CN1454318A - System, method, and apparatus for electromagnetic compatibility-driven product design - Google Patents

Abstract

A system, method, and apparatus for electromagnetic compatibility-driven design of electronic devices and systems according to one embodiment of the invention performs measurement of emissions from electronic devices and accounts for electromagnetic interactions among the functional blocks of an electronic system during the design phase. In an exemplary application, a characterization of near-field emissions is used to calculate radiation intensity in near- and/or far-field regions.

Description

Be used for system, method and apparatus that Electro Magnetic Compatibility drives product design

Related application

The application requires the U.S. Provisional Patent Application No.60/222 that is entitled as " System; Method; and Apparatusfor Field Scanning " of submission on August 3rd, 2000,906 and the U.S. Provisional Patent Application No.60/304 that is entitled as " Method of Compl iance Testing " that submits to July 10 calendar year 2001,479 interests.

Background

Invention field

The present invention relates to the design and the test of electronic installation and system.

Background information

The electromagnetic radiation of measuring sensor, printed circuit board (PCB) and electronic installation and system is very important, the reasons are as follows.At first, the electromagnetic interference (EMI) that circuit produces can cause undesirable influence to other circuit in same device and other device.Therefore, Electro Magnetic Compatibility is related to the operate as normal of emitter and other apparatus adjacent.Secondly, wasted the power that does not convert this device expectation output to.This power dissipates with Electromagnetic Launching, comprises infrared (IR) or heat radiation, and is especially harmful to the battery life of portable product such as radio communication device.In addition, in order to set up and keep the consistance with specified limits, must monitor the EMI radiation.

To the portable product of radio communication one class, require miniaturization, light weight and low-power consumption and work in uncertain environment, the performance requirement of these designing requirements and enhancing as enhance system function, direct contradiction such as communication bandwidth and data throughout.Do not pay attention to element/device Electro Magnetic Compatibility earlier in the design phase, just can't produce and to satisfy these products of contradiction requirement in groups, therefore wish to have the electromagnetic compatibility of supporting electronic installation and system and drive the instrument that designs.

Summary of the invention

The equipment of one embodiment of the invention comprises the sensor of an output several data signal, a kind of mechanism controllably sets up multiple positioning relation with three dimensional constitution between sensor and source, the energy field of each data-signal representative source emission is with one or more influences to described sensor of a kind of positioning relation of correspondence.Processing unit receives this data-signal and the locating information relevant with multiple positioning relation, and the output field feature, and this feature comprises the three-dimensional feature expression of energy field to the sensor influence.

In obtaining a kind of method of radiation data, signal is received from sensor, and this signal is represented the influence of electromagnetic field to sensor, and selects this signal to exceed the frequency of threshold value.Received signal comprises the quality of the tested device at launching site being imported an excitation signal and/or change excitation signal; Also comprise the loss that signal paths such as loss and cable loss are inserted in the transport function and/or the compensation of this signal application sensor.

Set up the positioning relation of sensor and tested device, in the plane that is arranged essentially parallel to the tested device surface, move such as sensor.To every kind of positioning relation, the data-signal of reception is represented this influence to sensor, and measures the quality (as direction or the size in magnetic field) of this data-signal in selected frequency.

In the method for obtaining radiation data of another embodiment of the present invention, set up the positioning relation of sensor and field source.Data-signal is received from sensor, and each signal is represented with the influence to sensor of the different positioning relations of correspondence.Receive data-signal and comprise cable loss in the transport function of application sensors and/or the signal that compensation is received from sensor.According to a size and a direction that characterizes this vector, obtain data value by each data-signal.This method also comprises uses the transport function that obtains this sensor with reference to the field source correcting sensor.

In the method for obtaining radiation data of another embodiment of the present invention, set up the positioning relation of sensor and field source.When setting up these and concerning, sensor and source one of them or both relatively move.Data-signal is received from sensor, and each signal represents this with the influence to sensor of the different positioning relations of correspondence, and obtains a data value by each data-signal.

According to this data value, obtain three-dimensional at least field and express.This method also comprises this expression of demonstration, but for example the pseudo-color of display field is expressed, or shows and a tandem source images of expression.This method also comprises source input excitation signal, comprises the frequency or the amplitude that change this excitation signal.

In the method for obtaining the magnetic susceptibility data of another embodiment of the present invention, make field source near electronic installation, for example this source comprises an antenna.Change a quality (as frequency or intensity) of field, receive data-signal from electronic installation (Tathagata is from many pins of device).When receiving data-signal, source and electronic installation one of them or both can relatively move.This data-signal is represented an influence to electronic installation (as the voltage based on the field induction) and corresponding different field mass values.Storage distributes based on the magnetic susceptibility of data-signal.

The storage medium of another embodiment of the present invention keeps an array, and the value that this array comprises is represented one or more electromagnetic fields of electronic installation emission.In one example, each value is corresponding to certain any two-dimensional position in the predetermined plane, and based on intensity and the direction of electromagnetic field at this point.In another example, each value is based on the size and the direction that characterize the vector of electromagnetic field in corresponding point.

The equipment of another embodiment of the present invention comprises Electromagnetic Calculation device and the electromagnetic interference (EMI) counter that is coupled with it.The Electromagnetic Calculation device receives (A) about the information of a plurality of element relative positions and (B) multiple radiation profiles, and each radiation profiles relates to the information of exporting relevant induction field in the lump of a plurality of elements.The electromagnetic interference (EMI) counter receives (C) multiple magnetic susceptibility and distributes, and every kind of magnetic susceptibility distributes and relates to one of a plurality of elements, with the information of (D) relevant induction field and export the information that relevant induction field influences.

The diagnosis of other embodiment of the present invention and estimating and measuring method comprise near-field thermal radiation, the received radiation limit of obtaining tested device and the radiation intensity of calculating tested device.Radiation intensity is with the distance and/or the frequency computation part of radiation limit regulation.The method of testing of other embodiment of the present invention comprises the radiation threshold value and/or the visual demonstration near-field thermal radiation feature of comparison radiation intensity and radiation limit.

Brief description

Fig. 1 is the locating device block diagram of one embodiment of the invention.

Fig. 2 A is the vertical view of arm 132.

Fig. 2 B is the side view of arm 132.

Fig. 3 A is the side view of interior location sensor.

Fig. 3 B is the vertical view of interior location sensor.

Fig. 4 is the sensor diagrammatic sketch of one embodiment of the invention.

Fig. 5 is the active sensor diagrammatic sketch of one embodiment of the invention.

Fig. 6 is the tabular sensor diagrammatic sketch of one embodiment of the invention.

Fig. 7 A is the tabular sensor probe portion diagrammatic sketch of one embodiment of the invention.

Fig. 7 B illustrates plate 312 and 314.

Fig. 8 is the effective capacitance diagrammatic sketch when the tabular working sensor of one embodiment of the invention.

Fig. 9 A is the short column sensor diagrammatic sketch of one embodiment of the invention.

Fig. 9 B is the spherical sensor diagrammatic sketch of one embodiment of the invention.

Figure 10 is the effective capacitance diagrammatic sketch of one embodiment of the invention when spherical working sensor.

Figure 11 is the annular sensor diagrammatic sketch of one embodiment of the invention.

Figure 12 illustrates being electrically connected of the multiturn ring 319 that is produced on the multilayer board.

Figure 13 illustrates the cross section of the multiturn ring 319 that is produced on the multilayer board.

Figure 14 is the annular sensor diagrammatic sketch of one embodiment of the invention.

Figure 15 illustrates the path of probe portion in the plane of scanning motion.

Figure 16 is the photo that the near-field scan instrument that constitutes by one embodiment of the invention is shown.

Figure 17 illustrate by one embodiment of the invention that constitute with the near-field scan instrument block diagram fixation of sensor coupling.

Figure 18 illustrates the radiation profiles of VLSI chip.

Figure 19 illustrate by one embodiment of the invention that constitute with the near-field scan instrument block diagram rotation sensor coupling.

Figure 20 illustrates by the rotation sensor of all embodiment formations of the present invention and the photo of rotating mechanism.

Figure 21 illustrates the expression of the information of collecting with the rotation sensor of Figure 20.

Figure 22 illustrates the photo of the active magnetic field sensor that constitutes by one embodiment of the invention.

Figure 23 illustrates the photo of the some annular sensor that constitute by all embodiment of the present invention.

Figure 24 illustrates the photo of TEM sensor.

Figure 25 illustrates the comparison of the 10mm annular sensor being made the result of twice correction test.

Figure 26 illustrates the photo of the active sensor that constitutes by one embodiment of the invention.

Figure 27 illustrates the close-up shot photo of sensor shown in Figure 26.

Figure 28 illustrates the synoptic diagram of sensor shown in Figure 26.

Figure 29 illustrates the S11 curve of short twisted-pair feeder.

Figure 30 illustrates by the rotation sensor of all embodiment formations of the present invention and the photo of rotating mechanism.

Figure 31 illustrates by the rotation sensor of all embodiment formations of the present invention and the photo of stepper motor rotating mechanism.

The photo of Figure 32 is pointed out the locating laser device on the rotating mechanism that constitutes by one embodiment of the invention.

Figure 33 illustrates the interior location switch synoptic diagram of the rotating mechanism that constitutes by one embodiment of the invention.

Figure 34 illustrates and uses the correction result's that the active sensor that constitutes by one embodiment of the invention and TEM sensor obtain screen to show.

Figure 35 illustrates and uses the result's that the rotation sensor that constitutes by one embodiment of the invention obtains screen to show.

Figure 36 represents to use the information representation of the rotation sensor collection that constitutes by one embodiment of the invention.

Figure 37 illustrates and uses the correction result's that the E field short column sensor that constitutes by one embodiment of the invention obtains screen to show.

Figure 38 illustration one defines by the plane of incidence of the spherical sensor of 2mm that one embodiment of the invention constitutes.

Figure 39 illustrates the transfer curve of the spherical sensor of 2mm when parallel and vertical polarization that constitutes by one embodiment of the invention.

Figure 40 illustrates the operation system map of specific embodiment of the present invention.

Figure 41 illustrates the constitutional diagram of program and engine in the operating system of specific embodiment of the present invention.

Figure 42 illustrates the processing flow chart of the operating system of specific embodiment of the present invention.

Figure 43 illustrates the starting menu block diagram of the operating system of specific embodiment of the present invention.

Figure 44 illustrates the input screen of the operating system of specific embodiment of the present invention.

Figure 45 illustrates the preview mask figure of the operating system of specific embodiment of the present invention.

Figure 46 illustrates the preview screen of the operating system of specific embodiment of the present invention.

Figure 47 illustrates the operating system preview level process flow diagram of specific embodiment of the present invention.

Figure 48 illustrates the starting of the operating system of characteristic embodiment of the present invention and selects screen.

Figure 49 illustrates the operating system screen of specific embodiment of the present invention, can select, imports or edit sensor transfer function thereon.

Figure 50 is illustrated in can be to the display window of fc-specific test FC regulation DUT scanning area and increment in the operating system preview screen of specific embodiment of the present invention.

The operating system that Figure 51 illustrates specific embodiment of the present invention shows the screen that the selection of z axle parameter is talked with.

The operating system that Figure 52 illustrates specific embodiment of the present invention shows the screen that spectrum analyzer is set up to the fixation of sensor scan operation.

The operating system that Figure 53 illustrates specific embodiment of the present invention shows the screen that spectrum analyzer is set up to the rotation sensor scan operation.

Figure 54 illustrates the electrical diagram of doing the rotation sensor scan operation with the operating system of specific embodiment of the present invention.

Figure 55 illustrates the preview screen structure of the operating system of specific embodiment of the present invention.

Figure 56 illustrates the IR sensor of the operating system of specific embodiment of the present invention and sets up screen.

The peak that Figure 57 illustrates the operating system of specific embodiment of the present invention monitors search foundation screen.

Figure 58 illustrates the scan screen structure of the operating system of specific embodiment of the present invention.

Figure 59 illustrates the screen that comprises with the real-time reading scan operation of the operating system of specific embodiment of the present invention.

Figure 60 illustrates the operating system indication field intensity of specific embodiment of the present invention and the screen of rotation relationship shows.

Figure 61 illustrates the scan screen structure of the operating system of specific embodiment of the present invention.

Figure 62 illustrate specific embodiment of the present invention operating system manifest the screen structure.

Figure 63 illustrate specific embodiment of the present invention operating system manifest screen.

The screen that Figure 64 illustrates the operating system indication field decay of specific embodiment of the present invention shows.

The screen that Figure 65 illustrates the operating system of specific embodiment of the present invention shows, the position of indication sensor relative tested device on the device bitmap images.

The screen that Figure 66 illustrates the operating system of specific embodiment of the present invention shows that indication is monitored signal Spectrum Analysis instrument waveform.

Figure 67 illustrate specific embodiment of the present invention operating system manifest the screen structure.

Figure 68 illustrate specific embodiment of the present invention operating system manifest the screen structure.

The sensor calibration screen that Figure 69 illustrates the operating system of specific embodiment of the present invention shows.

Figure 70 illustrates the process flow diagram of robotization placement tool.

Figure 71 illustrates the method flow diagram of one embodiment of the invention.

Figure 72 illustrates the process flow diagram of Figure 71 method expansion.

Figure 73 illustrates the process flow diagram of another expansion of Figure 71 method.

Figure 74 illustrates the process flow diagram of Figure 73 method expansion.

Figure 75 illustrates the method flow diagram of another embodiment of the present invention.

Figure 76 illustrates the expansion of Figure 75 method.

Figure 77 illustrates the another kind expansion of Figure 75 method.

Figure 78 illustrates the block diagram of one embodiment of the invention equipment.

Figure 79 illustrates the circuit board with element of radiation profiles in some indicating predetermined districts.

Figure 80 illustrates the expression of Figure 79, and indication is corresponding to the induction field of the calculating of radiation profiles.

Figure 81 illustrates the diagnosis of one embodiment of the invention.

Figure 82 illustrates the diagnosis of one embodiment of the invention.

Figure 83 illustrates the Evaluation Method of one embodiment of the invention.

Figure 84 illustrates the Evaluation Method of one embodiment of the invention.

Figure 85 illustrates the actinometry method of one embodiment of the invention.

Figure 86 illustrates the radiation profiles of VLSI chip when 12MHz.

Figure 87 illustrates the radiation profiles of VLSI chip when 60MHz.

Figure 88 illustrates the electric field feature of VLSI tube core when 20MHz.

Circuit board (left side) is shown Figure 89 and VLSI chip (right side) is subjected to the electric field scanning result in the zone of 20MHz radiation effect.

Figure 90 illustrates VLSI tube core (top) and circuit board (end) magnetic field radiation distributes when 20MHz pseudo-color and profile diagram.

The electric field radiation that Figure 91 illustrates normal wave filter (A) and fault filter (B) distributes.

Figure 92 illustrates the radiation profiles of AC adapter under its basic switch frequency (65KHz).

Figure 93 illustrates the radiation profiles of cell phone under 340MHz.

Figure 94 illustrates the radiation profiles of cell phone under 60MHz that is obtained by the magnetic field sensor that constitutes by one embodiment of the invention.

Figure 95 illustrates four separate planes above product of cell phone shown in Figure 94 and sentences the near-field signature that 60MHz uses the magnetic field sensor that constitutes by one embodiment of the invention to record.

The spectral content that Figure 96 is illustrated in the VLSI chip print of being made by two different foundry goods that records in 180～185MHz relatively.

Figure 97 illustrates respectively the radiation spectrum comparison of three ASIC A, B making with 0.42,0.35 and 0.25 micron process and C.

Figure 98 illustrates the radiation profiles of pair transistor test board.

Figure 99 illustrates another radiation profiles of the described pair transistor circuit of Figure 98.

Figure 100 illustrates the process flow diagram of the EMI/EMC driving computer-implemented method of one embodiment of the invention.

Describe in detail

By the accurate location automatically of sensor, the equipment of one embodiment of the invention is collected the near field characteristic data of DUT.DUT can be active device, printed circuit board (PCB), interconnection line or whole electronic products such as passive element, integrated circuit.In an example embodiment, DUT places on the turntable, and sensor is connected to mechanical arm or other detent mechanism with three degree of freedom, and data are handled through aut.eq., produce the space distribution of this DUT near-field thermal radiation.The radiation in each zone of data and electromagnetic spectrum (comprising RF and infrared region) of collecting is relevant, and measures with fixing or rotation sensor.In another embodiment, a plurality of points critically are provided with an emitting antenna near DUT, also handle the data that so obtain by monitoring all or the DUT output terminal subclass of selecting, and characterize the magnetic susceptibility of this DUT to radiation.

System, the method and apparatus of all embodiment of the present invention described herein can be applicable to following one or more occasions.In addition, the method for one embodiment of the invention can obtain with similar results that other system or equipment obtained.

1) frequency, feature and/or the position of electromagnetic radiation source and/or interference effect mechanism in identification Electronic Components And Devices, RF hardware, circuit board and other electronic product.

2) provide by device parameter such as correct selection work frequency, clock edge and Electronic Packaging to optimize the principle that lay on the chip plane, be convenient to and/or carry out the design of the special IC (ASIC) that hangs down radiation.

3) ASIC and other electronic unit and product are set up the near-field thermal radiation rules, with identification and reject the electronic unit of high near-field thermal radiation, examination foundry goods and manufacturing process.

4) the specific ASIC of research changes the radiation level variation that (being processing dimension, distribute power and total arrangement) causes because of device characteristic.

5) when the design beginning, provide element and device radiation feature information.

6) radiation characteristic and the applicability of the encapsulation of research ASIC and other electron component are set up the selection and the principle of design of this encapsulation, and the examination Electronic Packaging, relatively contain the radiance of the difference encapsulation of same ASIC.

