CN106910694B - A kind of automatic detection at circuit devcie angularity method and device - Google Patents
A kind of automatic detection at circuit devcie angularity method and device Download PDFInfo
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- CN106910694B CN106910694B CN201710130120.7A CN201710130120A CN106910694B CN 106910694 B CN106910694 B CN 106910694B CN 201710130120 A CN201710130120 A CN 201710130120A CN 106910694 B CN106910694 B CN 106910694B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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Abstract
The present invention relates to a kind of automatic detections into the method for circuit devcie angularity, comprising: the surface-feature image Fig0 of acquisition device；Extract device under test surface-feature image Fig1, Fig2 ... FigN, identify one by one region F1, F2 to be measured ... Fn；Amount of warpage scanning is carried out to the region to be measured recognized and calculates angularity γ；The angularity γ being calculated is compared with the angularity standard value L of setting, and calculates tolerance；If the tolerance that device under test is calculated in the range of the tolerance difference S of setting, determines that the device under test or IC products are unqualified otherwise for qualification.The invention also discloses a kind of automatic detections into the device of circuit devcie angularity.The present invention is scanned region to be measured using white light scanning interference technique and carries out amount of warpage measurement and calculate angularity, and whole process without human intervention, can effectively derive from dynamic judgement electronic component or whether IC products are qualified.
Description
Technical field
The present invention relates to integrated circuit device angularity inspection technology fields, and especially a kind of automatic detection is at circuit device
The method and device of part angularity.
Background technique
In hyundai electronics manufacturing industry, the manufacturing process of electronic component and the encapsulation process of integrated circuit, unavoidably
To use to techniques manufacture means such as machine-shapings, the surface treatments such as chemical process, machining, hot-working；It was encapsulating
Cheng Zhong arrives greatly various types of substrates, is needed between the small variety classes device to bare chip using differences such as cementing or welding
Technique packaged type.Therefore in the manufacturing process of electronic component and the encapsulation process of integrated circuit, a large amount of machinery is answered
Power, temperature stress and material are equipped with stress etc. and are introduced into electronic component, cause the deformation failure of component, and then seriously affect
The function of integrated circuit is realized.
With the rapid development of electronics industry, the microminaturization of the device in large scale integrated circuit is necessarily becoming for development
Gesture, the micromation of IC products and large-scale mean that density of components is higher.To the carry out office of high-density device
It is that can not obviously implement that hand dipping device deformation in portion's, which is unable to satisfy manufacture demand again,.In face of such status, how
In time, it is efficient must find in IC products encapsulation front and back component by the failure conditions such as stress deformation be realize it is highly reliable,
High consistent, high efficient production IC products important leverage.Common detection device is can not be quickly directly to will seal
The residual stress in component that dress and encapsulation are completed carries out detection characterization.But the release approach of stress is the deformation of material,
It can may determine that the component with the presence or absence of deformation, therefore, it is determined that whether being failure by measuring the deformation angularity of component
Part.Therefore, it is badly in need of the automatic detection of energy non-destructive testing and characterization electronic component angularity in high-end integrated circuit manufacturing field
The method of angularity efficiently quickly realizes that the failure to integrated circuit automated production material and IC products deforms
Detection and judgement, to improve the yield rate and reliability of product.In current automatic testing method, not for electrical member
The automatic method of device angularity only just carries out Tracing back of quality questions in product when something goes wrong, searches reason, produce at this time
Product have been completed, and can only be scrapped, and a large amount of man power and material is wasted.
Summary of the invention
The primary purpose of the present invention is that providing the automatic inspection of a kind of energy non-destructive testing and characterization electronic component angularity
Angularity is surveyed, efficiently quickly realizes the inspection of the failure deformation to integrated circuit automated production material and IC products
Survey and determine, thus improve product yield rate and reliability automatic detection at circuit devcie angularity method.
To achieve the above object, the invention adopts the following technical scheme: a kind of automatic detection is at circuit devcie warpage
The method of degree, this method include the steps that following order:
(1) the surface-feature image Fig0 of acquisition device intercepts region to be measured on the surface-feature image Fig0 of device
Standard area figure Fig F0 used as angularity comparisonF0；
(2) extract device under test surface-feature image Fig1, Fig2 ... FigN, identify one by one region F1 to be measured,
F2 ,……Fn；
(3) amount of warpage scanning is carried out to the region to be measured recognized and calculates angularity numerical value γ；
(4) the angularity numerical value γ being calculated is compared with the angularity standard value L of setting, and calculates appearance
Difference；If the tolerance that device under test is calculated in the range of the tolerance difference S of setting, determines the device under test or integrated electricity
Road product is qualification, is unqualified otherwise.
