CN202084018U - touch panel - Google Patents

Abstract

An embodiment of the present invention provides a touch panel, comprising: a transparent substrate, comprising a sensing area and a peripheral area; a plurality of transparent bridge lines, partially covering the sensing area; an insulating layer, partially covering the transparent bridge line; a plurality of metal lines, partially covering the peripheral area; and a transparent conductive layer, at least covering the transparent bridge line and the metal line, the transparent conductive layer comprising a plurality of first units, a plurality of second units and a plurality of connecting lines, the plurality of first units and the plurality of second units are arranged in a staggered manner, the connecting line connects two adjacent second units, the transparent bridge line connects two adjacent first units, and the plurality of metal lines are connected to the first unit or the second unit adjacent to the peripheral area. The touch panel of the present invention avoids oxidation and scratching of the metal lines by setting a transparent conductive layer to cover the metal lines.

Description

touch panel

technical field

The utility model relates to a touch panel, in particular to a touch panel which uses a high-hardness metal compound to cover metal wires, so as to avoid the problem of oxidation of the metal wires and the problem of scratching of the metal wires. the

Background technique

Touch panels have been widely used in fields such as household products, communication devices, and electronic information devices. Usually, touch panels are applied as input interfaces of personal digital assistants (PDAs), electronic products, and game consoles. The current trend of integration of touch panels and display screens allows users to select representative icons displayed on the panel with fingers or stylus, so that personal digital assistants, electronic products and game consoles can perform favorite functions. This kind of touch panel is also applied to the public information inquiry system, which can provide the public with an efficient operating system. the

The traditional touch panel includes a transparent substrate, and the transparent substrate has a surface composed of a plurality of sensing areas, and the distributed sensing areas are used to sense signals caused by a user's touch with a finger or a stylus to perform input or control. The sensing area is made of a transparent conductive film, such as indium tin oxide (ITO), and the user can effectively operate the device by touching the corresponding transparent conductive film displayed on a specific position on the display screen. the

In order to effectively detect the correct position where the user touches the panel with a finger or a stylus, many touch panel technologies have been developed. FIG. 1 illustrates a conventional touch panel 200 , and FIG. 2 is a cross-sectional view along line 1 - 1 in FIG. 1 . The touch panel 200 includes a transparent substrate 201 , a first transparent conductive layer 203 , an insulating layer 209 and a second transparent conductive layer 211 . The first transparent conductive layer 203 is patterned and formed on the transparent substrate 201 by a photoetching process, and includes a plurality of first units 205 and a plurality of first wires 207 connected to the first units 205 aligned in the longitudinal direction. The insulating layer 209 covers the first transparent conductive layer 203 and the substrate 201 . The patterned second transparent conductive layer 211 is formed on the insulating layer 209 and includes a plurality of second electrode units 213 and a plurality of second wires 215 connected to the second units 213 aligned in the lateral direction. the

The touch panel 200 also has a plurality of metal wires 217, which are arranged on one side of the insulating layer 209, and through the plurality of metal wires 217, each lateral connection of the second unit 213 can be turned to the plurality of the metal wires 217. the confluence end. The first transparent conductive layer 203 and the second transparent conductive layer 211 cover the substrate 201 , and the insulating layer 209 covers the entire area of the substrate 201 . the

However, the metal wire 217 is prone to oxidation by reacting with oxygen in the air, thereby increasing resistance; in order to avoid the oxidation problem of the metal wire 217, the prior art must coat a protective layer (not shown) on the surface of the metal wire 217 In the figure), the metal wire 217 is isolated from the air and avoids scratches. However, in addition to increasing the manufacturing cost, the protective layer also absorbs light, thus resulting in poor light transmittance. Therefore, there is a need in the market for a touch panel capable of overcoming the above-mentioned shortcomings of existing touch panels. the

Contents of the invention

The utility model provides a touch panel to avoid the problem of oxidation of metal wires and the problem of scratching of metal wires. the

