CN1319163C - Semiconductor package with heat sink - Google Patents

Abstract

The semiconductor package with a heat sink of the present invention includes: a substrate having a first surface and an opposing second surface; at least one chip disposed on the first surface of the substrate and electrically connected to the substrate; a plurality of solder balls implanted on the second surface of the substrate; the radiating fin is provided with a flat part and a supporting part extending from the edge of the flat part, is connected on the first surface of the substrate by utilizing the supporting surface of the supporting part, and the supporting surface is provided with at least one concave part, and the surface of the concave part is provided with at least one protruding unit; and the adhesive material laid between the supporting part and the substrate, so that the adhesive material filled into the concave part and coating the periphery of the protruding unit greatly improves the adhesive force between the radiating fin and the substrate without increasing the manufacturing cost, the radiating fin is prevented from easily falling off under the shock, and the structural design of the radiating fin does not influence the circuit layout on the substrate and cause chip fracture.

Description

Semiconductor package with heat sink

technical field

The present invention relates to a semiconductor package with a heat sink, in particular to a semiconductor package with a heat sink that can firmly bond the heat sink to prevent it from falling off.

Background technique

Flip-chip ball grid array (Flip-Chip Ball Grid Array, FCBGA) semiconductor package is a packaging structure with flip chip and ball grid array at the same time, so that the active surface (Active Surface) of at least one chip passes through multiple The solder joints (Solder Bumps) are electrically connected to one surface of the substrate (Substrate), and a plurality of solder balls (Solder Ball) as input/output (I/O) terminals are planted on the other surface of the substrate; this The packaging structure can greatly reduce the volume, and also eliminate the existing wire design, which can reduce impedance and improve electrical properties to avoid signal degradation during transmission. Therefore, it has become the mainstream packaging technology for chips and electronic components.

Due to the superior characteristics of flip-chip ball grid array packaging, it is mostly used in highly integrated multi-chip packages to meet the volume and computing requirements of such electronic components, but due to the high frequency of such electronic components The calculation characteristics make it generate more heat than ordinary packages during operation. Therefore, whether the heat dissipation effect is good or not has become an important key to the quality rate of this type of packaging technology; the existing flip-chip ball grid array package is directly Stick the heat sink (Heat Sink) on the non-active surface (Non-active Surface) of the chip, without transferring heat through the poor thermal conductivity encapsulant (Encapsulant), thus forming a chip-adhesive-heat sink-external Direct heat dissipation path to achieve better heat dissipation than other packages.

For this type of packaging structure, in the prior art, the heat sink is directly bonded to the substrate with adhesive materials such as adhesive (Adhesive) or solder (Solder), and the area of the heat sink is larger than the area of the chip, so as to achieve Better heat dissipation, such as those disclosed in U.S. Patent No. 5,311,402, No. 5,396,403, No. 5,931,222, No. 5,637,920, No. 5,650,918 or No. 6,011,304; The actual bonding area between the heat sink and the substrate is not large, which limits its bonding stability, especially when there are other passive components (Passive Components) that improve its electrical performance on the substrate, it is even more reduced. The bonding area between the substrate and the heat sink makes it easy for the heat sink to fall off under a shear force during the subsequent shock test (Shock Test) or other external vibrations.

To solve this problem, U.S. Patent No. 6,093,961 also discloses a package structure that mechanically strengthens the joint stability of the heat sink. As shown in FIG. 11 , an elastic hook-shaped leg is designed on the edge of the heat sink 50 51. Engage the heat sink 50 on the chip 52 in a clamping manner to improve the bonding stability of the heat sink 50. However, this design method only considers the firmness of the heat sink 50, but results in a larger package. This is because the coefficient of thermal expansion (Coefficient of Thermal Expansion, CTE) of the heat sink 50 and the chip 52 is very different, so the contact surface 53 of the heat sink 50 and the hook-shaped leg 51 are very easy to be damaged in the subsequent high-temperature process or reliability test. The chip 52 is pressed due to the difference in thermal deformation between the chip 52 and the chip 52 , resulting in cracking of the chip 52 .

