CN119043950A - Automatic testing device and method for chip bonding tensile force and shearing force - Google Patents

Abstract

The present application provides an automated testing device and method for chip bonding tension and shear force, which belongs to the field of microelectronic reliability testing and failure technology, wherein a three-dimensional scanning unit determines the spatial distribution of bonding wires and bonding points of a chip to be processed, and generates a spatial distribution 3D imaging diagram; a path acquisition unit identifies and judges the spatial distribution 3D imaging diagram, and calculates the movement path of a puller or a pusher; a push-pull force applying unit is equipped with a puller or a pusher tooling of different sizes and ranges, which applies tension to the bonding wires of the chip to be processed or shear force to the bonding points, and records the force value that the chip to be processed can accept through a force sensor; a mobile control unit transports the push-pull force applying unit to a designated position along the path planned by the path acquisition unit, and performs a push-pull force test action. The present application greatly improves the ability to test the bonding tension and shear force of smaller advanced packaged chips.

Description

Automatic testing device and method for chip bonding tensile force and shearing force

Technical Field

The application belongs to the technical field of microelectronic reliability tests and failures, and particularly relates to an automatic testing device and method for chip bonding tensile force and shearing force.

Background

Chip bonding tension and shear force testing is a necessary means for verifying chip bonding and shear strength, wherein the chip bonding strength refers to bonding strength between an inner lead at a bonding point of an internal package of a component and a chip and a package, and the chip shear strength refers to bonding strength between a chip and a package or a substrate. Through the test of the bonding tension and the shearing force of the chip, corresponding test data are obtained, and compared with corresponding standards, whether the bonding strength and the shearing strength of the chip reach the standards can be verified, and the bonding strength and the shearing strength of the chip are important indexes for measuring the technological process of the semiconductor package, and have important significance for the reliability evaluation and failure analysis of the chip.

At present, a bonding tension and a shearing force of a chip are tested, and the main method is to apply tension to a bonding wire on the chip or apply pushing force to a bonding point by using a bonding shearing force tester and selecting a proper drag hook and a proper push knife, and monitor pushing or pulling force values.

The conventional bonding shear force tester is mainly composed of a microscope, a pushing or pulling module with a force value sensor, a mobile control unit of the pushing or pulling module, a sample stage and a control computer for mechanical data collection and processing. When the device is used, under the observation of a microscope, the drag hook or the push-pull knife in the push-pull force module is moved to the initial position corresponding to the chip to hover, for example, the bottom of the bonding wire or the side surface of the bonding point, when hovering is required, the push-pull knife or the drag hook does not contact the chip, otherwise, the test force value is influenced, meanwhile, in the whole moving process, the push-pull knife or the drag hook does not cause destructive damage to the structure of the chip, finally, the program is set to directionally move the drag hook or the push-pull knife so as to contact the bonding wire or the bonding point of the chip, and meanwhile, the pulling force or the pushing force in the contact process is measured, so that bonding and shearing strength data of the chip are obtained.

Along with the higher and finer chip integration level and finer manufacturing process scale, the produced chip size is smaller and smaller, the small-size high-density chip brings great disadvantages to the bonding and shearing strength test, a tester can hardly ensure not to collide with the chip even if operating under a microscope in the process of moving the drag hook or the push-broach, and the drag hook or the push-broach is also difficult to hover at the corresponding position when the bonding wire and the bonding point density are too high. For bonding and shear strength testing of small-size chips, more time and effort are required, and artificial defects are easily caused in the operation process, so that the testing result is influenced.

Disclosure of Invention

Aiming at the defects of the prior art, the application aims to provide an automatic testing device and method for chip bonding tension and shearing force, which aim to solve the problems of low efficiency and low operability caused by the reduction of the chip size of the existing chip bonding tension and shearing force.

