CN203466223U - Light emitting diode packaging structure - Google Patents
Light emitting diode packaging structure Download PDFInfo
- Publication number
- CN203466223U CN203466223U CN201320390298.2U CN201320390298U CN203466223U CN 203466223 U CN203466223 U CN 203466223U CN 201320390298 U CN201320390298 U CN 201320390298U CN 203466223 U CN203466223 U CN 203466223U
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- CN
- China
- Prior art keywords
- led
- plastic stent
- emitting diode
- led chip
- casting glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 239000004033 plastic Substances 0.000 claims abstract description 55
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000005266 casting Methods 0.000 claims description 36
- 239000003292 glue Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 14
- 241000218202 Coptis Species 0.000 claims description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000000565 sealant Substances 0.000 abstract 3
- 238000005538 encapsulation Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000012856 packing Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002991 molded plastic Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model provides a light emitting diode (LED) packaging structure. The LED packaging structure comprises at least two metal supports, an LED chip, pouring sealant and a plastic support. The LED chip is arranged on at least one metal support and is electrically connected with the two metal supports respectively. The pouring sealant is used for sealing the whole LED chip. The plastic support is used for bearing the at least two metal supports and is provided with at least two through holes, and the at least two metal supports penetrate out of the plastic support through the at least two through holes. According to the LED packaging structure, the LED chip is isolated from the plastic support by the pouring sealant so that the reliability of LED packaging is improved and the heat dissipating performance is good.
Description
Technical field
The utility model is about LED technology field, and particularly about a kind of package structure for LED.
Background technology
Light-emitting diode (light emitting diode, LED) is because the features such as it is energy-conservation, safety, long service life are widely used.
LED encapsulation need complete output electrical signals, the normal operation of protection chip, and the function of output visible ray, its existing electrical quantity, has again design and the specification requirement of optical parameter.
Fig. 1 is the profile of encapsulation (lamp led) structure of existing pinned.As shown in Figure 1, pinned encapsulating structure comprises metallic support 10 ', LED chip 11 ', gold thread 12 ', casting glue 13 ', and wherein, metallic support 10 ' comprises anode rod 101 ', cathode rod 102 ' and reflector 103 '.It is upper that the positive pole of LED chip 11 ' is linked anode rod 101 ' with gold thread 12 ' bonding, and the negative pole of LED chip 11 ' is bonded in the reflector 103 ' of metallic support with silver slurry, and seal with casting glue 13 ' at the top of metallic support 10 '.The encapsulating structure processing procedure of pinned is simple, and LED chip 11 ' only has a kind of material of casting glue 13 ', but because casting glue 13 ' is less with the bond strength of metallic support 10 ', so it needs more casting glue just can have enough mechanism's power, thereby causes poor radiation.
Fig. 2 is the profile of existing surperficial adhesive type encapsulating structure.As shown in Figure 2, surperficial adhesive type encapsulating structure comprises a plurality of metallic supports 100, plastic stent 110, LED chip 120, gold thread 130 and casting glue 140.Wherein, plastic stent 110 utilizes ejection formation to form, and plastic stent 110 offers groove, for placing LED chip 120.LED chip 120 is electrically connected to a plurality of metallic supports 100 by gold thread 130, and casting glue 140 is potted on groove, thereby seals LED chip 120 and gold thread 130.Because casting glue 140 and the bond strength of plastic stent 110 are obviously better than metal, therefore the casting glue 140 that the encapsulating structure of surperficial adhesive type needs is obviously less than the encapsulating structure of pinned, but the LED chip of surperficial adhesive type has the multiple plastic materials such as plastic stent 110 and casting glue 140 around, internal stress is excessive, easily cause plastic stent 110 and casting glue 140 to depart from, thereby cause encapsulating structure reliability low.
Therefore, be necessary to provide improved technical scheme to overcome the above technical problem existing in prior art.
Utility model content
The purpose of this utility model is to provide and a kind ofly can improves reliability, and good LED encapsulating structure and the LED method for packing of thermal diffusivity.
The utility model provides the encapsulating structure of a kind of light-emitting diode (light-emitting diode, LED), and the encapsulating structure of described LED comprises at least two metallic supports, LED chip, casting glue and plastic stent.Described LED chip is arranged on described at least one on metallic support and forms respectively electric connection with two metallic supports, described casting glue by whole described LED chip sealing within it, described plastic stent is used for carrying described two metallic supports, and described plastic stent has at least two through holes, described at least two metallic supports pass described plastic stent by described at least two through holes.
The beneficial effects of the utility model are, adopt LED encapsulating structure of the present utility model, utilize casting glue by LED chip and plastic stent isolation, thereby make the surrounding of LED chip only have a kind of plastic material (casting glue), improved the reliability of LED encapsulation, and thermal diffusivity is good.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technology hand end of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other objects, features and advantages of the present utility model can be become apparent, below especially exemplified by embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the profile of the encapsulating structure of existing pinned.
