CN107030589A - A kind of chemical-mechanical grinding device - Google Patents

Abstract

The invention belongs to the technical field of semiconductor mechanical grinding equipment, in particular to a chemical mechanical grinding equipment. The grinding fluid supply position of the existing grinding fluid supply pipe is relatively single, and the centrifugal force of the rotation of the turntable alone cannot ensure that the grinding force on the grinding pad under the grinding head is high. The grinding liquid can be evenly distributed, and the uneven distribution of the grinding liquid will directly affect the grinding effect of the grinding head, resulting in uneven grinding results of the substrate and other shortcomings. The following scheme is proposed, a chemical mechanical grinding equipment, including a support base, The support base has a hollow structure, and the inner cavity of the support base is fixed with a first drive device through a bracket. The output shaft of the first drive device passes through the upper side wall of the support base and is connected with the turntable through a flange. The cross section of the turntable It is circular and has a rectangular vertical section. The chemical mechanical grinding equipment can make the object to be ground fully soaked with the grinding liquid, thereby making it evenly ground, improving the uniformity and flatness.

Description

A kind of chemical mechanical grinding equipment

technical field

The invention relates to the technical field of semiconductor mechanical grinding equipment, in particular to chemical mechanical grinding equipment.

Background technique

With the rapid development of VLSI, the manufacturing process of integrated circuits has become more and more complex and sophisticated. In order to improve integration and reduce manufacturing costs, the feature size of components is getting smaller and the number of components per unit area of the chip is increasing. It is difficult for planar wiring to meet the requirements of high-density distribution of components. Multilayer wiring technology can only be used to take advantage of the verticality of the chip. Space, and further increase the integration density of the device. However, the application of multilayer wiring technology will cause the surface of the substrate to be uneven, which is extremely unfavorable to the graphics production. Therefore, it is often necessary to planarize the surface of the substrate.

At present, the chemical mechanical polishing method is the best method to achieve global planarization, especially after the semiconductor manufacturing process enters the sub-micron field, it has become an indispensable manufacturing process technology.

Chemical mechanical polishing is to use chemical solution mixed with very small abrasive particles to react chemically with the processed surface to change the chemical bond on the surface, generate products that are easy to remove mechanically, and then remove the chemical reactants by mechanical friction to obtain ultra-smooth and non-damaging of the flattened surface.

However, the grinding liquid supply position of the grinding liquid supply pipe on the chemical mechanical grinding equipment of the prior art is relatively single, and the centrifugal force of the rotation of the turntable alone cannot ensure that the grinding liquid on the grinding pad under the grinding head can be evenly distributed, and the distribution of the grinding liquid is not enough. Uniformity will directly affect the grinding effect of the grinding head, resulting in uneven substrate grinding results, and most of the equipment currently on the market is relatively complex in structure and bulky, and it is extremely inconvenient to move it.

The notification number is CN201960447U, which proposes a chemical mechanical equipment grinding equipment to solve the above problems by adding sensors and multi-channel grinding liquid injection pipes, which inevitably makes the structure of the equipment more complicated and makes the cost higher.

Therefore, we urgently need to design a chemical mechanical grinding equipment to solve the above problems.

Contents of the invention

The purpose of the present invention is to solve the problem that the grinding liquid supply position of the grinding liquid supply pipe on the chemical mechanical grinding equipment in the prior art is relatively single, and the centrifugal force of the rotation of the turntable alone cannot ensure that the grinding liquid on the grinding pad under the grinding head can be uniform. distribution, and the uneven distribution of the polishing liquid will directly affect the grinding effect of the grinding head, resulting in uneven substrate grinding results and other shortcomings, and a chemical mechanical polishing equipment is proposed.