The application provides an automatic testing device for chip bonding tensile force and shearing force, which comprises a sample table, a three-dimensional scanning unit, a path acquisition unit, a push-pull force application unit and a movement control unit, wherein the sample table is connected with the three-dimensional scanning unit;

The device comprises a sample platform, a mobile control unit, a three-dimensional scanning unit, a path acquisition unit, a push-pull force application unit, a detection unit and a control unit, wherein the push-pull force application unit is arranged above the sample platform;

The device comprises a sample table, a three-dimensional scanning unit, a path acquisition unit, a push-pull force application unit and a movement control unit, wherein the sample table is used for fixing a chip to be processed, the three-dimensional scanning unit is used for determining the spatial distribution of bonding wires and bonding points of the chip to be processed, generating a spatial distribution 3D imaging image and transmitting the spatial distribution 3D imaging image to the path acquisition unit, the path acquisition unit is used for identifying and judging the spatial distribution 3D imaging image of the bonding wires and the bonding points of the chip to be processed and calculating the movement path of a draw hook or a push-pull tool, the push-pull force application unit is provided with draw hook or push-pull tools with different sizes and measuring ranges and used for applying pull force to the bonding wires of the chip to be processed or applying shearing force to the bonding points, and recording force values acceptable by the chip to be processed through a force sensor, and the movement control unit is used for conveying the push-pull force application unit to a designated position along the path planned by the path acquisition unit and performing push-pull force test action.

Further preferably, the path acquisition unit is configured to identify and judge a 3D imaging map of spatial distribution of bonding wires and bonding points of a chip to be processed by using a trained path acquisition model, where the path acquisition model is obtained by learning and training based on a sample, so as to acquire path acquisition capabilities of different chips.

On the other hand, the application provides an automatic test method for the bonding tension and the shearing force of a chip, which comprises the following steps:

Step S1, determining the spatial distribution of bonding wires and bonding points of a chip to be processed through three-dimensional scanning, and generating a spatial distribution 3D imaging diagram;

S2, utilizing a trained path acquisition model to identify and judge a space distribution 3D imaging diagram of a chip to be processed, and calculating a motion path of a drag hook or a push-broach so that the drag hook or the push-broach hovers at a position corresponding to a bonding wire and a bonding point;

Step S3, judging whether the motion path of the drag hook or the push broach meeting the requirement is calculated in the step S2, if the motion path meets the requirement, turning to the step S4, otherwise, changing the size of the drag hook or the push broach, turning to the step S2;

And S4, setting the pushing and pulling force according to the material and the diameter of the bonding wire, moving the draw hook or the push-pull knife to enable the draw hook or the push-pull knife to contact the bonding wire or the bonding point of the chip to be processed, and simultaneously measuring the pushing force or the pulling force in the contact process to acquire bonding and shearing strength data of the chip to be processed.

Further preferably, the path acquisition model is obtained by learning and training based on samples, so as to realize path acquisition capability of different chips.

Further preferably, the moving path in step S3 needs to satisfy the following requirements:

the drag hook or the push-broach is not contacted with the chip to be processed in the moving process of the drag hook or the push-broach along the moving path, and the drag hook or the push-broach can hover under the bonding wire or at the side surface of the bonding point.

Further preferably, step S3 specifically includes the steps of:

Judging whether the drag hook or the push-broach contacts a chip to be processed in the moving process of the drag hook or the push-broach along the moving path, and whether the drag hook or the push-broach can hover under the bonding wire or the side surface of the bonding point, if both the drag hook and the push-broach are satisfied, determining that the path acquisition model calculates the moving path meeting the requirement, otherwise, selecting the drag hook or the push-broach with smaller size, executing the step S2, if the moving path meeting the requirement still cannot be obtained, continuing to reduce the size of the drag hook or the push-broach, executing the step S2 until the moving path meeting the requirement is obtained, and if the minimum drag hook or the push-broach is adopted, executing the step S2, and stopping the push-pull force test.

Further preferably, the path acquisition model is an AI identification model obtained by sample acquisition and model training using big data processing and machine learning techniques.