7) the research processing dimension provides the information of inner transit time and radiation spectrum bandwidth relationship to the influence of radiation spectrum.

8) assessment is used for the material of wireless occasion and the near field shielding validity of physical dimension.

9) the near-field thermal radiation performance of more different ASIC designs.

10) make the actinometry of system and product one-level.This application helps that individual component meets the FCC standard but the combination back does not meet the situation of standard and/or cisco unity malfunction because of interference problem.

11) performance of evaluation RF and microwave connector and antenna.

12), and make the space heat distribution distribute relevant with space RF by making the DC field measurement and/or set up distribution curve in the measurement in the infrared band of electromagnetic spectrum and/or another zone.This application is fit to for example study the RF heating effect to the encapsulation of RF devices such as power amplifier, monitors the temperature of the core parts that use among the ASIC such as random access and flash memory.

13), be provided for direction and amplitude data that specific absorption rate (SAR) is measured according to the standard of Federal Communications Committee (FCC) and/or other wireless personal communications product or the requirement of standard group.

14) for example the RF of physical imperfection by identification RF wave filter and connector, the Electronic Packaging of breaking, circuit board etc. sews the tracing trouble analysis.

15) exploitation is for the radiation and the magnetic susceptibility database of the use of computer-aided design (CAD) (CAD) instrument.

16) make magnetic susceptibility measurement by near device, element and system, forming electromagnetic field, to assess this influence to these parts.

17) multi-chip module and three-dimensional electronic encapsulation are done the near-field thermal radiation measurement, evaluate its design and performance.

18) the noise plane of measurement mechanism or product surrounding space, noise refers at random a kind of or asynchronous procedure.

19) do single the triggering and measure, to study the relevant incident of EMI/EMC that during little time window, to observe.

20) change the amplitude in the signal/source that applies simultaneously with single-frequency, or change source frequency simultaneously, circuit board or device or element are made actinometry with fixed amplitude.This application can provide valuable information to the characteristic of the last interference mechanism of working of DUT, especially can produce visual transport function to every kind of situation.This information helps checking the given design that a series of frequencies and/or amplitude are done.

21) obtain direction and the size of magnetic field at each scanning position.In this is used,, can write down the maximum field strength of each scanning position and the angle that it occurs by the rotary magnetic field sensor.The characteristic in sensor output indication magnetic field or to the characteristic of its electric current that causes.By the vector that the output of each scanning position is derived, for example can be by pseudo-color reflection method coding.According to one embodiment of the invention, the rotation sensor radiation data of also available each device is set up the radiation data storehouse to cad tools, and this moment, available mathematical method arrived current density, the therefrom near field of calculation system any point and/or far field with data-switching.

Hardware

The radiation of electronic installation was measured by the artificial sample probe that uses in the past always, promptly a kind of technology of seeking harsh " focus " general position that is limited to.In a kind of commercial application, settle a sample probe array in the grid below test surfaces, (DUT) installs on the test surfaces with tested device, and scans this array.A shortcoming of probe array is that any Measurement Resolution that obtains all is limited by the size of indivedual probes and the spacing of probe.Therefore, use probe array to be limited to the measurement of making circuit board or product one-level, precision is enough to discern the near field sources position of DUT surrounding space far from.

Another shortcoming of probe array is the measured value that can only provide two dimension to limit, the basis of the authentic communication that this class measured value can not develop as the distance between relevant near field and the source or decay.An important results is that the measured value that obtains can not be used for determining the near field classification of emission.

The 3rd shortcoming of probe array is the field that the measured value that obtains can not accurately be represented the DUT actual transmission.Because array must have big quantity sensor just can obtain useful resolution, so the possibility of the inaccuracy of causing is arranged.Therefore, this array is easy to DUT is loaded, and all unit of array also can directly or by DUT interaction take place each other.In addition, the array shell can make the measured value distortion at some frequency generation resonance.

The 4th shortcoming of probe array is only to be applicable to the ring-shaped article sensor, thereby this type of sensor electric near field of energy measurement not.

Another quality that existing instrument lacks is a modularity, even because of in its limited functional and reliability scope, this quasi-instrument also can only with the standard probe coupling.In addition, existing instrument of this class and method are obtained the relative measurement value at the most, can't obtain quantified measures (measuring as supporting electromagnetic measurement).And the existing instrument of this class and undecomposable E of method or H field component also can't the measurement field directions.

The IC industry is used the electromagnetic radiation of transverse-electromagnetic (TEM) sensor evaluation IC at present.Radiation test is DUT to be placed in the TEM sensor carry out.A kind of so visible standard J1752/3 of Evaluation Method (" the Electromagnetic Compatibility Measurement Procedures forIntegrated Circuits:Integrated Circuit Radiated Emission MeasurementProcedure; 150KHz ~ 100MHz; TEM Cell " that publish March nineteen ninety-five) (SAE (Warrendale, PA)).Though the TEM sensor can be indicated radiationless and radiation level, can not the interior radiation source positions of recognition device, also can't discern the interference mechanism that causes tested device or system's malfunction.

Fig. 1 illustrates the locating device 100 of one embodiment of the invention.Tested device (DUT) 10 is placed on the platform 110, and the latter can be movable platforms such as the static platform of Fig. 1, or turntable.In an exemplary method, platform 110 comprises the polymer surfaces of selecting for minimal reflection; The little circuit board that also can comprise the effect of electromagnetism buphthalmos.For example, the sort circuit plate comprises a passive element array, and it has the zero point that can detect to the sensor reference position in particular spatial location (being not more than the minimum stride of locating device 100 as area).Platform 110 also can comprise other registration element (as mechanical buphthalmos, hole and/or the pin that cooperates with system under test (SUT)).

Sensor 120 is near DUT 10.In an exemplary method, though sensor 120 is positioned at DUT 10 tops, for most of purposes, the relative orientation of these two objects is unimportant to implementing the present invention, for studying relevant radiation, as long as make sensor 120 enough near DUT 10.For example, as long as DUT10 is correctly fixing, sensor 120 can be placed DUT 10 the side or even below.

In an exemplary method, locating device 100 is xyz platforms, comprises three grades: the higher level 160 who moves up and down; The middle rank 150 (watching) of carrying higher level 160 and move left and right by Fig. 1; See the subordinate 140 that the direction of turnover paper moves with carrying middle rank 150 and edge from Fig. 1.The mechanical couplings effect of one of best radiationless stepper motor of utilizations at different levels and three is moved.In the application-specific of this method, at different levelsly be connected to its stepper motor through belt and pulley structure, be 18 inches along every maximum moving distance, the minor increment of adjacent position is less than 1 micron, and positioning resolution is better than 2 microns.

Need not or except the stepping electrode, but the locating device 100 also one or more rack and pinions of adapted unit, servomotor or any similar device that can do accurate spatial translation and/or rotation.From broad sense, implement this specific embodiment of the present invention, only require and locating device 100 can be controlled by coming alignment sensor critically with the suitable distance of three dimensional constitution motion.

In one embodiment of the invention shown in Figure 1 system, arm 130 is connected to locating device 100 with sensor 120, makes sensor keep vertical orientation.As mentioned above, for most of purposes, the certain orientation of arm 130 and sensor 120 is unimportant, as long as sensor 120 is suitably near DUT10.In some occasion, also wish the far-end (as only the time) of supporting arm 130 perpendicular to the plane interscan of the axis of sensor 120.

Near arbitrary device of electric field, magnetic field or thermal field output signal sensor 120 can be in response to.Since must with the locating device coupling of Fig. 1, can adopt suitable commercial device such as sample probe or infrared (IR) sensor, or use the sensor of one embodiment of the invention described herein.

An advantage of Fig. 1 locating device is a modularity.In this method, to be convenient to change or transposing sensor 120, the user can be from far-ranging for selecting the sensor of specific occasion special designs.For the transport function that compensates selected sensor (comprise correcting probe with interaction, loading effect, frequency dependent effect etc.), the characteristic of cable loss and/or any extra cell (as amplifier or wave filter) that may in sensor signal path, use, can make signal processing operations to the signal that obtains.In addition, the data of collection can manifest with various form, and can export and/or store for other occasion and use.

For doing to have the measurement of directional component, sensor 120 can be around the rotation of one of its axis, as winding the axle rotation perpendicular to the DUT surface.Fig. 2 A and 2B illustrate overlooking and side view of arm 130 among the embodiment 132 respectively, and arm 130 makes sensor 120 do the axle rotation with control mode.In this example, motor pulley 146 is contained in stepper motor 148 rotating shafts (radiationless).The rotation of motor pulley 146 reaches sensor pulley 142 by belt 144, and the latter is contained in the rotating shaft of sensor 120 (or rotating shaft of fixation of sensor 120).The adjusting mechanism 152 (as comprising one or more grooves and securing member) that is provided with is the position of (as along arm 132) adjusting stepper motor 148 at least linearly, make belt 144 correctly locate and strain, can realize the precision control of sensor 120 rotation directions like this by the automatic control of stepper motor 148.

May wish also that rotating mechanism (as arm 132) comprises the interior location sensor of indication sensor 120 orientations.In an exemplary method, interior location sensor sensor 120 turns over the time (as the optics Warning Mark on the detecting sensor 120) of an ad-hoc location.Fig. 3 A and 3B illustrate a kind of suitable construction that comprises disk 162, and rotate with sensor 120 around its axle near the hole 164 the disc circumference.In the static position of phase countershaft, an optoelectronic switch 166 with transmitter 168 and detecting device 169 is set, make the light path of disk blocking switch, unless the hole is passed through between transmitter 168 and detecting device 169.The orientation of the output signal indication sensor 120 of detecting device 169, and should orientation relevant with the measured value that probe portion 310 obtains is to indicate tested directed situation.

In other embodiments, can use non-belt drives pulley mechanism, realize the controlled rotation of sensor 120 such as tooth bar-pinion assemblies.A kind of similar rotating mechanism also can be integrated into sensor 120 rather than arm 130 structures own.Available other suitable mechanism of the rotation of sensor 120 realizes that this mechanism can be contained on the locating device 100, can rotation positioning device 100, or be used as the part of locating device 100.In other implementation method, platform 110 makes DUT 10 relative sensor 120 translations and/or rotations.Although arm 130 is useful elements of one embodiment of the invention, not the necessary parts of other embodiment of the present invention, sensor 120 directly can be installed on the locating device 100.

Fig. 3 A and 3B also illustrate the another feature that can allocate arm 130 embodiment into: registration unit 154.This unit is used for the fine registration of sensor 120 initial positions and DUT 10, and the DUT image (as numeral or the digital photo of DUT) that this aligning produces other output of a certain output and its of this equipment or other device is relevant.In a system-level measurement exemplary method, registration unit 154 comprises can provide the cross bundle pattern laser diode module of (as being used for visual reference).In another kind of device and die-level measuring method, for improving registration precision, registration unit 154 comprises ultraportable camera or other imaging device (as having CMOS or ccd sensor).

Sensor

Fig. 4 illustrates the block diagram of the sensor 120 of measuring electromagnetic field.As described herein, the characteristic of probe portion 310 is looked application-specific and/or tested type and is changed.Similarly, the characteristic of cable 230 also varies depending on the application, and for example, cable 230 may be semi-rigid and/or protected type, can be small-diameter coaxial cable (is 50 Ω as impedance).In another implementation method, cable 230 may be a twisted-pair feeder, and impedance changes with torsional angle.

Regulating circuit 240 can be inserted the signal path of cable 230, although can omit this circuit in other sensor 120 implementation methods.Regulating circuit 240 comprises passive or active filter, passive impedance matching network (as balance-balun) or for example uses the active network of field effect transistor (FET) and/or low noise amplifier.Note, cable 230 between probe portion 310 and the regulating circuit 240 needn't and the cable 230 of 250 of regulating circuit 240 and connectors of the same type, for example, the cable of regulating circuit 240 1 sides can be unbalanced type (as a concentric cable), and the opposite side cable can be balanced type (as a twisted-pair feeder).

Fig. 5 illustrates the sensor circuit figure of one embodiment of the invention, comprises the active enforcement method 242 of regulating circuit 240.Biasing T-shaped 190 (can be external in sensor) is used for power is added to sensor signal lines from DC power supply 195.In regulating circuit 242, power is added to amplifier 170 through AC piece 180, prevents that sensor signal from passing through its power supply wiring feed-in amplifier.In case of necessity, available decoupling capacitor prevents that the DC power signal is by its output terminal feed-in amplifier 170.In an exemplary method, amplifier 170 is Monolithic Microwave Integrated Circuit (MMIC), as IVA-14 series variable gain amplifier (Agilent Technologies, PaloAlto, CA).In another implementation method, change control end input at least a portion this voltage, the gain of may command amplifier 170 or other parameter by biasing T-shaped 190 dc voltage that provides and pair amplifier 170.To the balanced type operation, probe portion 310 can be connected to amplifier 170 by twisted-pair feeder.

For mechanical stability, the element of sensor 120 can be installed on arbitrary substrate 220, substrate 220 causes the tool rigidity, to tested not obviously influence.For example, substrate 220 can be glass epoxy resin or other substrate of the printed circuit board (PCB) (PCB) of making or be equipped with regulating circuit 240 on it.

The measuring-signal of induction is finally exported to external cable at connector 250 in the probe portion 310, and the latter delivers to processing unit to this signal.Connector 250 can be fit to cross over that expected frequency range carries electric signal and any structure that do not have significantly sacrificing (or being reparable loss at least).In an example application, connector 250 is that SMA connector (meeting the military performance rules MIL-PRF-39012 of U.S. Department of Defense) or another kind are fit to carry the connector of RF signal (as BNC, N).The sensor of Fig. 4 form can the time-varying field of survey frequency from hundreds of KHZ to several GHZ.

Fig. 6 illustrates the block diagram of sensor 120 tabular sensor implementation methods 122, can be used for measuring electric field.The probe portion 310 of this sensor comprises pair of conductive plate 314 and 312 (shown in Fig. 7 B), and the conductor 234 of every block of plate and concentric cable 232 is connected (shown in Fig. 7 A) with one of 236 conductions.In a particular implementation method, cable 232 is the semi-rigid 50 Ω concentric cable of a kind of minor diameter.

Each plate 312 and 314 usefulness metals are made; For example, plate can be etched into each face of two-sided PCB.In the example implementation method, plate 312 and 314 is unidimensional, is circle or rectangle, diameter from less than 2mm to being not more than 30mm.Shown in Fig. 7 B, there is a hole in plate 312 central authorities, can allow central conductor 234 not contact with it by plate 312.

Shown in Fig. 7 A, it is the medium 316 of ε that a specific inductive capacity is arranged between the plate.Capacitor C 1 is expressed as ε A/d, and wherein A is plate area (m ²), d is the distance (m) between the plate.For the output impedance of 50 Ω, the voltage V2 at plate two ends is expressed as with the ratio of tested current potential V1 $\frac{V_2}{{\mathrm{<figure-callout\; id="1"\; label="V"\; filenames="A0181540400641.png,A0181540400771.png"\; state="\{\{state\}\}">V</figure-callout>}}_1}=\frac{1}{1+\frac{C_1}{{\mathrm{<figure-callout\; id="2"\; label="C"\; filenames="A0181540400681.png,A0181540400881.png"\; state="\{\{state\}\}">C</figure-callout>}}_2}+\frac{1}{50\mathrm{\&omega;}{C}_1}}---\left(1\right)$

ω is signal frequency (radian per second) in the formula, C ₂Be the electric capacity (method) between sensor 120 and DUT 100 (as Fig. 8).

In addition, detect the spherical sensor implementation method 126 that electric field also can be used the veneer sensor implementation method of the sensor 120 of being with short column lead-in wire 317 or the sensor 120 of minor diameter ball 318 is arranged at the probe tip.The short column sensor of Fig. 9 A can only detect the vertical component (promptly having only vertical component to produce electric current in the short column lead-in wire) of incident E field.On the other hand, the spherical sensor of Fig. 9 B can detect all three kinds of components of incident E field because all three-dimensional field wires all with the spheroid tangent.

Can think that the spherical sensor of Fig. 9 B is the expansion of above-mentioned tabular sensor.Because the tabular or short column sensor of the same diameter of remolding sensitivity of spherical sensor is bigger, thus when using between spherical sensor and DUT distance bigger, the launching site is reduced to minimum to the interference of sensor.Spheroid 318 is that diameter is the brass spheroid of 1～5mm, although also can use the spheroid of other material, shape and/or size.The constructive method of spherical sensor is one section semi-rigid coaxial cable of finishing, makes a part of central conductor and cuts off body and expose, and spheroid and central conductor is welded (or conduct electricity couple together) again.Spherical sensor can be used for for example doing system-level measurement (as cell phone, expansion plate, printed circuit board (PCB)).

Spherical sensor is by showing effective capacitance C _EffTo electric field sampling, C _EffIt is the capacitor C between shielded conductor 236 and the DUT10 ₃And the capacitor C between spheroid 318 and the DUT 10 ₄The tandem compound (see figure 10).For keeping first-order approximation, can in above-mentioned expression formula (1), use C respectively ₃With C ₄Replaced C ₁With C ₂, with the relation between expression probe two ends (being between spheroid 318 and the shielded conductor 236) voltage and the tested current potential amplitude.For reduce the disturbance of tested field as far as possible, wish to reduce C ₃With C ₄, as reducing the diameter of cable 230 and spheroid 318 respectively.