To sum up, how to strengthen the adhesion of the heat sink while reducing the contact area between the heat sink and the chip is an important research and development direction. Therefore, some people have proposed several connection methods for positioning the heat sink with external fixing parts , the U.S. Patent No. 5,396,403 case shown in Figure 12 is to set up positioning holes 62 and 63 on the corresponding positions of the heat sink 60 and the base plate 61 respectively, and use bolts 64 to embed them therein, so as to avoid the fall of the heat sink 60, U.S. Patent No. 5,926,371 also discloses a similar connection method; in addition to the above-mentioned screw connection method, there is also a structure for positioning the heat sink with a fastener, such as U.S. Patent No. 6,441,485, as shown in Figure 13, that is, The hook structure 71 disposed on the edge of the heat sink 70 is embedded in the hole 73 on the substrate 72 to position the heat sink 70 .

However, for the above-mentioned existing structures that use external fixing parts to locate the heat sink, the common point is that holes must be opened on the reserved area on the substrate. This design can reduce the available circuit layout area on the substrate, and at the same time It also increases the manufacturing cost of the substrate, and if the hole is invaded by external moisture or pollutants during the process, the good rate of the package cannot be predicted.

Therefore, related improvements are gradually developing toward changing the design of the heat sink to strengthen its adhesion, so as to avoid damaging the original functions of the chip and the substrate while fixing the heat sink. Figure 14 is a cross-sectional view of one of the designed packages. The feature is that a groove 82 is set on the contact surface of the heat sink 80 and the substrate 81, and the filling of the adhesive material 83 in the groove 82 increases the contact area between the heat sink 80 and the adhesive material 83, thereby improving the heat sink 80. However, the adhesion of the heat sink provided by this type of design is only slightly higher than that of directly attaching the heat sink to the substrate, which is difficult to cope with the subsequent impact test and the vibration environment during transportation, and still cannot solve the problem of the heat sink falling off. problem, and does not meet the needs of users.

The recent development is to improve the design of Figure 14. As shown in Figure 15, the groove on the heat sink is changed to a dovetail groove structure 91, so that the diameter of the opening end is slightly smaller than the diameter of the inner wall to strengthen The attachment of the heat sink 90, this design has indeed improved the adhesion effect of the heat sink 90, but it still cannot meet the needs of mass production. Shrinking or gradually increasing the groove is a difficult problem in manufacturing, not to mention the micro-sized technical field like semiconductor packaging. Therefore, although the dovetail groove structure 91 shown in FIG. 15 has theoretical effects, its process is very difficult to realize. Difficult, the accuracy is also difficult to control, and it is difficult to meet the mass production scale and cost requirements.

Through the reform process of the above-mentioned existing technology, it can be found that if the problem of strengthening the adhesion of the heat sink is improved, other process restrictions will be derived while solving the existing problems, or even though all the problems can be overcome, it will consume extremely high process costs. , It is difficult to carry out commercial implementation, so there has never been a solution that can fully meet the needs of the industry.

In summary, how to develop a semiconductor package with a heat sink so that the heat sink does not fall off, and at the same time, it can also meet the needs of simple process and low cost, without reducing the good rate of chips and substrates, is a related research and development. urgent issues in the field.

Contents of the invention

In order to overcome the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a semiconductor package with a heat sink that can be firmly bonded to prevent the heat sink from falling off.

Another object of the present invention is to provide a semiconductor package with a heat sink that has a simple process and has a heat sink locking function.

Another object of the present invention is to provide a low-cost semiconductor package with a heat sink.

Another object of the present invention is to provide a semiconductor package with a heat sink that can be firmly bonded to the heat sink without affecting the circuit layout on the substrate.

Another object of the present invention is to provide a semiconductor package with a heat sink that does not cause chip cracks.

To achieve the above and other objects, the semiconductor package provided by the present invention includes: a substrate having a first surface and an opposite second surface; at least one chip is connected to the first surface of the substrate and electrically The heat sink has a flat part and a support part extending from the edge of the flat part, and the support part is connected to the first surface of the substrate through the support part, and the chip is covered on the flat part, the support part and the In the space surrounded by the substrate, there is a recess on the surface of the support part in contact with the substrate, and at least one protrusion unit is provided on the surface of the recess; the adhesive material is laid between the support part of the heat sink and the first surface of the substrate , to fill into the recess and cover the surrounding of the protruding unit; and a plurality of solder balls, implanted on the second surface of the substrate. Wherein, the above-mentioned concave portion may be a groove or a plurality of openings.

