CN201483358U - Mechanical arm used for polishing pad adjusting device - Google Patents
Mechanical arm used for polishing pad adjusting device Download PDFInfo
- Publication number
- CN201483358U CN201483358U CN2009202084858U CN200920208485U CN201483358U CN 201483358 U CN201483358 U CN 201483358U CN 2009202084858 U CN2009202084858 U CN 2009202084858U CN 200920208485 U CN200920208485 U CN 200920208485U CN 201483358 U CN201483358 U CN 201483358U
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- Prior art keywords
- adjusting device
- polishing pad
- mechanical arm
- roof
- pad adjusting
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Abstract
The utility model discloses a mechanical arm used for a polishing pad adjusting device, which comprises a shell and a transmission device arranged in the shell, wherein the shell comprises a base plate and a cover matched with the base plate; the cover comprises at least one top wall and a side wall which is formed by extending downwards along the edge of the top wall, wherein an inclined angle is formed between the top wall and the horizontal direction; the inclined top wall leads deionized water to easily flow in the surface thereof, can effectively remove polishing liquid or other particles on the top wall, guarantees the deionized water not to remain on the top wall, prevents pollutants from being formed on the surface of the top wall, can improve the stability of chemical and mechanical polishing process, and further improves the yield of products.
Description
Technical field
The utility model relates to integrated circuit and makes the field, relates in particular to a kind of mechanical arm that is used for polishing pad adjusting device.
Background technology
Along with dimensions of semiconductor devices reduces day by day, because multilayer interconnection or the bigger deposition process of filling depth ratio have caused the excessive fluctuating of wafer surface, cause the difficulty that photoetching process focuses on, feasible control ability to live width weakens, reduced the uniformity of live width on the entire wafer, therefore, industry has been introduced cmp (Chemical Mechanical Polishing CMP) has been come the planarization wafer surface.
The cmp processing procedure is that wafer surface is contacted with the lapped face of grinding pad, then, by the relative motion between wafer surface and the described lapped face with described wafer surface planarization.Therefore, the flatness of the lapped face of grinding pad is vital for the cmp processing procedure.At present, industry utilizes the polishing pad adjusting device (Pad Conditioner) of chemical-mechanical grinding device to adjust the flatness of the lapped face of grinding pad usually, so that the formation state of lapped face meets technological requirement.
Please refer to Fig. 1 to Fig. 2, wherein, Fig. 1 is the sectional view of existing polishing pad adjusting device, Fig. 2 is the structural representation of the lid of mechanical arm among Fig. 1, as shown in the figure, described polishing pad adjusting device comprises: mechanical arm 10, support member 20, adjustment part 30, assembly 40, actuator 50, driving shaft 60, motor 70 and wetting nozzle 80, wherein, adjustment part 30 is connected in the bottom of an assembly 40, and optionally compressing grinding pad on the platform (platen) that adheres to chemical-mechanical grinding device, described adjustment part 30 is generally diamond disk (diamond disk).
Wherein, mechanical arm 10 comprises housing and is arranged at the interior transmission device of described housing, wherein said housing comprises base plate 11 and the lid 12 that is connected with this base plate 11, described lid 12 comprises the roof 13 of level and the sidewall 14 that extends along each edge-perpendicular of the roof 13 of described level downwards, and described transmission device comprises pulley 15 and the conveyer belt 16 that is connected with pulley 15.
When needs use adjustment part 30 to adjust described grinding pad, actuator 50 can make mechanical arm 10 around described support member 20 rotations, therefore an assembly 40 is moved, described adjustment part 30 is positioned at described grinding pad top, and an assembly 40 is optionally exerted pressure to adjustment part 30 with respect to described lapped face, at this moment, motor 70 drives driving shaft 60 and conveyer belt 17 rotations, and then drives adjustment part 30 rotations to adjust described grinding pad surface.When adjustment part 30 was adjusted the flatness of described grinding pad, lapping liquid was splashed to roof 13 tops through regular meeting.