The annular sensor implementation method 128 of the sensor 120 shown in Figure 11 is used to measure magnetic field.This sensor comprises ring 319, and ring 319 can be lead or metal, even can be etched into printed circuit board (PCB) (PCB).Ring 319 can be single turn ring or multiturn ring.In exemplary method, ring 319 diameter from 1mm to being not more than 10mm.Voltage V by the magnetic flux density B (vector) of field induction on ring 319 terminals can be expressed as

V＝n×B×ω×A×cos (2)

Wherein n is the ring number of turn, and ω is signal frequency (radian per second), and A is the long-pending (m of anchor ring ²), α is the angle of vector B and plane of a loop.

Figure 12 illustrates the method that the circle 262,264 and 266 that will be etched into the multiturn ring of multi-layer PCB with hidden path 272,274 and 276 interconnected and be connected to terminal trace 282 and 284.Figure 13 illustrates the cross section of this multiturn etching ring along the intercepting of AA line, and every circle of ring with interlayer insulation body 290 separately.

Figure 14 illustrates the annular sensor implementation method 129 of sensor 120, is used to measure magnetic field.In this method, balanced transmission line (as twisted-pair feeder 234) carries the signal from balance sensor ring 319.As mentioned above, select and/or change twist angle, the impedance of this cable of scalable is as the input end that cable can be adjusted to the impedance that makes ring 319 and regulating circuit 240 or with another transmission line or handle and grade be complementary.In exemplary method, ring 319 usefulness are made twisted-pair cable 234 same leads and are formed.

In an exemplary method, annular sensor 129 comprises above-mentioned active regulating circuit 242.In this method, amplifier 170 usefulness differential amplifiers constitute.With twisted-pair cable 234, the difference operation pattern has been offset its common mode interference, has the height noise immunity.

In order to characterize the launching site of two dimension or 3D region exactly, wish that the probe portion 310 that prevents sensor 120 moves (unless should move controlled) relative to the sensor remainder.For example, wish before beginning to measure the axis of probe portion 310 alignment sensor bodies is prevented that probe portion 310 from departing from this position during use.

As shown in figure 14, fragility extends 295 can constitute one section minor diameter glass tube, on the hermetically-sealed cable 230 probe portion is received the part of regulating circuit 240 and/or connector 250.This extension can prevent the displacement of the probe portion 310 relative sensor body of sensor 120, when the accidental collision of probe portion 310 (as with DUT10 or platform 110) also can reduce the damage sensor body as far as possible.Fragility is extended 295 and also is beneficial to probe portion 310 aligning (as centrally aligned) sensor body.The assembly that comprises probe portion 310, cable 230 and fragility extension 295 prepares in advance, can change rapidly during damage.Fragility extension 295 also can be used for other all implementation method of sensor 120 described herein.

Because ring 319 is oriented detection elements, so annular sensor 129 can be measured the direction of the magnetic vector of relative DUT10 ad-hoc location.For example, sensor 129 can rotate with arm 132 or above-mentioned similar means, during turning repeatedly sampling is done in its output.In an exemplary method, connector 250 is SMA connector or similar devices of a kind of rotation, can be in the rotation of system and do not transmit RF signal (with possible DC power) between the rotating element.

As described in reference Fig. 5, biasing T-shaped 190 can provide DC power supply by sensor signal alignment active sensor.When active sensor rotates with arm 132 or above-mentioned similar mechanism, wish biasing T-shaped 190 opposite side that places connector 250 with respect to probe portion 310, make biasing T-shaped 190 pairs rotations keep static.

When detecting thermal field, but application sensors 120 pairs infrared (IR) is distinguished radiosensitive implementation method.The probe portion 310 of this sensor comprises a photodiode or other photosensitive semiconductor device, and this device is through mixing, and can improve it in this regional sensitivity and/or reduce its sensitivity to other wavelength radiation.But this sensor is the adapted light filter also, prevents that undesirable radiation from arriving detecting element.

In sensor 120 another embodiment, near the radiation the DUT from the observation place with optical means (as passing through Connectorized fiber optic cabling) guiding pick-up unit far away, without electric approach by cable 230.From removing the RF cable near the DUT, this embodiment makes scanning process reduce to minimum to the influence of tested field.As when measuring thermal field, when during near DUT, using same IR sensor to sensor.When measuring magnetic field or electric field, distance sensor can be the commercial device that can change from the RF field of light signal.

Can with other type sensor of the locating device coupling of Fig. 1, comprise that probe portion 310 comprises the sensor of two vertical coil.This class sensor can be measured the size and the direction of static magnetic field or nearly static magnetic field.The probe portion 310 of another kind of sensor comprises the tube core portion of field effect transistor.When setover with one of drain electrode in the relative source of grid, available another utmost point detects electric field or electric charge, and probe also can amplify.

Use one or more MEMS (micro electro mechanical system) (MEMS) element, can dwindle the size of above-mentioned probe portion 310.For example, probe portion 310 comprises that the sensor of MEMS element can detect the field of wavelength in millimeter, inferior millimeter even infra-red range.The sensor of other type comprises the probe portion with one or more hall effect sensors, magnetoresistive transducer or superconducting quantum interference device (SQUID).Also can use the sensor of band probe described herein portion 310 arrays.Such as described herein, sensor of one embodiment of the invention and locating device can detect the signal that its value has only 1/10th microvolts (or microampere), and measure the restriction that upper limiting frequency only is subjected to the characteristic of selected particular sensor.

Operating system

When using sensor described herein and locating device, wish to realize one or more functions, comprise correcting sensor, the motion and the position of control sensor, Other Instruments such as control signal path intermediate frequency spectrum analyser, processing is received from the signal of sensor and/or DUT, and collection and impression data.For example, wish that the control sensor moves through a certain particular area or volume with respect to DUT, receive simultaneously, handle, store and/or shows that sensor exports with particular area or volume in the relevant data of electromagnetic field that present.In an exemplary method, the Several Methods of all embodiment of operating system coordinated implementation the present invention described herein (as comprising this class function).

This type operating system can be designed to same basically operation; use same basically interface; and irrelevant with the scale or the specific characteristic in groups of controlled sensor and locating device, and also and the particular procedure, data aggregation and/or the signal generating apparatus that appear in the signal path irrelevant.To scan operation, the user interface of this operating system generally is divided into three kinds of states: prepare, scan and manifest.The function that preproduction phase carries out comprises:

1) selects the suitable sensor of expecting the application scenario.Comprise field type, sensitivity, signal to noise ratio (S/N ratio) and resolution or the spot size (as measuring with reference to the source) of sensor with selecting relevant sensor characteristic to one or more;

2) the preparation signal path comprises a low noise amplifier (LNA) as hope in signal path, or wishes to reduce the gain level of amplifier in the path or prime amplifier.May wish that the path of preparing comprises signal processing units such as one or more wave filters, perhaps other factors such as compensating cable loss and amplifier noise index.Also may wish the transition function (as resulting) of compensation sensor by calibration process as herein described.At this moment, for automatic identification sensor also selects suitable transport function (as selecting to contain the specific file of this transport function then, or the catalogue or the file of this file are stored in indication), can comprise an identification mechanism (as comprising mechanical keys and/or optics and/or the electric mechanism that detects this sensor identification sign indicating number);

3) select certain frequency, a certain frequency range or some frequencies out of the ordinary or the some frequency ranges that to study;

4) to scanning area and resolution programming.Area or the volume selecting and programme and be scanned, the user can be along parameters such as each x, y and z axle input range and increments.For example, Figure 15 is illustrated in the scan path of probe portion 310 between all measurement points of regulation, is limited by increment size and scan size in each axis of plane.In one embodiment, the user selects distance and the spacing between the adjacent plane (this class three-dimensional measurement applies to measure tested the decay characteristic with distance) of scanning area, plane of scanning motion number (each plane parallel is in the DUT surface), first plane and DOT.If the parameter of input does not produce an integer measured value, scalable increment size and/or scanning area in each.In other implementation method, can only scanning appear at the discrete point of selecting or along straight line of stipulating or curve.The user is limited to import order is passed through probe portion 310 from DUT in minor increment sweep parameter (as avoiding collision);

5) select storage to collect the file and/or the filename of data.Also can select file layout (as for the compatibility of another software package);

6) external instruments such as configures spectral analyser and/or oscillograph are with the data of handling and/or the record sensor is exported.There is related parameter to comprise datum and unit, resolution and video bandwidth, sweep time and scope, peak skew and asks equal;

7) DUT is configured to work in selected pattern and/or one or more external sources are configured to provide input signal at sweep phase to DUT at sweep phase, and/or changes signal in a controlled manner;

8) one or more external sources are configured to provide signal to magnetic susceptibility measurement.At this moment, with passive sensor radiation rather than detection signal, or with antenna element (as comprising the suitable ring of size, one pole or dipole radiator) and locating device coupling described herein; With

9) select one or more operations (having) that will carry out at sweep phase, as collecting radiological data or magnetic susceptibility data.Also can select gating or trigger action pattern (as detecting pulsed field).

Preproduction phase comprises detection scanning.In an exemplary method, the control of operating rod or computer mouse for example is set, make the sensor 120 manual location of relative DUT10 (perhaps importing the coordinate of one group of required target of sensor) from keyboard.These characteristics can be done the manual scanning of preparation to DUT, or sensor is placed peak described herein monitoring mode.In addition, operating rod control or similar manual detent mechanism can input pickup 120 initial position, but a certain recognition feature (as make DUT image and/or various tested field picture be more convenient for aiming at make comparisons) that also can this initial position be aimed at DUT with registration unit 460.

Also can do spectral component and peak control survey (as when preparing or replace scan operation).For example, for preparing the frequency (as the excessive frequency of radiation level) of research, can compose content measurement at detection scanning and/or sweep phase identification.In one embodiment of the invention method, measure the field that DUT is launched with spectrometer (or other suitable detector) and have the frequency of hard intensity component, select this specific then, also can calculate unwanted environment (background) peak or further feature, from the data of preparing to manifest, delete by the frequency sweep rate.Back one characteristics are particularly suited for measuring in the place of unshielded chamber.

The peak control survey be between the device (or process) in selected frequency range more total near-field thermal radiation provide the foundation.In a kind of like this method of one embodiment of the invention, sensor is fixed near the DUT.Select bandwidth S (MHz), when output, write down the frequency and the amplitude of each signal at the frequency range interscan sensor of selecting.According to this letter, spectrum content qualitative index (SCFM) can be calculated to be $\mathrm{SCFM}=\frac{N}{s}{\left[\underset{i=1}{\overset{N}{\mathrm{\&Sigma;}}}{A}_i^2\right]}^{1/2}---\left(3\right)$

N is the number of signals in the specified scope in the formula, A _iIt is the amplitude of each signal.The existence of signal is with respect to noise plane or predetermined threshold value definition.During spectral component or peak control survey, it is static or move and/or rotate relative to DUT that sensor can keep.

During detection scanning arbitrarily, the user can move sensor with respect to DUT, and observes tested radiation level (as frequency or the frequency range to select).According to this information, whether user's decision needs amplifier, can judge also whether tested radiation is caused by DUT or external source.When the interferometry of external source, can before scan operation, take preventive measures,, signal path be added a suitable filters as shielding DUT, select for use to have more optionally sensor (as having littler spot size), and/or from record data, deduct and disturb and it is compensated.Necessary, can or reduce gain coefficient by filtering and reduce signal level.

When using orientation sensor, the preproduction phase also can comprise the minimum separation between checking checkout area directional component.As for annular sensor, when being parallel to this, plane of a loop obtains minimum signal, when hanging down as for the field, plane of a loop obtains peak signal.If minimum poor (dB) with maximal value do not satisfy the threshold value of stipulating, signal path can be configured in case of necessity comprise additional gain or select different sensors for use.

Available another operator scheme is with TEM sensor or microstrip line correcting sensor.Be enough to the feasible reference field that neglects the microstrip line emission of edge and connector influence with TEM sensor or its length, its advantage is to simulate its value exactly.By the known field characteristic of correcting sensor response characteristic, can obtain the calibration curve (, making sensor output level and frequency dependence) of this sensor as to constant incoming level.

Actinometry is carried out with the frequency or the frequency range of one or more selections.Similarly, magnetic susceptibility measurement also carries out with the frequency or the frequency range of one or more selections.The operator scheme that sweep phase is selected comprises fixing or rotation sensor, fixing or various combinations that rotation DUT, electric field or magnetic field supervision, RF or stilling the theatre monitor.

In the time domain measurement pattern, available oscillograph shows the time-domain signal of DUT radiation.This pattern is applicable to that contact measurement can make the occasion that is studied field distortion, also can monitor trigger event.In the thermal simulation monitoring mode, can monitor that DUT goes up the temperature of single point by the time.Other operator scheme comprises mapping DC field.

At sweep phase, when DUT worked, the field intensity data on one or more selection frequencies were as the function of sensing station and measured and record.This equipment can write down the amplitude of various selection frequencies automatically at each sensing station in area of selecting or the appearance body.The user can select to monitor the type of display of collecting data, also be provided with reading of monitor scans process in an exemplary method.In case of necessity, can be to the motion state programming of sensor, with displacement and/or the orientation of compensation DUT in scan period.This compensation is particularly useful for the situation that DUT rotates at sweep phase.

Spectrometer is with the output of zero span (tuning receiver) pattern (or another suitable detector) supervision rotation sensor in scan period, and spectrometer output is sampled with A/D converter (ADC).In an exemplary method, trigger the ADC sampling with the sensor internal position of detecting (as coiling 162 hole 164), handle the data (as passing through principal computer) of sampling then, determine size and the direction of field vector at each scanning position.For example, (as maximum and minimum the measurement) done to measure in each fixing x, y of sensor, z position, can draw the resultant magnetic field intensity of this sensing station after the combination at two orthogonal directionss of ring.

Monitor the output of rotation sensor, also comprise the glitch monitor that for example detects and indicate the problem that may occur with rotary connector.The wearing and tearing of this connector and cracking, perhaps the prime amplifier fault can be introduced glitch or spike to the RF line.According to the indication of this monitor, for correcting this problem, can suspend scanning step (may comprise the data that storage is collected so far), then finish scanning again.In other method, the glitch monitor can be given notice to the user by for example page and/or Email in the autoscan indication of operating period.

Manifesting the stage (and/or from memory search) data presentation precedent such as RF field intensity, IR intensity, the source impedance that sweep phase can be collected and/or the pseudo-chromaticity diagram picture that is distributed in the power in preliminary election area or the volume; DUT surface current density distribution equivalent curve; And/or field intensity with from DUT apart from the decay curve.Also can obtain and more several curves every different near-field thermal radiation characteristic of curve representative.During data aggregation, also one or more this type of curve can be shown with current test parameter (as selecting in preview phase).Other display format that manifests the stage application comprises:

A) in being scanned area or volume, show two dimension or the 3-D view that field intensity changes.In an exemplary method, show the field intensity value with the false colour colour display screen, represent the high field strong position as redness, purple is represented than the low field intensity position.Electricity (magnetic) field is measured by volt (the peace)/rice of linear unit and dB microvolt (the microampere)/rice of log unit.The differentiation of field, DUT top, the two-dimensional representation method of all parallel planes of available comprehensive collection differing heights above DUT shows; In an example application, these interplanars separate 1～3mm;

B) relation curve of field intensity and distance (as linearity, logarithm or semilog form), the field decay of the distance of specified point is gone up in expression with device.These curves can be determined the border of nearly far-field region and/or discern the classification in tested near field, also can be used for the shielding of layout board and shell one-level;

C) field direction equivalent curve.These curve negotiating rotation field sensors also write down out that on-the-spot peaked orientation obtains.For example, sensor turns over 180 ° or 360 °, and represents the field direction of analyzing spot in the grid with suitable directed straight line or arrow.The near-field information that this mode obtains is relevant with electric current distribution among the DUT;

D) be applicable to the original of other routine analyzers such as MATLAB or the data of filtering;

E) RF power density curve, wherein the each point representative is at total RF power (promptly in bandwidth) of this position probing; With

F) heat (as the infrared) field picture from producing with electricity, the data that obtain of the similar mode in magnetic field.The correlativity of this type of curve and RF power density curve can be checked the RF thermal effect that for example device is encapsulated.The cold and hot high low intensity points with field intensity and position relation curve of thermal imagery is made comparisons, can judge that heating is still caused in a certain other source by RF.

When the data that record contained orientation values, also available polar coordinates showed above-mentioned curve.Can during appearance mode, catch and display additional information, comprise the image of miscellaneous equipment in the signal path (as the spectrometer screen).Image described herein and information demonstration also comprise printing color and/or black white image.

Suppose that in scanning previous crops suitable step of registration the curve that obtains described herein can make up mutually/or combine with other image (and/or DUT contour images) of DUT, to disclose tested the correlativity with the DUT further feature.For example, the cursor in the DUT digital picture can be collected the cursor associating of the one or more demonstrations of data together, just discerns corresponding locus easily in the middle of various demonstrations.In a kind of this class formation, for example cursor is shifted to a certain focus in intensity curve, will this cursor be shifted to corresponding to the position that changes focus in the DUT bitmap images.Perhaps, the feature of the data and curves (as isoline) of collecting can be overlapped onto on the DUT digital picture.

In an exemplary method, carry out the routine of control as herein described, processing and Presentation Function, (single integrated interface TX) is coordinated down for National instrument company, Austin using the LabVIEW software package.Select for use this ad hoc approach only for ease of exploitation, rather than the present invention is limited, the method for all embodiment of the present invention can be implemented with any other suitable software package and combination thereof.For example, arbitrary or all functions as herein described all can be carried out in order to C, C++, C#, Visual Basic, Java or other suitable computerese written program.

Scanning system by one embodiment of the invention body plan

This section discussion is by the high-accuracy displacement of a kind of robotization and the scanning system of one embodiment of the invention body plan.This scanning system has made up control, signal record and process software, and accurate and high-resolution mapping is done in the near field.This discussion relates to a specific embodiment of the present invention, does not limit the general description of other embodiment provided herein.

