CN118173672B - MicroLED flexible display screen preparation monitoring method - Google Patents

Abstract

The present invention discloses a method for monitoring the preparation of a MicroLED flexible display screen, and relates to the technical field of display screen preparation. The present invention obtains a repair evaluation index by comprehensively analyzing the voltage estimation, difference estimation, expected leakage current, and extreme leakage current of a MicroLED array during a power-on inspection test period, thereby providing a comprehensive evaluation index for the repair and optimization of the MicroLED array. The repair difference is further calculated and matched with a set difference value range, so that the repair level of each MicroLED array can be quickly determined, thereby sending it to the most suitable repair workshop, thereby improving the preparation efficiency and intelligence.

Description

A method for monitoring the preparation of a MicroLED flexible display screen

Technical Field

The present invention relates to the technical field of display screen preparation, and in particular to a method for monitoring the preparation of a MicroLED flexible display screen.

Background Art

MicroLED display technology has the advantages of high luminous efficiency, wide color gamut and long life, and is widely used in large-screen and high-brightness information display. In the preparation process of Micro LED flexible display screens, after the array is powered on, inspected and repaired, the array needs to be immersed in transparent silicone, resin or transparent polyimide and other colloid materials by injection molding. After the colloid is cured, the pixels and wires are fixed to form a thin-film structure flexible display screen.

However, there are still the following deficiencies in the above-mentioned preparation process:

The arrays cannot be classified into different repair levels according to the results of the array power-on inspection and sent to the corresponding workshops for repair. The defective products are directly sent to manual sorting, which has a low degree of intelligence and affects the production efficiency of flexible displays.

During the process of the array being immersed in the colloidal material for curing, the curing process cannot be monitored and adjusted, resulting in the quality of the injection molding not being guaranteed, bubbles and defects appearing, and affecting the final quality of the product.

To this end, a method for monitoring the preparation of a MicroLED flexible display screen is introduced.

Summary of the invention

In view of this, the present invention provides a method for preparing and monitoring a MicroLED flexible display screen to solve the problems raised by the above-mentioned background technology.

The object of the present invention can be achieved by the following technical solution: A method for preparing and monitoring a MicroLED flexible display screen, comprising:

Step 1: Prepare a MicroLED array, use automated testing equipment to power on each MicroLED array, and record relevant parameters for analysis to obtain a repair assessment index α of the corresponding MicroLED array;

Step 2: Based on the quality standard of the preparation, a reference threshold of the repair evaluation index α is set, and according to the comparison result of the corresponding MicroLED array repair evaluation index α, the corresponding MicroLED array is transported to the corresponding workshop;

Step 3: After selecting the colloid material, immerse the corresponding MicroLED array in the selected colloid material, set the curing time period of the MicroLED array based on the characteristics of the colloid material, and monitor the curing process in real time. When the midpoint of the set curing time period is reached, analyze the parameter changes of the curing process in the monitoring time period before the midpoint to obtain the optimized adjustment index β;

Step 4: Based on the optimization adjustment index β of the corresponding MicroLED array in the monitoring time period before the midpoint, the obtained optimization adjustment index β is compared with the set reference threshold. If it is greater than the set reference threshold, the warning signal is triggered to suspend the curing of the MicroLED array, and the triggered warning signal and the optimization adjustment index β are sent to the mobile terminal of the manager. After receiving the warning signal, the manager remotely adjusts the heating element and the pressure control system based on the optimization adjustment index β. After the adjustment, the MicroLED array continues to be cured based on the remaining curing time period of the midpoint;

Step 5: After the colloid is cured, the display screen undergoes a series of pretreatment steps to form a flexible display screen body with a thin film structure, and then undergoes subsequent testing and inspection.

