CN203691831U - Power supply module printed circuit board and system formed thereby - Google Patents
Power supply module printed circuit board and system formed thereby Download PDFInfo
- Publication number
- CN203691831U CN203691831U CN201420017625.4U CN201420017625U CN203691831U CN 203691831 U CN203691831 U CN 203691831U CN 201420017625 U CN201420017625 U CN 201420017625U CN 203691831 U CN203691831 U CN 203691831U
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- China
- Prior art keywords
- power module
- inductance
- module plate
- power supply
- mainboard
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000005516 engineering process Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model provides a power supply module printed circuit board and a system formed by the power supply module printed circuit board. The system comprises an inductor (60), an inductor input pin (70) and an inductor output pin (80), wherein the mainboard (10) of the inductor (60) is equipped with a power supply module plate (20). The power supply module plate (20) is provided with a hole passing through the inductor (60), so that the power supply module plate (20) is exactly embedded at the periphery of the inductor (60) and above the mainboard (10). The power supply module plate (20) is configured with a power supply module input pin (40) and a power supply module output pin (50) that are respectively connected to the inductor input pin (70) and the inductor output pin (80). The inductor input pin (70) and the inductor output pin (80) are respectively connected to an inductor input circuit and an inductor output circuit configured on the power supply module plate (20). The power supply module printed circuit board and the system enable stable performance of a power supply system.
Description
Technical field
The utility model relates to electronic technology field, relates in particular to printed substrate (PCB, Printed Circuit Board) and design and the manufacture method of power module in electronic product.
Background technology
Along with the development of modern science and technology, require PCB volume or area more and more less, and the function that will realize is more and more, so require the integrated level of wiring board more and more higher, thereby make PCB layout density more and more higher, increase thus the cabling difficulty of PCB, simultaneously for overall PCB design has brought great challenge and limitation.Moreover along with reaching its maturity of electronic product system research and development technology, the design of some local function modules of projects is all often consistent from function.Such as, power module, a perfect power-supply system can be used in multiple projects.
The solution of current PC B design is that design is on a PCB separately by a perfect power-supply system, and projects veneer uses this power-supply system by connector, thereby guarantees the stability of power module design and improve the operating efficiency of Power Engineer.But this design can be subject to the restriction of the problem such as structure and heat radiation of framework conventionally.
As shown in Figure 1, for the structure of traditional power module plate 2, it is connected by a higher power module connector 4 with mainboard 1, make like this whole height of mainboard 1 increase, it comprises height, PCB(mainboard 1 and the power module plate 2 of this connector 4) height of each power module device 3 on thickness and power module plate 2.This can make mainboard 1 height quite serious structure of generation in whole system framework influence each other, and also can have a strong impact on the heat radiation of system simultaneously.
Therefore, need to design a kind of PCB of power module, can under the prerequisite of stability that guarantees power module design, comprehensively solve the problems such as architectural configurations and heat radiation.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of power module printed circuit board (PCB) and method for designing thereof, can under the prerequisite that guarantees power module resistance to overturning, make compact conformation and good heat dissipation effect.
In order to solve the problems of the technologies described above, the utility model provides a kind of system being formed by power module printed circuit board (PCB), comprises mainboard (10) and power module plate (20), wherein:
Mainboard (10) disposes inductance component (60), inductance input pin (70) and the inductance output pin (80) of power module plate (20);
On power module plate (20), have the hole that can pass inductance component (60) size, make power module plate (20) just be embedded in inductance component (60) and be assemblied in mainboard (10) top around; Power module input pin (40) and the power module output pin (50) of the upper configuration of power module plate (20), respectively correspondingly with inductance input pin (70), is connected inductance output pin (80) connection, meanwhile, this inductance input pin (70), connection inductance output pin (80) are also correspondingly connected with inductance input circuit and the inductance output circuit of the upper configuration of power module plate (20) respectively.
Further, the highest device on power module plate (20) and inductance component (60) are with high.
Further, between power module plate (20) and mainboard (10), short device and design large area cabling are put in remaining gap.
In order to solve the problems of the technologies described above, the utility model provides the power module printed circuit board (PCB) of a kind of use in foregoing system, wherein, the inductance component (60) of power module plate (20), inductance input pin (70) and inductance output pin (80) are all configured on mainboard (10); On this power module plate (20), have the hole that can pass inductance component (60) size, make this power module plate (20) just be embedded in inductance component (60) and be assemblied in mainboard (10) top around; On power module plate (20), power module input pin (40) and the power module output pin (50) of configuration, respectively correspondingly with inductance input pin (70), is connected inductance output pin (80) connection, meanwhile, this inductance input pin (70), connection inductance output pin (80) are also correspondingly connected with inductance input circuit and the inductance output circuit of configuration respectively.