An embodiment of the present invention provides a touch panel, comprising: a transparent substrate including a sensing area and a peripheral area; a plurality of transparent bridging wires partially covering the sensing area; an insulating layer partially covering the sensing area Transparent bridging lines; a plurality of metal lines partially covering the peripheral area; and a transparent conductive layer covering at least the transparent bridging lines and the metal lines, the transparent conductive layer comprising a plurality of first units, a plurality of second units and a plurality of a connection line, the plurality of first units and the plurality of second units are arranged alternately, the connection line connects two adjacent second units, and the transparent bridging line connects two adjacent first units, so The plurality of metal lines are connected to the first unit or the second unit adjacent to the peripheral area. the

Further, the transparent conductive layer directly covers the metal wire. the

Further, the insulating layer includes:

a first insulating region partially covering the transparent bridging line; and

A second insulating region partially covers the metal line. the

Further, the transparent conductive layer is disposed on the second insulating region on the metal line. the

Further, each bridging line connects the shortest path between two adjacent first units. the

Further, the bridging lines are conductive oxide lines or metal lines. the

Further, the transparent conductive layer is a metal compound layer. the

Further, the transparent substrate is a glass plate or a transparent polymer plate. the

Another embodiment of the present invention provides a touch panel, including: a transparent substrate, including a sensing area and a peripheral area; a metal layer, including a plurality of first metal wires partially covering the sensing area; a plurality of second metal lines partially covering the peripheral area; an insulating layer partially covering the first metal lines; and a transparent conductive layer partially covering the first metal lines and the second metal lines, the transparent conductive layer comprising A plurality of first units, a plurality of second units, and a plurality of connection lines, the plurality of first units and the plurality of second units are arranged alternately, the connection line connects two adjacent second units, the first A metal line connects two adjacent first units, and the plurality of second metal lines are connected to the first unit or the second unit adjacent to the peripheral area. the

Further, the transparent conductive layer directly covers the second metal wire. the

Further, the insulating layer includes:

a first insulating region partially covering the first metal line; and

A second insulating region partially covers the second metal line. the

Further, the transparent conductive layer is disposed on the second insulating region of the second metal line. the

Further, each connecting line connects the shortest path between two adjacent second units. the

Further, the connecting wire is a conductive oxide wire or a metal wire. the

Further, the transparent conductive layer is a metal compound layer. the

Further, the transparent substrate is a glass plate or a transparent polymer plate. the

The touch panel of the present invention covers the metal wires with a transparent conductive layer, so as to avoid the oxidation of the metal wires and the scratching of the metal wires. the

The technical features and advantages of the present invention have been broadly summarized above, so that the following detailed description of the present invention can be better understood. Other technical features and advantages constituting the subject of the patent application scope of the present utility model will be described below. Those skilled in the technical field of the present invention should understand that the concepts and specific embodiments disclosed below can be used to modify or design other structures or processes to achieve the same purpose as the present invention. Those with ordinary knowledge in the technical field to which the utility model belongs should also understand that this type of equivalent construction cannot depart from the spirit and scope of the utility model defined by the appended claims. the

Description of drawings

Fig. 1 illustrates an existing touch panel;

Fig. 2 is a sectional view along line 1-1 in Fig. 1;

3 to 6 are top views illustrating a method for manufacturing a touch panel according to an embodiment of the present invention;

Fig. 7 is an embodiment along the sectional view of line 2-2 in Fig. 6;

Fig. 8 is an embodiment along the sectional view of line 3-3 in Fig. 6;

Fig. 9 is another embodiment along the sectional view of line 3-3 in Fig. 6;

Fig. 10 is another embodiment along the sectional view of line 3-3 in Fig. 6;

11 to 14 are top views illustrating a method for manufacturing a touch panel according to another embodiment of the present invention;

Fig. 15 is an embodiment along the sectional view of line 4-4 in Fig. 14;

Fig. 16 is an embodiment along the sectional view of line 5-5 in Fig. 14;

Fig. 17 is another embodiment of the sectional view along line 5-5 in Fig. 14;