This near-field thermal radiation scanning system is used for two purposes of diagnosis and research and development.For example as diagnostic tool, this system is used for following task:

1) the undesirable radiation radiation source of identification chip, packaging part, circuit board and system's one-level.

2) identification influences the interference mechanism of element and systemic-function.

3) the specific ASIC of research changes the radiation level variation that causes because of for example feature sizes of devices, distribute power and whole the laying.

4) research particular mask measure and/or material are to the validity of electromagnetic noise inhibition.

In its basic structure, the system of this specific embodiment of the present invention comprises passive (E or the H) sensor that is contained on the mechanical arm, the master control personal computer of three positioning systems, low noise amplifier, signal detector (as spectrometer) and programming back execution motion/instrument control and data acquisition tasks.In view of its modular design, this system (Figure 16) is fit to the sensor and the required signal Processing and the detection hardware of other existing application-specific of standard or user's regulation/design.The block diagram of this basic structure is shown in Figure 17.

This system obtains radiation profiles as follows: after the user defines the scanning area/space of DUT top, sensor each scanning position and relevant frequency examine voltage through amplification, by the spectrometer record.Then, principal computer is through gpib bus (National instrument company, Austin, TX; Be also referred to as " IEEE-488 ") read this signal level and write down field intensity.The field strength distribution of each frequency constitutes by the intensity of drawing each scanning position (or pixel) record, can be revealed as pseudo-chromaticity diagram picture.Typical output format is:

∑[x _i，y _i，z _i，I _i] (4)

X in the formula _i, y _iWith z _iThe volume coordinate that refers to the i time sampling, I _iThe record intensity that refers to this sampling.Figure 18 illustrates the intensity curve that an example obtains with fixation of sensor.

Same structure also can obtain frequency content information to device.Collection is included in the measurement of fixed position (as the tube core top).Program writes down the signal that this device launches and is provided with post analysis in given bandwidth.

Utilize rotation sensor can obtain more complete field picture.The system architecture of this application is shown in Figure 19 and 20, has wherein write down the maximum field strength of each scanning position, together with the angle that occurs.This information obtains with the revolution sensing assembly that is contained on the scanner arm, as shown in figure 20.

The typical case of this structure exports indication magnetic field or causes this electric current.The available vector representative of each scanning position (or pixel), its big I is pressed the chromatic graph coding as mentioned above.Figure 21 illustrates the radiation profiles that an example obtains the microstrip line with its characteristic impedance ending.

The attainable feature of the scanning system of this embodiment of the invention comprises:

A) instrument has three degree of freedom and works with electromagnetism and stilling the theatre sensor.

B) modular design allows the user to select detecting device, sensor and signal Processing hardware for use.

C) can do 1 micron stepping.

D) sensitivity: H field, 1 μ A/m; The E field, and 0.1mV/m (the 10mm magnetic field sensor, 1000MHz).

E) single pass is done repeatedly scanning frequently.

F) the Adaptive spectra analyser of each frequency optimization is set.Relevant frequency has the individual settings value, comprises triggering measuring.

G) interaction sensor transfer function editing machine is for LNA (low noise amplifier) gain provides input with cable loss.

H) with laser pointer or according to the scanning area of DUT size regulation.

I) to the selectable scanning stride of each size.

J) scan a series of radiation frequencies, show the field intensity at each peak of finding.The sweep frequency that preservation is selected for use.

K) manual sensing station during preview.Sensing station can pass through operating rod, mobile screen cursor or set from the keyboard input coordinate.

L) the H field sensor of a record radiation direction and amplitude.

M) be used to monitor IR sensor with imaging.

N) during the autoscan, can show the pseudo-chromaticity diagram picture of one or more of field intensity in real time.Scale can automatic or controlled setting.

O) behind the end of scan, can call manifest/analysis engine provides following additional information to the user:

1) shows the digital picture (as bitmap) of DUT in conjunction with the pseudo-chromaticity diagram picture of field intensity.Utilize the combination cursor to make the focus of DUT and the corresponding relation visualization between ad-hoc location;

2) curve that a plurality of planes indicator gauge light field is decayed with distance by force;

3) to the spectrum waveform of each frequency display capture;

4) orientation sensor is shown the field intensity and the angle of each position.

Exploitation and the sensor that uses all embodiment of the present invention

This section discussion can be made the some E and the H field sensor of detailed high resolving power mapping to the field.Discussion relates to specific embodiment of the present invention, does not limit the general description of other embodiment of this paper proposition.

For obtaining the near field measurement value, wish to use magnetic, the electric component of the accurate measurement field of energy and high-resolution sensor is arranged.Used type of sensor (as passive or active) and size depend on the intensity and the distribution in the source of being studied.Figure 22 illustrates the active sensor of an example by one embodiment of the invention body plan, and Figure 23 illustrates the sensor of another example by all embodiment body plans of the present invention.

The field sensor reference source in TEM or the Crawford sensor is relatively proofreaied and correct.This class sensor is usually used in (in the standard of issuing in Federal Communications Committee) device magnetic susceptibility and sensor calibration measurement is set up a uniform field.The basic structure of TEM sensor (Figure 24) can be considered the correction of sidewall type strip line, and the characteristic impedance of overall 50 Ω can be kept in the size of selecting for use and two taperings, sets up reference field by application source voltage in the sensor.

Be automatic correcting sensor in relevant frequency range, developed a kind of computer-controlled device, obtain a formula or look-up table then and it is used as the transport function of sensor.Be the precision of checking this method, bought some commercial probes and be sent to certified laboratory and proofread and correct.Then, the resulting correction result of method who this breadboard result and these commercial probes is used one embodiment of the invention in our laboratory compare (Figure 25 be the 10mm cycling probe the correction result relatively).

Annular sensor is designed for the measurement time-varying magnetic field.We have developed the some passive annular sensor that can proofread and correct in the TEM sensor.Though this correction provides accurate relatively transport function, comprises that the sensor of passive annular sensor still has some problems.For example, owing to use the asymmetrical characteristic of the annular sensor of semi-rigid coaxial cable section making, sensor plays the E field sensor to a certain extent.By increasing the impedance matching element of flat raft between ring (balanced line) and semi-rigid coaxial cable (unbalanced line), reduced this problem.But because the limited bandwidth of matched transform device (balance one unbalanced type), this method has been damaged the bandwidth of sensor.And passive sensor does not provide isolation between ring (detecting element) and amplifier.Therefore, articulating is become the part of sensor to the line segment (reaching 1 foot sometimes) of testing circuit, can influence measuring accuracy, the result is distorted.

Therefore for obtaining more accurate result, designed a kind of sensor that contains active annular sensor, this sensor can be used as fixation of sensor or rotation sensor.Sensor powers on by its RF output line, thereby provides direct current by the RF output line of sensor to its circuit.This power applications the biasing T type device of output terminal, can keep when making the user apply direct current with circuit in amplifier isolate.At the prime amplifier of sensor, make direct current and amplifier RF output keep decoupling with two inductors.

Ring is connected to amplifier through the twisted-pair feeder transmission line, and sensor ring and twisted-pair feeder all are the inherent balance types.Then, be added to the prime amplifier input end signal differential that sensor is obtained.The combination of twisted-pair feeder and differential amplifier structure has good noise immunity.Figure 26 and 27 illustrates the active sensor photo by one embodiment of the invention body plan, and Figure 28 illustrates the synoptic diagram of this sensor circuit.

But probe output voltage faraday inductive law is characterized by:

V＝BωA?cosθ (5)

The induced voltage of V finger ring terminal in the formula, B refers to magnetic flux density, ω refers to field frequencies range, A finger ring area, the angle of θ finger ring plane and applied field.Figure 29 illustrates return loss (S11) curve of twisted-pair feeder short-term.

Measure for obtaining high resolving power, it is long-pending to wish to reduce anchor ring.It is desirable to measure the field characteristic of space any point, weaken with anchor ring is long-pending, must use the external amplifier of high-gain low-noise but in fact encircle response characteristic.

Passive annular sensor can make or be etched on the FR4 material with semi-rigid coaxial cable.The effective diameter size of system-level application (as being used to test expansion plate or cell phone) is 2～10mm.

Use the vector field sensor and can obtain more complete picture H field, direction and intensity.This type of is measured by the realization of rotation one active sensor (being contained in microminiature stepper motor on the scanner arm as application).In this device, the maximum field strength of each scanning position and the angle of appearance thereof have been write down.

To this structure, the direct current of sensor and RF output terminal thereof can pass through the shared same path of 50 Ω swivel adapter heads.The signal that detects is given spectrometer through amplification, and the latter is as the tuned receiver of band envelope detector.The simulation output of analyser is connected to the A/D change-over panel, and later processing is carried out with software entirely.The pulse of stepper motor indexing attachment is added to the A/D converter scan clock, and it is synchronous to realize that rotation and data acquisition are operated.

For setting up a reference sensor position, the dimmer switch that is contained on the arm sends to the A/D change-over panel with the position of holing on the sensor pulley.This routine typical sensor rotating speed is that per second 3 changes.Figure 30 and 31 illustrates all elements of sensor and rotating mechanism, and Figure 32 illustrates the locating laser device that is used to set up sensor and DUT referring-to relation, and Figure 33 illustrates the summary circuit diagram of dimmer switch module one embodiment.Figure 34 illustrates with method of one embodiment of the invention and TEM sensor and obtains the screen demonstration that active sensor is proofreaied and correct the result, and the screen that Figure 35 illustrates the result who obtains with rotation sensor shows.

Use the output of the method demonstration of one embodiment of the invention, the electric current that indication magnetic vector or this vector cause.For example, available its size is represented each scanning position (pixel) by the vector of chromatic graph coding.Figure 36 illustrates an example radiation profiles that the microstrip line with its characteristic impedance termination obtains is shown.

The minimum form of electric-field sensor is a bit of lead that stretches out on ground level as unipole antenna.In time-varying electric field E, voltage V=L * E that the sensor output terminal produces, wherein L is effective one pole length, i.e. half of physical length.Figure 37 illustrates the screen demonstration that the E field sensor is proofreaied and correct the result, and the method for using one embodiment of the invention obtains.

Transport function to spherical sensor exploitation is discussed below, is supposed that probe places homogeneous medium and is exposed to polarization and the known electromagnetic field of electric field intensity, also supposes probe very little on electricity (being that its size is more much smaller than tested electromagnetic field wavelength).The particular probe that is studied is the spherical probe of 2mm, the concentric cable matched termination that is attached thereto.

According to these hypothesis, the probe transport function is defined as follows:

Wherein θ is the angle of the incident electromagnetic field direction of propagation and coaxial cable axis, as shown in figure 38.

Among Figure 38, what illustrate is parallel-polarized electric field situation.During vertical polarization, electric field has only x component (promptly hanging down as for the plane of incidence).

Must point out that Figure 38 illustrates so-called parallel polarization situation, yz is defined as the reference planes of incident electromagnetic field, and electric field intensity is parallel to the plane of incidence.As everyone knows, in Theory of Electromagnetic Field, arbitrary incident field can be decomposed into two parts, promptly horizontal magnetic part (having only the x component in magnetic field and y, the z component of electric field) and transverse electric part (having only the x component of electric field and y, the z component in magnetic field).Horizontal magnetic partly constitutes the parallel polarization of Figure 38.Transverse electric partly refers to vertical polarization, because of the plane of incidence of its electric field intensity perpendicular to definition.For the full feature of probe receiving feature, two components definition transport functions of reply field.

Transport function (6) draws by a series of simulations, the incident electric field excitation of plane wave (the parallel or vertical) representative of the correct polarization of its middle probe, and the direction of propagation, incident field is as a parameter.Must point out, suppose that the wavelength ratio probe size is much bigger, then the voltage of Jie Shouing mainly is subjected to spheroid electric dipole moment (being proportional to the spheroid volume) control.Particularly, needle point plays the capacitive load effect.The induction current of probe is proportional to the time-derivative of electric field.Therefore, suppose it is the concentric cable of a matched termination, then the voltage of Jie Shouing also is proportional to the time-derivative of electric field.

The utilization analog result for parallel and situation vertical polarization, can draw following expression formula to transport function (6):

H _par(θ)＝0.0158+0.1556θ+1.0072?sinθ (7、8)

Hperp(θ)＝0.1634+0.0162θ-0.0204sinθ

Angle θ unit is a radian in the formula.Figure 39 has described formula (7) and (8) with figure, and these formula cause following observation:

Vertical polarization.To all practical applications, this transport function is irrelevant with incident angle, and the axis that this fact is easy to always to cross with electric field concentric cable is relevant, thereby has nothing to do with incident angle with the electric field magnitude of probe interaction.

Parallel polarization.Transport function and electromagnetic field incident angle are closely related, and when electric field was parallel to probe axis, transport function drew its maximal value.

The operating system of a specific embodiment of the present invention

Figure 40～69 illustrate the situation of the operating system of a specific embodiment of the present invention.Discussion relates to a specific embodiment of the present invention, but does not limit the general description of other embodiment mentioned in this article.

Figure 40 illustrates the general picture of this operating system, and Figure 43 illustrates the structure of starting menu.Optionally operator scheme comprises:

Electromagnetic sensor, the time become output;

Field sensor, direct current output (as IR or hall effect sensor);

Simulation output, single point is measured;

Sensor calibration;

The peak monitors;

And time domain measurement.

Can on preview screen, select new test, or call an existing file and analyze on the screen or consult manifesting.

Figure 45 illustrates a kind of preview screen structure to the time-varying field electromagnetic sensor.Can set up at detecting information/filename specifies and to carry out following function on the screen:

Sensor is selected (promptly fixing or rotation, active or passive), specified sensor transport function for use;

The specified file name;

Pair amplifier, wave filter and/or cable input gain or loss;

Input test information.

On DUT physical dimension/position foundation screen, make following function:

X, Y, Z scope;

X, Y, Z increment;

DUT top number of planes;

The position of relative test board.

This sets up available laser cross bundle and/or machine is aimed at the vision realization.

Set up on the menu screen at spectrometer and can realize following function:

Select the spectrometer model;

To being monitored frequency manual control/set up spectrometer;

Parameter is set, as resolution bandwidth, sweep time, video bandwidth, span, peak skew, ask all, unit, datum;

Select frequency;

Keep respective waveforms;

Under source control submenu (promptly to putting on the signal source of DUT), can carry out following function:

Signal generator is set up menu: frequency and/or amplitude;

Pulse producer is set up menu;

Preference pattern;

Select test parameter.

Figure 47 illustrates the process stream of preview level.In a detecting information task, can carry out following function:

The regulation sensor type;

Editor's sensor transfer function;

Input LNA gain and cable loss;

Select bitmap file;

Keep setting.

In setting up scan task, can do down column selection:

X/y axle zone;

Stride;

Number of planes and position.

In the detector configurations task, can carry out following function:

Monitor DUT;

Catch waveform;

Seek all peaks in the band;

Limit the RF setting value.

The preview of RF rotation sensor screen is similar to the preview screen of fixation of sensor, and the key distinction is that spectrometer sets up menu.Spectrometer works in zero span pattern, promptly as the tuned receiver of selected sweep frequency.The output of spectrometer detecting device is read by A/D converter, and tracer signal intensity is with the variation of sensor corner.

The DUT preview screen of rotation platform pattern is similar to the fixation of sensor situation, but these variations are arranged.Now, sensor is followed user-defined DUT isoline (describing the formula of this isoline as user's input) on every side.DUT places on the turntable and rotates by user-defined incremental angular, is mounted to sensor parallel with mechanical arm with the aligning laser instrument now.

Figure 55 illustrates the preview screen structure of the field sensor of using direct current output.On single point simulation output measurement screen, can carry out following function (is example with the IR sensor):

Detecting device output is configured to A/D;

Radiance is set;

Regulation is monitored the bright spot on the DUT;

Regulate the detecting device height, limit the bright spot size.

On any field sensor screen of direct current output, function class is similar to the situation of fixation of sensor, but these variations are arranged: only with a frequency measurement, detecting device is output delivers to A/D converter.

The peak monitors that the preview screen is similar to the situation of RF fixation of sensor, but these variations are arranged:

Single fixation of sensor position, DUT top;

Spectrometer is set up parameter and is comprised marker peak skew, resolution bandwidth, average time and datum;

Selection comprises the frequency span of scanning, initial and final frequency, cable loss, amplifier gain and sensor type.

Then, radiation frequency and the respective magnitudes of program record DUT.

Figure 58 illustrates the scan screen structure of RF fixation of sensor.This pattern comprises the multiple spot data that user-defined test condition (signal amplitude, frequency, rise time etc.) write down each scanning position.On monitor real time datas such as pseudo-chromaticity diagram picture screen, can select:

To each plane of DUT top, or

To each radiation frequency, or

Each particular set value (as frequency, amplitude, rise time) to the signal source that adds to DUT.

Reading on the screen and can select:

Sensing station;

Field intensity;

Frequency;

The sensor calibration factor of each frequency;

The z axial plane number of DUT top;

Sensor transfer function;

X, Y, the Z limit.

The scan screen of RF rotation sensor is similar to the situation of RF fixation of sensor, but following variation is arranged:

Real-time pseudo-chromaticity diagram picture can be presented at the maximum field strength of each pixel record;

Polar coordinates/linear schedule shows the intensity and the angular relationship of each scanning position;

The control of sensor position of rotation.

RF/DUT rotary scanning screen is similar to the situation of RF fixation of sensor, but such variation is arranged, and realtime graphic shows the field intensity in each cross section of regulation scanning space.

Figure 61 illustrates the scan screen structure of dc fields sensor, and it is similar to the situation of RF fixation of sensor, but changes: realtime graphic shows static state (DC) field intensity of each scanning position.