In step (1), multiple integrated circuit device or integrated circuit finished product are placed on clamping tooling, transmission guide rail will
Clamping tooling is transmitted on objective table；It enables white light source generate light, is irradiated on clamping tooling wherein by interference microscope
One component surface adjusts area grayscale to be measured by display output system, receives with image processing system acquisition
The optical signal of component reflection, the surface-feature image Fig0 of generating device, and stored by signal processing system；It is arranged white
Radiant, interference microscope and image processing system search for region to be measured on surface-feature image Fig0, and in surface characteristics
The region F0 to be measured standard area figure Fig used as angularity comparison is intercepted on image Fig0F0, it is stored in signal processing system.
In step (2), start the transmission guide rail on objective table, it is micro- that clamping tooling to be measured is placed on to interference one by one
The lower section of mirror；Picture signal conversion generates to the surface-feature image FigN of corresponding device by image processing system, N take 1 to
N, and transmit and store to signal processing system, wherein surface-feature image corresponding to first device under test is denoted as Fig1,
Surface-feature image corresponding to second device under test is denoted as Fig2, and so on, the corresponding surface of n-th of device to be measured
Characteristic image is denoted as FigN；Signal processing system extracts the surface-feature image FigN for the device that image processing system transmitting comes,
White light source and interference microscope are moved on into the position for needing to measure on device and identify region F1, F2 to be measured ..., Fn.
In step (3), white light source is divided into reference beam and measuring beam by interference microscope, wherein measuring beam
Component surface is irradiated, reflection is formed on surface and forms interference image again by interference microscope and reference beam；The image
It is acquired by image processing system, signal processing system calculates the image of acquisition, and display output system shows irradiation area
Warp image and data, be scanned one by one obtain n-th device region F1, F2 to be measured ..., the amount of warpage of Fn simultaneously
Calculate the region angularity, obtain angularity numerical value, be followed successively by the first scan position of N device angularity numerical value γ 1, the
The angularity numerical value γ 2 of two scan positions ..., the angularity numerical value γ n of the n-th scan position；Above-mentioned n sector scanning position
Angularity numerical value γ 1, γ 2 ... it is medium to be called that γ n is stored in signal processing system；By default in signal processing system
Program, set region F1, F2 to be measured ..., angularity standard value L1, L2 of Fn ... Ln and tolerance difference ± S1,
±S1、……±Sn。
In step (4), intelligent decision system by region F1, F2 to be measured on device ..., the angularity numerical value γ of Fn
1, γ 2 ... γ n and angularity standard value L1, L2 of default ... Ln is compared, if tolerance difference is less than setting
Tolerance difference ± S1, ± S1 ... ± Sn then determines that region is qualification at this, is otherwise determined as unqualified；In component cases
Or the position angularity to be determined of all components to be measured in integrated circuit is all qualified, then determines the device or integrated electricity
Road product is qualified, otherwise, it is determined that the device or IC products are unqualified.
The signal processing system find on setting component or integrated circuit finished product it is multiple need to measure angularity to
Survey region F1, F2 ..., the method for Fn it is as follows: in the surface-feature image FigN of component preset need to find it is to be measured
The picture search area FigF1 of region F1 carries out similar image comparison positioning to region F1 to be measured, obtains component to be measured or integrated
It needs to measure the region F1 to be measured of angularity on circuit finished product, and component or integrated circuit finished product is successively obtained by the method
Upper multiple region F1, F2 to be measured for needing to measure angularity, F3 ..., Fn.
Another object of the present invention is to provide a kind of automatic detections into the device of circuit devcie angularity, including loading
Platform installs the transmission guide rail for transmitting clamping tooling thereon, and multiple electronic components or integrated are clamped on the clamping tooling
Circuit product, the surface setting of clamping tooling are used for the white light scanning interferometry system of sampler surface warp spirogram picture
System, the first signal output end of white light scanning interferometer measuration system with for device surface amount of warpage image carry out data extraction
Be connected with the signal input part of the signal processing system of storage, the signal output end of signal processing system with for signal processing
The signal input part for the intelligent decision system that the data characteristics that system generates is determined is connected, and the signal of intelligent decision system is defeated
Outlet, white light scanning interferometer measuration system second signal output end respectively with display output system the first signal input part and
Second signal input terminal is connected.