In general, the above technical solutions conceived by the present application have the following beneficial effects compared with the prior art:

The application provides an automatic testing device for chip bonding tension and shearing force, which is characterized in that a chip to be processed is fixed through a sample stage, and then the chip to be processed is scanned by a three-dimensional scanning unit, so that the spatial position of the chip to be processed in push-pull force test is not changed, a 3D imaging chart of the spatial distribution of the chip to be processed generated by three-dimensional scanning can accurately indicate the distribution of bonding wires and bonding points of the chip to be processed, and the size of each part of the space, and the human error observed by naked eyes through a microscope is reduced.

The application provides an automatic testing device for bonding pulling force and shearing force of a chip, which utilizes a trained path acquisition model to identify and judge a 3D image of the spatial distribution of the chip, combines the size of a draw hook or a push knife, calculates the movement path of the draw hook or the push knife above the chip, accurately avoids damage caused by collision of the draw hook or the push knife with bonding wires, bonding points and the like on the chip during manual operation, improves production efficiency and reduces unnecessary damage.

The application provides an automatic test method for bonding pulling force and shearing force of a chip, which utilizes a trained path acquisition model to calculate the motion path of a drag hook or a push-broach above the chip, if the size of the drag hook or the push-broach can not calculate the motion path meeting the requirement, the drag hook or the push-broach with smaller size is selected, and the path acquisition model is reused for operation.

Drawings

Fig. 1 is a schematic structural diagram of an automated testing device for chip bonding tensile force and shear force according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a push-pull force applying unit in a chip bonding pulling force and shear automatic test device according to an embodiment of the present application;

fig. 3 is a flow chart of an automated testing method for bonding tension and shear force of a chip according to an embodiment of the present application.

Detailed Description

Embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

As shown in fig. 1, an embodiment of the present application provides an automated testing device for die bonding tension and shear force, including:

the sample stage is used for fixing the chip to be processed and ensuring that the space position of the sample is not changed in the push-pull force test;

The three-dimensional scanning unit is used for determining the spatial distribution of bonding wires and bonding points of the chip to be processed, generating a spatial distribution 3D imaging diagram and transmitting the spatial distribution 3D imaging diagram to the path acquisition unit;

The path acquisition unit is used for utilizing the trained path acquisition model to identify and judge the 3D imaging diagram of the space distribution of the bonding wires and the bonding points of the chip to be processed and calculate the motion path of the drag hook or the push broach;

The pushing and pulling force applying unit is provided with draw hooks or push-broach tools with different sizes and measuring ranges and is used for applying pulling force to bonding wires of chips to be processed or applying shearing force to bonding points, and recording force values acceptable by the chips to be processed through the mechanical sensor for bonding and shearing strength data acquisition;

and the movement control unit is used for conveying the push-pull force applying unit to a specified position along the path planned by the path acquisition unit and performing push-pull force testing action, as shown in fig. 2.

As shown in fig. 3, the application further provides an automatic testing method for the bonding tension and shearing force of a chip, which comprises the following steps:

fixing a chip to be processed on a sample table to ensure that the spatial position of a sample is not changed in a push-pull force test;

Determining the spatial distribution of bonding wires and bonding points of a chip to be processed through three-dimensional scanning, and generating a spatial distribution 3D imaging diagram;

Step three, utilizing a trained path acquisition model to identify and judge a space distribution 3D imaging diagram of a chip, and calculating a motion path of a drag hook or a push-broach so that the drag hook or the push-broach can hover at a designated position near a bonding wire and a bonding point;

judging whether the motion path of the drag hook or the push broach meeting the requirement is calculated in the third step, if so, turning to the fifth step, otherwise, replacing the size of the drag hook or the push broach, and carrying out the calculation in the third step again;

and fifthly, according to the material and the diameter of the bonding wire, setting the pushing and pulling force according to the corresponding standard specification, starting a testing procedure to move the drag hook or the push knife so as to contact the bonding wire or the bonding point of the chip, and simultaneously measuring the pulling force or the pushing force in the contact process to obtain bonding and shearing strength data of the chip.

Further preferably, the path acquisition model is obtained by learning based on a large number of samples, which are derived from a large number of chip objects to be tested, to obtain the path acquisition capabilities of the model for different chips.