What Figure 62 illustrated the RF fixation of sensor manifests the screen structure.Read screen and comprise column selection down:

The Z number of planes;

X、Y、Z；

Frequency;

The Z absolute altitude.

The video data screen comprises following feature:

False colour colour TV/the magnetic field of each frequency distributes by force;

The DUT bitmap;

The DUT image is checked the associating cursor of radiation profiles.

To other analysis or manifest program screen and carry out in the function of output data, Matlab VI accesses software package Matlab in the Labview program in an example.In case Matlab GUI interface is effective, set up radiation profiles with regard to the raw data that the operating system of available this paper discussion obtains.

Decay (field) curve map screen comprises column selection down:

Select observation point;

Select the reference point of DUT;

Describe E or H field decay speed;

Compare 1/r, 1/r2,1/r3 slope.

Manifest screen RF/DUT rotation screen and be similar to the situation of RF fixation of sensor, but the three-dimensional plot of these variations: E or H radiation profiles is arranged, and/or show the horizontal and vertical cross section of radiation profiles.

The screen that manifests of RF rotation sensor is similar to the situation of RF fixation of sensor, but these variations are arranged:

Radiation profiles is set up by the maximum field strength of each scanning position;

Direction and amplitude that each scanning position is read;

The isogram that shows each scanning position magnetic field (or electric current) direction and amplitude;

The field amplitude is pressed the colour chart coding as in the previous;

Each scans the field intensity polar plot at seat;

Field direction angle/amplitude is in the variation of each scanning position with z;

Have, the field direction angle is with the variation of Z.

What Figure 67 illustrated the DC field sensor manifests the screen structure.On retrieval simulated data screen, can retrieve the simulated data that in a period of time, a certain assigned position on the DUT is write down.The pseudo-chromaticity diagram picture screen of field intensity is similar to the fixedly situation of EM sensor, but has increased simulation output in the duration of selecting.The detecting information screen comprises detector parameters, ambient temperature and/or sweep parameter.

Figure 68 illustrates that the peak monitors manifests the screen structure, and the detecting information screen comprises analysis of spectrum analyser parameter, DUT information, sensor information and/or scanning position.The data screen comprises the table histogram of listing each amplitude and corresponding data.Spectrum content factor of merit (SCFM) screen comprises the frequency band of selecting selection in whole measurement bandwidth or this bandwidth.

The time domain measurement screen is similar to the frequency domain measurement screen, and detecting device is mould/number oscillograph, and has write down signal in the variation of the time of each scanning position.

The purpose that sensor calibration is used the TEM sensor screen comprises:

In the TEM sensor, set up reference field;

When reference field occurring to a particular frequency range correcting sensor;

Set up the look-up table of preparing to be used as sensor transfer function or being used to analyze/search for and design new sensor.

The user can select:

Frequency range;

Reference field level in the TEM sensor:

Sensor type.

Other function of screen comprises the drafting correction data, sets up look-up table, preservation and printing.

Determine nearly far-field pattern according near field measurement

Discussion is useful to EMI to distinguish nearly far-field effect.The field intensity of far field or radiation field reduces (r is the distance from the source) with 1/r.The near field is non-radiative, comprises following one or more component:

Electrostatic field, promptly electric charge adds up the non-time-varying field of generation, and its field intensity is with 1/r ³Reduce,

Accurate stilling the theatre, i.e. the electric current non-time-varying field that flows and to induct, its field intensity is with 1/r ²Reduce and

Stationary field changes in time at RF or microwave frequency.

In more complete description, suppose a dipole field (as seeing Christos Christopoulos, 38～42 pages, Principles and Techniques of Electromagnetic Compatibility, CRCPress, Boca Raton, FL, 1995).In the near field region, with 1/r ³The item of decay is represented electrostatic field, thereby the capacitive energy storage.With 1/r ²The item of decay represent accurate stilling the theatre that current element causes and dipole relevant energy storage on every side; This effect is described to perceptual near field.

Must emphatically point out, in the near field region, electricity, magnetic-field component and direct intrinsic impedance (Z unlike free space by medium _In) and be correlated with near field impedance Z _{The near field}On size and direction, all be different from Z _InFor the dipole situation, this shows that the E field component is greater than the component to the far field expectation.If research is coil antenna rather than dipole antenna, situation is just opposite: it is main becoming the H component.

Therefore, near the source, the source feature is reflected as the EM characteristic of transmitted wave.And in the far field, do not have thing can discern the source characteristic in the field characteristic, thereby increased the importance of near field measurement.

There is the border of reactance and radiation area in the about λ of distance sources/2 π places, and λ is the wavelength of measured signal component.For instance, for the 1000MHz signal, the about 30cm of λ, 5cm so only have an appointment far from the source in border, nearly far field.To the 2000MHz signal, the border is 2.5cm only far from the source.In these two zones, by reason as herein described, major concern be the reactive near-field district.

Though codes and standards require compound certain far-field radiation index, the in fact easier interfered circuit of near-field effect.For example, the near-field thermal radiation of element, device or a circuit can disturb the work of adjacent elements or device, or with circuit shielding or product casing generation interaction, or run into and can become radiation field and contributive other mechanism of far-field radiation.So just can make up two elements, device or circuit, each radiation limit all up to specification wherein, but because the problem that near-field effect causes, the device that obtains can can't be worked.

In the method for one embodiment of the invention, the near-field thermal radiation of having collected tested device or system (DUT) distributes, and calculates radiation intensity (as distance and/or the orientation by relative this DUT regulation) in view of the above.By in presumptive area, measuring the near field of setter or functional block, may on certain plane above this device (as being parallel to the DUT surface), collect radiation profiles.The size on this plane (being scanning area) can less than, be equal to or greater than the size of device, as the about 20mm of the every limit of scanning area ratio device.Part may not or wish to measure the near field that exceeds this distance according to the sensitivity of used sensor.Yet, may needn't measure the field that exceeds this distance, because it is the information in the scanning area still is enough to calculate reliably the field that the circuit board (or other structure) of plan is gone up the radiation formation of arbitrary place device, as described below.

After having measured the magnetic near field, just can calculate corresponding current density.According to current density, can obtain the vector magnetic potential at the arbitrary place of circuit board (or the arbitrary place of DUT surrounding space), the feature of arbitrary H of place of circuit board and E field can be provided like this.This result based on Huygens-Fresnel principle or surperficial equivalence principle (at AdvancedEngineering Electromagnetics, Constantine A.Balanis, Wiley, 1989 and " Determination of Far-Field Antenna Problem from Near-FieldMeasurements ", Richard C.Johnson, Proceedings of the IEEE, VOL.61, no.12 has crossed discussion among the December 1973).The Huygens-Fresnel principle points out that each point all is considered to cause the secondary source of spherical wavelet on the appointment wave front, can obtain the field of the outside any point of wave front according to these basic small echos.Use this principle,, just can calculate the whole field structure in this source if know electric current or CHARGE DISTRIBUTION in the source structure exactly.

According to the Schelkunoff introduction, surperficial equivalence principle is a more rigorous methods of Huygens-Fresnel principle.This principle points out that each point is considered to new secondary sphere wave source on the primary reflection front, and the secondaries front can constitute the envelope of these secondary spherical waves.This principle is based on uniqueness principle.Uniqueness principle points out, diminishes limiting by the source in this district is unique in the district, add electric field in borderline tangential component or magnetic field tangential component on the border, promptly the former is on segment boundary, the latter is on its coboundary.Field in the harmless medium is considered to diminish the limit (loss goes to zero) of respective fields in the medium.Like this, if in the surface of sealing, fully grasped tangent line electric field or magnetic field, just can determine the field in the passive region.

In an application of this principle, replace actual source (as a device) with source of equal value.In designation area, the source and actual source equivalence that it is said calculating are because the field that they produce in this zone is identical with the field that actual source produces.Rotation sensor described herein can be measured tangent line magnetic field, thereby can calculate tangent line H component.

As described below according to the second method that the near field measurement result measures: the radiation profiles that is used in this specified circuit element of magnetic vector component statement that the plane surface of a certain distance in element top records.In one example, the zone in measurement magnetic field is the rectangular area of this circuit component of encirclement areal coverage on integrated substrate.Field component is measured with one group of assigned frequency, represents with the functional attributes of this circuit component.

To each frequency, utilize electromagnetic radiation principle to obtain the electricity and the magnetic-field component of the plane superjacent air space any point of measuring radiation distribution.Being fit to a kind of mathematical operation of this calculating, is to making integration with the product of the tangent magnetic-field component in radiation profiles plane on the radiation profiles plane.In an exemplary method, use the Green function integration, but the electromagnetic field that representation space a bit (observation point) produces because of the so-called electric dipole current source that is positioned at another point (being called source point) of space under given frequency.The dipole electric current is calculated as the tested tangent line magnetic field of Chosen Point on the radiation profiles plane and corresponding to the product of the rectangle region of field measurement grid resolution (distance of each dimension limits between promptly being measured by opposite field).Integration is carried out with numerical approach, may be interpreted as electromagnetic field vector superposed of each dipole contribution that is positioned at all measurement points of radiation profiles.

In case only after the finite part in space obtains its radiation profiles, (be a plane of element top in this example, be enough to surround the areal coverage of this element) that this processing can be predicted the element radiation of this element superjacent air space any point.As described herein, element can be used for the planning of guidance system plane to this electromagnetic radiation ability of integrated substrate, thereby whether causes other circuit component fault according to the electromagnetic interference (EMI) of circuit component, decides the arrangement of circuit component.

The third method of measuring according to the near field measurement result is based on representing total electromagnetic field with the mode expansion.By the electromagnetic field measurements on the suitable surface in the near field (as the plane surface of plane wave expansion), can obtain the amplitude and the direction of these moulds.Grasp the amplitude and the direction of each component in the mode expansion, just can describe radiation field comprehensively.

File layout

For storage and/or shifting, wish to make measurement data format (as using the data that above-mentioned sensor and locating device are collected, such as radiation profiles).For example, measurement data can be formatted into one or more matrixes or array, and storage is file again.The head of this file can comprise initial distance (as along the axis that is orthogonal to DUT 10 surfaces) such as sensor 120 and DUT 10, separates the distance of each sampled point in x, y and/or z direction, along the transport function of the size of the scan area of x, y and/or z direction or volume, frequency under the measurement data or frequency range, used type of sensor and/or sensor, by deposit data type and/or used information such as format, and in the data processing path such as the information of other devices such as amplifier gain and spectrometer resolution bandwidth.File also comprises bitmap or other digital picture of DUT 10, illustrates first and measures relative position, scanning area profile and/or mesh lines.Similarly, can be to the data formatting and the storage of collecting during the magnetic susceptibility measurement (as sensitivity distribution), head can comprise similar information (as the information of source with distance, antenna or other radiating element characteristic, tested device characteristic and tested pin sign, relevant simulated environment or the protocol characteristic of tested device).

In an exemplary method, the data-storing that each plane (as along hanging down as for the axis on DUT 10 surfaces each plane from DUT 10 different distance) is recorded is matrix independently, and its dimension is corresponding to planar axes.The tested field strength that matrix Zhu Xiang representative records in the relevant position.Or with interpolation of data between measurement point and draw additional matrix entries.

File can contain the data value corresponding to an above survey frequency, and the value of each survey frequency is stored in different matrixes or several groups of matrixes.Corresponding to the data storage of orientation survey in two matrixes: one is amplitude or intensity, and one is direction (as being unit with the degree).

Represent the value of other measurement data to store, without matrix or array format with vector format.For example, the measurement data that the peak obtains during monitoring is stored as two corresponding vectors: one is survey frequency, and one is the intensity at this frequency record.Perhaps, frequency information is stored in top of file, as initial value and increment size (as when evenly dividing frequency measurement).For make measured sensor (as not rotating directional magnetic field sensors such as annular sensor) for the pairwise orthogonal durection component, can write down one group of independently vector to each directional component, later on again calculated field in the amplitude and/or the direction of each point.

Each matrix (or vector) item can store for a string ASCII (text) numeral (limiting and/or fixing length) string, comprises radix point and/or preposition and/or back tail zero-bit.For example, ascii text file can comprise two or more matrixes, separates matrix (as every septal line with one or more line feed/accord with indication) with one or more septal line.Perhaps, each matrix entries is with bigit or floating-point format storage.In other method, can image (as bitmap) form stored data value matrix.

As mentioned above, can change the signal (as amplitude, frequency, modulation etc.) of input DUT during measurement.At this moment, the file that stores last measurement data comprises the matrix of each variation level of input signal.The information that top of file comprises can be discerned various incoming signal levels (as dB), and makes each incoming signal level and corresponding data value matrix correlation.

Cad tools

In the design and manufacturing of contemporary electronic systems and device (as integrated circuit), the element erecting tools is very general automatically.Figure 70 illustrates the process flow diagram of this class instrument, it with the logical OR illustrative circuitry describe translate into model and in actual prototype installation elements.The input data of automatic fitting tool are included in and describe logic flow or the signal flow that for example is built in SPICE (" simulator program that integrated circuit importance is arranged ") net table or hardware description language (" the HOL ") file on the function.This instrument also receives such as the data of finishing the restriction of prototype size and/or shape.When designing integrated circuit, automatic fitting tool is also referred to as " floor plan device ", though similar tools also can design multi-chip module (MCM), circuit board or sub-component or even a complete set of assembly of final user and consumer products and so on.

As everyone knows, if model is followed certain topological design rule, just can reduce the possibility of unexpected complicacy in the final prototype operation.It is close mutually that such topological design rule is that the component positioning that will highly connect gets, and reduces the length and the complicacy that interconnect as far as possible.Simultaneously, this rule-like also limits when settling model and uses long parallel signal trace, reduces to crosstalk, be coupled as far as possible and makes load effect in the circuit, helps guaranteeing system-wide signal integrity like this.

Yet even last installation model meets predetermined laying rule, the prototype that obtains also often can not be worked as scheduled.A reason is that these lay the regular electromagnetism interaction of reality between different elements in the system that reckons without.Electromagnetic interference (EMI) and Electro Magnetic Compatibility depend on the physics of various circuit components consumingly and settle and the interconnection of these elements and the distribution of power and ground terminal.And along with the raising of assembling density and frequency of operation with element of dwindling of component size, electromagnetic radiation effect becomes more obvious in the circuit, therefore in fact can not once especially work in the circuit elements design of microwave frequency by high integrated component.

Even part design successfully is applied to early stage prototype, also can produce this class problem.For example, in more than one design, just more and more general application circuit piece.For example, the sort circuit piece may begin by early stage Application Design, and perhaps manufacturer from the outside purchases as an intellecture property (IP) (being also referred to as " IP core ").When the sort circuit piece is used for varying environment, as close different functional block, or work in different frequencies, duty factor or clock edge, or, meet the problem that the laying instrument of laying rule just can not be predicted appearance in order to checking with different technology manufacturings.

Moreover, the origin cause of formation of making this class problem in the prototype not easy to identify, a reason is the radiation source that is difficult to point out to cause in some radiators trouble, thereby the corrective action of taking more or less blindly, and by this prototype modification several times, the true cause of problem is still unclear, has wasted time and money.Not only design process becomes expensive alternate test and error circulation, and some measure (as adding shielding) even prove harmful, as has increased weight, has wasted volume, even makes the deterioration that more becomes of actual interference mechanism.

Therefore, wish circuit to be laid a kind of prevention method of proposition, thereby discern potential problem, and before the expensive real-time process of beginning, be convenient to assess rapidly and easily solution by in the interelement electromagnetism interaction of design phase evaluation circuits.

Shown in Figure 71, the automatic distribution method of electronic installation of one embodiment of the invention and/or system comprises receiving circuit description and element mount message (task P120).The circuit that task P120 receives is described information such as component type, size and connectivity is provided, as comprises the logic flow or the information flow that are built in SPICE grid table, hdl file or the synoptic diagram are done the function description.This data description digital circuit, mimic channel or comprise the numeral with the simulation two-part circuit.As for the component positioning information that task P120 receives, these data for example can obtain from automatic element erecting tools.Other data that task P120 receives comprise size restrictions and/or environmental information, such as the characteristic of relevant electromagnetic shielding element and aspect, position etc.

In task P130, calculate the electromagnetic field of the circuit inductance that data limited that receives by task P120.Except the data that task P120 receives, also calculate this with reference to one or more radiation profiles corresponding to all elements of circuit.These radiation profiles can be measured and/or mathematical simulation arrives any precision, can be used as database, and based on measurement data (as the measurement data of collecting with locating device as herein described and one or more sensor).By only encouraging required piece selectively, can be to a certain collection radiation profiles data in tube core or the module.In an example application, radiation profiles defines the near-field thermal radiation of particular element type, and is revealed as two dimension or three-dimensional ground relative position grid and corresponding coefficient.

The data of task P130 output format by different way.For example, task P130 can produce a secondary field picture of each element, or the synthetic field picture of the single width of whole assembly, or a width of cloth field picture of each pre-stationary part of assembly, or the synthetic field picture of a width of cloth of each preset frequency in the group.In addition, the frequency that can be limited to a particular frequency range or a group critical (or in band) is calculated in the field of this task.Be also noted that, analyze and be not limited to two dimension: can generate the three dimensional field image, calculate these enough data as long as radiation profiles comprises.In an exemplary method, the field strength pattern picture of E and H field in the DUT predetermined distance plane is as independently matrix output storage.In other method, image also can be indicated field direction.(notice that " image " only is used in reference to the matrix or the array of indicating value here, use this term not represent that this image must show the form that maybe must be revealed as certain suitable demonstration, although various enforcement method can comprise this ability.)