The white light scanning interferometer measuration system is made of interference microscope, white light source and image processing system, described
Interference microscope is located at the surface of clamping tooling, the white light source between interference microscope and image processing system,
The signal output end of image processing system is connected with the control terminal of white light source, and the output end of described image processing system is as white
The output end of optical scanning interferometer measuration system, described image processing system is interior to be equipped with ccd image sensor.
The signal processing system and intelligent decision system are built in computer, set one in the signal processing system
A storage unit.
As shown from the above technical solution, the present invention has the advantages that first, the present invention utilizes automatic machinery identification technology
Identification positioning is carried out to region to be measured, white light scanning interference technique is recycled to be scanned to region to be measured and carry out amount of warpage survey
Angularity is measured and calculates, whether the angularity numerical value finally by component range to be measured preset in Compare System meets setting
Tolerance threshold value requires to determine whether component supplied materials is qualified with whether integrated circuit finished product reaches manufacture, and whole process is not necessarily to people
Work operation can effectively derive from dynamic judgement electronic component or whether IC products are qualified, be conducive to quickly and efficiently arrange
Find the product matter occurred during the IC products automated manufacturing of the reliability requirements harshness such as army's grade, aerospace grade
Amount problem；Second, the present invention can rapidly and efficiently to needed on batch electronic component region to be tested carry out identification positioning simultaneously
Test amount of warpage, calculate angularity data, determine the device whether meet supplied materials encapsulation require and IC products whether
Qualification can not only find supplied materials problem before IC manufacturing, reject undesirable device, and can be in integrated electricity
Road checks the hidden danger of quality of product after manufacturing, do over again in time, substantially increases the yield rate and reliability of product, saves big
Amount fund and manpower.
Detailed description of the invention
Fig. 1 is the device of the invention structural schematic diagram；
Fig. 2 is a kind of schematic diagram that LTCC low-temperature co-fired ceramics welds together with AlSi alloy substrate；
Fig. 3 is the amount of warpage scanning figure and data of region F1 to be measured；
Fig. 4 is the amount of warpage scanning figure and data of region F2 to be measured；
Fig. 5 is the schematic illustration that angularity is calculated with the amount of warpage measured；
Fig. 6 is the angularity data statistics of the AlSi substrate and region F1 and F2 to be measured after LTCC welding of different-alloy ingredient
Schematic diagram；
Fig. 7 is the schematic diagram counted to the average angularity of different product；
Fig. 8 is flow chart of the method for the present invention.
Specific embodiment
As shown in figure 8, a kind of method of automatic detection at circuit devcie angularity, this method includes the step of following order
It is rapid:
(1) the surface-feature image Fig0 of acquisition device intercepts region to be measured on the surface-feature image Fig0 of device
Standard area figure Fig F0 used as angularity comparisonF0；
(2) extract device under test surface-feature image Fig1, Fig2 ... FigN, identify one by one region F1 to be measured,
F2 ,……Fn；
(3) amount of warpage scanning is carried out to the region to be measured recognized and calculates angularity numerical value γ；
(4) the angularity numerical value γ being calculated is compared with the angularity standard value L of setting, and calculates tolerance；
If the tolerance that device under test is calculated determines the device under test or integrated circuit in the range of the tolerance difference S of setting
Product is qualification, is unqualified otherwise.
As shown in figure 8, in step (1), multiple integrated circuit device or integrated circuit finished product are placed on clamping tooling,
Clamping tooling is transmitted on objective table by transmission guide rail；It enables white light source generate light, clamping is irradiated to by interference microscope
Wherein a component surface is adopted by display output system adjusting area grayscale to be measured with image processing system in tooling
Collect the optical signal of the component reflection received, the surface-feature image Fig0 of generating device, and is stored by signal processing system
Get up；White light source, interference microscope and image processing system are set, region to be measured is searched on surface-feature image Fig0,
And the region F0 to be measured standard area figure Fig used as angularity comparison is intercepted on surface-feature image Fig0F0, deposit letter
Number processing system.