In some embodiments, the specific process of obtaining the repair assessment index α is:

Set a test time period for power-on inspection, obtain the change of the forward voltage of the MicroLED array under normal working conditions during the test time period, extract the forward voltage at each time point during the test time period, calculate the forward voltage at each time point using the standard deviation formula, and obtain the voltage change value of the MicroLED array. At the same time, extract the highest forward voltage and the lowest forward voltage at each time point, calculate the difference between the two, and use it as the voltage difference value of the MicroLED array;

Setting weight coefficients of the voltage change value and the voltage difference value of the MicroLED array, multiplying the voltage change value and the voltage difference value of the MicroLED array by the corresponding weight coefficients respectively, and then summing the multiplication results as the voltage estimation Da of the MicroLED array;

Obtain the current value of the MicroLED array at different voltages during the test period, and measure the effective area of the MicroLED array electrode at the same time, and calculate the current value and the effective area using the formula J=K/A to obtain the current density, where K is the current value and A is the effective area of the electrode;

The brightness and luminous area of the MicroLED array at different current densities are measured, and the luminous flux is obtained by multiplying the brightness by the luminous area. The obtained luminous flux is converted to obtain the luminous power of the MicroLED array and recorded as ;

And through the formula Calculating the Electrical Power of MicroLED Arrays ; Where V is the specific applied voltage;

pass Calculate and obtain the luminous efficiency of the MicroLED array at different current densities , using the standard deviation formula to calculate the luminous efficiency at different current densities Perform calculation and use the calculated value as the difference estimate Db of the MicroLED array;

Apply a set reverse bias voltage to the MicroLED array during the test period, where the set reverse bias voltage includes an expected reverse bias voltage and an extreme reverse bias voltage, and measure and record the reverse leakage current through the MicroLED array at each applied reverse bias voltage, marking the leakage current values at the expected reverse bias voltage and the extreme reverse bias voltage as Dc and Ds, respectively;

Substitute the voltage estimate Da, difference estimate Db, expected leakage current Dc and extreme leakage current Ds of the MicroLED array during the power-on test period into the formula , weighted calculation is performed to obtain the repair evaluation index α of the corresponding MicroLED array; , , as well as They respectively represent the maximum allowable voltage estimation, the maximum allowable difference estimation, the maximum allowable expected leakage current and the maximum allowable extreme leakage current; ea1, ea2, ea3 and ea4 are the influence weight factors of the voltage estimation Da, the difference estimation Db, the expected leakage current Dc and the extreme leakage current Ds.

In some embodiments, according to the comparison result of the corresponding MicroLED array repair assessment index α, the corresponding MicroLED array is transported to the corresponding workshop, specifically:

The repair evaluation index α of the MicroLED array is compared with the set reference threshold. If it is less than the set reference threshold, it is sent to the curing workshop for curing process; if it is greater than the set reference threshold, a repair signal is generated, the difference between the repair evaluation index α and the reference threshold is calculated, and the calculated difference is recorded as the repair difference, and the difference value ranges corresponding to the repair difference are set. Each difference value range corresponds to a repair level, and the repair difference of the MicroLED array is matched with the set difference value ranges to obtain the repair level of the MicroLED array; the repair level is divided into general repair level, medium repair level and severe repair level; set general repair, medium repair and severe repair to correspond to general repair workshop, medium repair workshop and severe repair workshop respectively;

Based on the repair level of the MicroLED array, the MicroLED array is transported to the corresponding repair workshop.

In some embodiments, according to the comparison result of the corresponding MicroLED array repair assessment index α, the corresponding MicroLED array is transported to the corresponding workshop, further comprising:

During the transportation process, the number of cells to be repaired in the corresponding repair workshop is obtained, and a reference value of the number of cells to be repaired is set. If the number of cells to be repaired in the corresponding repair workshop is greater than the set reference value, a transportation optimization signaling is generated to obtain the number of cells to be repaired in the other two repair workshops outside the corresponding repair workshop. If both are greater than the number of cells to be repaired in the corresponding repair workshop, the MicroLED array continues to be transported to the corresponding repair workshop.