Fig. 18 is another embodiment of the sectional view along line 5-5 in Fig. 14;

Fig. 19 is another embodiment of the sectional view along line 5-5 in Fig. 14;

20 to 22 are top views illustrating a method for manufacturing a touch panel according to another embodiment of the present invention;

Figure 23 is a sectional view along line 6-6 in Figure 22;

Figure 24 is a sectional view along line 7-7 in Figure 22; and

Fig. 25 is another embodiment of a cross-sectional view taken along line 7-7 in Fig. 22 . the

Detailed ways

FIG. 3 to FIG. 6 are top views illustrating a method for manufacturing the touch panel 10 according to an embodiment of the present invention. Referring to FIG. 3 , firstly, a transparent substrate 11 is provided, which includes a sensing area 13 and a peripheral area 15 . In an embodiment of the present invention, the material of the transparent substrate 11 is glass or a transparent polymer plate, such as polycarbonate (PC) and polyvinyl chloride (PVC). Afterwards, a plurality of transparent bridging lines 17 are formed, which partially cover the sensing region 13 . In an embodiment of the present invention, the plurality of transparent bridging lines 17 are formed by an optical etching process, and the material thereof is a conductive oxide, such as indium tin oxide (ITO), aluminum zinc oxide (AZO) or indium oxide Zinc (IZO), or metal. The optical etching process includes sputtering, coating, exposing, soft baking, hard baking, developing, baking and other steps. the

Referring to FIG. 4 , an insulating layer 18 is formed, which includes a plurality of insulating regions 19 , each partially covering the transparent bridge line 17 . In an embodiment of the present invention, the plurality of insulating regions 19 are formed by an optical etching process, and respectively partially cover the plurality of bridge lines 17, the optical etching process includes sputtering, coating, exposure, Soft bake, hard bake, developing, baking and other steps. In an embodiment of the present invention, the opposite ends of each bridging line 17 are not covered by the insulating region 19, and the material of the insulating region 19 is a transparent polymer material, such as a photoresist material. the

Referring to FIG. 5 , a plurality of metal lines 21 are formed partially covering the peripheral region 15 . In an embodiment of the present invention, the plurality of metal lines 21 are formed by an optical etching process, the optical etching process includes sputtering, coating, exposure, soft baking, hard baking, developing, baking and other steps. the

Referring to FIG. 6, a transparent conductive layer 30 is formed to at least cover the transparent bridge line 17 and the metal line 21. The transparent conductive layer 30 includes a plurality of first units 31, a plurality of second units 35, and a plurality of first connection lines. 33 and a plurality of second connection lines 37, the plurality of first units 31 and the plurality of second units 35 are arranged in a staggered manner, the first connection line 33 connects two adjacent second units 35, the transparent The bridge line 17 connects two adjacent first units 31, the plurality of metal lines 21 are connected to the first unit 31 or the second unit 35 adjacent to the peripheral area 15, and the plurality of second connection lines 37 covers the plurality of metal wires 21 . the

In an embodiment of the present invention, each of the transparent bridging lines 17 is the shortest path connecting two adjacent first units 31 . In an embodiment of the present invention, the material of the transparent conductive layer 30 is a metal compound, such as indium tin oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO). The optical etching process includes sputtering, coating, exposing, soft baking, hard baking, developing, baking and other steps. The material of the transparent substrate 31 is glass or a transparent polymer plate, such as polycarbonate (PC) and polyvinyl chloride (PVC). the

Fig. 7 is a cross-sectional view along line 2-2 in Fig. 6, and Fig. 8 is an embodiment of a cross-sectional view along line 3-3 in Fig. 6 . Referring to FIG. 7 , the transparent bridging line 17 and the plurality of first connecting lines 33 are isolated from each other by the insulating region 19 . Referring to FIG. 8 , the transparent conductive layer 30 covers the plurality of metal lines 21 . The utility model uses the second connecting line 37 of the transparent conductive layer 30 to cover the metal wire 21, and the transparent conductive layer 30 is a metal compound, which is not easily oxidized; in addition, the hardness of the transparent conductive layer 30 is higher than that of the metal wire 21. Hardness, not easy to be scratched. the

