CN202825548U - Grinding pad adjustor washing equipment and chemical machinery grinding device - Google Patents
Grinding pad adjustor washing equipment and chemical machinery grinding device Download PDFInfo
- Publication number
- CN202825548U CN202825548U CN 201220521040 CN201220521040U CN202825548U CN 202825548 U CN202825548 U CN 202825548U CN 201220521040 CN201220521040 CN 201220521040 CN 201220521040 U CN201220521040 U CN 201220521040U CN 202825548 U CN202825548 U CN 202825548U
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- Prior art keywords
- grinding
- grinding pad
- washing cup
- pad adjuster
- adjustment part
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000227 grinding Methods 0.000 claims abstract description 87
- 238000004140 cleaning Methods 0.000 claims abstract description 64
- 238000005406 washing Methods 0.000 claims abstract description 57
- 239000000126 substance Substances 0.000 claims abstract description 18
- 239000012530 fluid Substances 0.000 claims abstract description 16
- 238000005507 spraying Methods 0.000 claims abstract description 6
- 238000005498 polishing Methods 0.000 claims description 21
- 239000007921 spray Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 19
- 239000000758 substrate Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 12
- 239000003344 environmental pollutant Substances 0.000 description 7
- 231100000719 pollutant Toxicity 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000002045 lasting effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses grinding pad adjustor washing equipment and a chemical machinery grinding device. The grinding pad adjustor washing equipment comprises a washing cup and at least one spray nozzle. A grinding pad adjustor is arranged above the washing cup. The spray nozzle is fixed on circumferential wall of the washing cup, and is used for spraying cleaning fluid to the grinding pad adjustor arranged above the washing cup. The chemical machinery grinding device can effectively prolong service life of a loading plate of a grinding disc, and can reduce reject ratio of products.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly a kind of grinding pad adjuster cleaning device and chemical mechanical polishing device.
Background technology
Cmp (CMP) is a kind of the most frequently used planarization processing procedure.In the CMP processing procedure, will contain the chemical milling agent (being also referred to as lapping liquid) that grinds composition and the spin finishing pad be carried out wetting, and utilize wetting spin finishing pad that the substrate front surface is carried out cmp.
In conjunction with Fig. 1 and Fig. 2, chemical mechanical polishing device 100 comprises a plurality of grinding stations 101 and a plurality of grinding pad adjuster cleaning device 102.Described grinding stations 101 comprises grinds load bearing arm 103, the grinding carrier 104 that is positioned at described grinding load bearing arm 103 1 ends and a polishing pad 105, when substrate 106 is ground, the back side of substrate 106 can be fixed on the described grinding carrier 104, and to be ground (front) keeping described substrate 106 down, by described substrate 106 rotations of rotarily driving of described grinding carrier 104.Simultaneously, described grinding load bearing arm 103 can be exerted pressure to substrate 106, and substrate 106 surfaces are ground mutually with described polishing pad 105, and by the flattening surface of chemical milling agent with substrate 106.
Because the cmp processing procedure is that substrate surface is contacted with the lapped face of polishing pad, then, by the relative motion between substrate surface and the described lapped face with described wafer surface planarization.Therefore, the flatness of the lapped face of grinding pad is vital for the cmp processing procedure.At present, industry utilizes the grinding pad adjuster (Pad Conditioner) of chemical-mechanical grinding device to adjust the flatness of the lapped face of grinding pad usually, described grinding pad adjuster comprises to be adjusted arm 108 and is connected in the adjustment part 109 of adjusting arm 108 1 ends, described adjustment part 109 is generally diamond disk (diamond disk), it optionally compresses polishing pad 105, so that the formation state on polishing pad 105 surfaces meets technological requirement.The adjustment part 109 of described grinding pad adjuster is in the process of grinding, and its surface can contaminatedly be carried and be ground chip, chemical milling agent or other impurity.In the process of lapping of 109 pairs of successive substrates of contaminated adjustment part, can because the pollutant that himself carries causes scuffing to follow-up substrate, need in time to clean contaminated adjustment part 109.
