CN200965601Y - LCD panel backlight cooling device - Google Patents

Abstract

The utility model relates to a backlight heat dissipation device of a liquid crystal panel, which comprises a liquid crystal module; a light diffusion plate arranged at the subsequent position of the liquid crystal module; a backlight heat sink, which comprises a plurality of LED chips, a circuit board, a heat sink and a heat sink, wherein the LED chips are arranged on the circuit board, a conductive layer is arranged above the LED chips, the heat sink is arranged at the subsequent part of the circuit board, and the heat sink is arranged at the subsequent part of the heat sink; therefore, when the light emitting diode is used as the backlight source of the liquid crystal panel, the color saturation and the light uniformity can be improved, and the liquid crystal panel has an excellent heat dissipation function, thereby actively improving the image quality of the liquid crystal panel.

Description

LCD panel backlight cooling device

Technical field:

The utility model relates to a liquid crystal panel, in particular to a liquid crystal panel backlight heat dissipation device which provides a liquid crystal panel backlight, has excellent color saturation and heat dissipation effect, and can further improve the display effect of the liquid crystal panel.

Background technique:

By the way, LCD panels are currently the mainstream for TV or computer screens. LCD panels are used to display images, so the color saturation requirements must be very high, which also relatively reflects the design and production quality of LCD panels. The structure of a conventional liquid crystal panel is shown in FIG. 1. The liquid crystal panel 90 includes a liquid crystal module 91, a light diffusion plate 92 and a backlight 93, wherein the backlight 93 is composed of a plurality of cold cathode tubes (CCFL). The light projected by the cold cathode tube is diffused by the light diffusion plate 92 and then enters the liquid crystal module 91 to serve as a backlight source for the liquid crystal panel 90 .

Although the aforementioned cold-cathode tubes provided by the conventional liquid crystal panel 90 can provide a backlight source, because the color saturation presented by the cold-cathode tubes is relatively low, it is obvious that the desired image quality of the liquid crystal panel 90 is higher. obstacle. In order to solve this problem, light-emitting diodes (LEDs) are used to replace cold-cathode tubes as the backlight of liquid crystal panels. Although the color saturation of light projected by light-emitting diodes is higher than that of cold-cathode tubes, The heat dissipation of light-emitting diodes is poor, and it is easy to accumulate heat to form a high temperature, which will affect the operation of the liquid crystal module, and the light uniformity of the light-emitting diodes is also poor. If the light-emitting diodes are greatly increased The distribution of the quantity of the body will also increase its production cost, which is not in line with economic benefits or unfavorable market competition. Therefore, how to solve the heat dissipation and light uniformity problems of light-emitting diodes in liquid crystal panels, and take into account the economical efficiency of their manufacture, is something that the industry or people with lofty ideals should think about and strive for breakthroughs. important topic.

In view of the above-mentioned shortcomings in the use of LCD panels and the fact that their structural design is not ideal, the author of this case started to develop and conceive its solution, hoping to develop a more quality and economical LCD panel backlight cooling device , to serve the public and promote the development of this industry, then through a long time of thinking and have the generation of the utility model.

Utility model content:

The purpose of this utility model is to provide a liquid crystal panel backlight cooling device, which uses light-emitting diodes as a backlight to improve the color saturation of the liquid crystal panel, and has an excellent heat dissipation function, and then actively improves the performance of the liquid crystal panel. image quality.

Another object of the present invention is to provide a liquid crystal panel backlight cooling device, which can effectively improve the light uniformity of the light-emitting diodes and serve as the best backlight for the liquid crystal panel.

The technical means adopted by the utility model to achieve the above purpose mainly includes a liquid crystal module; a light diffusion plate, which is located at the successor position of the liquid crystal module; a backlight cooling device, which includes a plurality of light-emitting diode chips 1. A circuit board, a heat dissipation plate and a heat dissipation device, the light emitting diode chip is arranged on the circuit board, a conductive layer is arranged on the top of the light emitting diode chip, and the heat dissipation plate is arranged on the circuit board The successor position of the cooling plate, and the heat dissipation device is arranged at the successor position of the heat dissipation plate.

The beneficial effects of the utility model are: using the light-emitting diode as the backlight source, it can have higher color saturation and better light uniformity at the same time, and has an excellent heat dissipation function, which can greatly improve the image of the liquid crystal panel Image quality.