If it is less than the number of items to be repaired in the corresponding repair workshop, the transportation distances between the corresponding repair workshop and the other two repair workshops are obtained respectively, and the weight coefficients corresponding to the number of items to be repaired and the transportation distances are set. The number of items to be repaired and the transportation distances of the other two repair workshops are multiplied by the corresponding weight coefficients respectively, and then the result is summed up to obtain result one; based on the preset usage priority coefficients of the general repair workshop, the medium repair workshop and the serious repair workshop; the result one of the other two repair workshops is multiplied by the corresponding usage priority coefficients to obtain the preferred evaluation values of the other two repair workshops, and the repair workshop with the smallest preferred evaluation value is used as the target repair workshop for the MicroLED array. After marking the MicroLED array, the transportation path is changed to the target repair workshop, and the number of items to be repaired in the target repair workshop is increased by one.

In some embodiments, the parameter changes of the curing process during the monitoring period before the intermediate point are analyzed, specifically:

Obtain the temperature value of the curing area at each time point in the monitoring period before the middle point and substitute it into the temperature graph for representation, draw the numerical point in the temperature graph corresponding to the temperature value of the curing area at each time point, draw the reference area in the temperature graph corresponding to the reference temperature change range based on the preset reference temperature change range, count the number of numerical points outside the reference area in the temperature graph as the abnormal temperature number and record it as Fa, and at the same time, use each numerical point outside the reference area as the reference point, and use the nearest reference area line as the target point to draw a vertical line, calculate the length of each vertical line and accumulate them, and obtain the abnormal temperature value and record it as Fb; use the standard deviation formula to calculate the temperature value of the curing area at each time point, and obtain the temperature variation value and record it as Fc;

Based on the above steps, the pressure value inside the colloidal material at each time point in the monitoring period before the middle point is obtained and substituted into the pressure graph to represent the abnormal pressure number Ha, abnormal pressure value Hb and pressure variation value Hc corresponding to the pressure change in the monitoring period are obtained.

In some embodiments, the specific steps of obtaining the optimized adjustment index β are: according to the formula Perform weighted calculation to obtain the optimization adjustment index β of the MicroLED array; ra1, ra2 and ra3 are the influence weight factors of the abnormal temperature number Fa, abnormal temperature value Fb and temperature variation value Fc respectively; ry1, ry2 and ry3 are the influence weight factors of the abnormal pressure number Ha, abnormal pressure value Hb and pressure variation value Hc respectively;

Where Gt and Gk represent the fixing temperature and pressure of the MicroLED array during the fixing process, respectively. and They represent the maximum allowable values of solid temperature and solid pressure respectively; m1 and m2 are the influencing weight factors of solid temperature Gt and solid pressure Gk respectively.

Compared with the prior art, the present invention has the following beneficial effects:

The present invention obtains a repair evaluation index by comprehensively analyzing the voltage estimation, difference estimation, expected leakage current and extreme leakage current of the MicroLED array during the power-on inspection test period, thereby providing a comprehensive evaluation index for the repair and optimization of the MicroLED array. The repair difference is further calculated and matched with the set difference value range, so that the repair level of each MicroLED array can be quickly determined, so that it can be sent to the most suitable repair workshop, thereby improving the preparation efficiency and intelligence.

The present invention can avoid repair and preparation delays by generating transport optimization signaling and taking into account the number of repairs to be made and the transport distance in other workshops;

The present invention monitors the temperature and pressure in real time during the curing process, performs parameter analysis at the middle point of the curing time period to obtain an optimized adjustment index, and further compares the optimized adjustment index with a reference threshold to identify abnormal conditions in the curing process in real time, trigger early warnings in time, prevent potential quality problems, and ensure the curing quality.

BRIEF DESCRIPTION OF THE DRAWINGS

Further details, features and advantages of the present application are disclosed in the following description of exemplary embodiments in conjunction with the accompanying drawings, in which:

Fig. 1 is a flow chart of the present invention;

FIG. 2 is a temperature graph constructed in the present invention.