In order to achieve the above object, the present invention adopts the following technical solutions:

A kind of chemical mechanical grinding equipment, comprising a support base, the support base is a hollow structure, the inner cavity of the support base is fixed with a first drive device through a bracket, the output shaft of the first drive device passes through the upper side wall of the support base and the The turntable is connected by a flange, the cross section of the turntable is circular, the vertical section is rectangular, and the upper side of the turntable is welded with a first rotating shaft, and the end of the first rotating shaft away from the turntable is connected to the grinding device through the flange, and A cylinder is welded on the upper side of the turntable, and a liquid outlet hole is opened on the side wall of the end of the cylinder close to the turntable, and the first rotating shaft and the grinding device are located in the inner chamber of the cylinder.

The upper side of one end of the support base is fixed with a first column by screws, the upper side of the other end is fixed with a second column by screws, a fixing ring is welded on the side wall of the first column, and a grinding liquid storage tank is fixed in the fixing ring. The liquid discharge end of the grinding liquid storage tank is provided with a serpentine liquid discharge pipe, and a liquid flow regulating valve is arranged on the serpentine liquid discharge pipe, and the liquid discharge end of the serpentine liquid discharge pipe extends directly above the liquid inlet end of the cylinder. The top of the second column is welded with a beam, and the end of the beam away from the second column is fixed with a second driving device by a screw, the output shaft of the second driving device is connected with one end of the second rotating shaft through a flange, and the second rotating shaft The other end is connected to the grinding head through the flange, the grinding head is located directly above the grinding device, and the object to be ground is located between the grinding head and the grinding device.

The grinding device includes a current limiting device, a chassis, a liquid discharge hole and a grinding pad, wherein the grinding pad is attached to the upper side of the chassis, and the current limiting device is welded on the side wall of the outer ring of the chassis whose vertical section is isosceles trapezoidal, wherein the limiting The cross section of the flow device is circular, and the liquid discharge hole is opened on the flow limiting device.

Preferably, the cross section and the vertical section of the support base are both rectangular, and the four corners of the bottom of the support base are fixed with moving rollers by screws, and the upper and outer side walls of the support base are punched with grooves for supplying the abrasive liquid.

Preferably, both the first drive device and the second drive device use motors, and both the first drive device and the second drive device are provided with reducers, and the signal input ends of the first drive device and the second drive device are both It is connected with the PLC controller, and the steering of the two driving devices is the same.

Preferably, the second column and the first column are parallel to each other, and the second column and the beam are perpendicular to each other, and the second column is provided with a lifting device, the lifting device adopts a hydraulic cylinder, and the signal input end of the lifting device is connected to the PLC controller. connect.

Preferably, the diameter of the cylinder is equal to the diameter of the circumscribed circle of the flow limiting device, and there are 5-10 liquid outlet holes on the side wall of the cylinder near the turntable, and the liquid outlet holes are along the axial direction of the cylinder Arrange evenly.

Preferably, the central axes of the first rotating shaft, the second rotating shaft, the grinding head and the grinding device are located on the same straight line.

Preferably, the vertical section of the flow limiting device is an isosceles trapezoid whose height is equal to half of the height of the object to be ground.

Preferably, the upper side wall of the chassis is on the same level as the bottom end of the flow limiting device.

Preferably, the cross section of the grinding head is circular, the vertical section is rectangular, and the diameter of the grinding head is smaller than the diameter of the chassis.

Preferably, 2-3 fixing rings are welded on the side wall of the first column, and a rubber ring is provided on the inner side wall of the fixing ring.

Beneficial effects of the present invention:

1. The chemical mechanical grinding equipment is equipped with a grinding device consisting of a cylinder, a flow limiting device, a chassis, a liquid discharge hole and a grinding pad, which can make the object to be ground fully saturated with the grinding liquid, and then make it be Uniform grinding improves uniformity and flatness.

2. The chemical mechanical grinding equipment has a frame structure, which is easy to move, and its simple structure avoids the addition of electronic components such as sensors, making the entire equipment low in cost, more convenient to use, and easier to maintain.