The semiconductor package with a heat sink of the present invention may also include: a substrate having a first surface and an opposite second surface; at least one chip mounted on the first surface of the substrate and electrically connected to the substrate; The heat sink has a flat portion and a support portion extending from the edge of the flat portion, the support portion is connected to the first surface of the substrate, and the chip is covered by the flat portion, the support portion, and the substrate. In the space, wherein, there is at least one protruding unit on the surface of the support part that is not in contact with the substrate; an adhesive material is laid between the support part of the heat sink and the first surface of the substrate, and the surface of the support part to cover covering around the protruding unit; and a plurality of solder balls planted on the second surface of the substrate.

The above-mentioned protruding unit can be a single burr, a double-hook burr, or a whole row of burrs, and it is formed on two opposite inner wall surfaces of the groove or opening, or on the inner wall surface of the support portion, and The protrusion faces the first surface of the substrate, and the protrusion unit can be formed by punching (Stamp) with a pointed punch (Punch), or can be formed by scraping with a horizontal punch.

In addition, the groove or opening is also punched by a stamping head, and its cross-sectional shape depends on the type of the stamping head, which can be square, V-shaped, semicircular or other shapes.

Therefore, through the design of the above-mentioned protruding unit, the adhesive material can be used to stick the heat sink on the first surface of the substrate, and pressure is applied to fill the adhesive material into the groove or opening to cover the protrusion. Around the unit, or directly covering the protruding unit on the surface of the support part, and then through the contact between the protruding unit and the adhesive material, it provides the force to lock the heat sink, so that the heat sink will not fall off easily when it is shaken, and the process is simple. low cost. At the same time, its structural design will not affect the circuit layout on the substrate and cause chip breakage.

Description of drawings

1A is a cross-sectional view of a preferred embodiment of a semiconductor package with a heat sink of the present invention;

Fig. 1B is a bottom view of the heat sink shown in Fig. 1;

Fig. 2A is the forming schematic view of the groove shown in Fig. 1;

Fig. 2B is a schematic diagram of forming the protrusion unit shown in Fig. 1;

Fig. 3 is a schematic diagram of adhesion between the heat sink supporting part and the substrate shown in Fig. 1;

Fig. 4 is a schematic diagram of Embodiment 2 of the protruding unit of the present invention, which is a bottom view of the heat sink;

5A and 5B are schematic diagrams of Embodiment 3 of the protrusion unit of the present invention;

6A to 6C are schematic diagrams of Embodiment 4 of the protrusion unit of the present invention;

7A and 7B are schematic diagrams of other embodiments of the groove of the present invention;

8A and 8B are schematic diagrams of other embodiments of the groove of the present invention;

9A is a cross-sectional view of another embodiment of the semiconductor package with heat sink of the present invention;

Fig. 9B is a bottom view of the heat sink shown in Fig. 9A;

10 is a cross-sectional view of yet another embodiment of a semiconductor package with a heat sink of the present invention;

FIG. 11 is a cross-sectional view of a package disclosed in US Patent No. 6,093,961;

12 is a cross-sectional view of a package disclosed in US Patent No. 5,396,403;

13 is a cross-sectional view of a package disclosed in US Patent No. 6,441,485;

Figure 14 is a cross-sectional view of a conventional package with grooves on the heat sink; and

FIG. 15 is a cross-sectional view of a conventional package with a dovetail groove structure on the heat sink.

Detailed ways

Example 1

1A is a sectional view of a preferred embodiment of a semiconductor package with a heat sink of the present invention, which is a flip-chip ball grid array package 1 (FCBGA), including a substrate 10 as a chip carrier (Chip Carrier), with a bump The block 11 is electrically connected to the substrate 10 and placed on the chip 12 on the first surface 10a of the substrate 10, the underfill insulating material 13 filled around the bump 11 is placed on the first surface 10a of the substrate 10 The square heat sink 14 on the top, the adhesive material 15 laid between the heat sink 14 and the first surface 10a of the substrate, and a plurality of solders that are implanted on the second surface 10b of the substrate 10 and electrically connected with the plurality of bumps 11 Ball 16; Wherein, this square cooling fin 14 has a square flat part 14a and the support part 14b that extends toward the direction of substrate 10 from the periphery of this flat part 14a, is bonded on the first surface 10a of substrate 10 by support part 14b, simultaneously A closed groove 17 is provided on the annular support portion 14b, and on the two opposite inner wall surfaces in the groove 17, there are respectively a plurality of protruding units 18 arranged at intervals, and the protrusions of the protruding units 18 are directed toward the side of the substrate 10 direction.