DETAILED DESCRIPTION

Several embodiments of the present application will be described in more detail below with reference to the accompanying drawings so that those skilled in the art can implement the present application. The present application can be embodied in many different forms and purposes and should not be limited to the embodiments described herein. These embodiments are provided to make the present application comprehensive and complete, and to fully convey the scope of the present application to those skilled in the art. The embodiments do not limit the present application.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this application belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant art and/or the context of this specification, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

Referring to FIG. 1 and FIG. 2 , a method for preparing and monitoring a MicroLED flexible display screen includes:

Step 1: Prepare MicroLED arrays. In the preparation of MicroLED arrays, a large number of microLED structures need to be produced on semiconductor substrates through micromachining technology. The microLED structures will serve as the light-emitting units of the display screen. Each MicroLED array is powered on and inspected using automated testing equipment. Related parameters are recorded for analysis to obtain the repair assessment index α of the corresponding MicroLED array.

The specific process of obtaining the repair evaluation index α is:

Set a test time period for power-on inspection, obtain the change of the forward voltage of the MicroLED array under normal working conditions during the test time period, extract the forward voltage at each time point during the test time period, calculate the forward voltage at each time point using the standard deviation formula, and obtain the voltage change value of the MicroLED array. At the same time, extract the highest forward voltage and the lowest forward voltage at each time point, calculate the difference between the two, and use it as the voltage difference value of the MicroLED array;

Setting weight coefficients of the voltage change value and the voltage difference value of the MicroLED array, multiplying the voltage change value and the voltage difference value of the MicroLED array by the corresponding weight coefficients respectively, and then summing the multiplication results as the voltage estimation Da of the MicroLED array;

It should be noted that by calculating the standard deviation of the forward voltage, the voltage stability of the MicroLED array during continuous operation can be evaluated. A smaller standard deviation value indicates high voltage stability and good performance consistency.

Obtain the current value of the MicroLED array at different voltages during the test period; connect the current probe to the corresponding electrode of the MicroLED array and gradually increase the current; at the same time, measure the effective area of the MicroLED array electrode, and calculate the current value and the effective area using the formula J=K/A to obtain the current density; where K is the current value and A is the effective area of the electrode;

Measure the brightness and luminous area of the MicroLED array at different current densities; use a photometer to measure the brightness of the MicroLED array; multiply the brightness by the luminous area to obtain the luminous flux, convert the obtained luminous flux to obtain the luminous power of the MicroLED array and record it as ; Through the set conversion coefficient, the luminous flux is multiplied by the set conversion coefficient to obtain the luminous power;

And through the formula Calculating the Electrical Power of MicroLED Arrays ; Where V is the specific applied voltage;

pass Calculate and obtain the luminous efficiency of the MicroLED array at different current densities , using the standard deviation formula to calculate the luminous efficiency at different current densities Perform calculation and use the calculated value as the difference estimate Db of the MicroLED array;

It should be noted that the standard deviation formula is used to calculate the luminous efficiency of each group, and the value obtained reflects the degree of variation in the luminous efficiency; the larger the standard deviation, the greater the range of variation in the luminous efficiency at different current densities, indicating that there is a large inconsistency in the performance of the MicroLED array.

Apply a set reverse bias voltage to the MicroLED array during the test period, where the set reverse bias voltage includes an expected reverse bias voltage and an extreme reverse bias voltage, and measure and record the reverse leakage current through the MicroLED array at each applied reverse bias voltage, marking the leakage current values at the expected reverse bias voltage and the extreme reverse bias voltage as Dc and Ds, respectively;

It should be noted that the performance of the MicroLED array under different conditions can be more comprehensively reflected by setting the expected reverse bias voltage and the extreme reverse bias voltage.