In task P140, the effect of the field of calculation task P130 induction.Utilization distributes corresponding to the magnetic susceptibility of all circuit components and measures these effects.The method that one embodiment of the invention is measured certain particular element magnetic susceptibility distribution is described below.Relative tested device of antenna or system place a fixed position (as DUT central authorities tops), according to antenna performances such as DUT characteristic selective radiation figure such as encapsulation and die-size and bright spot sizes.Along with antenna response in the signal (as with preset frequency and amplitude) of input and the width of cloth is penetrated, monitor and voltage that sense of place that the selected terminal of record DUT applies is answered.As described herein, induced voltage can be stored in the file and (, do once input) respectively being monitored terminal as vector, the information and/or the agreement that characterize measurement environment are recorded in top of file.

In other enforcement method, when monitoring and write down induced voltage, can change the signal (as amplitude and frequency) of input aerial.For example, can between the threshold frequency of some preliminary elections, change the signal of input.In another example, increase the amplitude of input signal, breakdown conditions appears in DUT.Or except changing input signal, antenna and/or DUT relatively move, and make radiating antenna cover path, zone or the volume of near the preliminary election of DUT, simultaneously record position information and corresponding induced voltage.In addition, the relative orientation (as rotary antenna) of antenna and DUT be can change, directed information and corresponding induced voltage write down simultaneously.At this moment, can with information storages such as signal, position and/or directed setting value top of file (as initial value with increase (subtracting) value), or as one or more vectors or matrix, the induced voltage measured value is stored in (as each is monitored terminal) in corresponding vector or the matrix.

During the supervision, can or be controlled to the DUT programming and carry out a series of specific instructions (as the ordinary authentication test) or the function of certain repetition.As by impelling DUT to present the characteristic of every kind of measurement, so that more easily detect and/or set up the fault condition of DUT.

Perhaps, obtain sensitivity distribution by simulation to small part.In a kind of such method of one embodiment of the invention, (Cadence design system, San Jose CA) wait the simulation packaging part that the signal of simulation is annotated on the selected node or terminal of tested device or system (DUT) with Specctra.The signal of simulation for example can change in amplitude of stipulating and/or frequency range (or certain critical value), and the level of simulating signal is noted (as up to puncture taking place or simulated DUT not meet certain performance index) together with its effect to crucial core of DUT or circuit.

For making the magnetic susceptibility distribution relevant, measure the launching site intensity (as the field picture of calculating according to task P130) of selected node or terminal position with the radiation profiles of potential countermeasure set.According to the distance of this node or terminal and radiator and the factors such as geometric configuration of packaging part, circuit board and/or interconnection line, these field intensity (as excellent or peace/rice) are converted to the voltage of node or terminal then.

The magnetic susceptibility distributed data base comprises some distributions of an element, and every kind of distribution is corresponding to different frequencies, operating voltage, processing size etc.Task P140 also can be by for example detecting the effect that induction field is measured in the position that exceeds the distribution threshold value.In another enforcement method, task P140 can compensate relative orientation and the launching site and/or the magnetic susceptibility of various elements.

Figure 72 illustrates a kind of expansion of Figure 71 method.In this method, induced noise value that task P140 calculates and ifq circuit data are included in the SPICE simulation, so that the work that prototype is made in prediction.This operation is considered " virtual prototype ".Make and assess the prototype performance with expense except the deviser need not be taken time, this method is also by providing problem area information to instruct the deviser.

In the another kind expansion of Figure 71 method shown in Figure 73, the induced noise value that available task P140 calculates judges by the prototype that the model body plan is installed whether meet design discipline.If task P160 concludes that this prototype is not inconsistent rules, just rejects this model.

In the expansion of Figure 73 method shown in Figure 74, the induced noise value that task P140 calculates is used to instruct correction circuit to describe and/or the element mount message.For example, if these values show the performance of certain particular element and especially are subjected to the field influence that another element produces, if allow other restrictive condition (as circuit board size and dimensional limit, connectivity requirement etc.), then can in task P170, revise the installation of this element, this two elements are separated.Perhaps, show that a frequency that comprises of an element generation is similar to the frequency of operation of neighbouring element, can in task P170, describe by correction circuit, to change the frequency of operation of second element if calculate.

Figure 75 illustrates the process flow diagram of another embodiment of the present invention method, comprises the task P220 that computing element is installed.In a method, task P220 combines component size and thermal sensitivity, shell and other restrictive condition and connectivity and installation requirement physical messages such as (as being connected required with other device or circuit board) with laying rule (as avoiding long parallel traces) above-mentioned.Figure 76 illustrates the expansion of Figure 75 method, comprises breadboardin task P250.

Figure 77 illustrates the another kind expansion of Figure 75 method, comprises that electromagnetism meets (EMC) evaluation tasks P180 and fault analysis task P190.In task P180, effect and desired indicator (as one or more noise thresholds) that task P140 calculates are made comparisons, if exceed standard, task P190 just makes and revises decision.In an example, to the fault first time, the compensating element installation code also returns task P220, and to the fault second time, then correction circuit is described and comprised shielding, and task P210 is returned in operation.

Figure 78 illustrates the block diagram of one embodiment of the invention device.Electromagnetic Calculation device 710 receiving circuits are described and element mount message signal S110 and radiation profiles signal S120, to the signal of electromagnetic interference (EMI) counter 720 output relevant calculation electromagnetic fields.The field that counter 720 will calculate distributes with the magnetic susceptibility that receives on signal S130 and makes comparisons, and according to above-mentioned desired indicator output result.

Figure 79 and 80 illustrates the operational circumstances that cad tools is used in system's one-level.In this example, when preliminary the laying, consider, 5 elements (as integrated circuit) are placed on the printed circuit board (PCB) according to connectivity and signal integrity.One of them element is considered to the assailant, and under a predetermined critical frequency, the behaviour area of the electromagnetic near field radiation profiles that it records is represented with the bright spot in its packaging part lower right corner.At this moment, other element is considered to the victim.Use the method or the equipment of one embodiment of the invention, comprise the tested radiation profiles of mathematical method expansion, the induction field at arbitrary place on the counting circuit plate, the noise of induction around the measurement function piece again.Then, the exposure limit (as the indication that distributed by magnetic susceptibility) of induced noise value and each element is made comparisons, identify EMC and destroy.In this example, the element that is determined as EMC destruction is indicated with solid slug in Figure 80.In other method, the new laying that a kind of EMC of correction destroys has been proposed.

In another embodiment of the present invention method, task P130 comprises the another kind of coupling mechanism during the research integrated circuit (IC) design: interference or " the substrate coupling " of Semiconductor substrate induction, cause parasitic displacement and/or conduction current flow to take place in Semiconductor substrate by passive and/or active device.Study this phenomenon and can optimize the circuit laying that suppresses this class interference, help to instruct suitable protective ring design to isolate, can consider that ohmic loss and/or capacitance to substrate design passive element on the core to its Effect on Performance to strengthen.Figure 100 illustrates the process flow diagram of the EMC driving method for designing of another embodiment of the present invention.

The automatic distribution method of electronic installation of one embodiment of the invention and/or system, system or equipment can design an any particle size fraction device and system.For example, term used herein " element ", the element on the Semiconductor substrate be can be formed in, functional block (as mimic channel or digital circuits such as XOR gate circuit or microprocessor such as resonant ring or phaselocked loops), silicon chip or tube core, discrete package part or circuit module in the integrated circuit also can be referred to.As mentioned above, can do certain correction (as designing integrated circuit time compensation substrate coupling) to the different grain size level.

Diagnostic test and product assessment

Portable mobile wireless electronics Design of device is general divides two stages.In the phase one, after doing one " stretching, extension circuit board " and confirming that design concept effectively, reduce circuit size with the fit shapes coefficient.At this moment have two problems.At first, owing to one or more self-interference mechanisms only occur after subminiaturization, so the device that dwindles may not work in same level (or not working) in extreme case.Regrettably, the deviser does not know the feature and the corresponding correcting method of this specific mechanisms usually, and often test-the method for makeing mistakes of blindness is corrected with costliness.

Secondly, the device that dwindles can produce undesirable radiation, comprises uneven or embed-type antenna as portable radio device, and the ground plane that makes circuit board is as another pin of dipole and radiation.In wider scope, the energy of electronic installation emission can produce potential danger and/or near the device work of influence to the user.Before this class device is provided in to sell or is used for working environment, by rules and regulations, at least in its original purposes scope, require the supplier to prove that this device is safe to user's (with other possible personnel), will prove that also this device can not disturb the work of other device.For example, industry and/or government regulation all require the supplier to confirm that this device meets some radiation limitations.

Except electromagnetic interference (EMI) and legal biddability problem, the undesirable radiation of electronic installation also means has wasted electric power.For battery powdered devices such as cell phone or pocket computers, reduce this radiation and also help extending battery life.

In some occasion, can not influence the work of final products in the radiation that the design phase uses computation model to confirm that conscious radiator produces and/or not exceed specific level (promptly recording) by distance and/or direction with this device regulation.Yet many electronic installations are complicated as can't to do this simulation.For example, except one or more conscious electromagnetic energy radiators (as antenna), electronic installation also comprises some the unconscious electromagnetic energy radiators printed circuit board (PCB) of unbalanced antenna (as couple), must do laboratory measurement this moment with the proof biddability.

The electromagnetism biddability is spent money with pre-biddability method of testing very much, as require the pre-anechoic room of specialized equipment.Regrettably, when the undesirable radiation limit of electronic installation, be difficult to discern its reason usually.Under the situation that is no more than other requirement (as size, cost and/or weight), make device meet the corrective action of biddability, comprise and set up shielding, redesign one or more printed circuit board (PCB) and/or change aerial position.But these measures often only based on the intuitivism and the experience that obtain from similar situation of past, can not prove and understand present failure mechanism.When not understanding former thereby taking corrective action, even can increase the weight of radiation problem.Lack understanding can cause a series of costlinesses the biddability test loop test with make mistakes.

Wish to reduce the expense of biddability and pre-biddability test, also wishing provides the information of failure mechanism in the biddability test, and more is desirable to provide the information of electronic installation oneself interference mechanism.

Figure 81 illustrates the process flow diagram of the diagnosis of one embodiment of the invention.Task P130 obtains the near-field thermal radiation feature of tested device.In an example application, tested device comprises at least one active device, i.e. its work relates to the discrete component of semiconductor junction activity.Active device comprises integrated circuit and transistor.

In an enforcement method, the near-field thermal radiation feature comprise in the tested device reactive near-field zone every bit in some sampled points (as apart from this apparatus surface less than λ/2 π, wherein λ is the wavelength of relevant frequency) locate the expression (as intensity level and direction) of magnetic vector.As mentioned above, can use the quasistatic approximation method to near-field thermal radiation, and collect this feature with one or more sensors as herein described and locating device in this zone.In one example, all sampling optimizations are in the plane of distance tested device surface predetermined distance.In other enforcement method, task P130 can obtain a kind of different characteristic in certain emission magnetic field and/or the feature at different launching sites.

Task P310 can or obtain radiation feature from data file (as on one or more magnetic, light, phase transformation or other non-volatile media) from the storer array of (as on semiconductor RAM).Perhaps, task P130 comprises by measurement as herein described (as one or more planes or the volume to DUT regulation) and collects radiation feature.In an enforcement method, radiation feature relates to the radiation (as the carrier-frequency range of emitter, or internal operating frequencies, as intermediate frequency, mixing or local frequency) of the frequency or the frequency range of one or more regulations.According to the characteristic and/or the fc-specific test FC standard of tested device, task P130 comprises the test signal of using and/or controlling this tested device of input, for example changes amplitude, frequency and/or the modulation that applies signal, and/or changes the terminal that tested device applies signal.

Task P330 calculates the radiation intensity of tested device in one or more preset distances and/or direction, as the radiation intensity of arbitrary DUT of place in the computational rules volume resolution of regulation (as reach).Radiation intensity can power density (as watt/kg or watt/cm ²), electric field intensity (represents as volt/m) or magnetic field intensity (as the current density of representing with peace/m), and can be expressed as one or more matrixes, array, image or file.Task P330 can suppose the transmission of passing through free space and/or calculate transmission channel, comprise one or more transmission mediums that characterize with special parameters such as permittivity and magnetoconductivities, task P330 can transfer via features as import reception memorizer or another process biography by the user.The description of transmission channel or medium also comprises the shielding material with the indication of features such as position, shape and formation.

The calculating of task P330 is limited to specific frequency or one group or a series of frequency, as comprises and calculate in one plane, tested device surface and the current density (curl of the tangent line magnetic vector of measurement as described herein) at some each points place in the reactive near-field region.Calculate radiation intensity and can use various converter techniques, as Huygens-Fresnel, mode expansion, Green's principle and/or fourier transform.But task P310 and/or P330 be the compensating measure artefact also, as the transport function of survey sensor and/or the transmission line load of reception measuring-signal.

Task P350 receives the intensity that task P330 calculates and also discerns high radiance point or the zone, as comprises intensity and one or more predetermined threshold of calculating are made comparisons (as in the task P355 of Figure 82).Task P350 (P355) exportable indication source position and EMI/EMC upset result's (as using and a plurality of pseudo-colors or other image or curve map as herein described) of mechanism.

Figure 82 illustrates the process flow diagram of another embodiment of the present invention diagnosis.In task P360, design according to the correction tested device as a result of task P155 indication, as set up or revise shielding (as at focus and/or install between the coupling element around self), designing printed circuit board is laid (as separating radiating element and sensitive element) again, and/or change aerial position (as coupling and the radiation of minimizing with ground plane).

Figure 83 illustrates the process flow diagram of another embodiment of the present invention Evaluation Method.Task P320 is received in specific range and/or limits the radiation limit of one or more maximum radiant intensity with the tested device specific direction, and this limit also can limit characteristic frequency or the frequency range that can use each maximum radiant intensity.Each maximum radiant intensity available horsepower density (as watt/kg or watt/cm ²), electric field intensity (as the volt/m) or magnetic field intensity (as the peace/m) expression.For example, rules or industry standard to the limit gauge of far-field radiation be decided to be from this install about 3 meters, under the carrier frequency of device (or in certain limit).Task P335 received radiation feature and radiation limit are also calculated radiation intensity (as described in to task P330, and with the distance and/or the frequency of radiation limit regulation).

A field of safe biddability test relates to the specific absorption rate (SAR) that measure R F radiation is a tissue, as assessing its influence to the user by emitters such as test cell phones.The distance that common legal limit with SAR is limited to from this device reaches (or in certain carrier-frequency range) under 5cm place and the carrier frequency at this device.In this occasion, task P135 calculates the radiation intensity (promptly calculating the radiation intensity in the free space in addition or also) of tested device in the medium that special parameters such as permittivity and magnetoconductivity limit.For example, can select for use the definition of this medium to be similar to the electromagnetic signature of people's skull and brain or other human body parts.

Task P340 makes comparisons the radiation intensity of calculating and the radiation limit of task P320 reception.As among the above-mentioned task P350, the result of task P340 (P345) indicates the position in source and the mechanism that EMI/EMC upsets.

The Evaluation Method of Figure 83 can be done pre-biddability test.For example, pre-biddability test can be discerned the problem area of assessment, and can redesign before actual biddability test with the biddability of a radiometric value inspection and two kinds of limit of SAR and far field.Method flow diagram shown in Figure 84 comprises above-mentioned correction task P360, wherein before testing again, can redesign this device (as the result according to task P345 indication).In another implementation method of the present invention, virtual prototype as herein described is used can be with radiation limit (as SAR and far field) as design objective.

In other was used, the radiation limit that task P120 receives related to the susceptibility (as described herein collection and/or the magnetic susceptibility of storage distribution indication) of a part of device self to the energy of its another part radiation.

Though this paper has described the application of test cell phone and pocket computer, one embodiment of the invention method can also be tested arbitrary electronic installation that has the source device.Active device is a discrete component, and its work relates to the activity of semiconductor junction.The example of active device comprises integrated circuit and transistor.

Figure 85 illustrates the process flow diagram of the actinometry method of another embodiment of the present invention.As described herein, task P306 obtains the spectrum content information of tested device (as integrated circuit) in selected frequency range, as obtaining the spectrum content qualitative index (SCFM) in the broadband range.Task P308 selects for use some frequencies to do further assessment in the frequency range of selecting, as selects for use spectrum content information to exceed some frequencies of predetermined threshold.Task P322 receives one or more radiation limit, comprises distance and radiation threshold value separately.Perhaps, task P322 receives some radiation limit corresponding to institute's selected frequency.Task P312 obtains near-field thermal radiation to institute's selected frequency and distributes, and task P332 calculates corresponding radiation intensity, and task P342 makes comparisons radiation intensity and radiation limit, and is as described herein.The spectrum content information of the device that task P306 obtains can be stored and/or be passed to other applications: for example system-level application such as frequency planning and/or aspect planning.

Above-mentioned all embodiment make any technician in this area can use the present invention.Can do various corrections to these embodiment, and the General Principle that this paper proposes also is applicable to other embodiment.For example, the present invention can partly or entirely be embodied as hardware circuitry, make the circuit structure of special IC, or the firmware program of the nonvolatile memory of packing into or as the software program that loads of machine-readable sign indicating number one class data storage media, this class sign indicating number is the executable instructions of array of logic elements such as microprocessor or other digital signal processing unit.Therefore, the present invention is not limited to above-mentioned all embodiment, but meets the principle and the new feature of the widest range that this paper discloses by any way.

Application

This section is discussed the result of the some systems of all embodiment of the present invention, method and apparatus different application.Discussion relates to all specific embodiments of the present invention, does not limit the more general description of other embodiment.

ASIC characterization: Figure 86 and 87 illustrate the VLSI chip 12 and 60MHz under radiation feature.Use is positioned at the magnetic field sensor of chip top 5mm measures with the 1mm increment, and distribution plan indicates on the packaging part or the level and the content of its surround.According to six magnetic-field measurements of the separate planes of 5mm at interval, draw three-dimensional cross-sectional.