The heat sink 14 is made of nickel-plated copper material (Ni-Plated-Cu), and its flat portion 14a has a thickness of about 20 to 40 mils (mil); meanwhile, the thermal expansion coefficient of the nickel-plated copper material is also the same as that of commonly used Substrate material (for example epoxy resin, polyimide, BT resin or FR4 resin etc.) To the lowest, wherein, the height of the support portion 14b can be designed to be 10 to 40 mils (mil), and its value can be determined according to the thickness of the chip or the number of layers configured; in addition, the flat portion 14a of the heat sink 14 is made of thermally conductive adhesive 19 is bonded on the surface of the chip 12, and the heat generated by the chip 12 is conducted to the flat portion 14a of the heat sink 14 through the thermally conductive adhesive 19 and dissipated.

Figure 1B shows the bottom view of the above-mentioned heat sink. The heat sink of this embodiment is a square heat sink 14. As shown in the figure, the closed groove 17 provided on the annular support portion 14b is surrounded into a square shape, and There are a plurality of protruding units 18 arranged at intervals on the two opposite inner wall surfaces in the groove 17, and the adhesion of the adhesive material 15 to the heat sink 14 is strengthened by the protruding units 18; wherein, the groove 17 is shown in Figure 2A As shown, it is formed by punching (Stamp) with the existing square stamping head 21 (Punch), so that its cross-sectional shape is square, and has two parallel and opposite first surfaces 17a and second surfaces 17b respectively, and a plurality of protrusions Unit 18, as shown in FIG. 2B, is punched and formed with a triangular sharp-edged stamping head 22, so that a plurality of single protruding burrs opposite to each other at intervals are formed on the first and second surfaces 17a, 17b of the groove 17 according to a predetermined schedule. (Burr), and make the protrusions of the burr 18 face the direction of the substrate 10. Therefore, through this rapid stamping method, the required heat sink groove 17 and protrusion unit 18 can be produced simply and at low cost.

3 is an enlarged schematic view of the supporting portion after the heat sink is adhered to the substrate, wherein the adhesive material 15 is pre-laid on the first surface 10a of the substrate 10 and the area where the support portion 14b of the heat sink 14 contacts, and is squeezed after being pressed. Fill in the groove 17 of the support part 14b, and after filling a certain amount, wrap around the protruding unit 18, and then solidify through the baking (Baking) step, so as to use the protruding unit 18 to achieve the effect of locking (Locking), and at the same time , using the spaced arrangement of the protruding units 18 (as shown in FIG. 1B ) on the first and second surfaces 17a, 17b of the groove 17, the locking force of the adhesive material 15 on the heat sink 14 can be distributed more evenly , so as to increase its adhesive strength, so as to prevent the heat sink 14 from falling off after being shaken; generally speaking, the more the filling amount of the adhesive material 15 is, the better the adhesion to the heat sink 14 will be. In the design of the present invention, at least the filling height of the adhesive material 15 in the groove 17 must be higher than the h-h line shown in FIG. The effect of sheet 14.

Therefore, through the design of the groove 17 and the protruding unit 18 on the heat sink 14 of the present invention, the adhesion of the heat sink 14 can be improved without changing the layout design of the substrate 10, so as to prevent it from falling off due to shock, and at the same time , because the heat sink 14 of the present invention is not positioned by the contact relationship with the chip 12, it will not press the chip 12 in the subsequent high-temperature process, causing the chip 12 to break; in addition, because the design of the groove 17 and the protrusion unit 18 is as above It is formed by a simple stamping process, so it can be mass-produced at low cost with only a suitable stamping head. It will not consume a lot of process costs like the existing dovetail groove or other groove opening methods, and can be solved at the same time All the problems of the prior art.

Example 2

The design of the groove 17 and the protruding unit 18 of the present invention is not limited to the above-mentioned embodiment 1. In terms of the positional arrangement relationship between the protruding units 18, it is not limited to the spaced relative arrangement shown in FIG. 1B, such as the heat sink shown in FIG. 4 Bottom view is another embodiment of its arrangement. Its design makes the protruding units form two opposite rows of burrs 28, respectively protruding on the first and second surfaces 17a, 17b of the square groove 17, so that the glue The adhesive material 15 is filled around the entire row of burrs 28 to play the function of evenly locking the heat sink 14 .