Substitute the voltage estimate Da, difference estimate Db, expected leakage current Dc and extreme leakage current Ds of the MicroLED array during the power-on test period into the formula , weighted calculation is performed to obtain the repair evaluation index α of the corresponding MicroLED array; , , as well as They represent the maximum allowable voltage estimate, the maximum allowable difference estimate, the maximum allowable expected leakage current, and the maximum allowable extreme leakage current respectively; ea1, ea2, ea3, and ea4 are the influence weight factors of the voltage estimate Da, the difference estimate Db, the expected leakage current Dc, and the extreme leakage current Ds, and their values are set to 1.172, 1.165, 1.163, and 1.158 respectively;

It should be noted that the repair evaluation index is obtained by comprehensively analyzing the voltage valuation, difference valuation, expected leakage current and extreme leakage current of the MicroLED array during the power-on inspection test period, which provides a comprehensive evaluation indicator for the repair and optimization of the MicroLED array, facilitating subsequent distribution and management.

Step 2: Based on the quality standard of the preparation, a reference threshold of the repair evaluation index α is set, and according to the comparison result of the corresponding MicroLED array repair evaluation index α, the corresponding MicroLED array is transported to the corresponding workshop; specifically:

The repair evaluation index α of the MicroLED array is compared with the set reference threshold. If it is less than the set reference threshold, it is sent to the curing workshop for curing process; if it is greater than the set reference threshold, a repair signal is generated, the difference between the repair evaluation index α and the reference threshold is calculated, and the calculated difference is recorded as the repair difference. The difference value ranges corresponding to the repair difference are set, and each difference value range corresponds to a repair level. The repair difference of the MicroLED array is matched with the set difference value ranges to obtain the repair level of the MicroLED array; the repair level is divided into general repair level, medium repair level and severe repair level;

Set general repair, medium repair and severe repair to correspond to general repair workshop, medium repair workshop and severe repair workshop respectively;

Based on the repair level of the MicroLED array, the MicroLED array is transported to the corresponding repair workshop. During the transportation process, the number of LEDs to be repaired in the corresponding repair workshop is obtained, and a reference value of the number of LEDs to be repaired is set. If the number of LEDs to be repaired in the corresponding repair workshop is greater than the set reference value, a transport optimization signaling is generated to obtain the number of LEDs to be repaired in the other two repair workshops outside the corresponding repair workshop. If both are greater than the number of LEDs to be repaired in the corresponding repair workshop, the MicroLED array continues to be transported to the corresponding repair workshop.

If it is less than the number of items to be repaired in the corresponding repair workshop, the transportation distances between the corresponding repair workshop and the other two repair workshops are obtained respectively, and the weight coefficients corresponding to the number of items to be repaired and the transportation distances are set. The number of items to be repaired and the transportation distances of the other two repair workshops are multiplied by the corresponding weight coefficients respectively, and then the result is summed to obtain result one; based on the preset usage priority coefficients of the general repair workshop, the medium repair workshop and the serious repair workshop; the usage priority coefficient of the serious repair workshop is the largest, and the usage priority coefficient of the general repair workshop is the smallest; the result one of the other two repair workshops is multiplied by the corresponding usage priority coefficients to obtain the preferred evaluation values of the other two repair workshops, and the repair workshop with the smallest preferred evaluation value is used as the target repair workshop for the MicroLED array. After marking the MicroLED array, the transportation path is changed to the target repair workshop, and the number of items to be repaired in the target repair workshop is increased by one;

It should be noted that by calculating the repair difference and matching it with the set difference value range, the repair level of each MicroLED array can be quickly determined so that it can be sent to the most suitable repair workshop; by generating transport optimization signaling and considering the number of repairs to be made and the transport distance of other workshops, repair and preparation delays can be avoided; the transport path of the MicroLED array can be flexibly adjusted according to actual conditions to ensure that each array can be repaired in the shortest time possible, while maximizing the utilization efficiency of the repair workshop.