Further, the highest device on power module plate (20) and inductance component (60) are with high.
The maximum height of power module PCB of the present utility model does not exceed the inductance height of power module, therefore do not affect the limit for height layout of integral product mainboard, do not affect the radiating effect of system yet, simultaneously for a large amount of arrangement spaces and cabling space have been saved in the design of High density of PCB plate, avoid cabling to wear the risk of intensive power hole, guarantee the stable performance of power-supply system, shortened design, the debugging cycle of power module and improved efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of traditional power module printed circuit board (PCB);
Fig. 2 is the structural representation of the system embodiment of power module printed circuit board (PCB) formation of the present utility model.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, the technical solution of the utility model is at length set forth.Should be appreciated that, the embodiment below enumerating is only for description and interpretation the utility model, and do not form the restriction to technical solutions of the utility model.
The system embodiment that a kind of power module printed circuit board (PCB) that the utility model provides forms, its structure as shown in Figure 2, comprises mainboard 10 and power module plate 20, wherein:
In said system embodiment, the highest device on power module plate 20 and inductance component 60 are with high.
In said system embodiment, between power module plate 20 and mainboard 10, short device and design large area cabling are put in remaining gap.
So, the maximum height of power module plate 20 is no more than the height of inductance component 60 on power module.Therefore power module PCB design scheme one of the present utility model does not affect the height-limit area layout of mainboard 10 entirety, do not affect the heat dissipation problem of whole power-supply system yet, simultaneously also for a large amount of arrangement spaces and cabling space have been saved in the design of High density of PCB plate, avoid cabling to wear the risk of intensive power hole, guarantee the stable performance of power-supply system, improved Power Management Design and debugging efficiency.
Claims (5)
1. the system being formed by power module printed circuit board (PCB), comprises mainboard (10) and power module plate (20), it is characterized in that:
Mainboard (10) disposes inductance component (60), inductance input pin (70) and the inductance output pin (80) of power module plate (20);
On power module plate (20), have the hole that can pass inductance component (60) size, make power module plate (20) just be embedded in inductance component (60) and be assemblied in mainboard (10) top around; Power module input pin (40) and the power module output pin (50) of the upper configuration of power module plate (20), respectively correspondingly with inductance input pin (70), is connected inductance output pin (80) connection, meanwhile, this inductance input pin (70), connection inductance output pin (80) are also correspondingly connected with inductance input circuit and the inductance output circuit of the upper configuration of power module plate (20) respectively.
2. according to system claimed in claim 1, it is characterized in that, the highest device on described power module plate (20) and described inductance component (60) are with high.
3. according to the system described in claim 1 or 2, it is characterized in that, between described power module plate (20) and mainboard (10), short device and design large area cabling are put in remaining gap.
4. the use power module printed circuit board (PCB) in the system as claimed in claim 1, it is characterized in that, inductance component (60), inductance input pin (70) and the inductance output pin (80) of power module plate (20) are all configured on mainboard (10); On this power module plate (20), have the hole that can pass inductance component (60) size, make this power module plate (20) just be embedded in inductance component (60) and be assemblied in mainboard (10) top around; On power module plate (20), power module input pin (40) and the power module output pin (50) of configuration, respectively correspondingly with inductance input pin (70), is connected inductance output pin (80) connection, meanwhile, this inductance input pin (70), connection inductance output pin (80) are also correspondingly connected with inductance input circuit and the inductance output circuit of configuration respectively.
5. according to power module printed circuit board (PCB) claimed in claim 4, it is characterized in that, the highest device on described power module plate (20) and described inductance component (60) are with high.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420017625.4U CN203691831U (en) | 2014-01-10 | 2014-01-10 | Power supply module printed circuit board and system formed thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420017625.4U CN203691831U (en) | 2014-01-10 | 2014-01-10 | Power supply module printed circuit board and system formed thereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203691831U true CN203691831U (en) | 2014-07-02 |
Family
ID=51013679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420017625.4U Expired - Fee Related CN203691831U (en) | 2014-01-10 | 2014-01-10 | Power supply module printed circuit board and system formed thereby |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203691831U (en) |
-
2014
- 2014-01-10 CN CN201420017625.4U patent/CN203691831U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20190110 |