As shown in figure 8, starting the transmission guide rail on objective table in step (2), clamping tooling to be measured being placed one by one
In the lower section of interference microscope；Picture signal conversion is generated to the surface-feature image of corresponding device by image processing system
FigN, N take 1 to n, and transmit and store to signal processing system, wherein surface characteristics figure corresponding to first device under test
As being denoted as Fig1, surface-feature image corresponding to second device under test is denoted as Fig2, and so on, n-th of device to be measured
The corresponding surface-feature image of part is denoted as FigN；The surface that signal processing system extracts the device that image processing system transmitting comes is special
Image FigN is levied, white light source and interference microscope are moved on into the position for needing to measure on device and identify region F1, F2 to be measured
、……、Fn。
As shown in figure 8, in step (3), white light source is divided into reference beam and measuring beam by interference microscope,
Wherein measuring beam irradiates component surface, forms reflection on surface and is formed again by interference microscope and reference beam and interferes
Image；The image is acquired by image processing system, and signal processing system calculates the image of acquisition, and display output system is aobvious
The warp image and data for showing irradiation area, be scanned one by one obtain n-th device region F1, F2 to be measured ..., Fn
Amount of warpage and calculate the region angularity, obtain angularity numerical value, be followed successively by the angularity of the first scan position of N device
Numerical value γ 1, the second scan position angularity numerical value γ 2 ..., the angularity numerical value γ n of the n-th scan position；Above-mentioned n area
The angularity numerical value γ 1 of domain scan position, γ 2 ... it is medium to be called that γ n is stored in signal processing system；Signal processing system
Pre-set programs are pressed in system, set region F1, F2 to be measured ..., angularity standard value L1, L2 of Fn ... Ln and tolerance
Difference ± S1, ± S1 ... ± Sn.
As shown in figure 8, multiple on the signal processing system searching setting component or integrated circuit finished product need to measure
Region F1, F2 to be measured of angularity ..., the method for Fn it is as follows: in the surface-feature image FigN of component preset need
The picture search area FigF1 of the region F1 to be measured found carries out similar image comparison positioning to region F1 to be measured, obtains member to be measured
It needs to measure the region F1 to be measured of angularity on device or integrated circuit finished product, and component or collection is successively obtained by the method
At the region F1, F2 to be measured for needing to measure angularity multiple on circuit finished product, F3 ..., Fn.
As shown in figure 8, in step (4), intelligent decision system by region F1, F2 to be measured on device ..., Fn
Angularity numerical value γ 1, γ 2 ... γ n and angularity standard value L1, L2 of default ... Ln is compared, if tolerance
Difference be less than setting tolerance difference ± S1, ± S1 ... ± Sn then determines that region is qualification at this, is otherwise judged to not conforming to
Lattice；The position angularity to be determined of all components to be measured in component cases or in integrated circuit is all qualified, then determining should
Device or IC products are qualified, otherwise, it is determined that the device or IC products are unqualified.
As shown in Figure 1, the present apparatus includes objective table, the transmission guide rail for transmitting clamping tooling, the folder are installed thereon
It holds and clamps multiple electronic components or IC products in tooling, the surface setting of clamping tooling is used for sampler surface
The white light scanning interferometer measuration system of amount of warpage image, the first signal output end of white light scanning interferometer measuration system with for pair
Device surface amount of warpage image carries out data extraction and is connected with the signal input part of the signal processing system of storage, signal processing system
The signal of the signal output end of system and the intelligent decision system for being determined the data characteristics that signal processing system generates
Input terminal is connected, and the signal output end of intelligent decision system, the second signal output end of white light scanning interferometer measuration system are distinguished
It is connected with the first signal input part of display output system and second signal input terminal.Display output system contains display, bears
The data characteristics ratio of duty display image processing system imaging, the data processed result of signal processing system, intelligent decision system
Relatively result.
As shown in Figure 1, the white light scanning interferometer measuration system is by interference microscope, white light source and image processing system
Composition, the interference microscope are located at the surface of clamping tooling, and the white light source is located at interference microscope and image procossing
Between system, the signal output end of image processing system is connected with the control terminal of white light source, described image processing system it is defeated
Output end of the outlet as white light scanning interferometer measuration system, described image processing system is interior to be equipped with ccd image sensor.It is described
Signal processing system and intelligent decision system are built in computer, and a storage unit is set in the signal processing system.
As shown in Figure 1, the top of objective table is equipped with conveyer belt, white light light can be entered by the multiple clamping toolings of continuous moving one by one
Source and interference microscope can coverage.The material of clamping tooling is alloy or plastics, and clamping tooling is equipped with multiple arrays
The cavity of formula arrangement can load multiple components or integrated circuit finished product for rapid batch measurement.White light source and interference
Microscope can move under system drive along tri- axis direction of X, Y and Z, can by light-resource fousing any need measurement region,
To obtain clearly area image.Show that output system and image processing system, signal processing system, intelligent decision system connect
Connect, and can with real-time display image processing system grab and measure at image, signal processing system result, intelligent decision
System determine component or integrated circuit finished product whether He Ge result.