When adjustment part 30 did not use, mechanical arm 10 can move near the wetting nozzle 80, and wetting nozzle 80 can spray deionized water to polishing pad adjusting device, with working surface wetting or cleaning machine arm 10.Yet, because roof 13 is levels, horizontal surface also is unfavorable for that deionized water flows, therefore the deionized water that sprays can not guarantee to rinse out lapping liquids all on the roof 13 or particle, and cause lapping liquid, particle and deionized water often remain in roof 13 surfaces and form pollutant, this just needs the frequent wiping roof 13 of plant maintenance personnel to get rid of these pollutants, in case the plant maintenance personnel in time do not remove these pollutants, when mechanical arm 10 rotates to the grinding pad top once more, these pollutants then very likely drop on the grinding pad and reduce the yield of product, for example, dry lapping liquid powder or particle can cause wafer surface to scratch, deionized water drops onto on the grinding pad then can cause the grinding rate instability, brings tremendous loss to explained hereafter.
The utility model content
The utility model provides a kind of mechanical arm that is used for polishing pad adjusting device, easily forms pollutant with the top wall surface that solves the existing mechanical arm, and causes the problem of the yield decline of product.
For addressing the above problem, the utility model proposes a kind of mechanical arm that is used for polishing pad adjusting device, described mechanical arm comprises housing and is arranged at the interior transmission device of described housing, described housing comprises base plate and the lid that mates with this base plate, the sidewall that described lid comprises at least one roof and extends downwards along this roof edge, wherein said roof and horizontal direction have the inclination angle.
Optionally, described lid comprises a roof, and the inclination angle that described roof and horizontal direction form is 1 °～10 °, and the cross section of described lid is a right-angled trapezium.
Optionally, described lid comprises the roof that two mutual opposed courts tilt, and the inclination angle that described two roofs and horizontal direction form is 1 °～10 °.
Optionally, described lid is integrated, and described lid is connected with described base plate by screw.
Optionally, described base plate be shaped as rectangle, offer first hole and second hole on the described base plate.
Optionally, described transmission device comprises pulley and the conveyer belt that is connected with described pulley.
Optionally, described polishing pad adjusting device also comprises an assembly that is connected with described conveyer belt.
Optionally, described polishing pad adjusting device also comprises the adjustment part that is connected with described assembly.
Compared with prior art, the roof and the horizontal direction of the lid of mechanical arm of the present utility model have the inclination angle, the surface that is to say described roof is an inclined surface, described inclined surface makes splash deionized water thereon flow easily, help removing lapping liquid or other particle on the roof, and guarantee on the roof not can residual deionized water, avoid top wall surface to form pollutant, improve the stability of cmp processing procedure, and then improved the yield of product.
Description of drawings
Fig. 1 is the sectional view of existing polishing pad adjusting device;
Fig. 2 is the structural representation of the lid of mechanical arm among Fig. 1;
Fig. 3 is the schematic diagram of the polishing pad adjusting device of the utility model embodiment one;
Fig. 4 is the structural representation of the lid of mechanical arm among Fig. 3;
Fig. 5 is the structural representation of lid of the mechanical arm of the utility model embodiment two.
The specific embodiment
Below in conjunction with the drawings and specific embodiments the mechanical arm that is used for polishing pad adjusting device that the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
In background technology, mention, because the roof of the mechanical arm of existing polishing pad adjusting device is a level, the roof of described level is unfavorable for that deionized water flows, therefore cause lapping liquid, particle and deionized water to remain in top wall surface and form pollutant, if these pollutants in time removed then may not drop on the grinding pad, cause the grinding rate instability, and cause occurring defective such as wafer surface scuffing, influence the yield of product, bring tremendous loss to explained hereafter.
The utility model provides a kind of mechanical arm that is used for polishing pad adjusting device, easily forms pollutant with the top wall surface that solves the existing mechanical arm, and causes the problem of the yield decline of product.
Embodiment 1
Please refer to Fig. 3 to Fig. 4, wherein, Fig. 3 is the schematic diagram of the polishing pad adjusting device of the utility model embodiment one, Fig. 4 is the structural representation of the lid of mechanical arm among Fig. 3, as shown in the figure, this mechanical arm 100 that is used for polishing pad adjusting device comprises housing and is arranged at the interior transmission device of housing, wherein, described housing comprises base plate 111 and the lid 112 that mates with this base plate 111, described lid comprises roof 113 and along the downward sidewall 114 that extends in the edge of this roof 113, described transmission device comprises pulley 115 and the conveyer belt 116 that is connected with described pulley 115.
