CN205082111U - Copper sheet external connection conduction type chip heat radiation structure - Google Patents
Copper sheet external connection conduction type chip heat radiation structure Download PDFInfo
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- CN205082111U CN205082111U CN201520719747.2U CN201520719747U CN205082111U CN 205082111 U CN205082111 U CN 205082111U CN 201520719747 U CN201520719747 U CN 201520719747U CN 205082111 U CN205082111 U CN 205082111U
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- heat
- copper sheet
- sheet
- heat dissipation
- heat conduction
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 32
- 239000010949 copper Substances 0.000 title claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 230000005855 radiation Effects 0.000 title abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 239000004519 grease Substances 0.000 claims abstract description 8
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 5
- 210000005069 ears Anatomy 0.000 claims description 3
- 150000001879 copper Chemical class 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及一种铜片外接传导式芯片散热结构。The utility model relates to a heat dissipation structure of a conductive chip externally connected to a copper sheet.
背景技术Background technique
常规的芯片上加铝片及风扇的散热方式相对较占空间，即需要产品有足够的内部空间。另外，风扇的启动会产生噪音，对于大多数有噪音要求的产品并不适用。并且产品上还需要设置进风口及排风口，散热效果一般，结构上亦相对复杂。Conventional heat dissipation methods of adding aluminum sheets and fans on the chip are relatively space-consuming, that is, the product needs to have sufficient internal space. In addition, the start of the fan will generate noise, which is not suitable for most products with noise requirements. In addition, the product also needs to be equipped with air inlets and exhaust outlets, the heat dissipation effect is average, and the structure is relatively complicated.
发明内容Contents of the invention
本实用新型所要解决的技术问题是提供一种结构及安装简便，不需要设置风口，不会产生噪音，并且导热铝片直接与空气接触，散热效果非常理想的铜片外接传导式芯片散热结构。The technical problem to be solved by the utility model is to provide a structure and easy installation, no need to set the tuyere, no noise, and the heat conduction aluminum sheet directly contacts with the air, and the heat dissipation effect is very ideal.
本实用新型是通过以下技术方案来实现的：一种铜片外接传导式芯片散热结构，包括PCB主板，所述PCB主板贴附有导热铜片，所述导热铜片的底部及PCB主板的上端涂有导热硅脂，导热铜片通过导热硅脂固定贴紧于PCB主板上，所述PCB主板的两端各安装一散热铝片，所述导热铜片的两端各设置一连接耳。The utility model is realized through the following technical solutions: a heat dissipation structure of a conductive chip externally connected to a copper sheet, including a PCB main board, the PCB main board is attached with a heat-conducting copper sheet, the bottom of the heat-conducting copper sheet and the upper end of the PCB main board Coated with heat-conducting silicone grease, the heat-conducting copper sheet is fixed and tightly attached to the PCB main board through the heat-conducting silicon grease, a heat-dissipating aluminum sheet is installed at both ends of the PCB main board, and a connecting ear is respectively arranged at both ends of the heat-conducting copper sheet.
作为优选的技术方案，所述连接耳上均开设有两个第一螺孔，所述散热铝片安装于连接耳的下端面，正对第一螺孔的散热铝片上开设有两个第二螺孔。As a preferred technical solution, two first screw holes are opened on the connecting ears, the heat dissipation aluminum sheet is installed on the lower end surface of the connecting ear, and two second screw holes are opened on the heat dissipation aluminum sheet facing the first screw holes. screw holes.
作为优选的技术方案，所述第一螺孔与第二螺孔设置有螺丝，所述导热铜片与散热铝片间通过螺丝锁紧连接。As a preferred technical solution, the first screw hole and the second screw hole are provided with screws, and the heat-conducting copper sheet and the heat-dissipating aluminum sheet are locked and connected by screws.
作为优选的技术方案，所述导热铜片的材质为紫铜。As a preferred technical solution, the heat-conducting copper sheet is made of red copper.
本实用新型的有益效果是：本实用新型与现有技术相比，结构及安装简便，不需要设置风口，不会产生噪音，并且导热铝片直接与空气接触，散热效果非常理想。The beneficial effects of the utility model are: compared with the prior art, the utility model has a simple structure and installation, does not need to be provided with a tuyere, does not generate noise, and the heat-conducting aluminum sheet is directly in contact with the air, so the heat dissipation effect is very ideal.
附图说明Description of drawings
为了更清楚地说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1为本实用新型的整体结构示意图。Figure 1 is a schematic diagram of the overall structure of the utility model.
具体实施方式detailed description
本说明书中公开的所有特征，或公开的所有方法或过程中的步骤，除了互相排斥的特征和/或步骤以外，均可以以任何方式组合。All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and/or steps.