Description of drawings:

FIG. 1 is a schematic structural diagram of a conventional liquid crystal panel;

Fig. 2 is a structural representation of the utility model;

Fig. 3 is the structure schematic diagram of light-emitting diode chip of the present invention;

Fig. 4 is a schematic diagram of the perforation arrangement of the conductive layer of the light-emitting diode chip of the present invention;

Fig. 5A is a schematic diagram of the first embodiment of the heat dissipation device of the present invention;

Fig. 5B is a schematic diagram of the second embodiment of the heat dissipation device of the present invention;

Fig. 5C is a schematic diagram of the third embodiment of the heat dissipation device of the present invention;

Fig. 5D is a schematic diagram of the fourth embodiment of the heat dissipation device of the present invention;

Fig. 5E is a schematic diagram of the fifth embodiment of the heat dissipation device of the present invention;

Fig. 5F is a schematic diagram of the sixth embodiment of the heat dissipation device of the present invention;

Description of figure number:

90 LCD panel 91 LCD module

92 light diffusion plate 93 backlight

100 LCD panels 10 LCD modules

20 light diffusion plate 30 backlight cooling device

31 light-emitting diode chip 32 circuit board

35 cooling plate 36 cooling device

33 insulating layers 350 grooves

34 conductive layer 311 first wave front

341 perforation 312 second wave front

36A Mesh Cooling Pad 36B Metal Perforated Mesh

36C cooling pipe 36D fan

36E aluminum extruded heat sink 360E groove

Detailed ways:

In order to enable the examiner to have a better understanding and understanding of the technical features and achieved effects of the utility model, I would like to provide a diagram of a better embodiment and a detailed description, as follows:

Please refer to Fig. 2, the liquid crystal panel 100 of the present utility model comprises a liquid crystal module 10, a light diffusion plate 20 and a backlight cooling device 30; The device 30 is located at the successor position of the light diffusion plate 20, wherein the backlight heat dissipation device 30 further includes a plurality of light emitting diode chips 31, a circuit board 32, a heat dissipation plate 35 and a heat dissipation device 36, the light emitting two Pole chip 31 (LED Chip) is located on the circuit board 32 (such as surface soldering technology-SMD), the light emitting diode chip 31 can also be packaged; the circuit board 32 is provided with an insulating layer behind 33, used to isolate the circuit layer connecting the heat dissipation plate 35 and the light-emitting diode 31; the heat dissipation plate 35 is located at the subsequent position of the circuit board 32, as heat dissipation, in a preferred embodiment, the heat dissipation plate 35 is a metal plate, which is used to provide a better heat dissipation function, and the heat dissipation device 36 (described in detail below) is provided behind the heat dissipation plate 35 .

Referring to Fig. 3, a conductive layer 34 is arranged above the light emitting diode chip 31. When the light emitting diode chip 31 emits a light source to the conductive layer 34, light source diffraction (Diffraction) will be produced as a spherical first A wave front 311, the first wave fronts 311 are transmitted for a certain distance and then meet each other to form an expanded irradiation area, and the illumination brightness of the LED light source is quite uniform due to the mutual interference of the first wave fronts 311. In a preferred embodiment, the length of the conductive layer 34 is greater than the length of the emitting surface above the LED chip 31 .

Referring to FIG. 4, the conductive layer 34 is further provided with a perforation 341. When the light source emitted by the LED chip 31 passes through the perforation 341 of the conductive layer 34, a single slit diffracted second wavefront 312 is generated. Since the second wavefront 312 is generated above the perforation 341 of the conductive layer 34, the distance between the second wavefront 312 and the first wavefront 311 to complete the expansion of the illuminated area of the light source becomes shorter, that is, the light source can be closer The expanded irradiation area is formed within the distance. And design like this can make the first wave front 311 produced on both sides of the light-emitting diode chip 31, and the second wave front 312 produced by the conductive layer 34 through the single slit of the perforation 341, after the two interfere, it will make Brightness is more uniform. Moreover, the perforation 341 can be arranged in plural to enhance its illumination effect; furthermore, the perforation 341 can be formed on the conductive layer 34 by an etching process, or use metal particles doped with light-transmitting particles to be screen-printed. The conductive layer 34 is formed, and the light-transmitting particles act like the perforation 341 to generate the second wavefront 312 .

Please refer to FIG. 2 and FIG. 5A together. The heat dissipation device 36 includes a mesh heat dissipation pad 36A, which is fixed on the heat dissipation plate 35. The mesh heat dissipation pad 36A is formed by weaving metal materials. .

As shown in Figure 5B, it is the second embodiment of the heat dissipation device of the present invention. The heat dissipation device 36 includes a metal perforated net 36B, and the metal perforated net 36B is fixed on the heat dissipation plate 35. The metal perforated net 36B can be a metal The sheet is rolled to form thermal perforations therein.

As shown in FIG. 5C, it is the third embodiment of the heat dissipation device of the present invention. The heat dissipation device 36 includes a heat dissipation pipe (HeatPipe) 36C arranged on the heat dissipation plate 35, and a cooling liquid is arranged in the heat dissipation pipe 36C. The heat energy on the cooling plate 35 is taken away by means of circulating flow.