FIG. 9 is another embodiment of a cross-sectional view taken along line 3-3 in FIG. 6 . Compared with the embodiment of FIG. 8, the metal line 21 is directly formed on the transparent substrate 11; in the embodiment of FIG. 9, the transparent bridge line 17 is directly formed on the transparent substrate 11, and the metal line 21 is directly formed on the transparent bridging lines 17 . In a word, the embodiments of Fig. 8 and Fig. 9 all use the second connection line 37 of the transparent conductive layer 30 to cover the metal line 21, and the transparent conductive layer 30 is a metal compound, which is not easily oxidized; in addition, the hardness of the transparent conductive layer 30 The hardness is higher than that of the metal wire 21 and is not easy to be scratched. the

Fig. 10 is another embodiment of the cross-sectional view taken along line 3-3 in Fig. 6 . Compared with the embodiment of FIG. 8, the metal line 21 is directly formed on the transparent substrate 11; the embodiment of FIG. The area 19 covers the transparent bridging line 17 , and the metal line 21 is directly formed on the insulating area 19 . In a word, the embodiments of Fig. 8 and Fig. 10 all use the second connection line 37 of the transparent conductive layer 30 to cover the metal line 21, and the transparent conductive layer 30 is a metal compound, which is not easily oxidized; in addition, the hardness of the transparent conductive layer 30 The hardness is higher than that of the metal wire 21 and is not easy to be scratched. the

The existing metal wires are easily oxidized due to the reaction with oxygen in the air, and a protective layer must be coated on the surface of the metal wires; on the contrary, the utility model uses the transparent conductive layer 30 to cover the plurality of metal wires 21 can omit the need to coat a protective layer on the surface of the metal wire in the prior art, but still avoid the problems of metal wire oxidation and scratches. the

FIG. 11 to FIG. 14 are top views illustrating a method of manufacturing a touch panel 60 according to another embodiment of the present invention. Referring to FIG. 11 , firstly, a transparent substrate 61 is provided, which includes a sensing region 63 and a peripheral region 65 . In an embodiment of the present invention, the material of the transparent substrate 61 is glass or a transparent polymer plate, such as polycarbonate (PC) and polyvinyl chloride (PVC). After that, a plurality of transparent bridging lines 67 partially covering the sensing area 63 are formed. In an embodiment of the present invention, the plurality of transparent bridging lines 67 are formed by a photoetching process, and the material is a conductive oxide, such as indium tin oxide (ITO), aluminum zinc oxide (AZO) or oxide Indium Zinc (IZO). The optical etching process includes sputtering, coating, exposing, soft baking, hard baking, developing, baking and other steps. the

Referring to FIG. 12 , a plurality of metal lines 69 partially covering the peripheral region 65 are formed. In an embodiment of the present invention, the plurality of metal lines 69 are formed by an optical etching process. The optical etching process includes sputtering, coating, exposing, soft baking, hard baking, developing, baking and other steps. the

Referring to FIG. 13 , an insulating layer 70 is formed, including a plurality of first insulating regions 71 and second insulating regions 73. The first insulating regions 71 partially cover the transparent bridge lines 67, and the second insulating regions 73 partially cover the metal lines. 69. In an embodiment of the present utility model, the insulating layer 70 is formed by an optical etching process, and the opposite ends of each bridge line 67 are not covered by the insulating layer 70, and the material of the insulating layer 70 is A transparent polymer material, such as photoresist material. the

Referring to FIG. 14, a transparent conductive layer 80 is formed to at least cover the transparent bridge line 67 and the metal line 69. The transparent conductive layer 80 includes a plurality of first units 81, a plurality of second units 85, and a plurality of first connection lines. 83 and a plurality of second connection lines 87, the plurality of first units 81 and the plurality of second units 85 are arranged in a staggered manner, the first connection line 83 connects two adjacent second units 85, the transparent The bridge line 67 connects two adjacent first units 81, the plurality of metal lines 69 are connected to the first unit 81 or the second unit 85 adjacent to the peripheral area 65, and the plurality of second connection lines 87 covers the plurality of metal lines 69 . The first connection line 83 connects the shortest path between two adjacent second units 85 . the