Fig. 2 is the profile of existing surperficial adhesive type encapsulating structure.
Fig. 3 is the profile of package structure for LED of the present utility model.
Fig. 4 is the flow chart of the LED encapsulation method of the utility model one embodiment.
Fig. 5 is the flow chart of the LED encapsulation method of another embodiment of the utility model.
Fig. 6 is for utilizing the LED encapsulating structure schematic diagram forming as the step S51 in Fig. 5.
Fig. 7 is for utilizing the LED encapsulating structure schematic diagram forming as the step S52 in Fig. 5.
Fig. 8 is for utilizing the LED encapsulating structure schematic diagram forming as the step S53 in Fig. 5.
Fig. 9 is for utilizing the LED encapsulating structure schematic diagram forming as the step S54 in Fig. 5.
Embodiment
For further setting forth the utility model, be to reach technology hand end and the effect that predetermined utility model object is taked, below in conjunction with accompanying drawing and preferred embodiment, embodiment, structure, feature and effect thereof to the package structure for LED according to the utility model proposes, be described in detail as follows:
Fig. 3 is the profile of light-emitting diode (light emitting diode, the LED) encapsulating structure of the utility model embodiment.As shown in Figure 3, LED encapsulating structure comprise at least two metallic support 10(figure only illustrate two), plastic stent 11, LED chip 12, casting glue 13.Plastic stent 11 is for carrying two metallic supports 10, and plastic stent 11 has two through holes, and two metallic supports 10 pass plastic stent 11 by two through holes.LED chip 12 is arranged at least one metallic support 10 and with two metallic supports 10 and forms respectively electric connection, and casting glue 13 by whole LED chip 12 sealings within it.
Concrete, LED chip 12 and two metallic supports 10 are formed and are electrically connected by gold thread 14 respectively, and other metallic support 10 in LED encapsulating structure can be used for heat radiation.Plastic stent 11 comprises base 113 and side portion structure 112, side portion structure 112 is arranged on base 113, two through holes are arranged on side portion structure 112 and with base 113 and separate certain distance, so that form a cavity between LED chip 12 and metallic support 10 and the upper surface of base 113, thereby the casting glue 13 of cavity holding portion by whole LED chip sealing within it, and by LED chip and plastic stent 11 isolation, make the surrounding of LED chip 12 only have a kind of plastic material (casting glue 13), to improve the reliability of LED encapsulation.
One end of two metallic supports 10 passes plastic stent 11 by two through holes, and the other end is wrapped in the lower surface of the base 113 of plastic stent 11.Plastic stent 11 is one-body molded by injection mo(u)lding.Certainly it will be appreciated by those skilled in the art that, plastic stent 11 can utilize the alternate manner moulding such as ejection forming technique.Casting glue 13 is silica gel, and what certainly it will be appreciated by those skilled in the art that is casting glue 13 other material such as be epoxy resin.
LED encapsulating structure of the present utility model utilizes casting glue 14 by LED chip 12 and plastic stent 11 isolation, thereby makes the surrounding of LED chip 12 only have a kind of plastic material (casting glue 14), improved the reliability of LED encapsulation 1, and thermal diffusivity is good.
Fig. 4 is the schematic flow sheet of the LED method for packing of the utility model one execution mode.LED method for packing comprises:
Step S41: two metallic supports are provided;
Step S42: one-body molded plastic stent, for carrying two metallic supports, and plastic stent has two through holes, and one end of two metallic supports passes plastic stent by two through holes;
Step S43: at least one metallic support, LED chip is set, and LED chip and two metallic supports are formed respectively to electric connection;
Step S44: inject casting glue, by whole LED chip sealing within it.
Concrete, LED method for packing also comprises the lower surface that the other end of two metallic supports is wrapped in to plastic stent.
Wherein, plastic stent is one-body molded by for example ejection forming technique.Two through holes are arranged on side portion structure and with base and separate certain distance, so that form a cavity between LED chip and metallic support and base, when injecting casting glue, thereby casting glue flows into cavity by whole LED chip sealing within it, and by LED chip and plastic stent isolation, make the surrounding of LED chip only have a kind of plastic material (casting glue), to improve the reliability of LED encapsulation.
The schematic flow sheet of the LED method for packing of another execution mode of Fig. 5 the utility model.As shown in Figure 5, LED method for packing comprises:
Step S51: two metallic supports are provided, and at least one metallic support, LED chip are set, and LED chip and two metallic supports are formed respectively to electric connection;
Step S52: inject casting glue, by whole LED chip sealing within it;
Step S53: on the basis of said structure, one-body molded plastic stent to be to carry two metallic supports, and plastic stent has two through holes, and one end of two metallic supports passes plastic stent by two through holes.