Description of drawings

Fig. 1 is the structural representation of a kind of chemical mechanical grinding equipment that the present invention proposes;

Fig. 2 is a schematic diagram of the internal structure of a support base of a chemical mechanical grinding equipment proposed by the present invention;

Fig. 3 is the structural representation of the grinding device of a kind of chemical mechanical grinding equipment that the present invention proposes;

Fig. 4 is the plan view of the polishing device of a kind of chemical mechanical polishing equipment that the present invention proposes;

Fig. 5 is a top view of a cylinder of a chemical mechanical polishing device proposed by the present invention.

In the figure: 1 beam, 2 second column, 3 lifting device, 4 supporting base, 5 turntable, 6 first column, 7 grinding liquid storage tank, 8 fixing ring, 9 serpentine discharge pipe, 10 liquid flow regulating valve, 11 Second driving device, 12 Second rotating shaft, 13 Grinding head, 14 Grinding device, 15 First rotating shaft, 16 Cylinder, 17 Object to be ground, 18 First driving device, 19 Liquid outlet hole, 141 Flow limiting device , 142 chassis, 143 drain hole, 144 grinding pad.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

With reference to Fig. 1, Fig. 2 and Fig. 5, a kind of chemical mechanical grinding equipment comprises support base 4, and support base 4 is hollow structure, and the inner chamber of support base 4 is fixed with first driving device 18 by bracket, and first driving device 18 The output shaft passes through the upper side wall of the support base 4 and is connected to the turntable 5 through a flange, the cross section of the turntable 5 is circular, the vertical section is rectangular, and the upper side of the turntable 5 is welded with a first rotating shaft 15, The end of the first rotating shaft 15 away from the turntable 5 is connected to the grinding device 14 through a flange, and a cylinder 16 is welded on the upper side of the turntable 5, and a liquid outlet 19 is opened on the side wall of the end of the cylinder 16 close to the turntable 5 , the first rotating shaft 15 and the grinding device 14 are located in the inner cavity of the cylinder 16 .

The upper side of one end of the support base 4 is fixed with a first column 6 by a screw, the upper side of the other end is fixed with a second column 2 by a screw, the side wall of the first column 6 is welded with a fixed ring 8, and a grinding wheel is fixed in the fixed ring 8. Liquid storage tank 7, the liquid discharge end of grinding liquid storage tank 7 is provided with serpentine liquid discharge pipe 9, and the liquid flow regulating valve 10 is arranged on the serpentine liquid discharge pipe 9, and the liquid discharge end of serpentine liquid discharge pipe 9 extends As for directly above the liquid inlet end of the cylinder 16, the top of the second column 2 is welded with a beam 1, and the end of the beam 1 away from the second column 2 is fixed with a second driving device 11 by screws, and the output shaft of the second driving device 11 passes through The flange is connected with one end of the second rotating shaft 12, the other end of the second rotating shaft 12 is connected with the grinding head 13 through the flange, the grinding head 13 is positioned directly above the grinding device 14, and the object to be ground 17 is positioned at the grinding head 13 and grinding device 14 between.

The cross-section and vertical section of the support base 4 are all rectangular, and the four corners of the bottom of the support base 4 are fixed with moving rollers by screws, and the upper side wall of the support base 4 is punched with grooves for supplying the abrasive liquid to flow. The drive unit 18 and the second drive unit 11 all adopt motors, and the first drive unit 18 and the second drive unit 11 are all provided with speed reducers, and the signal input terminals of the first drive unit 18 and the second drive unit 11 are all connected to The PLC controller is connected, and the steering of the two driving devices is the same.

