High-brightness backlight plate
Technical Field
The utility model relates to the field of light display components, in particular to a high-brightness backlight plate.
Background
In the prior art, the LED lamps of the vehicle-mounted backlight are usually arranged on the side edges, but the area of the side edges is smaller, the number of the lamp beads which can be arranged is smaller, the brightness is darker, and the requirements of some equipment with higher brightness cannot be met.
Therefore, there is an urgent need to provide a backlight plate with high brightness.
Disclosure of utility model
The utility model aims to overcome the defects in the prior art and provide a backlight plate with high brightness.
The aim of the utility model is realized by the following technical scheme:
A high-brightness backlight plate is used for illuminating a display assembly and comprises a substrate and a light source assembly, wherein the substrate comprises a first side face and a second side face which are opposite, the first side face faces the display assembly to be illuminated, and the light source assembly is arranged on the first side face.
In one embodiment, the light source assembly is a plurality of LED lamps, and the LED lamps are equally spaced on the first side.
In one embodiment, the substrate is an aluminum alloy sheet.
In one embodiment, the second side is provided with a heat dissipating assembly.
In one embodiment, the heat dissipating component is a graphite sheet.
In one embodiment, the heat dissipation component is an aluminum alloy heat dissipation member, and multiple heat dissipation blades are arranged on the aluminum alloy heat dissipation member.
In one embodiment, the aluminum alloy heat sink is screwed with the aluminum alloy plate.
In one embodiment, the aluminum alloy heat dissipation element is provided with a heat-conducting silicone grease layer.
In one embodiment, the second side surface is provided with a circuit board positioning area, and the heat dissipation assembly and the circuit board positioning area are arranged in an avoiding manner.
In one embodiment, the aluminum alloy plate and the aluminum alloy heat dissipation piece are respectively provided with 4 corresponding screw holes, and the aluminum alloy plate and the aluminum alloy heat dissipation piece are in threaded connection through the 4 screws and the 4 corresponding screw holes.
Compared with the prior art, the utility model has at least the following advantages:
1. Compared with the prior art, the high-brightness backlight plate has the advantages that the light source component is arranged on the first side face of the substrate, and the surface area of the first side face is larger than that of the side face of the substrate, so that the number of LED lamps which can be arranged on the side face is smaller, the number of the lamp beads which can be arranged on the first side face of the substrate is larger, the brightness is higher, the application environment with higher working requirements can be met, and the use experience of a user is improved.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings that are required to be used in the embodiments will be briefly described.
FIG. 1 is a schematic diagram of a high brightness backlight board according to an embodiment of the utility model;
FIG. 2 is a schematic diagram of a high brightness backlight according to an embodiment of the utility model;
fig. 3 is a schematic structural diagram of a high brightness backlight board according to an embodiment of the utility model.
Reference numerals:
The LED lamp comprises a substrate 10, a first side A, a second side B, a light source assembly 20, a heat dissipation assembly 30, a circuit board positioning area 40 and screws 50.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings.
Referring to fig. 1 and 2, the embodiment of the application provides a high brightness backlight board, which includes a substrate 10 and a light source assembly 20, wherein the substrate 10 includes a first side a and a second side B, the first side a faces to a display assembly to be illuminated, the light source assembly 20 is disposed on the first side a, compared with the prior art that the light source assembly 20 is disposed on a side of the substrate 10, since the surface area of the first side a is larger than that of the side of the substrate 10, the number of the LEDs that can be disposed on the side is smaller, and the application can dispose more beads on the first side a of the substrate 10, has stronger brightness, can meet the application environment with higher working requirements, and thus improves the user experience.
Further, referring to fig. 2, the light source assembly 20 is a plurality of LED lamps, which are disposed on the first side a of the substrate 10 at equal intervals, for example, the LED lamps are arranged in five rows and four columns, and are arranged on the first side a to uniformly illuminate the display assembly, so that the illumination brightness is greatly improved compared with that of one row in the prior art.
Still further, referring to fig. 1 and 3, since a large amount of heat is generated when the LED lamp works, the substrate 10 is made of aluminum alloy plate made of aluminum alloy metal material, so that the heat generated by the LED lamp works is dissipated to the outside, thereby protecting the working performance of the LED lamp and prolonging the service life of the LED lamp.
In order to further enhance the heat dissipation effect, the heat dissipation assembly 30 is disposed on the second side B of the aluminum alloy plate, and the heat dissipation assembly 30 has good heat dissipation performance, so that heat generated by the LED lamp is rapidly transferred into the aluminum alloy plate and the heat dissipation assembly 30, and the aluminum alloy plate and the heat dissipation assembly 30 rapidly dissipate heat.
In one embodiment, the heat dissipation assembly 30 is a graphite sheet, which has a large effective surface area for dissipating heat, and can be smoothly attached to the second side B,
In another embodiment, the heat dissipating component 30 is an aluminum alloy heat dissipating member, on which multiple heat dissipating fins are disposed, and the heat dissipating fins are perpendicular to the second side B, and because the aluminum alloy heat dissipating member is made of an aluminum alloy material, the heat generated by the LED lamp is quickly taken away by the aluminum alloy plate and the aluminum alloy heat dissipating member, so as to maintain a working environment with a lower temperature for the LED lamp to work.
Further, referring to fig. 3, the aluminum alloy heat dissipation member is screwed to the aluminum alloy plate, so that the aluminum alloy heat dissipation member and the aluminum alloy plate conduct heat rapidly, and dissipate in air, and the connection between the aluminum alloy heat dissipation member and the aluminum alloy plate is more stable and easy to detach due to the screw connection. Specifically, the embodiment of the application further comprises 4 high-temperature-resistant screws 50, and 4 corresponding screw holes are respectively formed in the aluminum alloy plate and the aluminum alloy heat dissipation piece, and the aluminum alloy plate and the aluminum alloy heat dissipation piece are in threaded connection through the 4 screws 50 and the 4 corresponding screw holes.
Further, the aluminum alloy heat dissipation piece is provided with a heat-conducting silicone grease layer, and the heat-conducting silicone grease layer is made of heat-conducting silicone grease heat dissipation materials, so that the heat dissipation effect is further enhanced.
In addition, referring to fig. 3, a second side B of the aluminum alloy plate is provided with a circuit board positioning area 40, and the heat dissipating component 30 is disposed away from the circuit board positioning area 40, so as to facilitate the circuit board arrangement.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model, which are within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.