Wherein, described roof 113 has the inclination angle with horizontal direction, the surface that is to say described roof 113 is an inclined surface, described inclined surface makes the deionized water of splash on roof 113 flow easily, help removing lapping liquid or other particle on the roof 113, and guarantee on the roof 113 not can residual deionized water, avoid roof 113 surfaces to form pollutants, improve the stability of cmp processing procedure, and then improved the yield of product.
Detailed, the longitudinal section of described lid 112 is a right-angled trapezium, roof 113 is 1 °～10 ° with the tiltangle that horizontal direction forms, preferably, roof 113 is 2 ° with the tiltangle that horizontal direction forms, and the angle of described inclination promptly helps deionized water and flows on roof 113, has avoided again because the angle that tilts is excessive, and cause mechanical arm 100 when moving to described grinding pad top position, with other assembly collision of chemical-mechanical grinding device.
In this enforcement, described lid 112 is integrated, and they can be by screw and 111 dismountable connections of base plate, to make things convenient for the installation and maintenance of mechanical arm 100 intrawares.Wherein, base plate 111 be shaped as rectangle, offer first hole and second hole on it.
Specifically, polishing pad adjusting device also comprises support member 200, adjustment part 300, an assembly 400, actuator 500, driving shaft 600, motor 700 and wetting nozzle 800.Wherein, driving shaft 600 is arranged in the support member 200, the one end is fixedly connected on motor 700, the other end extend in the described housing from described first hole, and fixedly connected with pulley 115, conveyer belt 116 is connected in an institute's pulley 115 and an assembly 400, with so that motor 700 can optionally rotate adjustment part 300.Described adjustment part 300 is connected to the bottom of an assembly 400, described assembly 400 is used to support described adjustment part 300 also optionally exerts pressure to described adjustment part 300 with respect to described lapped face, and described adjustment part 300 optionally compresses the grinding pad on the platform that adheres to chemical-mechanical grinding device.Certainly, conveyer belt 116 also can be other element that is suitable for conveying rotary motion between a motor 700 and an assembly 400.
When needs use described adjustment part 300 to repair grinding pads, the mechanical arm 100 that actuator 500 can make self-supporting part 200 extend rotates around support member 200, therefore can make described assembly 400 move, adjustment part 300 is positioned at described grinding pad top, and an assembly 400 is optionally exerted pressure to this adjustment part 300 with respect to described lapped face, motor 700 drive driving shafts 600 rotations this moment, and then drive conveyer belt 116 rotations, described conveyer belt 116 rotations then drive adjustment part 30 rotations to adjust described grinding pad surface, wherein, described adjustment part 300 can be diamond disk (diamond disk).When adjustment part 300 was adjusted the flatness of described grinding pad, inevitably, lapping liquid can be splashed on the described roof 113, because described roof 113 has the surface of inclination, therefore, was unfavorable for that lapping liquid accumulates on the roof 113.
And, when adjustment part 300 when not using, it can move near the wetting nozzle 800, described wetting nozzle 800 can spray deionized water to polishing pad adjusting device, with wetting and the cleaning adjustment part 300 working surface.Because in the present embodiment, roof 113 has the inclination angle with horizontal direction, the roof 113 of described inclination makes splash deionized water in its surface flow easily, help removing lapping liquid or other particle on the roof 113, and guarantee on the roof 113 not can residual deionized water, forms pollutants to avoid roof 113 surfaces, need not the frequent wiping mechanical arm 100 of plant maintenance personnel, and effectively raise the stability of cmp processing procedure, and then improved the yield of product.
Embodiment 2
In the present embodiment, the lid 212 that is used for the mechanical arm of polishing pad adjusting device comprises first roof 213 and second roof 214 that mutual opposed court tilts, and sidewall 215, the first roofs 213 that extend downwards along described two roof edges are 1 °～10 ° with the tiltangle 1 and second roof 214 that horizontal direction forms with the tiltangle 2 that horizontal direction forms.
Because described two roofs are towards tilting, make the deionized water of splash on lid 212 flow easily, help removing lapping liquid or other particle on first roof 213 and second roof 214, and guarantee on two roofs not can residual deionized water, avoid lid 212 surfaces to form pollutant, improve the stability of cmp processing procedure, and then improved the yield of product.