Further preferably, the trained path acquisition model is used for identifying a space distribution 3D imaging image generated by three-dimensional scanning of the chip to be tested, an optimal path for moving a push knife or a draw hook with a certain size to a fixed point to be tested is calculated and planned, and whether the path acquisition meets the target requirement can be judged by enabling the push knife or the draw hook to actually move along the planned path or not and touching the internal structure of the chip or not through the movement control unit. More specifically, the method comprises the following steps:

in the moving process of the whole drag hook or the push knife along the moving path, the push knife or the drag hook needs to avoid contacting with the chip, thereby damaging the structure of the chip;

finally, the drag hook or the push-broach can hover at a designated position near the bonding wire and the bonding point, for example, the side surface of the bonding point is flush with the bonding wire or the right under the bonding wire, and the push-broach or the drag hook does not contact the chip when the drag hook or the push-broach is required to hover, otherwise, the test force value is influenced.

Further preferably, the method for automatically testing the bonding tension and the shearing force of the chip provided by the application further comprises the following steps:

If the path acquisition model cannot calculate the motion path meeting the requirements, and the size drag hook or push broach cannot carry out bonding and shearing strength test of the chip to be processed, selecting the drag hook or push broach with smaller size, and reusing the path acquisition model to calculate, so as to calculate the proper motion path of the drag hook or push broach;

If the effective motion path of the drag hook or the push knife cannot be obtained, repeating the operation, and continuously replacing the size of the drag hook or the push knife to calculate until a path meeting the requirement is obtained;

if the size of the drag hook or the push-broach with smaller size is not available for selection and the ideal motion path of the drag hook or the push-broach is not obtained, the method indicates that bonding and shearing strength tests cannot be carried out on the chip to be processed under conditions, the test is terminated, and the drag hook or the push-broach with smaller size is required to be evaluated and customized later.

It should be further noted that, the path acquisition model is an AI identification model obtained by performing sample acquisition and model training by using big data processing and machine learning technologies, and the specific training process can be implemented by using a conventional model training method, which is not limited in detail.

In summary, compared with the prior art, the application has the following advantages:

according to the application, the chip to be processed is fixed through the sample stage, and then the three-dimensional scanning unit is used for scanning the chip to be processed, so that the spatial position of the chip to be processed in the push-pull force test is not changed, the three-dimensional scanning generates a 3D imaging chart of the spatial distribution of the chip to be processed, the bonding wire and bonding point distribution of the chip to be processed and the size of each part of the space can be accurately pointed out, and the human error observed by naked eyes through a microscope is reduced.

According to the application, the trained path acquisition model is utilized to identify and judge the space distribution 3D image of the chip, the movement path of the drag hook or the push knife above the chip is calculated by combining the size of the drag hook or the push knife, the damage caused by collision of the drag hook or the push knife with bonding wires, bonding points and the like on the chip during manual operation is accurately avoided, the production efficiency is improved, and unnecessary damage is reduced.

According to the application, the motion path of the drag hook or the push broach above the chip is calculated by using the trained path acquisition model, if the motion path meeting the requirement cannot be calculated by the size of the drag hook or the push broach, the drag hook or the push broach with smaller size is selected, and the path acquisition model is reused for calculation, so that the bonding pulling force and the shearing force testing capability of the advanced packaged chip with smaller size are greatly improved.

It is to be understood that the terms such as "comprises" and "comprising," which may be used in this application, indicate the presence of the disclosed functions, operations or elements, and are not limited to one or more additional functions, operations or elements. In the present application, terms such as "comprising" and/or "having" are to be construed as meaning a particular feature, number, operation, constituent element, component or combination thereof, but are not to be construed as excluding the existence or addition of one or more other features, numbers, operations, constituent elements, components or combinations thereof.