ASIC firmware validation: the RF coupling that the near field measurement indication radiation of VLSI chip and circuit board causes.Figure 88～90 illustrate VLSI tube core and encapsulation region.Plane with 130 microns E field sensor scanning tube core top 2mm obtains the distribution of Figure 88.

Element characteristicsization and diagnosis: on 25 mil thick alumina substrates, make the pass filter that is used to test.In Unit two of radiation test, one has in the substrate input field and to break.Figure 91 B illustrates, and causes mismatch owing to break, and defect filter is in the input field radiation.Figure 91 A, the yardstick of x and y axle is mm among the B.

Product and system-level measurement: the typical basic switch frequency of AC adapter is 30～200KMZ.The radiation of these frequencies is caused by common mode and differential mode two provenances.The imbalance of widely distributed and uncertain stray capacitance is these electric currents and voltage transitions a undesired signal.In the practical application, some coupling mechanisms are worked simultaneously.Adapter does not shield or during partly shielding effect, stray capacitance can increase the weight of this problem near the dependence of other target.

Result among Figure 92 pacifies 12 volts 2.5 of ratings by test that AC adapter with the 65KHz switch provides.Distribution of Magnetic Field obtains by 6 separate planes of sweep span 1cm.

Product and system-level measurement: figure D8 illustrates the radiation feature of cell phone under 340MHz, by phone up and down the magnetic-field measurement on three planes constitute, by battery phone is powered during test.This type of measurement can be checked the shielding material of application in the wireless product structure and the validity of technology.In this specific occasions, the phone Shielding Design device and circuit board one-level adapted conducting polymer.Under 60MHz, the cellular field scan of difference is shown in Figure 92 and 93.

Device actinometry: the undesirable signal shown in Figure 96, by the radiation of a kind of foundry goods (Fab1) manufactured samples, because consider the system-level interference problem of the wireless product of the same VLSI chip design that centers on another foundry goods (Fab2) making, its radiation bandwidth is higher.

Device spectrum content factor of merit: Figure 97 has compared three ASIC A, B, the radiation spectrum of C (using 0.42,0.35 and 0.25 micron manufacturing of process respectively) in 0～1000MHz scope.

RF ASIC circuit board is laid: transistor is a current switch, thereby except its normal signal processing or amplification work, also presents unconscious parasitic broadband radiation behavior.Because device size is little, though general transistorized radiation efficiency is extremely low, the possibility that one or more transistor radiation radiation exist (unless shielding correctly) meeting coupling causes secondary radiation and/or interference to adjacent conducting structure to adjacent elements.

Figure 98 and 99 illustrates the test result to the switching transistor near field.When shape coefficient Product Definition (especially for the square multi-chip module of 10mm) restricting circuits plate transistor area quantity, become board design test to join the performance of two transistorized power amplifiers.As scheme to adorn transistorized central authorities at circuit board shown in D13 and the D14, there is serious coupling, the place is more obvious at collector lead bonding.In addition, because the circuit board laying is unreasonable, the isolation between two input channels is very poor.Measure to confirm that through network analyzer pseudo-chromaticity diagram resembles sees that critically drawing amplifier gain gains with cross aisle.

Magnetic field radiation when Figure 98 illustrates only to the top transistor plus signal distributes, and shows between the transistor by the electromagnetic coupled of separation input with the ground lug of output line.More high-resolution picture (bottom) identifies coupling mechanism between two power transistors (frequency 1900MHz).

Figure 99 is illustrated in the magnetic field radiation distribution that three separate planes in test circuit top record, and bottom diagram looks like to illustrate the three-dimensional magnetic field radiation profiles cross section of circuit board top at X-axis intermediate point (frequency 1900MHz).

Claims (168)

1, a kind of measurement mechanism is characterized in that comprising:

Band probe portion also is configured to export the sensor of a plurality of measuring-signals, and wherein each described measuring-signal is with a corresponding relation in a plurality of three-dimensional localization relations between described probe portion and the described source, and the energy field that launch in the expression source is to the effect of described probe portion;

Locating device is configured to controllably set up described a plurality of positioning relation; With

Processing unit is configured to receive data according to measuring-signal and the locating information that relates to a plurality of positioning relations, and the output field feature,

Its midfield feature comprises the three-dimensional feature of expression energy field to the effect of described probe portion.

According to the measurement mechanism of claim 1, it is characterized in that 2, energy field is an electric field.

According to the measurement mechanism of claim 1, it is characterized in that 3, energy field is magnetic field.

According to the measurement mechanism of claim 1, it is characterized in that 4, energy field is a thermal field.

According to the equipment of claim 1, it is characterized in that 5, one of three-dimensional is the orientation on other the two-dimentional plane that limits.

According to the measurement mechanism of claim 5, it is characterized in that 6, described sensor winds the axis rotation perpendicular to the surface, source.

According to the measurement mechanism of claim 1, it is characterized in that 7, described sensor comprises an active device.

According to the measurement mechanism of claim 1, it is characterized in that 8, brittle component extends between probe portion and sensor body.

According to the measurement mechanism of claim 1, it is characterized in that 9, described probe portion comprises two boards, electric capacity is derived between each slave plate of described a plurality of data-signals.

According to the measurement mechanism of claim 1, it is characterized in that 10, described probe portion comprises a spheroid, its diameter is very little on electricity.

According to the measurement mechanism of claim 1, it is characterized in that 11, described sensor comprises one of matching network, amplifier and wave filter at least.

12, according to the measurement mechanism of claim 1, it is characterized in that, also comprise the registration unit that is configured to indicate the relative source orientation of described sensor.

According to the measurement mechanism of claim 12, it is characterized in that 13, described registration unit comprises a laser beam emitting device.

According to the measurement mechanism of claim 1, it is characterized in that 14, processing unit is configured to compensate the predetermined state of signal path between probe portion and the processing unit.

15, a kind of method is characterized in that comprising:

Between sensor and field source, controllably set up a plurality of three-dimensional localization relations, the output of described sensor is a plurality of corresponding to the measuring-signal of each described positioning relation wherein, and each described data-signal represent the effect of field to described sensor with a corresponding described positioning relation; With

In conjunction with the locating information that relates to described a plurality of positioning relations, handle measuring-signal, with expression a three-dimensional character to described sensor effect from described sensor.

According to the method for claim 15, it is characterized in that 16, described sensor is a magnetic field sensor.

According to the method for claim 15, it is characterized in that 17, described sensor is an electric-field sensor.

According to the method for claim 15, it is characterized in that 18, described sensor is a thermal sensor.

According to the method for claim 15, it is characterized in that 19, described sensor is the electronic installation of a job.

According to the method for claim 15, it is characterized in that 20, one of three-dimensional is the orientation on other the two-dimentional plane that limits.

21, according to the method for claim 15, it is characterized in that, use the spectrometer process data signal.

According to the method for claim 15, it is characterized in that 22, process data signal comprises the described sensor of the compensation predetermined state of the path of transmitted data signal thereon.

23, a kind of method of obtaining radiation data is characterized in that, described method comprises:

Reception is from first measuring-signal of sensor, and this first measuring-signal is represented the effect of the electromagnetic field of tested device emission to sensor;

Select the frequency of the amplitude of first measuring-signal above predetermined threshold;

Between sensor and tested device, controllably set up a plurality of positioning relations;

To each of a plurality of positioning relations, receive and represent electromagnetic field that tested device launches second measuring-signal the effect of sensor; With

To each second measuring-signal, by the quality of selected frequency measurement second measuring-signal.

24, according to the method for obtaining radiation data of claim 23, it is characterized in that, receive first measuring-signal and comprise transport function the signal application sensor.

25, according to the method for obtaining radiation data of claim 23, it is characterized in that, receive second measuring-signal and comprise transport function the signal application sensor.

26, according to the method for obtaining radiation data of claim 23, it is characterized in that, receive first measuring-signal and comprise that spectrometer is scanned window moves through predetermined frequency range.

27, according to the method for obtaining radiation data of claim 23, it is characterized in that, select frequency to be included in the scanning window and measure the amplitude of first measuring-signal, and will scan window and move through a frequency range.

According to the method for obtaining radiation data of claim 23, it is characterized in that 28, the quality of measuring second measuring-signal comprises measures the electromagnetic field direction in space.

29, according to the method for obtaining radiation data of claim 23, it is characterized in that electromagnetic field comprises magnetic field, the quality of measuring second measuring-signal comprises the mensuration magnetic direction.

According to the method for obtaining radiation data of claim 23, it is characterized in that 30, the quality of measuring second measuring-signal comprises measures the electromagnetic field amplitude.

31, according to the method for obtaining radiation data of claim 23, it is characterized in that, receive one of at least the first and second measuring-signals and comprise to tested device input excitation signal.

32, according to the method for obtaining radiation data of claim 31, it is characterized in that, receive one of at least the first and second measuring-signals and comprise the quality that changes excitation signal.

33, according to the method for obtaining radiation data of claim 32, it is characterized in that, receive one of at least the first and second measuring-signals and comprise the frequency that changes activation signal.

34, a kind of method of obtaining radiation data is characterized in that, described method comprises:

Controllably set up a plurality of positioning relations between sensor and the field source;

A plurality of measuring-signals of receiving sensor, each measuring-signal are corresponding to a different positioning relation, and the expression field is by the effect of corresponding positioning relation to sensor;

Every kind of positioning relation is obtained the data value of corresponding data signal, and this data value characterizes the size and the direction of vector based on the field.

According to the method for obtaining radiation data of claim 34, it is characterized in that 35, data value is based on the component of preset frequency.

36, according to the method for obtaining radiation data of claim 34, it is characterized in that, controllably set up a plurality of positioning relations and comprise relative source rotation sensor.

37, according to the method for obtaining radiation data of claim 34, it is characterized in that, controllably set up a plurality of positioning relations and be included in the plane that is arranged essentially parallel to the surface, source, sensor is moved to the position of a plurality of correspondences.

38, according to the method for obtaining radiation data of claim 34, it is characterized in that, receive a plurality of measuring-signals and comprise transport function this sensor of signal application that receives the self-sensing device.

According to the method for obtaining radiation data of claim 38, it is characterized in that 39, sensor transfer function is a frequency function.

40, according to the method for obtaining radiation data of claim 38, it is characterized in that, also comprise using and obtain this sensor transfer function with reference to the field source correcting sensor.

41, according to the method for obtaining radiation data of claim 34, it is characterized in that, receive a plurality of measuring-signals and be included in compensating cable loss in the signal that is received from sensor.

42, according to the method for obtaining radiation data of claim 34, it is characterized in that, obtain data value and comprise to detecting device and import corresponding data-signal.

According to the method for obtaining radiation data of claim 42, it is characterized in that 43, detecting device comprises the tuner-type receiver.

44, a kind of method of obtaining radiation data is characterized in that, described method comprises:

Controllably set up a plurality of positioning relations between sensor and the field source;

A plurality of measuring-signals of receiving sensor, each measuring-signal are corresponding to a different positioning relation, and the expression field is by the effect of corresponding positioning relation to sensor;

Every kind of positioning relation is obtained the data value of corresponding data signal; With

According to the three-dimensional at least field expression of data value output.

According to the method for obtaining radiation data of claim 44, it is characterized in that 45, each data value is relevant with the position of predetermined plane inner sensor, each data value comprises that the field, relevant position characterizes the size and the direction of vector.

According to the method for obtaining radiation data of claim 44, it is characterized in that 46, output field represents to comprise that display field represents.

According to the method for obtaining radiation data of claim 46, it is characterized in that 47, display field represents to comprise that the pseudo-color of display field represents.

According to the method for obtaining radiation data of claim 46, it is characterized in that 48, display field is represented to comprise and shown at least one source and represent the image of tandem source profile with the field.

49, according to the method for obtaining radiation data of claim 48, it is characterized in that, display field represent to comprise show a bit represent in the source images with the field in any dependence.

50, according to the method for obtaining radiation data of claim 45, it is characterized in that, also comprise source input excitation signal, to small part based on this excitation signal.

51, according to the method for obtaining radiation data of claim 50, it is characterized in that, comprise one of the frequency of controlling excitation signal at least and amplitude to source input excitation signal.

52, a kind of method of obtaining the magnetic susceptibility data is characterized in that, described method comprises:

Field source is placed near an electronic installation;

Change the quality of field;

Receive a plurality of data-signals of electronic installation, each data-signal is corresponding to the different mass values and an expression effect to this electronic installation of field; With

The magnetic susceptibility of storage electronic installation distributes, and this magnetic susceptibility distributes based on a plurality of data-signals.

According to the method for obtaining the magnetic susceptibility data of claim 52, it is characterized in that 53, field source comprises an antenna, comprises the transport function of using antenna and obtain the corresponding data value.

According to the method for obtaining the magnetic susceptibility data of claim 52, it is characterized in that 54, the location field source is included in during a plurality of data-signals of described reception, controllably move this source along intended path.

55, according to the method for obtaining the magnetic susceptibility data of claim 52, it is characterized in that, change a quality and comprise the change field strength.

56, according to the method for obtaining the magnetic susceptibility data of claim 52, it is characterized in that, change a quality and comprise the change field frequencies range.

57, according to the method for obtaining the magnetic susceptibility data of claim 52, it is characterized in that, receive a plurality of data-signals and comprise the data-signal that receives many pins of electronic installation.

According to the method for obtaining the magnetic susceptibility data of claim 52, it is characterized in that 58, each data-signal is based on the voltage of field induction.

59, a kind of data storage media that contains formatted data is characterized in that formatted data comprises: characterize the electricity of integrated circuit emission, the value in magnetic field.

60, a kind of computer-readable storage medium that keeps an array in computer system is characterized in that this array comprises: the value of the electromagnetic field of expression electronic installation emission.

According to the medium of claim 60, it is characterized in that 61, value wherein is based at least a electric field that electronic installation is launched or the measurement in magnetic field.

According to the medium of claim 60, it is characterized in that 62, wherein each value is corresponding to any two-dimensional position in the predetermined plane, and based on the intensity and the direction of this electromagnetic field.

According to the medium of claim 60, it is characterized in that 63, wherein each value is corresponding to any two-dimensional position in the predetermined plane, and characterize the size and the direction of vector based on this electromagnetic field.

According to the medium of claim 63, it is characterized in that 64, vector is the tangent line on electronic installation surface.

According to the medium of claim 60, it is characterized in that 65, on behalf of the near-field thermal radiation of this device, all values distribute.

66, a kind of electromagnetic compatibility that is used for drives the equipment that designs, and it is characterized in that described equipment comprises:

The Electromagnetic Calculation device is configured to receive mount message that (A) relevant a plurality of circuit components install relatively and (B) at least a radiation profiles, and each radiation profiles is corresponding to one of a plurality of circuit components; With

The electromagnetic interference (EMI) counter is coupled to the Electromagnetic Calculation device and is configured to receive at least one magnetic susceptibility distribution, and each magnetic susceptibility distributes corresponding to one of a plurality of circuit components,

Wherein the Electromagnetic Calculation device also be configured to export relevant induction field information and

The electromagnetic interference (EMI) counter also is configured to receive the information of relevant induction field, and exports the information of the effect that causes in relevant inductive electromagnetic place.

67, the electromagnetic compatibility that is used for according to claim 66 drives the equipment that designs, it is characterized in that, the Electromagnetic Calculation device also is configured to receiving circuit and describes, circuit is described and is comprised (E) at least one circuit component feature, each circuit component feature is corresponding to one of a plurality of circuit components, (F) connectivity information, described connectivity information relates at least one electric path, and each electric path connects wherein at least two circuit components.

According to the equipment that electromagnetic compatibility drives design that is used for of claim 67, it is characterized in that 68, circuit is described and comprised that synoptic diagram represents.

69, according to the equipment that electromagnetic compatibility drives design that is used for of claim 67, it is characterized in that circuit is described the multiple expression that comprises hardware description language.

According to the equipment that electromagnetic compatibility drives design that is used for of claim 67, it is characterized in that 70, circuit is described and comprised the net table.

According to the equipment that electromagnetic compatibility drives design that is used for of claim 66, it is characterized in that 71, the Electromagnetic Calculation device also is configured to receive the information about one of the feature of electromagnetic shielding element at least and position.

72, according to the equipment that electromagnetic compatibility drives design that is used for of claim 66, it is characterized in that each described at least a radiation profiles comprises repeatedly electromagnetic near field measurement result.

According to the equipment that electromagnetic compatibility drives design that is used for of claim 72, it is characterized in that 73, at least one radiation profiles, wherein each described a plurality of electromagnetic near field measurement is relevant with grid one position, described grid has two Spatial Dimensions at least.

74, according to the equipment that electromagnetic compatibility drives design that is used for of claim 72, it is characterized in that at least one radiation profiles, each described a plurality of electromagnetic near field measurement comprises amplitude and direction.

According to the equipment that electromagnetic compatibility drives design that is used for of claim 66, it is characterized in that 75, mount message comprises about relative tertiary location between described a plurality of circuit components and directed information.

76, according to the equipment that electromagnetic compatibility drives design that is used for of claim 75, it is characterized in that mount message comprises the information of relevant described a plurality of circuit component space dimensions.

77, according to the equipment that electromagnetic compatibility drives design that is used for of claim 66, it is characterized in that each described at least one radiation profiles comprises a plurality of electromagnetic near field measurement results,

For at least one radiation profiles, each described a plurality of electromagnetic near field is measured relevant with grid one position, and described grid has border and at least two Spatial Dimensions,

Induction field information comprises a plurality of induction field amplitudes,

Each of a plurality of amplitudes corresponding to one of a plurality of locus and

At least one of a plurality of locus is beyond described net boundary.

