer;
61 third through hole.
Detailed Description
As shown in fig. 1-3, an embodiment of the utility model provides a high heat dissipation, low-loss PCB board, including high frequency core 1 and the conventional core 2 of laminating each other, first through-hole 11 has been seted up to the face of high frequency core 1, second through-hole 21 has been seted up to the face of conventional core 2, first through-hole 11 forms shoulder hole 3 with second through-hole 21 intercommunication, the matching has the heat conduction element 4 of echelonment in shoulder hole 3, heat conduction element 4 include basic unit 41 and protruding in the ladder layer 42 on basic unit 41 surface, ladder layer 42 matches second through-hole 21, basic unit 41 matches first through-hole 11, shoulder hole 3 is formed with gap 5 with heat conduction element 4, be provided with heat conduction and electricity conductive glue layer 6 in the gap 5.
Further, the high-frequency core board 1 and the conventional core board 2 are connected in a pressing mode through prepregs 7.
Further, the high-frequency core board 1, the prepreg 7 and the conventional core board 2 are fixed in a fusion mode.
Further, the high-frequency core board 1, the prepreg 7 and the conventional core board 2 are fixed in a riveting manner.
Further, the gap 5 is filled with heat-conducting and electric-conducting silver glue or resin.
Further, the high-frequency core board 1 includes a high-frequency dielectric layer 12 made of a non-ceramic filled thermosetting material and copper foil layers 8 disposed on both sides of the high-frequency dielectric layer 12.
Further, the high-frequency core board 1 includes a high-frequency dielectric layer 12 made of polytetrafluoroethylene material and copper foil layers 8 disposed on two sides of the high-frequency dielectric layer 12.
Further, the conventional core board 2 comprises a conventional medium layer 22 formed by resin and glass fiber cloth, and copper foil layers 8 arranged on two sides of the conventional medium layer 22.
Further, the heat conducting element 4 is a red copper block.
Further, a third through hole 61 is formed in the surface of the heat and electricity conducting adhesive layer 6, and the third through hole 61 is matched with the first through hole 11 in position.
Example 1:
a high heat dissipation, low loss PCB board, its structure includes: each of which is a plate body formed by stacking a high-frequency core plate 1 and a conventional core plate 2. A layer of prepreg 7 is clamped between the high-frequency core board 1 and the conventional core board 2, and the laminated structure of the high-frequency core board 1, the prepreg 7 and the conventional core board 2 is fused and riveted for fixing to form a stable board body structure. Wherein, a first through hole 11 is formed on the high-frequency core plate 1 through milling groove processing, a second through hole 21 is formed on the conventional core plate 2 through milling groove processing, and the first through hole 11 is communicated with the second through hole 21 to form the stepped hole 3. In the present embodiment, the first through-holes 11 opened in the high-frequency core board 1 have a diameter smaller than that of the second through-holes 21 opened in the conventional core board 2. The heat conducting element 4 is T-shaped or stepped. The structure of the substrate comprises a base layer 41 matched with the second through hole 21 and a step layer 42 matched with the first through hole 11. It is worth mentioning that the size of the base layer 41 is smaller than the inner size of the second via hole 21, and the size of the step layer 42 is smaller than the inner size of the first via hole 11. So that a gap 5 is formed between the heat-conducting element 4 and the stepped bore 3. The gaps 5 are filled with heat and electricity conductive adhesive layers 6. The purpose of reducing dielectric loss is achieved.
The heat conducting element 4 is a T-shaped red copper block, which is arranged on the circuit board in a penetrating manner, and the exposed surfaces on the two sides of the heat conducting element have a grounding effect, so that the stability of the circuit board can be improved.
The prepreg 7 is connected with the high-frequency core plate 1 and the conventional core plate 2. After the lamination, a prepreg 7 can be formed as a third dielectric layer, and a third core board is formed by combining the copper foil layer 8 on one side of the high-frequency core board 1 and the copper foil layer 8 on one side of the conventional core board 2. The overall performance of the circuit board can be improved.