In sum, the utility model provides a kind of mechanical arm that is used for polishing pad adjusting device, described mechanical arm comprises housing and is arranged at the interior transmission device of described housing, described housing comprises base plate and the lid that is connected with this base plate, the sidewall that described lid comprises at least one roof and extends downwards along this roof edge, wherein said roof and horizontal direction have the inclination angle, described roof makes splash deionized water thereon flow easily, can remove lapping liquid or other particle on the roof effectively, and guarantee on the roof not can residual deionized water, avoid top wall surface to form pollutant, improve the stability of cmp processing procedure, helped improving the yield of product.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (11)
1. mechanical arm that is used for polishing pad adjusting device, comprise housing and be arranged at the interior transmission device of described housing, described housing comprises base plate and the lid that mates with this base plate, it is characterized in that, the sidewall that described lid comprises at least one roof and extends downwards along this roof edge, wherein said roof and horizontal direction have the inclination angle.
2. the mechanical arm that is used for polishing pad adjusting device as claimed in claim 1 is characterized in that, described lid comprises a roof, and the inclination angle that described roof and horizontal direction form is 1 °～10 °.
3. the mechanical arm that is used for polishing pad adjusting device as claimed in claim 2 is characterized in that, the longitudinal section of described lid is a right-angled trapezium.
4. the mechanical arm that is used for polishing pad adjusting device as claimed in claim 1 is characterized in that, described lid comprises the roof that two mutual opposed courts tilt, and the inclination angle that described two roofs and horizontal direction form is 1 °～10 °.
5. as any described mechanical arm that is used for polishing pad adjusting device in the claim 1 to 4, it is characterized in that described lid is integrated.
6. as any described mechanical arm that is used for polishing pad adjusting device in the claim 1 to 4, it is characterized in that described lid is connected with described base plate by screw.
7. as any described mechanical arm that is used for polishing pad adjusting device in the claim 1 to 4, it is characterized in that, described base plate be shaped as rectangle.
8. as any described mechanical arm that is used for polishing pad adjusting device in the claim 1 to 4, it is characterized in that, offer first hole and second hole on the described base plate.
9. as any described mechanical arm that is used for polishing pad adjusting device in the claim 1 to 4, it is characterized in that described transmission device comprises pulley and the conveyer belt that is connected with described pulley.
10. the mechanical arm that is used for polishing pad adjusting device as claimed in claim 9 is characterized in that, described polishing pad adjusting device also comprises an assembly that is connected with described conveyer belt.
11. the mechanical arm that is used for polishing pad adjusting device as claimed in claim 10 is characterized in that described polishing pad adjusting device also comprises the adjustment part that is connected with described assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202084858U CN201483358U (en) | 2009-08-26 | 2009-08-26 | Mechanical arm used for polishing pad adjusting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202084858U CN201483358U (en) | 2009-08-26 | 2009-08-26 | Mechanical arm used for polishing pad adjusting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201483358U true CN201483358U (en) | 2010-05-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202084858U Expired - Fee Related CN201483358U (en) | 2009-08-26 | 2009-08-26 | Mechanical arm used for polishing pad adjusting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201483358U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103286676A (en) * | 2013-05-31 | 2013-09-11 | 上海华力微电子有限公司 | Grinding fluid finisher |
| CN103962938A (en) * | 2013-01-31 | 2014-08-06 | 株式会社荏原制作所 | Polishing apparatus |
| CN107030589A (en) * | 2017-03-14 | 2017-08-11 | 黄河科技学院 | A kind of chemical-mechanical grinding device |
-
2009
- 2009-08-26 CN CN2009202084858U patent/CN201483358U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962938A (en) * | 2013-01-31 | 2014-08-06 | 株式会社荏原制作所 | Polishing apparatus |
| CN103962938B (en) * | 2013-01-31 | 2016-09-28 | 株式会社荏原制作所 | Lapping device |
| CN103286676A (en) * | 2013-05-31 | 2013-09-11 | 上海华力微电子有限公司 | Grinding fluid finisher |
| CN107030589A (en) * | 2017-03-14 | 2017-08-11 | 黄河科技学院 | A kind of chemical-mechanical grinding device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130226 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130226 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 No. 18 Zhangjiang Road, Shanghai Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100526 Termination date: 20180826 |