Example 3

According to the forming method of the protruding unit, it is not limited to punching with the triangular stamping head 22 mentioned above, and the protruding direction of the protruding unit is not limited to facing the substrate 10, such as the surface of the groove 17 shown in Fig. 5A and Fig. 5B , that is to use the horizontal stamping head 21 to scrape off a layer of material on the first surface 17a of the groove 17 to make the flange burrs 38 shown in FIG. 5B , which can also be coated on the adhesive material 15 After surrounding it, play the function of locking the cooling fin 14 .

Example 4

The form of the protrusion unit is not limited to a single burr, and multi-stage punching can also be used to produce a burr with multi-stage protrusions, such as the surface of the groove 17 shown in Figure 6A, Figure 6B, and Figure 6C. 22 punch out a first burr 48a, and then repeat the above action to make a second burr 48b, thus becoming a double-hook-shaped burr 48 with the first burr 48a and the second burr 48b shown in Figure 6C, although this embodiment It has a higher process cost, but its locking effect is better than the above-mentioned embodiment, and the adhesive material 15 and the surface of the groove 17 have more contact area, which can be determined according to the user's cost and adhesiveness requirements.

The above-mentioned embodiments all take the groove 17 with a square cross-section as an example. In fact, the cross-sectional shape of the groove is not limited to the above-mentioned shape, as shown in FIGS. Head 21 punches out a V-shaped groove 27, and can also form protruding units 18 on its two surfaces as shown in Figure 7B; The semicircular groove 37 can also exert the effect of the present invention.

In addition, in order to achieve the firm adhesion of the heat sink 14, the key lies in the covering design of the protruding units 18, 28, 38, 48 and the adhesive material 15, rather than the form of the grooves 17, 27, 37. Therefore, it can also be considered Replace the grooves of the present invention with other designs, such as the embodiment shown in Figures 9A and 9B, that is, replace the grooves 17 with the illustrated square openings 40, the eight square openings 40 are the heat sinks shown in Figure 9B 14 bottom view, respectively set on the corners or edges of the heat sink supporting part 14b, the inner wall surface of the opening 40 is also respectively formed with protruding units 18, so that after the adhesive material 15 is filled into each square opening 40, Evenly wrap around the plurality of protruding units 18 , and play the function of locking the heat sink 14 after being baked and solidified.

The number of openings 40 and the opening positions are not limited, but it is better to have a certain symmetry in the positions, so that the locking force of the adhesive material 15 on the heat sink 14 is evenly distributed, thereby having a better adhesion effect; at the same time The protruding unit 18 formed on the surface of the opening 40 is also like the above-mentioned embodiments, and has various positional arrangements, forming methods and protruding forms, which can be determined according to the designer's needs, and the cross-section of the opening 40 is not limited to square , It can also be made into other shapes such as V-shaped or round by using different stamping heads.

As mentioned above, the key to the stable adhesion of the heat sink 14 lies in the covering design of the protruding units 18, 28, 38, 48 and the adhesive material 15. Therefore, it is also possible to completely eliminate the above-mentioned grooves 17, 27, 37 or opening 40, as shown in FIG. In the accommodating space 141, the same enhanced adhesion effect can also be achieved, and the manufacturing cost of opening the grooves 17, 27, 37 or the opening 40 can also be reduced, which can better meet the needs of mass production, but in this embodiment, At least the filling height of the adhesive material 15 in the accommodating space 141 must be higher than the h-h line of the icon, so that it can fully wrap around the plurality of protruding units 18 to exert its locking function; FIG. 10 is only based on the above-mentioned The single burr 18 in Embodiment 1 is an illustration of a protruding unit, but the protruding unit can also be implemented in various ways such as a row of burrs 28 , flange burrs 38 or double-hook burrs 48 .

In summary, the semiconductor package with heat sink of the present invention has the effect of stably adhering the heat sink, and at the same time, its structural design will not cause damage to the chip and substrate, and then it can play the advantages of simple process and low cost. Advantages, to meet mass production requirements.