The second column 2 is parallel to the first column 6, and the second column 2 is perpendicular to the crossbeam 1, and the second column 2 is provided with a lifting device 3, the lifting device 3 adopts a hydraulic cylinder, and the signal input terminal of the lifting device 3 is connected to the PLC controller connection, the diameter of the cylinder 16 is equal to the diameter of the circumscribed circle of the current limiting device 141, and there are 5-10 liquid outlet holes 19 on the side wall of the cylinder 16 near the end of the turntable 5, and the liquid outlet holes 19 are along the The axial direction of the cylinder 16 is evenly arranged, the central axes of the first rotating shaft 15, the second rotating shaft 12, the grinding head 13 and the grinding device 14 are located on the same straight line, and the vertical section of the current limiting device 141 is an isosceles trapezoid. Its height is equal to 1/2 of the height of the object 17 to be ground, the upper side wall of the chassis 142 is on the same level as the bottom end of the current limiting device 141, the cross section of the grinding head 13 is circular, and the vertical section is rectangular, and The diameter of the grinding head 13 is smaller than the diameter of the chassis 142 , 2-3 fixing rings 8 are welded on the side wall of the first column 6 , and a rubber ring is arranged on the inner side wall of the fixing ring 8 .

3-4, the grinding device 14 includes a flow limiting device 141, a chassis 142, a liquid discharge hole 143 and a grinding pad 144, wherein the grinding pad 144 is attached to the upper side of the chassis 142, and the current limiting device 141 is welded on the vertical section to be equal. On the outer wall of the trapezoidal chassis 142 , the cross-section of the flow limiting device 141 is circular, and the liquid discharge hole 143 is opened on the flow limiting device 141 .

Working principle: Referring to Figure 1-5, when in use, by controlling the lifting device 3, the distance between the grinding head 13 and the grinding device 14 becomes larger, and then the object 17 to be ground is placed on the grinding device 14, and then controlled again The lifting device 3 makes the grinding head 13 press on the object 17 to be ground, then starts the first driving device 18 and the second driving device 11, and then adjusts the liquid flow regulating valve 10 to make the grinding liquid flow out from the grinding liquid storage tank 7 , and flow into the cylinder 16 along the serpentine liquid discharge pipe 9, the grinding fluid flowing into the cylinder 16 will submerge the object 17 to be ground under the effect of the flow limiting device 141, and the flow limiting device 141 is provided with a liquid discharge Hole 143, and then make the excess grinding liquid flow to the bottom of cylinder 16, then flow out from the liquid outlet hole 19 opened at the bottom of cylinder.

When grinding, first attach the grinding surface of the object 17 to be ground downward to the grinding head 13, and apply a downward pressure on the grinding head 13 to press the substrate tightly onto the grinding pad 144 of the grinding device 14; then, the turntable 5 The rotation makes the grinding device 14 rotate, and the grinding head 13 also rotates in the same direction to realize mechanical grinding; at the same time, the grinding liquid is stored on the grinding device 14, and the centrifugal force of the rotating disk is used to distribute on the grinding pad 144. A layer of liquid film is formed between the polishing pads 14, and the film chemically reacts with the surface of the object to be polished 17 to generate easily removable products. This process combines mechanical action and chemical reaction to remove materials on the surface of the substrate.

The above is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone familiar with the technical field within the technical scope disclosed in the present invention, according to the technical solutions of the present invention and its Any equivalent replacement or change of the inventive concept shall fall within the protection scope of the present invention.

Claims (10)

