CN202476026U - Water-cooled structure of component mounting boards of high-frequency equipment - Google Patents

Abstract

The utility model discloses a water-cooling structure of a high-frequency device component installation substrate. The water-cooling structure comprises a substrate and is characterized in that a water-cooling passage is arranged inside the substrate, a water inlet and a water outlet of the water-cooling passage are arranged on one side of the substrate, the substrate is molded through a die in a one-shot mode, the water-cooling passage comprises a water inlet passage and a water outlet passage and the water inlet passage is communicated with the water outlet passage through a connecting passage. The water-cooling structure has the advantage of being simple in structure. The water-cooling passage is directly formed inside the substrate by means of the die. Therefore, the water-cooling structure is convenient to process, free of potential safety hazards and better in the cooling effect.

Description

Water-cooled structure of component mounting boards of high-frequency equipment

technical field

The utility model relates to high-frequency equipment, in particular to a water-cooling structure for component mounting substrates of high-power high-frequency equipment.

Background technique

With the development of science and technology, there are more and more high-frequency devices in electronic devices. Usually, these high-frequency devices are composed of several electronic components, and these electronic components are usually installed on the substrate. During the working process, especially in the working process of high-power high-frequency devices, the electronic components often generate a large amount of Heat, in order to dissipate heat better, most equipment uses copper substrates to install these electronic components, and some use cooling fans, but because high-frequency equipment is generally sealed tightly, the effect of cooling fans is not very good; there are also People use water-cooling to cool electronic components, but the existing water-cooling structure generally makes the substrate hollow, and then installs cooling water pipes in the substrate, which is very troublesome in the production of the substrate , Secondly, the cooling water pipeline needs to be connected by multiple pipelines, so that joints will be formed in the substrate, which poses a safety hazard.

Utility model content

In view of the above-mentioned deficiencies in the prior art, the purpose of the utility model is to provide a water-cooling structure for component mounting substrates of high-frequency equipment, which has a simpler structure and better cooling effect.

In order to achieve the above purpose, the technical solution adopted by the utility model is as follows: a water-cooled structure of a component mounting substrate of high-frequency equipment, including a substrate, is characterized in that: the substrate has a cooling water channel inside, and on one side of the substrate Water inlet and outlet with cooling water channels.

Further, the substrate is molded at one time through a mold. Processing is more convenient.

Further, the cooling water channel includes a water inlet channel and a water outlet channel, and the water inlet channel and the water outlet channel are connected through a connecting channel; both the water inlet channel and the water outlet channel are two, and the cooling effect is better.

Further, the water inlet and the water outlet are respectively threaded with connecting elbows. It is connected with the external connection through threads, which can withstand higher water pressure and is safer; at the same time, it is more convenient to connect with the external water pipe by using the connection elbow.

Further, the substrate is made of copper, which has a better heat dissipation effect.

Compared with the prior art, the utility model has the advantages of simple structure, the cooling water channel is directly formed in the base plate through the mold, the processing is convenient, there is no potential safety hazard, and the cooling effect is better.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is a cross-sectional view along line A-A of Fig. 1 .

Detailed ways

The utility model will be further described below in conjunction with accompanying drawings and embodiments.

Embodiment: Referring to Fig. 1 and Fig. 2, a water-cooled structure of a component mounting substrate of a high-frequency device includes a substrate 1, the substrate is made of copper, and the heat dissipation effect is better, and each electronic component 2 is installed on the substrate during use 1 on. There is a cooling water channel inside the base plate 1 , and a water inlet 4 and a water outlet 5 of the cooling water channel are provided on one side of the base plate 1 . The base plate 1 is molded at one time through a mold; a cooling water channel is directly formed in the base plate 1 through the mold, which is convenient to process, has no potential safety hazard, and has a good cooling effect. The cooling water channel includes a water inlet channel 31 and a water outlet channel 32, and the water inlet channel 31 and the water outlet channel 32 communicate with 33 through a connecting channel; the entire channel forms a U-shaped structure; during actual processing, it can also be used as required The cooling water channel is tortuous to increase the cooling area, thereby improving the cooling effect. Both the water inlet channel 31 and the water outlet channel 32 are two, and the cooling effect is better. The water inlet and the water outlet are respectively threaded with connection elbows, which are connected to the external connection through threads, can withstand higher water pressure, and are safer; at the same time, it is more convenient to use the connection elbow to connect with the external water pipe.

In the actual processing process, it is also possible to manually process and install the water-cooling structure of the substrate. First, use tools to process the connecting channels through the two ends of the substrate from one end to the other end of the substrate; then process the water inlet channel and the water outlet channel, and connect the water inlet channel and the water outlet channel with the connecting channel; finally, use a screw plug or a plug to close the two ends of the connecting channel; when in use, connect the water inlet and outlet of the water inlet channel and the water outlet channel The elbow is connected to the external water pipe through the connecting elbow.

The utility model can be widely applied to the heat dissipation structure of each circuit unit of high-frequency equipment, especially high-power high-frequency induction heating equipment, because the interior of high-power high-frequency induction heating equipment mainly includes inverter unit, thyristor unit and rectifier unit, etc. And these several parts are often the places with large heat generation, and are also places where failures are easy to occur. Therefore, the inverter unit, the thyristor unit and the rectifier unit can effectively dissipate heat and cool them by adopting the cooling structure of the utility model. When actually installing the components (modules) of the inverter unit, thyristor unit, and rectifier unit, the components (modules) are installed on the cooling water channel, which can further improve the cooling effect.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than limit the technical solutions. Although the applicant has described the utility model in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that, Those who make modifications or equivalent replacements to the technical solutions of the present invention without departing from the purpose and scope of the technical solutions shall be included in the scope of the claims of the present invention.

Claims (6)

1. A water-cooled structure of a component mounting substrate of a high-frequency device, comprising a substrate, characterized in that: a cooling water channel is provided in the substrate, and a water inlet and a water outlet of the cooling water channel are provided on one side of the substrate. 2. The water-cooling structure of the component mounting substrate of the high-frequency equipment according to claim 1, wherein the substrate is molded at one time by a mold. 3. The water-cooling structure of the component mounting substrate of the high-frequency equipment according to claim 1, wherein the cooling water channel includes a water inlet channel and a water outlet channel, and the water inlet channel and the water outlet channel are connected through a connecting channel . 4. The water-cooling structure of the component mounting substrate of the high-frequency equipment according to claim 3, wherein there are two water inlet channels and two water outlet channels. 5. The water-cooling structure of the component mounting substrate of the high-frequency equipment according to claim 1, characterized in that: the water inlet and the water outlet are respectively screw-connected with connecting elbows. 6. The water cooling structure of the component mounting substrate of the high-frequency equipment according to claim 1, wherein the substrate is made of copper.

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