本说明书(包括任何附加权利要求、摘要和附图)中公开的任一特征，除非特别叙述，均可被其他等效或具有类似目的的替代特征加以替换。即，除非特别叙述，每个特征只是一系列等效或类似特征中的一个例子而已。Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.
如图1所示，本实用新型的种铜片外接传导式芯片散热结构，包括导热铜片10、散热铝片30、导热硅脂，将导热硅脂均匀的涂抹在导热铜片10的底部，将导热铜片10固定贴紧在PCB主板20上，然后将导热铜片10通过机牙螺丝与散热铝片30连接固定在一起。保证散热铝片30在产品上可外露于空气中。这样当芯片工作时，PCB主板20上的热量通过导热铜片10传导至散热铝片30，通过与空气的热量交换最终达到芯片散热的目的。As shown in Figure 1, the heat dissipation structure of the copper sheet externally connected to the conductive chip of the present utility model includes a heat-conducting copper sheet 10, a heat-dissipating aluminum sheet 30, and a heat-conducting silicon grease, and the heat-conducting silicon grease is evenly applied to the bottom of the heat-conducting copper sheet 10, Fix the heat-conducting copper sheet 10 on the PCB main board 20, and then connect and fix the heat-conducting copper sheet 10 with the heat-dissipating aluminum sheet 30 through machine teeth screws. Ensure that the heat dissipation aluminum sheet 30 can be exposed to the air on the product. In this way, when the chip is working, the heat on the PCB main board 20 is conducted to the heat-dissipating aluminum sheet 30 through the heat-conducting copper sheet 10, and finally achieves the purpose of chip heat dissipation through heat exchange with the air.
本实用新型的有益效果是：本实用新型与现有技术相比，结构及安装简便，不需要设置风口，不会产生噪音，并且导热铝片直接与空气接触，散热效果非常理想。The beneficial effects of the utility model are: compared with the prior art, the utility model has a simple structure and installation, does not need to be provided with a tuyere, does not generate noise, and the heat-conducting aluminum sheet is directly in contact with the air, so the heat dissipation effect is very ideal.
以上所述，仅为本实用新型的具体实施方式，但本实用新型的保护范围并不局限于此，任何不经过创造性劳动想到的变化或替换，都应涵盖在本实用新型的保护范围之内。因此，本实用新型的保护范围应该以权利要求书所限定的保护范围为准。The above is only a specific embodiment of the utility model, but the scope of protection of the utility model is not limited thereto, and any change or replacement that is not thought of through creative work should be covered within the scope of protection of the utility model . Therefore, the protection scope of the present utility model should be determined by the protection scope defined in the claims.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520719747.2U CN205082111U (en) | 2015-09-17 | 2015-09-17 | Copper sheet external connection conduction type chip heat radiation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520719747.2U CN205082111U (en) | 2015-09-17 | 2015-09-17 | Copper sheet external connection conduction type chip heat radiation structure |
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| Publication Number | Publication Date |
|---|---|
| CN205082111U true CN205082111U (en) | 2016-03-09 |
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| CN201520719747.2U Active CN205082111U (en) | 2015-09-17 | 2015-09-17 | Copper sheet external connection conduction type chip heat radiation structure |
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| CN (1) | CN205082111U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170195A (en) * | 2016-08-23 | 2016-11-30 | 深圳市优必选科技有限公司 | Electronic device |
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- 2015-09-17 CN CN201520719747.2U patent/CN205082111U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170195A (en) * | 2016-08-23 | 2016-11-30 | 深圳市优必选科技有限公司 | Electronic device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, 10th floor, Building A2, Lilang International Jewelry Industry Park, No. 31 Bulan Road, Longgang District, Shenzhen, Guangdong Province Patentee after: Shenzhen UBTECH Technology Co.,Ltd. Address before: 518000, 10th floor, Building A2, Lilang International Jewelry Industry Park, No. 31 Bulan Road, Longgang District, Shenzhen, Guangdong Province Patentee before: Shenzhen UBTECH Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231212 Address after: Room 601, 6th Floor, Building 13, No. 3 Jinghai Fifth Road, Beijing Economic and Technological Development Zone (Tongzhou), Tongzhou District, Beijing, 100176 Patentee after: Beijing Youbixuan Intelligent Robot Co.,Ltd. Address before: 518000, 10th floor, Building A2, Lilang International Jewelry Industry Park, No. 31 Bulan Road, Longgang District, Shenzhen, Guangdong Province Patentee before: Shenzhen UBTECH Technology Co.,Ltd. |