As shown in Figure 1, interference microscope and image processing system whole or local progress angularity can sweep component
Calculating is retouched, and is not limited by component size and shape, can visually carry out image and comparing or is passed through and intelligent decision
System compare, enter production line before can determine whether supplied materials quality, angularity meet the requirements first, enter production line it
Quality testing can be carried out to the IC products that component installs afterwards, determine whether qualification again.
Dashed region is angularity region F1 and F2 to be measured in Fig. 2；White light source transmitting white light is radiated at area to be measured respectively
Domain F1 and F2 carry out the measurement of angularity by interference microscope.
Fig. 3 is the amount of warpage scanning figure and data of region F1 to be measured, and equipment is by scanning region to be measured, to obtain the area
The 3D situation in domain, mainly scans the height change Z in Z-direction relative datum face, and it is maximum to calculate variation
Variate-value, the amount of warpage h1 of region F1 as to be measured.
Fig. 4 is the amount of warpage scanning figure and data of region F2 to be measured, and equipment is by scanning region to be measured, to obtain the area
The 3D situation in domain, mainly scans the height change in Z-direction relative datum face, and calculates the maximum variable of variation
Value, as F2 amount of warpage h2.
Fig. 5 is the schematic illustration that angularity is calculated with the amount of warpage measured；The straight of amount of warpage h is obtained using device
Data are connect, pass through and calculate angularity formula: γ=h/L and obtains the angularity in region to be measured.
Fig. 6 is the angularity data statistics of the AlSi substrate and region F1 and F2 to be measured after LTCC welding of different-alloy ingredient
Schematic diagram；The data of angularity, are compared by tolerance in extract equipment, can be to component supplied materials quality and production quality
It is shown and is controlled.
Fig. 7 is counted to the average angularity of different product, and the angularity data in extract equipment can be grasped not
With the quality of production and warpage feature of product.
In conclusion the present invention carries out identification positioning to region to be measured using automatic machinery identification technology, recycle white
Optical scanning interference technique is scanned region to be measured and carries out amount of warpage measurement and calculate angularity, finally by Compare System
In the angularity numerical value of preset component range to be measured whether meet setting tolerance threshold value and determine whether component supplied materials closes
Whether lattice and integrated circuit finished product, which reach manufacture, requires, and whole process without human intervention, can effectively derive from dynamic judgement electronics
Whether component or IC products are qualified.
Claims (5)
1. a kind of automatic detection includes the steps that following order at the method for circuit devcie angularity, this method:
(1) the surface-feature image Fig0 of acquisition device intercepts region F0 to be measured on the surface-feature image Fig0 of device and makees
For angularity comparison standard area figure Fig usedF0；
(2) extract device under test surface-feature image Fig1, Fig2 ... FigN identifies region F1, F2 to be measured one by one
,……Fn；
(3) amount of warpage scanning is carried out to the region to be measured recognized and calculates angularity numerical value γ；
(4) the angularity numerical value γ being calculated is compared with the angularity standard value L of setting, and calculates tolerance；If to
The tolerance that survey device is calculated then determines the device under test or IC products in the range of the tolerance difference S of setting
It is otherwise unqualified for qualification；
In step (1), multiple integrated circuit device or integrated circuit finished product are placed on clamping tooling, transmission guide rail will clamp
Tooling is transmitted on objective table；It enables white light source generate light, is irradiated on clamping tooling wherein one by interference microscope
Component surface adjusts area grayscale to be measured by display output system, the first device received is acquired with image processing system
The optical signal of part reflection, the surface-feature image Fig0 of generating device, and stored by signal processing system；White light light is set
Source, interference microscope and image processing system search for region to be measured on surface-feature image Fig0, and in surface-feature image
The region F0 to be measured standard area figure Fig used as angularity comparison is intercepted on Fig0F0, it is stored in signal processing system；
In step (2), starts the transmission guide rail on objective table, clamping tooling to be measured is placed on interference microscope one by one
Lower section；Picture signal conversion generates to the surface-feature image FigN of corresponding device by image processing system, N takes 1 to n, and
It transmitting and stores to signal processing system, wherein surface-feature image corresponding to first device under test is denoted as Fig1, and second
Surface-feature image corresponding to a device under test is denoted as Fig2, and so on, the corresponding surface characteristics of n-th of device to be measured
