CN203407063U - Heat dissipating type PCB - Google Patents
Heat dissipating type PCB Download PDFInfo
- Publication number
- CN203407063U CN203407063U CN201320420437.1U CN201320420437U CN203407063U CN 203407063 U CN203407063 U CN 203407063U CN 201320420437 U CN201320420437 U CN 201320420437U CN 203407063 U CN203407063 U CN 203407063U
- Authority
- CN
- China
- Prior art keywords
- layer
- copper foil
- pcb
- heat dissipating
- glass fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000011889 copper foil Substances 0.000 claims abstract description 27
- 239000004593 Epoxy Substances 0.000 claims abstract description 16
- 239000003365 glass fiber Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 9
- 238000002955 isolation Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to the technical field of electronic parts and components, and especially relates to a heat dissipating type PCB. The PCB comprises a board body formed by a base material layer, an epoxy glass fiber layer, and a copper foil layer, isolation blocks, a heat dissipating layer, and a chip. The epoxy glass fiber layer is disposed between the base material layer and the copper foil layer. Two sides of the copper foil layer are provided with the isolation blocks. The isolation blocks are fixedly connected with the heat dissipating layer. The chip is disposed between the heat dissipating layer and the copper foil layer. The base material layer, the epoxy glass fiber layer, the copper foil layer, and the isolation blocks are provided with holes. The heat dissipating type PCB is simple, compact, and reasonable in structure, convenient and fast in assembling, and reliable in connection. The chip can effectively isolate from outside air, thereby improving integrated electrical performance of a product, improving heat dissipation of the PCB, prolonging service life of the PCB, and greatly improving reliability of operation of the PCB. The PCB is easy to popularize.
Description
Technical field
The utility model relates to a kind of technical field of electronic devices and components, especially a kind of heat radiation type PCB heat board.
Background technology
Along with the develop rapidly of electron trade, the trend of electronic product microminiaturization is day by day obvious, and a PCB plate is except fixing various little electronic components, and its major function provides the mutual electrical connection of various electronic components in addition.Along with the development of information technology, electronic equipment also becomes increasingly complex, and pcb board is also widely applied.Existing pcb board heat dispersion is poor, and chip is exposed in air, easily damages, and has shortened the useful life of product, has reduced the reliability that pcb board is used.
Utility model content
In order to overcome the deficiency that existing pcb board heat dispersion is poor, useful life is short and dependability is low, the utility model provides a kind of heat radiation type PCB heat board.
The utility model solves the technical scheme that its technical problem adopts: a kind of heat radiation type PCB heat board, comprise the plate body, spacing block, heat dissipating layer and the chip that by substrate layer, epoxy glass fiber layer and copper foil layer, are formed, between substrate layer and copper foil layer, be provided with epoxy glass fiber layer, on copper foil layer, both sides are provided with spacing block, spacing block is fixedly connected with heat dissipating layer, between heat dissipating layer and copper foil layer, is provided with chip.
According to another embodiment of the present utility model, further comprise on substrate layer, epoxy glass fiber layer, copper foil layer and spacing block and be equipped with through hole.
The beneficial effects of the utility model are, this heat radiation type PCB heat board is simple in structure, compact and reasonable, easy to assembly quick, connect reliable, chip can be effectively and extraneous air isolate, improved the overall performance electrical performance of product, and improved the heat dispersion of pcb board, extended the useful life of pcb board, greatly improved the reliability of pcb board work, be easy to use and promote.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structural representation of the present utility model.
1. plate bodys in figure, 2. spacing block, 3. heat dissipating layer, 4. chip, 5. through hole, 11. substrate layers, 12. epoxy glass fiber layers, 13. copper foil layers.
Embodiment
If Fig. 1 is structural representation of the present utility model, a kind of heat radiation type PCB heat board, comprise the plate body 1, spacing block 2, heat dissipating layer 3, chip 4 and the through hole 5 that by substrate layer 11, epoxy glass fiber layer 12 and copper foil layer 13, are formed, between substrate layer 11 and copper foil layer 13, be provided with epoxy glass fiber layer 12, on copper foil layer 13, both sides are provided with spacing block 2, spacing block 2 is fixedly connected with heat dissipating layer 3, between heat dissipating layer 3 and copper foil layer 13, be provided with chip 4, on substrate layer 11, epoxy glass fiber layer 12, copper foil layer 13 and spacing block 2, be equipped with through hole 5.
During use, plate body 1 is comprised of substrate layer 11, epoxy glass fiber layer 12 and copper foil layer 13, between substrate layer 11 and copper foil layer 13, be provided with epoxy glass fiber layer 12, on copper foil layer 13, both sides are provided with spacing block 2, on substrate layer 11, epoxy glass fiber layer 12, copper foil layer 13 and spacing block 2, be equipped with through hole 5, through hole 5 is used as the louvre of plate body 1, spacing block 2 is fixedly connected with heat dissipating layer 3, between heat dissipating layer 3 and copper foil layer 13, be provided with chip 4, between spacing block 2, heat dissipating layer 3 and copper foil layer 13, form confined space in order to chip 4 to be installed.This heat radiation type PCB heat board is simple in structure, compact and reasonable, easy to assembly quick, connect reliable, chip can be effectively and extraneous air isolation, improve the overall performance electrical performance of product, and improved the heat dispersion of pcb board, extended the useful life of pcb board, greatly improved the reliability of pcb board work, be easy to use and promote.
Claims (2)
1. a heat radiation type PCB heat board, comprise the plate body (1), spacing block (2), heat dissipating layer (3) and the chip (4) that by substrate layer (11), epoxy glass fiber layer (12) and copper foil layer (13), are formed, it is characterized in that, between substrate layer (11) and copper foil layer (13), be provided with epoxy glass fiber layer (12), the upper both sides of copper foil layer (13) are provided with spacing block (2), spacing block (2) is fixedly connected with heat dissipating layer (3), between heat dissipating layer (3) and copper foil layer (13), is provided with chip (4).
2. heat radiation type PCB heat board according to claim 1, is characterized in that, on substrate layer (11), epoxy glass fiber layer (12), copper foil layer (13) and spacing block (2), is equipped with through hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320420437.1U CN203407063U (en) | 2013-07-16 | 2013-07-16 | Heat dissipating type PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320420437.1U CN203407063U (en) | 2013-07-16 | 2013-07-16 | Heat dissipating type PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203407063U true CN203407063U (en) | 2014-01-22 |
Family
ID=49942981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320420437.1U Expired - Fee Related CN203407063U (en) | 2013-07-16 | 2013-07-16 | Heat dissipating type PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203407063U (en) |
-
2013
- 2013-07-16 CN CN201320420437.1U patent/CN203407063U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20170716 |