In an embodiment of the present invention, each of the bridging lines 67 is the shortest path connecting two adjacent first units 81 . In an embodiment of the present invention, the material of the transparent conductive layer 80 is a metal compound, such as indium tin oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO). The optical etching process includes sputtering, coating, exposing, soft baking, hard baking, developing, baking and other steps. the

Fig. 15 is a cross-sectional view along line 4-4 in Fig. 14, and Fig. 16 is a cross-sectional view along line 5-5 in Fig. 14 . Referring to FIG. 15 , the transparent bridge line 67 and the plurality of first connection lines 83 are isolated from each other by the first insulating region 71 . Referring to FIG. 16 , in an embodiment of the present invention, the plurality of second connection lines 87 of the transparent conductive layer 80 cover the plurality of metal lines 69 . The utility model uses the second connection wire 87 of the transparent conductive layer 80 to cover the metal wire 69, and the transparent conductive layer 80 is a metal compound, which is not easily oxidized; in addition, the hardness of the transparent conductive layer 80 is higher than that of the metal wire 69 Hardness, not easy to be scratched. the

Fig. 17 is another embodiment of a cross-sectional view taken along line 5-5 in Fig. 14 . Compared with the embodiment of FIG. 16 , the metal wire 69 is directly formed on the transparent substrate 61 and the metal wire 69 is covered with the insulating region 73 of the insulating layer 70 , and then the plurality of second transparent conductive layers 80 The connection wires 87 are formed on the insulating region 73; in the embodiment of FIG. on metal wire 69. the

Fig. 18 is another embodiment of a cross-sectional view taken along line 5-5 in Fig. 14 . Compared with the embodiment of FIG. 16 , the metal wire 69 is directly formed on the transparent substrate 61 and the metal wire 69 is covered with the insulating region 73 of the insulating layer 70 , and then the plurality of second transparent conductive layers 80 The connection line 87 is formed on the insulating region 73; the embodiment of FIG. 18 forms the transparent bridge line 67 on the transparent substrate 61, and forms the metal line 69 on the transparent bridge line 67, and then the transparent A plurality of second connection lines 87 of the conductive layer 80 are formed on the metal line 69 . the

Fig. 19 is another embodiment of a cross-sectional view taken along line 5-5 in Fig. 14 . Compared with the embodiment of FIG. 16 , the metal wire 69 is directly formed on the transparent substrate 61 and the metal wire 69 is covered with the insulating region 73 of the insulating layer 70, and then the plurality of second transparent conductive layers 80 The connection line 87 is formed on the insulating region 73; the embodiment of FIG. An insulating region 73 of layer 70 covers the metal line 69 , and a plurality of second connection lines 87 of the transparent conductive layer 80 are formed on the insulating region 73 . the

In a word, the embodiments of FIG. 16 to FIG. 19 all use a plurality of second connection lines 87 of the transparent conductive layer 80 to cover the metal line 69, and the transparent conductive layer 80 is a metal compound, which is not easily oxidized; in addition, the transparent conductive layer 80 The hardness is higher than that of the metal wire 69, so it is not easy to be scratched. The existing metal wires are easily oxidized due to the reaction with oxygen in the air, so a protective layer must be coated on the surface of the metal wires; on the contrary, the utility model uses the transparent conductive layer 80 to cover the plurality of metal wires 71 can omit the need to coat a protective layer on the surface of the metal wire in the prior art, but still avoid the problems of oxidation and scratching of the metal wire. the

