CN104377542A - Pin type packaging structure and method for semiconductor laser - Google Patents

Abstract

The invention discloses a pin type packaging structure and method of a semiconductor laser. The packaging structure includes: positive pole tongue, negative pole tongue, epoxy resin lens; the negative electrode of the semiconductor laser chip is bonded on the negative pole tongue by solder, and the chip is parallel to the negative pole tongue; the positive pole of the semiconductor laser chip is passed through the gold The positive pole tongue and the negative pole tongue are encapsulated by the epoxy resin lens, and the positive pole tongue and the negative pole tongue are used as the positive pole pin and the negative pole pin of the semiconductor laser. The above-mentioned epoxy resin lens leads out. The invention has the advantages of simple packaging structure, simplified packaging process, low cost, good reliability and the like.

Description

A semiconductor laser lead package structure and method

technical field

The invention relates to the packaging technology of semiconductor lasers, in particular to a lead-type packaging structure and method for semiconductor lasers, which is suitable for the packaging of GaAs-based, InP-based, GaN-based, SiC-based and ZnO-based semiconductor lasers.

Background technique

A semiconductor laser is a type of laser with a semiconductor material as the optical gain medium. Its core is a diode chip with an optical feedback structure, usually called a laser diode. Compared with other lasers, semiconductor lasers have the advantages of small size, high efficiency, long life, and direct tuning.

Semiconductor lasers are used in a wide variety of applications. The application fields involve many aspects: such as: optical fiber communication, laser sensing, laser ranging, guidance, laser physiotherapy, etc. In recent years, low-power visible light semiconductor lasers are mostly used to make laser pointers, laser pointers, laser flashlights, etc., and the power is usually in milliwatts. Because of its small size, low power and easy to carry, it is loved by the majority of users.

At present, semiconductor lasers are usually packaged with TO (transistor outline transistor outline) sockets, as shown in Figure 1 and Figure 2, the traditional TO packaging form includes TO sockets, tongues, pins and caps. The nozzle tongue is arranged on the top of the tube seat, and its shape is a hexagonal column. The semiconductor laser chip is bonded on the tube tongue, and a tube cap is added on the tube seat. The surroundings of the cap are sealed metal, and the top of the middle cap is a lens. The cavity of the chip faces the lens in the center of the cap. This packaging form can guide the heat in the laser chip to the TO tube base and pins through the TO tube tongue, and the heat dissipation effect is good. But the disadvantage is that the cost of the package bracket is very high, the TO tube base, nozzle, and pins are all gold-plated metal, and the TO tube cap is also composed of metal and glass lens. Since low-power lasers are used for laser indication, the power is only 5mw or less, and the heat generated by the laser is very small. Package, the cost is high.

Contents of the invention

The object of the present invention is to provide a semiconductor laser pin-type packaging structure and method, which is especially suitable for the packaging of low-power semiconductor laser chips. It has a simple packaging process and extremely low cost, and is suitable for application fields such as laser pointers and laser pointers.

In order to achieve the above-mentioned purpose of the invention, the present invention provides a semiconductor laser pin type package structure, which includes: positive pole tongue, negative pole tongue, epoxy resin lens; the negative electrode of the semiconductor laser chip is bonded on the negative pole tongue by solder , the chip is parallel to the negative pole; the positive pole of the semiconductor laser chip is connected to the positive pole through a gold wire; the positive pole and the negative pole are encapsulated by the epoxy resin lens, and the positive pole and the negative pole The nozzle is drawn out from the epoxy resin lens as the positive pin and the negative pin of the semiconductor laser.

The present invention also provides a method for packaging using the semiconductor laser pin type packaging structure as described above, comprising the following steps:

Step 1: welding the cathode of the semiconductor laser chip on the cathode tongue;

Step 2: Connect the anode of the semiconductor laser chip to the anode tongue with a gold wire;

Step 3: Pouring the positive and negative tabs with epoxy resin glue in the mold under a protective atmosphere, curing them into a straw hat shape, and using one end of the positive and negative tabs as the positive pin and the negative The pins are exposed.

The semiconductor laser pin type packaging structure and method proposed by the present invention have the advantages of simple packaging structure, simplified packaging process, low cost, good reliability and the like.

