CN1193855C - 涂敷钎焊材料的装置 - Google Patents
涂敷钎焊材料的装置 Download PDFInfo
- Publication number
- CN1193855C CN1193855C CN 01803060 CN01803060A CN1193855C CN 1193855 C CN1193855 C CN 1193855C CN 01803060 CN01803060 CN 01803060 CN 01803060 A CN01803060 A CN 01803060A CN 1193855 C CN1193855 C CN 1193855C
- Authority
- CN
- China
- Prior art keywords
- brazing material
- sounding head
- fusion
- work piece
- inside groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 98
- 238000005219 brazing Methods 0.000 title claims description 94
- 238000005477 sputtering target Methods 0.000 claims abstract description 19
- 230000004927 fusion Effects 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 230000004087 circulation Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 9
- 238000002844 melting Methods 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 229910052738 indium Inorganic materials 0.000 abstract description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract description 5
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 abstract description 3
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 abstract description 3
- 239000001993 wax Substances 0.000 abstract 4
- 239000004744 fabric Substances 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- CVOFKRWYWCSDMA-UHFFFAOYSA-N 2-chloro-n-(2,6-diethylphenyl)-n-(methoxymethyl)acetamide;2,6-dinitro-n,n-dipropyl-4-(trifluoromethyl)aniline Chemical compound CCC1=CC=CC(CC)=C1N(COC)C(=O)CCl.CCCN(CCC)C1=C([N+]([O-])=O)C=C(C(F)(F)F)C=C1[N+]([O-])=O CVOFKRWYWCSDMA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP165971/2000 | 2000-06-02 | ||
| JP2000165971A JP3319740B2 (ja) | 2000-06-02 | 2000-06-02 | ロウ材塗布装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1392816A CN1392816A (zh) | 2003-01-22 |
| CN1193855C true CN1193855C (zh) | 2005-03-23 |
Family
ID=18669361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01803060 Expired - Fee Related CN1193855C (zh) | 2000-06-02 | 2001-03-23 | 涂敷钎焊材料的装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3319740B2 (ja) |
| CN (1) | CN1193855C (ja) |
| TW (1) | TW524866B (ja) |
| WO (1) | WO2001094068A1 (ja) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100785208B1 (ko) * | 2005-06-15 | 2007-12-11 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 스퍼터링 타깃 제조용 땜납 합금 및 이것을 이용한스퍼터링 타깃 |
| CN101396751B (zh) * | 2007-09-27 | 2011-03-02 | 比亚迪股份有限公司 | 一种回流焊焊接方法 |
| CN101768723B (zh) * | 2009-12-30 | 2012-05-09 | 宁波江丰电子材料有限公司 | 大尺寸靶材超声波处理装置及其处理方法 |
| TWI496621B (zh) * | 2010-10-26 | 2015-08-21 | Prologium Technology Co | 塗佈頭及其應用之佈漿機 |
| DE102011051024A1 (de) * | 2011-05-17 | 2012-11-22 | Schott Solar Ag | Verfahren zum stoffschlüssigen Verbinden von Elementen |
| CN103128390B (zh) * | 2011-11-30 | 2016-06-08 | 亚企睦自动设备有限公司 | 焊接环的预固定装置及焊接环的预固定方法 |
| CH706712A1 (de) * | 2012-07-05 | 2014-01-15 | Besi Switzerland Ag | Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat. |
| CN103921499B (zh) * | 2014-04-22 | 2017-02-15 | 刘建忠 | 具有优异钎焊性能的金属材料 |
| JP6689309B2 (ja) | 2018-03-26 | 2020-04-28 | Ｊｘ金属株式会社 | スパッタリングターゲット部材、スパッタリングターゲット組立体及びスパッタリングターゲット部材の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0753808Y2 (ja) * | 1991-07-16 | 1995-12-13 | 黒田電気株式会社 | 噴流式超音波ろう付装置 |
| US5230462A (en) * | 1992-07-08 | 1993-07-27 | Materials Research Corporation | Method of soldering a sputtering target to a backing member |
-
2000
- 2000-06-02 JP JP2000165971A patent/JP3319740B2/ja not_active Expired - Fee Related
-
2001
- 2001-03-23 CN CN 01803060 patent/CN1193855C/zh not_active Expired - Fee Related
- 2001-03-23 WO PCT/JP2001/002409 patent/WO2001094068A1/ja active Application Filing
- 2001-05-01 TW TW90110388A patent/TW524866B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001340959A (ja) | 2001-12-11 |
| TW524866B (en) | 2003-03-21 |
| WO2001094068A1 (fr) | 2001-12-13 |
| CN1392816A (zh) | 2003-01-22 |
| JP3319740B2 (ja) | 2002-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: NIPPON MINING AND METALS CO., LTD. Free format text: FORMER NAME OR ADDRESS: NIKKO MATERIALS CO. LTD |
|
| CP03 | Change of name, title or address |
Address after: Tokyo, Japan Patentee after: Nippon Mining & Metals Co., Ltd. Address before: Tokyo, Japan Patentee before: Nikko Materials Company, Limited |
|
| C56 | Change in the name or address of the patentee |
Owner name: JX NIPPON MINING + METALS CORPORATION Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: JX Nippon Mining & Metals Corporation Address before: Tokyo, Japan Patentee before: Nippon Mining & Metals Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050323 Termination date: 20130323 |