As shown in Figure 5D, it is the fourth embodiment of the heat dissipation device of the present utility model. The heat dissipation device 36 includes a fan 36D arranged on the heat dissipation plate 35, and the wind force of the fan 36D blows away the heat on the heat dissipation plate 35. heat energy.

As shown in Figure 5E, it is the fifth embodiment of the heat dissipation device of the present invention. The heat dissipation device 36 includes an extruded aluminum heat dissipation plate 36E, which can be fixed on the heat dissipation plate 35 by pasting or other methods. One end of the extruded aluminum heat sink 36E is a fin-shaped plate with a plurality of grooves 360E.

As shown in Figure 5F, it is the sixth embodiment of the heat sink of the present invention. The heat sink 36 can be directly formed on the heat sink 35, that is, the rear end of the heat sink 35 is a fin-shaped plate with a plurality of grooves 350. , so that it has a better heat dissipation function.

In the foregoing embodiments of the heat dissipation device, the heat dissipation device 36 can be used in combination of two or more implementations to further improve its heat dissipation effect.

The utility model liquid crystal panel backlight cooling device, the light projected by the light-emitting diode chip 31 enters the liquid crystal module 10 after being diffused by the light diffusion plate 20, as the backlight source of the liquid crystal panel 100; and because the heat dissipation plate 35 And the setting of the heat dissipation device 36 can properly cool down the high heat generated by the light emitting diode chip 31 to ensure the operational performance and service life of the liquid crystal module 10; and the light emitting diode chip 31 is passed through the After the conductive layer 34 is set, its luminosity can be greatly improved. Therefore, when the utility model utilizes light-emitting diodes as the backlight source, it can have higher color saturation and better light uniformity at the same time, and can completely solve the defects related to the conventional technology, thereby greatly improving the liquid crystal display. The image quality of the panel is poor.

The above are only preferred embodiments of the present utility model, and are not used to limit the scope of implementation of the present utility model. All equal changes and modifications are done according to the shape, structure, characteristics and spirit described in the scope of the patent claims. , should be included in the scope of the patent claims.

Claims (15)

1. A liquid crystal panel backlight cooling device, characterized in that it comprises: a liquid crystal module; A light diffusion plate is arranged on the successor part of the liquid crystal module; A backlight cooling device, which includes a plurality of light-emitting diode chips, a circuit board, a heat dissipation plate and a heat dissipation device, the light-emitting diode chip is arranged on the circuit board, and the top of the light-emitting diode chip is A conductive layer is provided, the heat dissipation plate is arranged on the subsequent part of the circuit board, and the heat dissipation device is arranged on the subsequent part of the heat dissipation plate. 2. The liquid crystal panel backlight heat dissipation device according to claim 1, wherein the light-emitting diode chip can be packaged. 3. The liquid crystal panel backlight heat dissipation device according to claim 1, wherein an insulating layer is provided behind the circuit board to isolate the heat dissipation plate from the circuit layer connected to the light-emitting diode. 4. The liquid crystal panel backlight heat dissipation device according to claim 1, wherein the heat dissipation plate is a metal plate. 5. The liquid crystal panel backlight cooling device according to claim 1, wherein the length of the conductive layer is preferably greater than the length of the emitting surface above the light emitting diode chip. 6. The liquid crystal panel backlight cooling device according to claim 1, wherein the conductive layer is provided with at least one through hole. 7. The liquid crystal panel backlight cooling device as claimed in claim 6, wherein the through hole is formed on the conductive layer by an etching process. 8 . The liquid crystal panel backlight cooling device according to claim 6 , wherein the through hole can be formed by doping the light-transmitting particles with metal particles through screen printing to form the light-transmitting particles like the through-hole. 9. The liquid crystal panel backlight heat dissipation device according to claim 1, wherein the heat dissipation device is a mesh heat dissipation pad, and the mesh heat dissipation pad is formed by weaving metal materials. 10. The liquid crystal panel backlight cooling device according to claim 1, wherein the cooling device is a metal perforated mesh. 11. The liquid crystal panel backlight cooling device according to claim 10, characterized in that, the perforated metal mesh is a heat dissipation perforation formed by rolling a metal sheet. 12. The liquid crystal panel backlight heat dissipation device according to claim 1, wherein the heat dissipation device is a cooling heat dissipation pipe disposed on the heat dissipation plate. 13. The liquid crystal panel backlight cooling device as claimed in claim 1, wherein the cooling device is a fan. 14. The liquid crystal panel backlight heat dissipation device according to claim 1, wherein the heat dissipation device is an extruded aluminum heat dissipation plate, and one end of the aluminum extruded heat dissipation plate is a fin-shaped plate with a plurality of grooves. 15. The liquid crystal panel backlight heat dissipation device according to claim 1, wherein the heat dissipation device is a fin-shaped plate with a plurality of grooves directly formed on the heat dissipation plate.

Images