FIG. 20 to FIG. 22 are top views illustrating a method for manufacturing a touch panel 100 according to another embodiment of the present invention. Referring to FIG. 20 , firstly, a transparent substrate 101 is provided, which includes a sensing region 103 and a peripheral region 105 . In an embodiment of the present invention, the material of the transparent substrate 101 is glass or a transparent polymer plate, such as polycarbonate (PC) and polyvinyl chloride (PVC). After that, a metal layer 110 is formed, including a plurality of first metal lines 107 partially covering the sensing area 103 and a plurality of second metal lines 109 partially covering the peripheral area 105 . In an embodiment of the present invention, the metal layer 110 is formed by an optical etching process, including sputtering, coating, exposure, soft baking, hard baking, developing, baking and other steps. the

Referring to FIG. 21, an insulating layer 120 is formed, including a plurality of first insulating regions 121 and second insulating regions 123. The first insulating region 121 partially covers the first metal line 107, and the second insulating region 123 partially covers the first insulating region 123. Two metal wires 109 . In an embodiment of the present invention, the insulating layer 120 is formed by an optical etching process, and the opposite ends of each first metal line 107 are not covered by the insulating layer 120, the insulating layer 120 The material is a transparent polymer material, such as photoresist material. the

Referring to FIG. 22 , a transparent conductive layer 130 is formed to at least cover the first metal line 107 and the second metal line 109 . In an embodiment of the present utility model, the transparent conductive layer 130 includes a plurality of first units 131, a plurality of second units 135, a plurality of first connection lines 133 and a plurality of second connection lines 137, the plurality of The first unit 131 and the plurality of second units 135 are arranged in a staggered manner, the first connecting line 133 connects two adjacent second units 135, and the first metal line 107 connects two adjacent first units 131 , the plurality of second metal lines 109 are connected to the first unit 131 or the second unit 135 adjacent to the peripheral region 105 , and the plurality of second connection lines 137 cover the plurality of metal lines 109 . the

In an embodiment of the present invention, each of the first metal lines 107 connects the shortest path between two adjacent first units 131 . In an embodiment of the present invention, the material of the transparent conductive layer 130 is a metal compound, such as indium tin oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO). The optical etching process includes sputtering, coating, exposing, soft baking, hard baking, developing, baking and other steps. the

Fig. 23 is a cross-sectional view along line 6-6 in Fig. 22, and Fig. 24 is a cross-sectional view along line 7-7 in Fig. 22 . Referring to FIG. 23 , the first metal line 107 and the first connection line 133 are isolated from each other by the first insulating region 121 . Referring to FIG. 24 , the second connection lines 137 of the transparent conductive layer 130 cover the plurality of metal lines 109 . The utility model uses the second connection line 137 of the transparent conductive layer 130 to cover the metal wire 106, and the transparent conductive layer 130 is a metal compound, which is not easily oxidized; in addition, the hardness of the transparent conductive layer 130 is higher than that of the metal wire 109 Hardness, not easy to be scratched. the

Fig. 25 is another embodiment of a cross-sectional view taken along line 7-7 in Fig. 22 . Compared with the embodiment of FIG. 24 , the metal line 109 is directly formed on the transparent substrate 101 and the metal line 109 is covered with the insulating region 123 of the insulating layer 120 , and then the plurality of second connections of the transparent conductive layer 130 Lines 137 are formed on the insulating region 123; after the embodiment of FIG. 25 forms the metal lines 109 on the transparent substrate 101, a plurality of second connection lines 137 of the transparent conductive layer 130 are directly formed on the metal lines. 109 on. the

The existing metal wires are easily oxidized due to the reaction with oxygen in the air, so a protective layer must be coated on the surface of the metal wires; on the contrary, the utility model uses the transparent conductive layer 130 to cover the plurality of metal wires 109 can omit the need to coat a protective layer on the surface of the metal wire in the prior art, but still avoid the problems of metal wire oxidation and scratches. the

The technical content and technical characteristics of the present utility model have been disclosed as above, but those with ordinary knowledge in the technical field of the utility model should understand that within the spirit and scope of the utility model defined by the appended patent scope, the utility model The teachings and disclosures are subject to various substitutions and modifications. For example, many of the processes disclosed above could be performed differently or replaced by other processes, or a combination of both. the