Concrete, LED method for packing also comprises step S54: metallic support is cut out to pin moulding, and the other end of two metallic supports is wrapped in to the lower surface of plastic stent.
Plastic stent comprises base and side portion structure, and side portion structure is arranged on base, and plastic stent is by injection mo(u)lding or ejection forming technique and one-body molded.Two through holes are arranged on side portion structure and with base and separate certain distance, so that form a cavity between LED chip and metallic support and base, thereby the casting glue of cavity holding portion by whole LED chip sealing within it, then form plastic stent, thereby avoided LED chip to contact with plastic stent body 112 and plastic stent base 113, thereby only there is a kind of plastic material (casting glue 14) in the surrounding that makes LED chip, improved the reliability of LED encapsulation 1, and thermal diffusivity is good.
Fig. 6 is for utilizing the LED encapsulating structure schematic diagram forming as the step S51 in Fig. 5.Fig. 7 is for utilizing the LED encapsulating structure schematic diagram forming as the step S52 in Fig. 5.Fig. 8 is for utilizing the LED encapsulating structure schematic diagram forming as the step S53 in Fig. 5.Fig. 9 is for utilizing the LED encapsulating structure schematic diagram forming as the step S54 in Fig. 5.Please refer to Fig. 6 to Fig. 9, LED chip 12 is placed on a metallic support 10, and LED chip 12 and two metallic supports 10 utilize respectively gold thread 14 to form and are electrically connected, and utilize casting glue 13 fixed L ED chips 12, finally form plastic stent 11, to carry two metallic supports 10, finally metallic support 10 other ends are wrapped in to the lower surface of plastic stent 11.Certainly, what it will be appreciated by those skilled in the art that is that LED chip 12 is placed on more than one metallic support 10, to form LED encapsulating structure as shown in Figure 3.
LED encapsulating structure of the present utility model, utilizes casting glue 13 by LED chip 12 and plastic stent 11 isolation, make the surrounding of LED chip 12 only have a kind of plastic material (casting glue 13) to improve the reliability of LED encapsulation, and thermal diffusivity is good.
Above, only embodiment of the present utility model, not the utility model is done to any pro forma restriction, although the utility model discloses as above with embodiment, yet not in order to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solutions of the utility model content, any simple modification of above embodiment being done according to technical spirit of the present utility model, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (7)
1. an encapsulating structure for light-emitting diode, is characterized in that, the encapsulating structure of described light-emitting diode comprises:
At least two metallic supports;
Light-emitting diode chip for backlight unit, is arranged at least one metallic support and with described two metallic supports and forms respectively electric connection;
Casting glue, by whole described light-emitting diode chip for backlight unit sealing within it;
Plastic stent, at least two metallic supports described in carrying, and described plastic stent has at least two through holes, and described at least two metallic supports pass described plastic stent by described at least two through holes.
2. package structure for LED as claimed in claim 1, is characterized in that, described plastic stent comprises base and side portion structure, and described side portion structure is arranged on described base.
3. package structure for LED as claimed in claim 2, it is characterized in that, described at least two through holes are arranged on described side portion structure and with described base and separate certain distance, so that between described light-emitting diode chip for backlight unit and described metallic support and described base, form a cavity, thereby the described casting glue of described cavity holding portion by whole described light-emitting diode chip for backlight unit sealing within it.
4. package structure for LED as claimed in claim 1, is characterized in that, described casting glue is silica gel or epoxy resin.
5. package structure for LED as claimed in claim 1, is characterized in that, described light-emitting diode chip for backlight unit and described two metallic supports form respectively electric connection by gold thread.
6. package structure for LED as claimed in claim 1, is characterized in that, described plastic stent is formed in one.
7. package structure for LED as claimed in claim 6, is characterized in that, described plastic stent is by injection mo(u)lding or ejection forming technique and one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320390298.2U CN203466223U (en) | 2013-07-02 | 2013-07-02 | Light emitting diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320390298.2U CN203466223U (en) | 2013-07-02 | 2013-07-02 | Light emitting diode packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203466223U true CN203466223U (en) | 2014-03-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320390298.2U Expired - Fee Related CN203466223U (en) | 2013-07-02 | 2013-07-02 | Light emitting diode packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203466223U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346240A (en) * | 2013-07-02 | 2013-10-09 | 深圳市光之谷新材料科技有限公司 | Light emitting diode packaging structure and method |
-
2013
- 2013-07-02 CN CN201320390298.2U patent/CN203466223U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346240A (en) * | 2013-07-02 | 2013-10-09 | 深圳市光之谷新材料科技有限公司 | Light emitting diode packaging structure and method |
| CN103346240B (en) * | 2013-07-02 | 2016-02-10 | 深圳市光之谷新材料科技有限公司 | A kind of package structure for LED and method |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140305 Termination date: 20190702 |
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| CF01 | Termination of patent right due to non-payment of annual fee |