As shown in Figure 1, the adjustment part 109 for timely cleaning grinding pad adjuster is provided with a grinding pad adjuster cleaning device 102 on the next door of each grinding stations 101.As shown in Figure 3, described grinding pad adjuster cleaning device 102 comprises a Washing cup (clean cup) 107, and the inwall bottom surface of described Washing cup 107 is rough matsurface, fills pure water in described Washing cup 107.When described grinding pad adjuster need to clean, described grinding pad adjuster is moved to the top of described Washing cup 107, and then contact with the inwall bottom surface of Washing cup 107 and immerse in the pure water by adjusting exert pressure adjustment part 109 surfaces with described grinding pad adjuster of arm 108, slow circumvolve adjustment part 109 makes the bottom surface of itself and Washing cup 107 produce friction again, by the pure water in above-mentioned friction and the Washing cup 107, the pollutant on the adjustment part 109 of described grinding pad adjuster can be disposed.
In actual production, find, adopt the adjustment part 109 of 102 pairs of grinding pad adjusters of grinding pad adjuster cleaning device to clean, the friction of the bottom surface of described adjustment part 109 and Washing cup 107, although can wash a part of pollutant, but too much friction can make the surface of destroying adjustment part 109, the service life of reducing described grinding pad adjuster.In addition, although the pure water in the Washing cup 107 is by the rotation of adjustment part 109, adjustment part 109 is produced certain flushing action, but because the pure water in the Washing cup 107 can not in time be changed, and the cleanliness factor of pure water is descended, may cause adjustment part 109 to be secondary polluted, thereby can't guarantee the cleaning performance to the grinding pad adjuster.Clean inadequate adjustment part 109, in the process of lapping to successive substrates, can be because the pollutant that himself carries, cause scuffing etc. bad to substrate.
The utility model content
The utility model provides a kind of grinding pad adjuster cleaning device and chemical mechanical polishing device, reaches the purpose that prolongs the adjustment part life-span, reduces the product fraction defective, to solve the short and high problem of product fraction defective of above-mentioned adjustment part life-span.
For solving the problems of the technologies described above, the utility model provides a kind of grinding pad adjuster cleaning device, comprise a Washing cup and at least one nozzle, described grinding pad adjuster is positioned at described Washing cup top, described nozzle is fixed in the perisporium of described Washing cup, is used for spraying cleaning fluid to the grinding pad adjuster of described Washing cup top.
Optionally, the quantity of described nozzle is 2-6.
Optionally, described nozzle is evenly distributed on the perisporium of described Washing cup.
Optionally, described nozzle is fixed in internal perisporium or the periphery wall at described Washing cup.
Optionally, the inwall bottom surface of described Washing cup is shiny surface.
Optionally, the inwall bottom surface of described Washing cup is matsurface.
Accordingly, also provide a kind of chemical mechanical polishing device, comprise a plurality of grinding stations and at least one described grinding pad adjuster cleaning device.
Optionally, described grinding stations comprises draws together a grinding pad adjuster, and described grinding pad adjuster comprises the adjustment part of adjusting arm and being connected in described adjustment arm one end.
Optionally, the diameter of described Washing cup is greater than the diameter of described adjustment part.
Optionally, described grinding stations also comprises a polishing pad, a grinding carrier that grinds load bearing arm and be connected in described grinding load bearing arm one end.
Optionally, the quantity of described grinding stations is 3.
The grinding pad adjuster cleaning device that the utility model adopts comprises a Washing cup and at least one nozzle, and described nozzle is fixed in the perisporium of described Washing cup, is used for spraying cleaning fluid to the top of described Washing cup.Adopt grinding pad adjuster cleaning device of the present utility model, when adjustment part is cleaned, can adjustment part be risen to the middle top of described Washing cup by adjusting arm, continue bottom surface and side jet cleaning liquid to described adjustment part by nozzle, the pollutant that sticks on the adjustment part is washed away.And do not need surface by the friction adjustment part, clean itself.Because omitted the abrasive action in the cleaning process, so the life-span of adjustment part can effectively be promoted.
In addition, because the cleaning fluid of nozzles spray is the cleaning fluid of the cleaning of in time process filtration, and in whole cleaning process, described adjustment part is unsettled being cleaned all, therefore can not produce because cleaning fluid is contaminated and produce secondary pollution, can also improve cleaning performance by the slow circumvolve of adjustment part simultaneously, guarantee the cleaning performance of grinding pad adjuster, therefore can effectively reduce and the scuffing that produces bad, thereby reduce the fraction defective of product.