Description of drawings

Figure 1 is a perspective view of the TO packaging structure of the original semiconductor laser;

Figure 2 is a top view of the TO packaging structure of the original semiconductor laser;

Fig. 3 is a cross-sectional view of a pin-type package structure of a semiconductor laser of the present invention;

〔Main components〕

Semiconductor laser tube core; 2-solder; 3-negative pole tongue and pin; 4-positive pole tongue and pin; 5-gold wire; 6-epoxy resin tube cap.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

FIG. 3 shows a schematic cross-sectional view of a semiconductor laser lead package structure proposed by the present invention. As shown in FIG. 3 , the packaging structure includes a positive electrode tab 4 , a negative electrode tab 3 , and an epoxy resin lens 6 . The semiconductor laser chip is bonded on the cathode tongue by solder, the chip is parallel to the cathode tongue, and the cavity of the chip emits light upward. The anode of the low-power semiconductor laser chip is connected to the anode tongue through a gold wire. The positive pole tab and the negative pole tongue are encapsulated by the epoxy resin lens, and the positive pole tab and the negative pole tongue are led out from the epoxy resin lens as positive pole pins and negative pole pins of the semiconductor laser. The epoxy resin lens is a straw hat-shaped structure. Both the positive pole tab and the negative pole tab are in the shape of a rectangular column or other cylinders, and the volume of the negative pole tab is slightly larger than that of the positive pole tab.

The positive pole tongue and pin, negative pole tongue and pin are made of copper, aluminum, iron or other metal materials.

The present invention also proposes a packaging method for a low-power semiconductor laser chip, comprising the steps of:

Step 1: Use gold-tin solder 2 to weld the low-power semiconductor laser chip 1 on the cathode tongue 3 of the semiconductor laser pin-type package structure through the second process of die bonding. The cathode of the semiconductor laser chip 1 is bonded to the cathode tab 3 of the packaging structure, and the cavity of the semiconductor laser chip 1 emits laser light upward. The welding temperature is 275 degrees, the welding time is 12s, and the welding is performed under a nitrogen atmosphere.

The positive pole and the negative pole tongue of the semiconductor laser pin package structure are in the shape of a rectangular column or other shapes. The tongues and pins of the semiconductor laser pin package structure can be metals with high thermal conductivity such as copper, iron, and aluminum. The solder can also be conductive silver paste, indium solder, and the like.

Step 2: Connect the anode (P surface) of the semiconductor laser chip 1 to the anode tongue 4 with a gold wire 5 by a wire bonding machine. The diameter of the gold wire is 10-30um.

Step 3: Fill the package with epoxy resin glue in the mold under a protective atmosphere, and cure it into a straw hat shape, exposing the positive and negative pins. The shape of the epoxy resin glue can form various caps with different curvatures that are beneficial to the light output of the semiconductor laser chip through an optical design. The protective atmosphere is nitrogen or other inert gases. The perfusion glue can also be materials such as silica gel, polymer, etc. that are transparent, easy to form, and have good heat dissipation.

The above semiconductor laser pin type packaging structure and method have the advantages of simple packaging structure, simplified packaging process, low cost, good reliability and the like.

The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention, and are not intended to limit the present invention. Within the spirit and principles of the present invention, any modifications, equivalent replacements, improvements, etc., shall be included in the protection scope of the present invention.

Claims (9)

1. a semiconductor laser pinned encapsulating structure, it comprises: positive pole pipe tongue, cathode tube tongue, epoxy resin lenses; The negative pole of semiconductor laser chip is by solder attach on cathode tube tongue, and chip is parallel with cathode tube tongue; The positive pole of described semiconductor laser chip is connected with positive pole pipe tongue by gold thread; Described positive pole pipe tongue and cathode tube tongue are packaged by described epoxy resin lenses, and described positive pole pipe tongue and cathode tube tongue are drawn from described epoxy resin lenses as the positive pole pin of described semiconductor laser and negative pole pin.

2. encapsulating structure as claimed in claim 1, wherein, described epoxy resin lenses is careless cap-like structure.

3. encapsulating structure as claimed in claim 1, wherein, described positive pole pipe tongue and cathode tube tongue are rectangular column shape, and the volume ratio positive pole pipe tongue of cathode tube tongue is large.

4. encapsulating structure as claimed in claim 1, wherein, described positive pole pipe tongue and cathode tube tongue are made up of metal material.

5. encapsulating structure as claimed in claim 1, wherein, the chamber of described semiconductor laser chip is towards upper bright dipping.

6. utilize the semiconductor laser pinned encapsulating structure described in claim 1 to carry out the method encapsulated, comprise the following steps:

Step 1: the negative pole of semiconductor laser chip is welded on described cathode tube tongue;

Step 2: semiconductor laser chip positive pole is connected with described positive pole pipe tongue with gold thread;

Step 3: by described positive pole pipe tongue and cathode tube tongue infusion epoxy resin glue in a mold under protective atmosphere, be solidified into straw hat shape, and one end of described positive pole pipe tongue and cathode tube tongue is exposed as positive pole pin and negative pole pin.

7. method according to claim 1, is characterized in that, the protective atmosphere in described step 3 is inert gas.

8. the epoxide-resin glue the method for claim 1, wherein in described step 3 is silica gel or polymer.

9. the method for claim 1, wherein adopt solder to be welded on by the negative pole of described semiconductor laser chip on described cathode tube tongue in described step 1, described solder is golden tin, conductive silver paste or indium solder.