In order to avoid that the thermally and electrically conductive glue layer 6 cannot fill the gap 5 by diffusion of the flow during the pressing. And filling resin or heat-conducting and electric-conducting silver adhesive serving as a filler in the gap 5 to fill the gap 5.
The high-frequency core board 1 is made of a plurality of materials, and in this embodiment, the structure of the high-frequency core board 1 includes a high-frequency dielectric layer 12 made of polytetrafluoroethylene material or non-ceramic filled thermosetting material, and copper foil layers 8 disposed on both sides of the high-frequency dielectric layer 12.
The conventional core board 2 is selected, and in this embodiment, for example, the structure of the conventional core board 2 includes a conventional dielectric layer 22 formed by resin and glass fiber cloth, and copper foil layers 8 disposed on both sides of the conventional dielectric layer 22.
Example 2:
a high heat dissipation, low-loss PCB board preparation method, the first step, match the appearance of the heat-conducting element 4, carry on the milling flutes to process on the face of the high-frequency core board 1 and face of the conventional core board 2 separately, make the first through hole 11 and second through hole 21 used for holding the heat-conducting element 4; secondly, the conventional core board 2 and the high-frequency core board 1 are aligned and stacked, a prepreg 7 is laid between the conventional core board and the high-frequency core board, and then the conventional core board and the high-frequency core board are fixed in a fusion and riveting mode, and at the moment, the first through hole 11 is communicated with the second through hole 21 to form a stepped hole 3; thirdly, cutting the peripheral shape of the heat and electricity conductive adhesive layer 6 according to the size of the second through hole 21, forming a third through hole 61 on the surface of the heat and electricity conductive adhesive layer 6, wherein the position of the third through hole 61 corresponds to the position of the first through hole 11, the section size of the third through hole 61 is smaller than that of the step layer 42 of the heat conductive element 4, and laying the cut heat and electricity conductive adhesive layer 6 on the step surface of the step hole 3; fourthly, pressing the heat conducting element 4 into the stepped hole 3, enabling the heat conducting and electricity conducting adhesive layer 6 to deform under stress, filling the gap 5 between the heat conducting element 4 and the stepped hole 3 in a diffusion mode, and performing a pressing process after positioning to obtain a laminated plate; fifthly, the surface of the heat conducting element 4 exposed out of the surface of the pressing plate is polished by abrasive paper or burnt by laser; sixthly, filling resin or heat-conducting and electric-conducting silver adhesive into the gap 5 between the heat-conducting element 4 and the stepped hole 3 to complete the gap 5; seventhly, drilling, milling a plating bath and performing whole-plate electroplating treatment on the laminated plate; and eighthly, carrying out outer layer pattern manufacturing, processing technology and electrical property test on the laminated board to finish the manufacture of the PCB.
Example 3:
a high heat dissipation, low-loss PCB board preparation method, the first step, match the appearance of the heat-conducting element 4, carry on the milling flutes to process on the face of the high-frequency core board 1 and face of the conventional core board 2 separately, make the first through hole 11 and second through hole 21 used for holding the heat-conducting element 4; secondly, the conventional core board 2 and the high-frequency core board 1 are aligned and stacked, a prepreg 7 is laid between the conventional core board and the high-frequency core board, and then the conventional core board and the high-frequency core board are fixed in a fusion and riveting mode, and at the moment, the first through hole 11 is communicated with the second through hole 21 to form a stepped hole 3; thirdly, cutting the peripheral shape of the heat and electricity conductive adhesive layer 6 according to the size of the second through hole 21, forming a third through hole 61 on the surface of the heat and electricity conductive adhesive layer 6, wherein the position of the third through hole 61 corresponds to the position of the first through hole 11, the section size of the third through hole 61 is larger than that of the step layer 42 of the heat conducting element 4, and sleeving the cut heat and electricity conductive adhesive layer 6 on the step layer 42 of the heat conducting element 4; fourthly, pressing the heat-conducting and electricity-conducting adhesive layer 6 which is sleeved on the heat-conducting element 4 and communicated with the heat-conducting and electricity-conducting adhesive layer into the stepped hole 3, enabling the heat-conducting and electricity-conducting adhesive layer 6 to deform under stress, filling the gap 5 between the heat-conducting element 4 and the stepped hole 3 in a diffusion mode, and performing a pressing process after positioning to obtain a pressed plate; fifthly, the surface of the heat conducting element 4 exposed out of the surface of the pressing plate is polished by abrasive paper or burnt by laser; sixthly, filling resin or heat-conducting and electric-conducting silver adhesive into the gap 5 between the heat-conducting element 4 and the stepped hole 3 to complete the gap 5; seventhly, drilling, milling a plating bath and performing whole-plate electroplating treatment on the laminated plate; and eighthly, carrying out outer layer pattern manufacturing, processing technology and electrical property test on the laminated board to finish the manufacture of the PCB.