1. A chemical mechanical grinding device, comprising a support base (4), characterized in that: the support base (4) is a hollow structure, and the inner cavity of the support base (4) is fixed with a first driving device (18) by a support , the output shaft of the first driving device (18) passes through the upper side wall of the support base (4) and is connected with the turntable (5) through a flange, the cross section of the turntable (5) is circular, and the vertical section is rectangular, And the upper side of the rotating disk (5) is welded with the first rotating shaft (15), and the end of the first rotating shaft (15) away from the rotating disk (5) is connected with the grinding device (14) by a flange, and the rotating disk (5) A cylinder (16) is welded on the upper side, and a liquid outlet (19) is opened on the side wall of the cylinder (16) close to the end of the turntable (5). The first rotating shaft (15) and the grinding device (14) are located at the In the inner cavity of cylinder (16); The upper side of one end of the support base (4) is fixed with a first column (6) by a screw, the upper side of the other end is fixed with a second column (2) by a screw, and the side wall of the first column (6) is welded with a fixed column. ring (8), the fixed ring (8) is fixed with a grinding liquid storage tank (7), and the liquid outlet end of the grinding liquid storage tank (7) is provided with a serpentine liquid discharge pipe (9), and the serpentine liquid discharge pipe (9) ) is provided with a liquid flow regulating valve (10), and the liquid outlet end of the serpentine discharge pipe (9) extends directly above the liquid inlet end of the cylinder (16), and the top of the second column (2) is welded with a beam (1), the end of the beam (1) away from the second column (2) is fixed with a second driving device (11) by screws, and the output shaft of the second driving device (11) is connected to the second rotating shaft (12) through a flange ), the other end of the second rotating shaft (12) is connected with the grinding head (13) through the flange, the grinding head (13) is located directly above the grinding device (14), and the object to be ground (17) is located Between the grinding head (13) and the grinding device (14); The grinding device (14) comprises a flow limiting device (141), a chassis (142), a liquid discharge hole (143) and a grinding pad (144), wherein the grinding pad (144) is attached to the upper side of the chassis (142), The current limiting device (141) is welded on the outer ring side wall of the chassis (142) whose vertical section is isosceles trapezoidal, wherein the cross section of the current limiting device (141) is circular, and the liquid discharge hole (143) is opened at the limit on the flow device (141). 2. chemical mechanical grinding equipment according to claim 1, is characterized in that, the cross-section and the vertical section of described support base (4) are all rectangular, and the bottom four jiaos of support base (4) are all fixed with moving by screw. roller, and the upper side outer wall of the support base (4) is stamped with a groove for supplying the grinding liquid to flow. 3. chemical mechanical grinding equipment according to claim 1, is characterized in that, described first driving device (18) and second driving device (11) all adopt motor, and first driving device (18) and second The drive devices (11) are all provided with reducers, and the signal input ends of the first drive device (18) and the second drive device (11) are connected to the PLC controller, and the steering of the two drive devices is the same. 4. A kind of chemical mechanical grinding equipment according to claim 1, characterized in that, the second column (2) and the first column (6) are parallel to each other, and the second column (2) and the beam (1) They are perpendicular to each other, and the second column (2) is provided with a lifting device (3), the lifting device (3) adopts a hydraulic cylinder, and the signal input end of the lifting device (3) is connected with a PLC controller. 5. A kind of chemical mechanical grinding equipment according to claim 1, characterized in that, the diameter of the cylinder (16) is equal to the diameter of the circumscribed circle of the flow limiting device (141), and the cylinder (16) is close to There are 5-10 liquid outlet holes (19) on one end side wall of the rotating disk (5), and the liquid outlet holes (19) are evenly arranged along the axial direction of the cylinder (16). 6. a kind of chemical mechanical grinding equipment according to claim 1, is characterized in that, the first rotating shaft (15), the second rotating shaft (12), grinding head (13) and grinding device (14) The central axis is on the same straight line. 7. A kind of chemical mechanical grinding equipment according to claim 1, is characterized in that, the vertical section of described current limiting device (141) is isosceles trapezoid, and its height is equal to the half of the height of object to be ground (17) one. 8. The chemical mechanical polishing device according to claim 1, characterized in that, the upper side wall of the chassis (142) is on the same level as the bottom end of the flow limiting device (141). 9. a kind of chemical mechanical grinding equipment according to claim 1, is characterized in that, the cross section of described grinding head (13) is circular, and vertical section is rectangular, and the diameter of grinding head (13) is less than chassis ( 142) diameter. 10. A kind of chemical mechanical grinding equipment according to claim 1, characterized in that 2-3 fixing rings (8) are welded on the side wall of the first column (6), and the fixing rings (8) Rubber rings are provided on the inner side wall.