In describing embodiments of the present application, it should be noted that the term "coupled" should be construed broadly unless otherwise indicated and limited thereto.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (7)

1. The automatic testing device for the chip bonding tensile force and the shearing force is characterized by comprising a sample stage, a three-dimensional scanning unit, a path acquisition unit, a push-pull force application unit and a movement control unit;

The device comprises a sample platform, a mobile control unit, a three-dimensional scanning unit, a path acquisition unit, a push-pull force application unit, a detection unit and a control unit, wherein the push-pull force application unit is arranged above the sample platform;

The device comprises a sample table, a three-dimensional scanning unit, a path acquisition unit, a push-pull force application unit and a movement control unit, wherein the sample table is used for fixing a chip to be processed, the three-dimensional scanning unit is used for determining the spatial distribution of bonding wires and bonding points of the chip to be processed, generating a spatial distribution 3D imaging image and transmitting the spatial distribution 3D imaging image to the path acquisition unit, the path acquisition unit is used for identifying and judging the spatial distribution 3D imaging image of the bonding wires and the bonding points of the chip to be processed and calculating the movement path of a draw hook or a push-pull tool, the push-pull force application unit is provided with draw hook or push-pull tool with different sizes and ranges and used for applying pull force to the coupling wires of the chip to be processed or applying shearing force to the bonding points, and recording force values acceptable by the chip to be processed through a force sensor, and the movement control unit is used for conveying the push-pull force application unit to a designated position along the path planned by the path acquisition unit and carrying out push-pull force test action.

2. The automated testing apparatus of claim 1, wherein the path acquisition unit is configured to identify and determine a spatially distributed 3D imaging map of bonding wires and bonding points of the chip to be processed using a trained path acquisition model, and wherein the path acquisition model is obtained by learning and training based on a sample to acquire path acquisition capabilities for different chips.

3. An automated testing method based on the automated testing apparatus of claim 1 or 2, comprising the steps of:

Step S1, determining the spatial distribution of bonding wires and bonding points of a chip to be processed through three-dimensional scanning, and generating a spatial distribution 3D imaging diagram;

S2, utilizing a trained path acquisition model to identify and judge a space distribution 3D imaging diagram of a chip to be processed, and calculating a motion path of a drag hook or a push-broach so that the drag hook or the push-broach hovers at a position corresponding to a bonding wire and a bonding point;

Step S3, judging whether the motion path of the drag hook or the push broach meeting the requirement is calculated in the step S2, if the motion path meets the requirement, turning to the step S4, otherwise, changing the size of the drag hook or the push broach, turning to the step S2;

And S4, setting the pushing and pulling force according to the material and the diameter of the bonding wire, moving the draw hook or the push-pull knife to enable the draw hook or the push-pull knife to contact the bonding wire or the bonding point of the chip to be processed, and simultaneously measuring the pushing force or the pulling force in the contact process to acquire bonding and shearing strength data of the chip to be processed.

4. The automated test method of claim 3, wherein the path acquisition model is derived from sample-based learning training to achieve path acquisition capabilities of different chips.

5. The automated testing method of claim 3 or 4, wherein the movement path in step S3 is required to meet the following requirements:

the drag hook or the push-broach is not contacted with the chip to be processed in the moving process of the drag hook or the push-broach along the moving path, and the drag hook or the push-broach can hover under the bonding wire or at the side surface of the bonding point.

6. The automated testing method of claim 5, wherein step S3 comprises the steps of:

Judging whether the drag hook or the push-broach contacts a chip to be processed in the moving process of the drag hook or the push-broach along the moving path, and whether the drag hook or the push-broach can hover under the bonding wire or the side surface of the bonding point, if both the drag hook and the push-broach are satisfied, determining that the path acquisition model calculates the moving path meeting the requirement, otherwise, selecting the drag hook or the push-broach with smaller size, executing the step S2, if the moving path meeting the requirement still cannot be obtained, continuing to reduce the size of the drag hook or the push-broach, executing the step S2 until the moving path meeting the requirement is obtained, and if the minimum drag hook or the push-broach is adopted, executing the step S2, and stopping the push-pull force test.

7. The automated testing method of claim 4, wherein the path acquisition model is an AI identification model obtained by sample collection and model training using big data processing and machine learning techniques.