According to the equipment that electromagnetic compatibility drives design that is used for of claim 66, it is characterized in that 78, each magnetic susceptibility distributes and represents the response characteristic of related circuit element to the electromagnetic field of the source generation of predetermined characteristic and position.

79, a kind of electromagnetic compatibility that is used for drives the method that designs, and it is characterized in that described method comprises:

According to the mount message of (A) a plurality of circuit component relative positions and (B) at least one radiation profiles, calculate induction field, wherein each radiation profiles corresponding to one of a plurality of circuit components and

According at least one magnetic susceptibility Distribution calculation inductive electromagnetic field action, each magnetic susceptibility distributes corresponding to one of a plurality of circuit components.

80, the electromagnetic compatibility that is used for according to claim 79 drives the method that designs, it is characterized in that, induction field calculates and describes based on circuit, comprise (E) at least one circuit component feature, each circuit component feature is corresponding to one of a plurality of circuit components, (F) connectivity information, described connectivity information relates at least one electric path, and every electric path connects two in a plurality of circuit components at least.

81,0 the electromagnetic compatibility that is used for drives the method that designs according to Claim 8, it is characterized in that, comprises that also the inductive electromagnetic field action of describing and calculating according to mount message, circuit calculates the circuit running of simulation.

82, according to Claim 81 be used for the method that electromagnetic compatibility drives design, it is characterized in that, also comprise result of calculation and at least one desired indicator of the circuit running of described simulation made comparisons.

83,2 the electromagnetic compatibility that is used for drives the method that designs according to Claim 8, it is characterized in that, also comprises according to described comparative result at least one in correction circuit description and the mount message.

84, according to Claim 80 be used for the method that electromagnetic compatibility drives design, it is characterized in that circuit is described and comprised that synoptic diagram represents.

85, according to Claim 80 be used for the method that electromagnetic compatibility drives design, it is characterized in that circuit is described and comprised that hardware describes a plurality of expression of language.

86,0 the electromagnetic compatibility that is used for drives the method that designs according to Claim 8, it is characterized in that, circuit is described and comprised the net table.

According to the method that electromagnetic compatibility drives design that is used for of claim 79, it is characterized in that 87, the calculating of induction field counter is based at least one information in the characteristic of electromagnetic shielding element and the position.

88, according to the method that electromagnetic compatibility drives design that is used for of claim 79, it is characterized in that each described at least one radiation profiles comprises a plurality of electromagnetic near field measurement results.

89,8 the electromagnetic compatibility that is used for drives the method that designs according to Claim 8, it is characterized in that, at least one radiation profiles, each described a plurality of electromagnetic near field is measured relevant with grid one position, and described grid has two Spatial Dimensions at least.

90,8 the electromagnetic compatibility that is used for drives the method that designs according to Claim 8, it is characterized in that at least one radiation profiles, each described a plurality of electromagnetic near field measurement comprises amplitude and direction.

According to the method that electromagnetic compatibility drives design that is used for of claim 79, it is characterized in that 91, mount message comprises described a plurality of circuit component relative tertiary location and directed information.

92, according to the method that electromagnetic compatibility drives design that is used for of claim 91, it is characterized in that mount message comprises the information of a plurality of circuit component space dimensions.

93. the method that electromagnetic compatibility drives design that is used for according to claim 79 is characterized in that each described at least one radiation profiles comprises a plurality of electromagnetic near field measurement results,

For at least one radiation profiles, each described a plurality of electromagnetic near field is measured relevant with grid one position, and described grid has border and at least two Spatial Dimensions,

Induction field information comprises a plurality of induction field amplitudes,

Each of a plurality of amplitudes corresponding to one of a plurality of locus and

At least one of a plurality of locus is beyond described net boundary.

According to the method that electromagnetic compatibility drives design that is used for of claim 79, it is characterized in that 94, each magnetic susceptibility distributes and represents the response characteristic of related circuit element to the electromagnetic field of the source generation of predetermined characteristic and position.

95, a kind of electromagnetic compatibility that is used for drives the method that designs, and it is characterized in that described method comprises:

Receiving circuit is described, comprise (A) at least one circuit component feature, each circuit component feature is corresponding at least one and (B) the connectivity information of at least one electric path in a plurality of circuit components, and every electric path connects at least two in a plurality of circuit components;

Describe according to circuit, calculate the mount message of a plurality of circuit component relative positions;

According to mount message and at least one radiation profiles, calculate induction field; With

Distribute according at least one magnetic susceptibility, calculate the inductive electromagnetic field action,

Wherein each radiation profiles corresponding to one of a plurality of circuit components and

Each magnetic susceptibility distributes corresponding to one of a plurality of circuit components.

96, according to the method that electromagnetic compatibility drives design that is used for of claim 95, it is characterized in that, also comprise the inductive electromagnetic field action of describing and calculating according to mount message, circuit, calculate the circuit running of simulation.

97, according to the method that electromagnetic compatibility drives design that is used for of claim 96, it is characterized in that, also comprise circuit running result of calculation and at least one desired indicator of described simulation are made comparisons.

98. the method that electromagnetic compatibility drives design that is used for according to claim 97 is characterized in that, also comprises according to described at least one that relatively connects in description of fruit correction circuit and the mount message.

99, a kind of data storage media with machine-readable sign indicating number, machine-readable sign indicating number comprise the instruction that can be carried out by array of logic elements, and described instruction limits a kind of method that electromagnetic compatibility drives design that is used for, and it is characterized in that this method comprises:

Based on the mount message of (A) a plurality of circuit component relative positions and (B) at least one radiation profiles calculate induction field, each radiation profiles corresponding to one of a plurality of circuit components and

According at least one magnetic susceptibility Distribution calculation inductive electromagnetic field action, each magnetic susceptibility distributes corresponding to one of a plurality of circuit components.

100, according to the data storage media of claim 99, it is characterized in that, calculating induction field describes based on circuit, comprise (E) at least one circuit component feature, each circuit component feature is corresponding to one of a plurality of circuit components, (F) connectivity information, described connectivity information relates at least one electric path, and every electric path connects at least two in a plurality of circuit components.

101,, it is characterized in that also comprising that the inductive electromagnetic field action of describing and calculating according to mount message, circuit calculates the circuit running of simulation according to the data storage media of claim 100.

102,, it is characterized in that also comprising circuit running result of calculation and at least one desired indicator of described simulation are made comparisons according to the data storage media of claim 101.

103, according to the data storage media of claim 102, it is characterized in that also comprising according to described comparative result correction circuit describe and mount message at least one.

According to the data storage media of claim 100, it is characterized in that 104, circuit is described and to be comprised that synoptic diagram represents.

According to the data storage media of claim 100, it is characterized in that 105, circuit is described and to be comprised that hardware describes a plurality of expression of language.

According to the data storage media of claim 100, it is characterized in that 106, circuit is described and comprised the net table.

107, according to the data storage media of claim 99, it is characterized in that,, calculate the induction field counter according at least one information in the characteristic of electromagnetic shielding element and the position.

According to the data storage media of claim 99, it is characterized in that 108, each described at least one radiation profiles comprises a plurality of electromagnetic near field measurement results.

According to the data storage media of claim 108, it is characterized in that 109, at least one radiation profiles, each described a plurality of electromagnetic near field is measured relevant with grid one position, described grid has at least two Spatial Dimensions.

According to the data storage media of claim 108, it is characterized in that 110, at least one radiation profiles, each of described a plurality of electromagnetic near field measurements comprises amplitude and direction.

According to the data storage media of claim 99, it is characterized in that 111, mount message comprises the relative tertiary location and directed information of described a plurality of circuit components.

According to the data storage media of claim 111, it is characterized in that 112, mount message comprises the information of a plurality of circuit component space dimensions.

113, according to the data storage media of claim 99, it is characterized in that, each described at least one radiation profiles comprise a plurality of electromagnetic near field measurement results and

For at least one radiation profiles, each described a plurality of electromagnetic near field is measured relevant with grid one position, and described grid has border and at least two Spatial Dimensions,

Induction field information comprises a plurality of induction field amplitudes,

Each of a plurality of amplitudes corresponding to one of a plurality of locus and

At least one of a plurality of locus is beyond described net boundary.

According to the data storage media of claim 99, it is characterized in that 114, each magnetic susceptibility distributes and represents the response characteristic of related circuit element to the electromagnetic field of the source generation of predetermined properties and position.

115, a kind of data storage media with machine-readable sign indicating number, machine-readable sign indicating number comprise the instruction that can be carried out by array of logic elements, and described instruction limits electromagnetic compatibility and drives method for designing, it is characterized in that described method comprises:

Receiving circuit is described, circuit is described and is comprised (A) at least one circuit component feature, each circuit component feature is corresponding at least one and (B) the connectivity information of at least one electric path in a plurality of circuit components, and every electric path connects at least two in a plurality of circuit components;

Describe according to circuit, calculate the mount message of a plurality of circuit component relative positions;

According to mount message and at least one radiation profiles, calculate induction field; With

Distribute according at least one magnetic susceptibility, calculate the inductive electromagnetic field action,

Wherein each radiation profiles corresponding to one of a plurality of circuit components and

Each magnetic susceptibility distributes corresponding to one of a plurality of circuit components.

116, according to the data storage media of claim 115, it is characterized in that, also comprise the inductive electromagnetic field action of describing and calculating according to mount message, circuit, calculate the circuit running of simulation.

117, according to the data storage media of claim 116, it is characterized in that, also comprise result of calculation and at least one desired indicator of the running of the circuit of described simulation are made comparisons.

118, according to the data storage media of claim 117, it is characterized in that, also comprise according to described comparative result correction circuit describe and mount message at least one.

119, a kind of diagnostic test method is characterized in that, described method comprises:

Obtain the near-field thermal radiation characteristic of tested device;

The received radiation limit comprises radiation intensity and respective distance; With

Calculate the radiation intensity of tested device in respective distance.

According to the diagnostic test method of claim 119, it is characterized in that 120, tested device is an electronic installation.

According to the diagnostic test method of claim 119, it is characterized in that 121, tested device is the radio frequency generating means.

According to the diagnostic test method of claim 119, it is characterized in that 122, tested device comprises an integrated circuit at least.

123, according to the diagnostic test method of claim 119, it is characterized in that, also comprise the visual demonstration that at least a portion near-field thermal radiation characteristic is provided.

124, according to the diagnostic test method of claim 119, it is characterized in that, also comprise relatively the radiation intensity calculated and value based on the radiation intensity of radiation limit.

125, according to the diagnostic test method of claim 124, it is characterized in that, also comprise and point out described comparative result.

According to the diagnostic test method of claim 119, it is characterized in that 126, the near-field thermal radiation feature comprises the feature of magnetic vector in each position of a plurality of positions,

A plurality of positions are above tested device in the plane.

According to the diagnostic test method of claim 126, it is characterized in that 127, the feature of magnetic vector in each a plurality of position comprises the intensity and the direction of vector.

128, a kind of assessment method of testing is characterized in that, described method comprises:

Obtain a plurality of near-field thermal radiation features of tested device, each near-field thermal radiation feature relates to a corresponding frequencies;

Receive at least one radiation limit, comprise radiation intensity and respective distance; With

To each corresponding frequencies, calculate the radiation intensity of tested device in respective distance.

129, according to the assessment method of testing of claim 128, it is characterized in that, also be included on the frequency range radiation level of measuring tested device and

In this frequency range, determine that a plurality of radiation level measured values surpass the frequency of predetermined threshold.

130, a kind of diagnostic test method is characterized in that, described method comprises:

Obtain tested device near-field thermal radiation feature;

According to this feature calculation from this tested device of the radiation field place of tested device one preset distance; With

The identification high radiation intensity area.

According to the diagnostic test method of claim 130, it is characterized in that 131, described method also comprises the design of revising tested device.

According to the diagnostic test method of claim 130, it is characterized in that 132, described method also comprises comparison radiation field and radiation limit.

According to the diagnostic test method of claim 130, it is characterized in that 133, the near-field thermal radiation feature comprises the feature of magnetic vector in each position of a plurality of positions,

Wherein a plurality of positions are above tested device in the plane.

According to the diagnostic test method of claim 133, it is characterized in that 134, the feature of magnetic vector in each position of a plurality of positions comprises the intensity and the direction of vector.

135, according to the diagnostic test method of claim 130, it is characterized in that, also comprise the visual demonstration that at least a portion near-field thermal radiation feature is provided.

136, a kind of Radiation Measurements is characterized in that, described method comprises:

Obtain the spectrum content information of tested device over a range of frequencies;

In this frequency range, select a frequency;

Obtain the near-field thermal radiation feature of tested device at institute's selected frequency;

The received radiation limit comprises radiation intensity;

Calculate the radiation intensity of tested device; With

The radiation intensity of radiation intensity of Ji Suaning and radiation limit relatively.

According to the diagnostic test method of claim 136, it is characterized in that 137, described method also comprises the design of revising tested device.

According to the diagnostic test method of claim 136, it is characterized in that 138, the near-field thermal radiation feature comprises the feature of magnetic vector each position in a plurality of positions,

Wherein a plurality of positions are above tested device in the plane.

According to the diagnostic test method of claim 138, it is characterized in that 139, the feature of magnetic vector in each position comprises the intensity and the direction of vector.

140, according to the diagnostic test method of claim 136, it is characterized in that, also comprise visual demonstration at least a portion near-field thermal radiation feature.

According to the measurement mechanism of claim 1, it is characterized in that 141, described probe portion comprises an active device.

142, measurement mechanism according to Claim 8 is characterized in that, brittle component comprises a glass tube.

143, measurement mechanism according to Claim 8 is characterized in that, brittle component surrounds truck between a part of probe portion and the sensor body.

According to the measurement mechanism of claim 12, it is characterized in that 144, registration unit comprises imaging device.

145, according to the measurement mechanism of claim 1, it is characterized in that having at least one to comprise and be configured to determination sensor Feature Recognition mechanism in locating device and the processing unit.

According to the measurement mechanism of claim 1, it is characterized in that 146, the truck between probe portion and the processing unit comprises a balanced transmission line,

According to the measurement mechanism of claim 146, it is characterized in that 147, signal path comprises a twisted-pair feeder.

According to the measurement mechanism of claim 1, it is characterized in that 148, the torsional angle of twisted-pair feeder is from twisted-pair feeder end to end difference.

According to the measurement mechanism of claim 1, it is characterized in that 149, sensor comprises regulating circuit.

According to the measurement mechanism of claim 1, it is characterized in that 150, regulating circuit comprises a differential amplifier.

According to the measurement mechanism of claim 1, it is characterized in that 151, probe portion comprises an etching ring.

According to the measurement mechanism of claim 1, it is characterized in that 152, probe portion comprises etched plate.

According to the measurement mechanism of claim 1, it is characterized in that 153, probe portion comprises at least one microcomputer electric component.

According to the measurement mechanism of claim 1, it is characterized in that 154, the signal path between probe portion and the processing unit comprises a rotary connector.

According to the measurement mechanism of claim 1, it is characterized in that 155, the signal path between probe portion and the processing unit comprises biasing T-shaped that is configured to receive the DC signal.

156, a kind of method of measuring vector field is characterized in that described method comprises:

Controllably set up a plurality of three-dimensional localization relations between sensor and the field source,

With respect to the source rotation sensor and receive a plurality of measuring-signals, each described measuring-signal is represented with the effect of this positioning relation to described sensor with each positioning relation; With

To each positioning relation, handle corresponding measuring-signal and the expression of obtaining the vector field of source emission.

157, according to the method for the measurement vector field of claim 156, it is characterized in that vector field represents to comprise the size and the direction of vector field.

158, according to the method for the measurement vector field of claim 156, it is characterized in that, handle corresponding measuring-signal and comprise according to measuring-signal to tuner-type receiver input data.

159, according to the method for the measurement vector field of claim 158, it is characterized in that the tuner-type receiver comprises spectrometer.

160, according to the method for the measurement vector field of claim 156, it is characterized in that rotation sensor comprises the interior location of detecting sensor.

161, according to the method for the measurement vector field of claim 160, it is characterized in that, handle corresponding measuring-signal and comprise that the sampling running of A/D converter is synchronous with described detecting sensor interior location with the A/D converter corresponding measuring-signal of sampling.

162, according to the measurement mechanism of claim 149, it is characterized in that, select the torsional angle of twisted-pair feeder between probe portion and the regulating circuit, with at least one impedance in coupling probe portion and the regulating circuit.

163, according to the method for obtaining radiation data of claim 23, it is characterized in that, receive measuring-signal and comprise the span of increase spectrometer on the predetermined rate scope.

According to the method for obtaining radiation data of claim 23, it is characterized in that 164, selected frequency comprises measures the big or small of the interior measuring-signal of window and moving window on a frequency range.

165, according to the method for obtaining radiation data of claim 34, it is characterized in that, receive a plurality of measuring-signals and be included in compensation insertion loss in the signal that is received from sensor.

166, a kind of method of obtaining radiation data is characterized in that, described method comprises:

Controllably set up a plurality of positioning relations between sensor and the field source;

Receive a plurality of measuring-signals from sensor, each measuring-signal represents the field with the effect of corresponding positioning relation to sensor corresponding to different positioning relations in the lump;

To each positioning relation, obtain data value from the corresponding data signal, this data value characterizes the size and the direction of vector based on the field; With

Data value is stored the computer-readable storage medium.

According to the method for obtaining radiation data of claim 42, it is characterized in that 167, detecting device comprises one of spectrometer and oscillograph.

168, according to the method for obtaining the magnetic susceptibility data of claim 52, it is characterized in that, receive the electronic installation running that a plurality of data-signals comprise that checking is predetermined from electronic installation.

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