Description of drawings
Fig. 1 is the structural representation of chemical mechanical polishing device of the prior art;
Fig. 2 is the structural representation of grinding stations of the prior art;
Fig. 3 is the structural representation of grinding pad adjuster cleaning device of the prior art;
Fig. 4 is the structural representation of the chemical mechanical polishing device of the utility model one embodiment;
Fig. 5 is the structural representation of the grinding pad adjuster cleaning device of the utility model one embodiment.
The specific embodiment
Core concept of the present utility model is, Washing cup in grinding pad adjuster cleaning device arranges at least one nozzle, be used for spraying cleaning fluid to the top of described Washing cup, when the grinding pad adjuster is cleaned, can adjustment part be risen to by adjusting arm the middle top of described Washing cup, by nozzle lasting bottom surface and side jet cleaning liquid to described adjustment part, the pollutant that sticks on the adjustment part is washed away.And do not need surface by the friction adjustment part, clean itself.Because omitted the abrasive action in the cleaning process, so the life-span of adjustment part can effectively be promoted.
In order to make the purpose of this utility model, technical scheme and advantage are clearer, further elaborate below in conjunction with accompanying drawing.
As shown in Figure 4, the utility model provides a kind of chemical mechanical polishing device 200, comprises a plurality of grinding stations 201 and a plurality of described grinding pad adjuster cleaning device 202.Described grinding stations comprises grinding load bearing arm 203, is positioned at the described grinding of grinding load bearing arm 203 1 ends carrier 204, a polishing pad 205 and grinding pad adjuster 206, and described grinding pad adjuster 206 comprises to be adjusted arm 207 and be connected in the adjustment part 208 of adjusting arm 207 1 ends.In the present embodiment, the quantity of described grinding stations 201 is 3.
As shown in Figure 5, described grinding pad adjuster cleaning device 202 comprises a Washing cup 209, at least one nozzle 210, and described nozzle 210 is fixed in the perisporium of described Washing cup 209, is used for spraying cleaning fluid to the top of described Washing cup 209.Preferably, the quantity of described nozzle is 2-6.
The process that adopts 202 pairs of described adjustment parts 208 of described grinding pad adjuster cleaning device to clean is as follows:
Step 1: rotate the middle top that described adjustment arm 207 moves to described adjustment part 208 described Washing cup 209;
Step 2: by described adjustment arm 207 described adjustment part 208 is dropped to predetermined altitude, make described adjustment part 208 be suspended on the middle top of described Washing cup 209;
Step 3: open described nozzle 210, make described nozzle 210 continue to spray cleaning fluid to bottom surface and the side of adjustment part 208, in cleaning process, can make described adjustment part 208 be in the slow circumvolve state, make described adjustment part 208 can access uniform cleaning;
Step 4: after cleaning end, close described nozzle 210, stop to spray cleaning fluid.
In above-mentioned steps three, in order to make nozzle 210 spray cleaning fluids to described adjustment part 208 with angle preferably, preferably, the diameter of described Washing cup 209 is set to the diameter greater than described adjustment part 208, such setting, also can guarantee to be sprayed to cleaning fluid on the adjustment part 208 falls into and with the Washing cup 209 of its below in, guaranteed the clean and tidy of working site.
In addition, in order to guarantee above-mentioned cleaning performance, preferred, described nozzle 210 is evenly distributed on the perisporium of described Washing cup 209.In order to guarantee the compactedness of grinding pad adjuster cleaning device 202, described nozzle 210 can be fixed in the internal perisporium of described Washing cup 209.But, adopt above-mentioned cleaning method, described Washing cup 209 is interior can a certain amount of cleaning fluid of accumulation, be immersed in for a long time for fear of nozzle 210 and cause in the cleaning fluid damaging, also described nozzle 210 can be fixed in the periphery wall of described Washing cup 209.
Adopt in the above-mentioned cleaning process, described adjustment part 208 is the unsettled middle top that is in described Washing cup 209 all the time, and not with the bottom surface contact friction of described Washing cup 209, inwall bottom surface that therefore can described Washing cup 209 is set to shiny surface.Certainly, in order still to keep cleaning method of the prior art, so that for the user provides two kinds of optional cleaning methods, inwall bottom surface that also can described Washing cup 209 is set to matsurface.