The PCB is applied to a large data server system socket based on a purley platform.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a high heat dissipation, low-loss PCB board which characterized in that: including the high frequency core and the conventional core of laminating each other, first through-hole has been seted up to the face of high frequency core, the second through-hole has been seted up to the face of conventional core, first through-hole and second through-hole intercommunication form the shoulder hole, the heat conduction component of echelonment is matched with in the shoulder hole, the heat conduction component include the basic unit and protruding in the ladder layer on basic unit's surface, the ladder layer matches the second through-hole, the basic unit matches first through-hole, the shoulder hole is formed with the gap with the heat conduction component, be provided with heat conduction and electricity conductive adhesive layer in the gap.
2. The high heat dissipation, low loss PCB of claim 1, wherein: and the high-frequency core board is connected with the conventional core board through a prepreg in a pressing manner.
3. The high heat dissipation, low loss PCB of claim 2, wherein: the high-frequency core board, the prepreg and the conventional core board are fixed in a fusion mode.
4. The high heat dissipation, low loss PCB of claim 2, wherein: the high-frequency core board, the prepreg and the conventional core board are fixed in a riveting mode.
5. The high heat dissipation, low loss PCB of claim 1, wherein: and the gaps are also filled with heat-conducting and electric-conducting silver adhesive or resin.
6. The high heat dissipation, low loss PCB of claim 1, wherein: the high-frequency core board comprises a high-frequency dielectric layer made of a non-ceramic filled thermosetting material and copper foil layers arranged on two sides of the high-frequency dielectric layer.
7. The high heat dissipation, low loss PCB of claim 1, wherein: the high-frequency core plate comprises a high-frequency medium layer made of polytetrafluoroethylene materials and copper foil layers arranged on two sides of the high-frequency medium layer.
8. The high heat dissipation, low loss PCB of claim 1, wherein: the conventional core board comprises a conventional medium layer formed by resin and glass fiber cloth and copper foil layers arranged on two sides of the conventional medium layer.
9. The high heat dissipation, low loss PCB of claim 1, wherein: the heat conducting element is a red copper block.
10. The high heat dissipation, low loss PCB of claim 1, wherein: and a third through hole is formed in the surface of the heat and electricity conducting adhesive layer and is matched with the first through hole in position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921997542.5U CN211210024U (en) | 2019-11-19 | 2019-11-19 | High heat dissipation, low-loss PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921997542.5U CN211210024U (en) | 2019-11-19 | 2019-11-19 | High heat dissipation, low-loss PCB board |
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| Publication Number | Publication Date |
|---|---|
| CN211210024U true CN211210024U (en) | 2020-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921997542.5U Active CN211210024U (en) | 2019-11-19 | 2019-11-19 | High heat dissipation, low-loss PCB board |
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| CN (1) | CN211210024U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110881240A (en) * | 2019-11-19 | 2020-03-13 | 广合科技（广州）有限公司 | High-heat-dissipation and low-loss PCB and manufacturing method thereof |
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2019
- 2019-11-19 CN CN201921997542.5U patent/CN211210024U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110881240A (en) * | 2019-11-19 | 2020-03-13 | 广合科技（广州）有限公司 | High-heat-dissipation and low-loss PCB and manufacturing method thereof |
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Address after: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong Patentee after: Guangzhou Guanghe Technology Co., Ltd Address before: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong Patentee before: DELTON TECHNOLOGY (GUANGZHOU) Inc. |