Image is denoted as FigN；Signal processing system extracts the surface-feature image FigN for the device that image processing system transmitting comes, will be white
Radiant and interference microscope move on to the position for needing to measure on device and identify region F1, F2 to be measured ..., Fn；
In step (3), white light source is divided into reference beam and measuring beam by interference microscope, and wherein measuring beam irradiates
Component surface forms reflection on surface and forms interference image again by interference microscope and reference beam；The image is schemed
As processing system acquisition, signal processing system calculates the image of acquisition, and display output system shows sticking up for irradiation area
Diagram picture and data, be scanned one by one obtain n-th device region F1, F2 to be measured ..., the amount of warpage of Fn and measuring and calculating
The region angularity, obtains angularity numerical value, and the angularity numerical value γ 1, second for being followed successively by the first scan position of N device is swept
Retouch position angularity numerical value γ 2 ..., the angularity numerical value γ n of the n-th scan position；It sticks up above-mentioned n sector scanning position
Curvature numerical value γ 1, γ 2 ... it is medium to be called that γ n is stored in signal processing system；Pre-set programs are pressed in signal processing system,
Set region F1, F2 to be measured ..., angularity standard value L1, L2 of Fn ... Ln and tolerance difference ± S1, ±
S1,……±Sn；
In step (4), intelligent decision system by region F1, F2 to be measured on device ..., angularity numerical value γ 1, the γ of Fn
2 ... γ n and angularity standard value L1, L2 of default ... Ln is compared, if tolerance difference is less than the appearance of setting
Difference ± S1, ± S1 ... ± Sn then determines that region is qualification at this, is otherwise determined as unqualified；In component cases or collect
It is all qualified at the position angularity to be determined of all components to be measured in circuit, then determine that the device or integrated circuit produce
Product are qualified, otherwise, it is determined that the device or IC products are unqualified.
2. according to the method described in claim 1, it is characterized by: the signal processing system finds setting component or integrated
Multiple region F1, F2 to be measured for needing to measure angularity on circuit finished product ..., the method for Fn it is as follows: in the table of component
The picture search area FigF1 that the region F1 to be measured that need to be found is preset in region feature image FigN carries out region F1 to be measured similar
Image comparison positioning, obtains the region F1 to be measured for needing to measure angularity on component or integrated circuit finished product to be measured, and pass through
The method successively obtains multiple region F1, F2, F3 to be measured for needing to measure angularity on component or integrated circuit finished product
、……、Fn。
3. a kind of device of method of the implementation as described in any one of claims 1 to 2, it is characterised in that: including objective table,
The upper transmission guide rail installed for transmitting clamping tooling, multiple electronic components are clamped on the clamping tooling or integrated circuit produces
Product, the surface setting of clamping tooling are used for the white light scanning interferometer measuration system of sampler surface warp spirogram picture, white light
First signal output end of scanning interferometer measuring system with for carrying out data extraction and storage to device surface amount of warpage image
The signal input part of signal processing system be connected, the signal output end of signal processing system with for raw to signal processing system
At the signal input part of intelligent decision system that is determined of data characteristics be connected, the signal output end of intelligent decision system,
The second signal output end of white light scanning interferometer measuration system respectively with display output system the first signal input part and second
Signal input part is connected.
4. device according to claim 3, it is characterised in that: the white light scanning interferometer measuration system is micro- by interfering
Mirror, white light source and image processing system composition, the interference microscope are located at the surface of clamping tooling, the white light source
Between interference microscope and image processing system, the control terminal phase of the signal output end and white light source of image processing system
Even, output end of the output end of described image processing system as white light scanning interferometer measuration system, described image processing system
It is interior to be equipped with ccd image sensor.
5. device according to claim 3, it is characterised in that: the signal processing system and intelligent decision system are built-in
In in computer, setting a storage unit in the signal processing system.
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| CN111912379A (en) * | 2020-07-24 | 2020-11-10 | 福建晶安光电有限公司 | Method for inspecting processing quality of processed surface of wafer and cutting quality of cutting surface |
| CN112224869A (en) * | 2020-10-26 | 2021-01-15 | 日月光半导体（昆山）有限公司 | Integrated circuit blanking device |
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