To sum up, in grinding pad adjuster cleaning device of the present utility model, because at Washing cup at least one nozzle is set, when adjustment part is cleaned, by nozzle lasting bottom surface and side jet cleaning liquid to described adjustment part, the pollutant that sticks on the adjustment part is washed away.Omitted the abrasive action in the cleaning process, so can effectively be promoted the life-span of adjustment part.In addition, in whole cleaning process, described adjustment part is unsettled being cleaned all, therefore can not produce the generation secondary pollution because cleaning fluid is contaminated, therefore guarantee the cleaning performance of adjustment part, can effectively reduce and the scuffing that produces bad, thereby reduced the fraction defective of product.
Obviously, those skilled in the art can carry out various changes and modification to utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these revise and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these change and modification.
Claims (11)
1. grinding pad adjuster cleaning device, it is characterized in that, comprise a Washing cup and at least one nozzle, described grinding pad adjuster is positioned at described Washing cup top, described nozzle is fixed in the perisporium of described Washing cup, is used for spraying cleaning fluid to the grinding pad adjuster of described Washing cup top.
2. grinding pad adjuster cleaning device as claimed in claim 1 is characterized in that, the quantity of described nozzle is 2-6.
3. grinding pad adjuster cleaning device as claimed in claim 1 is characterized in that described nozzle is evenly distributed on the perisporium of described Washing cup.
4. such as claim 1 or 3 described grinding pad adjuster cleaning devices, it is characterized in that described nozzle is fixed at the internal perisporium of described Washing cup or periphery wall.
5. grinding pad adjuster cleaning device as claimed in claim 1 is characterized in that, the inwall bottom surface of described Washing cup is shiny surface.
6. grinding pad adjuster cleaning device as claimed in claim 1 is characterized in that, the inwall bottom surface of described Washing cup is matsurface.
7. a chemical mechanical polishing device comprises that a plurality of grinding stations and at least one are such as the described grinding pad adjuster of any one in the claim 1 to 6 cleaning device.
8. chemical mechanical polishing device as claimed in claim 7 is characterized in that, described grinding stations comprises draws together a grinding pad adjuster, and described grinding pad adjuster comprises the adjustment part of adjusting arm and being connected in described adjustment arm one end.
9. chemical mechanical polishing device as claimed in claim 8 is characterized in that, the diameter of described Washing cup is greater than the diameter of described adjustment part.
10. chemical mechanical polishing device as claimed in claim 7 is characterized in that, described grinding stations also comprises a polishing pad, a grinding carrier that grinds load bearing arm and be connected in described grinding load bearing arm one end.
11. chemical mechanical polishing device as claimed in claim 7 is characterized in that, the quantity of described grinding stations is 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220521040 CN202825548U (en) | 2012-10-11 | 2012-10-11 | Grinding pad adjustor washing equipment and chemical machinery grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220521040 CN202825548U (en) | 2012-10-11 | 2012-10-11 | Grinding pad adjustor washing equipment and chemical machinery grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202825548U true CN202825548U (en) | 2013-03-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220521040 Expired - Lifetime CN202825548U (en) | 2012-10-11 | 2012-10-11 | Grinding pad adjustor washing equipment and chemical machinery grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202825548U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105365121A (en) * | 2014-08-28 | 2016-03-02 | 三纬国际立体列印科技股份有限公司 | Model cleaning device |
| CN108115553A (en) * | 2016-11-29 | 2018-06-05 | 中芯国际集成电路制造(上海)有限公司 | Chemical-mechanical polisher and cmp method |
-
2012
- 2012-10-11 CN CN 201220521040 patent/CN202825548U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105365121A (en) * | 2014-08-28 | 2016-03-02 | 三纬国际立体列印科技股份有限公司 | Model cleaning device |
| CN108115553A (en) * | 2016-11-29 | 2018-06-05 | 中芯国际集成电路制造(上海)有限公司 | Chemical-mechanical polisher and cmp method |
| EP3345724A1 (en) * | 2016-11-29 | 2018-07-11 | Semiconductor Manufacturing International Corporation (Shanghai) | Chemical mechanical polishing device and chemical mechanical polishing method |
| US10453702B2 (en) | 2016-11-29 | 2019-10-22 | Semiconductor Manf. Intl. (Shanghai) Corporation | Chemical mechanical polishing device and chemical mechanical polishing method |
| CN108115553B (en) * | 2016-11-29 | 2019-11-29 | 中芯国际集成电路制造(上海)有限公司 | Chemical-mechanical polisher and cmp method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130327 |