In addition, the scope of rights in this case is not limited to the processes, machines, manufacturing, material components, devices, methods or steps of the specific embodiments disclosed above. Those with ordinary knowledge in the technical field to which this utility model belongs should understand that, based on the teachings and disclosures of this utility model, processes, machines, manufacturing, material components, devices, methods or steps, whether they exist now or will be developed in the future, they are not related to this case Embodiments disclosed by those who perform substantially the same functions in substantially the same manner and achieve substantially the same results can also be used in the present invention. Therefore, the scope of claims below is intended to cover components, devices, methods or steps used in such processes, machines, manufacture, and substances. the

Claims (16)

1. a contact panel is characterized in that, this contact panel comprises:

One transparency carrier comprises a sensing region and an outer peripheral areas;

A plurality of transparent bridging lines, local this sensing region that covers;

One insulation course, local this transparent bridging line that covers;

A plurality of metal wires, local this outer peripheral areas that covers; And

One transparency conducting layer, at least cover this transparent bridging line and this metal wire, this transparency conducting layer comprises a plurality of first modules, a plurality of Unit second and a plurality of connecting line, described a plurality of first module and described a plurality of second unit alternative arrangement, this connecting line connects two these adjacent Unit second, this transparent bridging line connects two these adjacent first modules, and described a plurality of metal wires are connected in this first module or this Unit second of contiguous this outer peripheral areas.

2. contact panel as claimed in claim 1 is characterized in that: this transparency conducting layer directly covers this metal wire.

3. contact panel as claimed in claim 1 is characterized in that: this insulation course comprises:

One first insulating regions, local this transparent bridging line that covers; And

One second insulating regions, local this metal wire that covers.

4. contact panel as claimed in claim 3 is characterized in that: this transparency conducting layer is arranged on this second insulating regions on this metal wire.

5. contact panel as claimed in claim 1 is characterized in that: respectively this bridging line is to be connected the shortest path between two adjacent these first modules.

6. contact panel as claimed in claim 1 is characterized in that: this bridging line is conductive oxide line or metal wire.

7. contact panel as claimed in claim 1 is characterized in that: this transparency conducting layer is a metal compound layer.

8. contact panel as claimed in claim 1 is characterized in that: this transparency carrier is glass plate or transparent polymer sheet material.

9. a contact panel is characterized in that, this contact panel comprises:

One transparency carrier comprises a sensing region and an outer peripheral areas;

One metal level comprises a plurality of local first metal wire and a plurality of local second metal wires that cover this outer peripheral areas that cover this sensing region;

One insulation course, local this first metal wire that covers; And

One transparency conducting layer, local this first metal wire and this second metal wire of covering, this transparency conducting layer comprises a plurality of first modules, a plurality of Unit second and a plurality of connecting line, described a plurality of first module and described a plurality of second unit alternative arrangement, this connecting line connects two these adjacent Unit second, this first metal wire connects two these adjacent first modules, and described a plurality of second metal wires are connected in this first module or this Unit second of contiguous this outer peripheral areas.

10. contact panel as claimed in claim 9 is characterized in that: this transparency conducting layer directly covers this second metal wire.

11. contact panel as claimed in claim 9 is characterized in that: this insulation course comprises:

One first insulating regions, local this first metal wire that covers; And

One second insulating regions, local this second metal wire that covers.

12. contact panel as claimed in claim 11 is characterized in that: this transparency conducting layer is arranged on this second insulating regions on this second metal wire.

13. contact panel as claimed in claim 9 is characterized in that: respectively this connecting line is to be connected the shortest path between two adjacent these Unit second.

14. contact panel as claimed in claim 9 is characterized in that: this connecting line is conductive oxide line or metal wire.

15. contact panel as claimed in claim 9 is characterized in that: this transparency conducting layer is a metal compound layer.

16. contact panel as claimed in claim 9 is characterized in that: this transparency carrier is glass plate or transparent polymer sheet material.

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