Claims (30)

1. the semiconductor package part with fin is characterized in that, this semiconductor package part comprises:

Substrate has a first surface and an opposing second surface;

At least one chip connects and puts on the first surface of substrate and be electrically connected to substrate;

Fin, have a par with from this extended support portion, edge, par, connect by this support portion and to put on the first surface of substrate, and chip is coated on par, support portion and substrate encloses in the space that is set to, wherein, have at least one recess on the surface of support portion and substrate contacts, and have at least one protrusion unit on the surface of this recess;

Adhesive material, between the support portion of the fin that is laid in and the first surface of substrate, be packed in the recess and coat this protrusion unit around; And

A plurality of soldered balls are planted on the second surface that is connected to substrate.

2. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this recess is a groove.

3. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this recess is an opening.

4. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this protrusion unit is a single burr.

5. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this protrusion unit is that a pair of colludes burr.

6. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this protrusion unit is whole row's formula burr.

7. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this protrusion unit is formed at respectively on two opposed inner walls surfaces on the recess.

8. the semiconductor package part with fin as claimed in claim 1 is characterized in that the projection of this protrusion unit is towards the first surface of substrate.

9. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this protrusion unit is to form with the punching out of wedge angle staking punch.

10. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this protrusion unit is to form with horizontal staking punch striking.

11. the semiconductor package part with fin as claimed in claim 1 is characterized in that the cross section of this recess is square.

12. the semiconductor package part with fin as claimed in claim 1 is characterized in that the cross section of this recess is a V-shape.

13. the semiconductor package part with fin as claimed in claim 1 is characterized in that, the cross section of this recess is semicircle.

14. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this recess is to form with the staking punch punching out.

15. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this chip utilizes the first surface of conductive projection and substrate to electrically connect.

16. the semiconductor package part with fin as claimed in claim 15 is characterized in that, this semiconductor package part also comprises the insulating material that is filled in around the conductive projection.

17. the semiconductor package part with fin as claimed in claim 1 is characterized in that this semiconductor package part also comprises the heat-conducting glue of adhering chip and fin par.

18. the semiconductor package part with fin as claimed in claim 1 is characterized in that, this semiconductor package part is the flip chip ball grid array semiconductor package part.

19. the semiconductor package part with fin is characterized in that, this semiconductor package part comprises:

Substrate has a first surface and an opposing second surface;

At least one chip connects and puts on the first surface of substrate and be electrically connected to substrate;

Fin, have a par with from this extended support portion, edge, par, connect by this support portion and to put on the first surface of substrate, and chip is coated on par, support portion and substrate encloses in the space that is set to, wherein, the support portion with on the surface of substrate contacts does not have at least one protrusion unit;

Adhesive material is laid between the first surface of the support portion of fin and substrate, and the surface of this support portion, with coat protrusion unit around; And

A plurality of soldered balls are planted on the second surface that is connected to substrate.

20. the semiconductor package part with fin as claimed in claim 19 is characterized in that, this protrusion unit is a single burr.

21. the semiconductor package part with fin as claimed in claim 19 is characterized in that, this protrusion unit is that a pair of colludes burr.

22. the semiconductor package part with fin as claimed in claim 19 is characterized in that, this protrusion unit is whole row's formula burr.

23. the semiconductor package part with fin as claimed in claim 19 is characterized in that, this protrusion unit is formed at respectively on the inner wall surface of support portion, to be installed with in the space of coating chip.

24. the semiconductor package part with fin as claimed in claim 19 is characterized in that the projection of this protrusion unit is towards the first surface of substrate.

25. the semiconductor package part with fin as claimed in claim 19 is characterized in that, this protrusion unit is to form with the punching out of wedge angle staking punch.

26. the semiconductor package part with fin as claimed in claim 19 is characterized in that, this protrusion unit is to form with horizontal staking punch striking.

27. the semiconductor package part with fin as claimed in claim 19 is characterized in that, this chip utilizes the first surface of conductive projection and substrate to electrically connect.

28. the semiconductor package part with fin as claimed in claim 27 is characterized in that, this semiconductor package part also comprises the insulating material that is filled in around the conductive projection.

29. the semiconductor package part with fin as claimed in claim 19 is characterized in that this semiconductor package part also comprises the heat-conducting glue of adhering chip and fin par.

30. the semiconductor package part with fin as claimed in claim 19 is characterized in that, this semiconductor package part is the flip chip ball grid array semiconductor package part.

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