Step 3: After selecting the colloid material, immerse the corresponding MicroLED array in the selected colloid material, set the curing time period of the MicroLED array based on the characteristics of the colloid material, and monitor the curing process in real time. When the midpoint of the set curing time period is reached, analyze the parameter changes of the curing process in the monitoring time period before the midpoint to obtain the optimized adjustment index β;

The specific steps to obtain the optimized adjustment index β are:

S1: Obtain the temperature value of the curing area at each time point in the monitoring time period before the middle point and substitute it into the temperature graph for representation; use the temperature sensor for detection; draw the numerical points corresponding to the temperature value of the curing area at each time point in the temperature graph, and based on the preset reference temperature change range, draw the reference area in the temperature graph corresponding to the reference temperature change range, and count the number of numerical points outside the reference area in the temperature graph as the abnormal temperature number and record it as Fa. At the same time, use each numerical point outside the reference area as the reference point, and draw a vertical line with the nearest reference area line as the target point, calculate the length of each vertical line and accumulate them, and obtain the abnormal temperature value and record it as Fb;

The temperature value of the curing area at each time point is calculated using the standard deviation formula to obtain the temperature variation value and record it as Fc;

S2: Based on step S1, the pressure value inside the colloidal material at each time point in the monitoring time period before the middle point is obtained and substituted into the pressure graph to represent it, and the abnormal pressure number Ha, abnormal pressure value Hb and pressure variation value Hc corresponding to the pressure change in the monitoring time period are obtained;

S3: According to the formula A weighted calculation is performed to obtain the optimized adjustment index β of the MicroLED array; wherein ra1, ra2 and ra3 are the influence weight factors of the abnormal temperature number Fa, the abnormal temperature value Fb and the temperature variation value Fc, and the values are set to 1.124, 1.127 and 1.129 respectively; ry1, ry2 and ry3 are the influence weight factors of the abnormal pressure number Ha, the abnormal pressure value Hb and the pressure variation value Hc, and the values are set to 1.135, 1.138 and 1.142 respectively;

Where Gt and Gk represent the fixing temperature and pressure of the MicroLED array during the fixing process, respectively. and They represent the maximum allowable values of the solid temperature value and the solid pressure value respectively; m1 and m2 are the influence weight factors of the solid temperature value Gt and the solid pressure value Gk respectively, and their values are set to 1.548 and 1.562 respectively;

It should be noted that the calculated optimization adjustment index provides a quantitative indicator for evaluating the deviation between the actual parameters in the curing process and the preset reference values, and making necessary parameter adjustments to ensure the preparation quality of the MicroLED flexible display.

Step 4: Based on the optimization adjustment index β of the corresponding MicroLED array in the monitoring time period before the midpoint, the obtained optimization adjustment index β is compared with the set reference threshold. If it is greater than the set reference threshold, the warning signal is triggered to suspend the curing of the MicroLED array, and the triggered warning signal and the optimization adjustment index β are sent to the mobile terminal of the manager. After receiving the warning signal, the manager remotely adjusts the heating element and the pressure control system based on the optimization adjustment index β. After the adjustment, the MicroLED array continues to be cured based on the remaining curing time period of the midpoint;

It should be noted that by comparing the optimized adjustment index and the reference threshold, abnormal conditions in the curing process can be identified in real time, early warnings can be triggered in time, and potential quality problems can be prevented; managers can remotely adjust the heating elements and pressure control systems without on-site intervention, which can quickly respond to and solve problems in the curing process and improve production efficiency and preparation quality; by timely adjusting the curing parameters, the curing quality of the MicroLED array is ensured, which helps to improve the reliability and performance of the final product.

Step 5: After the colloid is cured, the display screen undergoes a series of pretreatment steps; the pretreatment steps include removing excess colloid material that may be generated during the curing process, and finely grinding and polishing the display screen to ensure accurate fixation of pixels and wires; forming a flexible display screen body with a thin film structure, and conducting subsequent testing and inspection.

The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims (4)

1. A method for manufacturing and monitoring MicroLED flexible display screens, comprising the steps of:

step one: preparing MicroLED arrays, carrying out power-on inspection on each MicroLED array by adopting automatic detection equipment, and recording relevant parameters for analysis to obtain a repair evaluation index alpha corresponding to the MicroLED array;

the specific process for obtaining the repair evaluation index alpha is as follows:

Setting a test time period of power-on inspection, acquiring the forward voltage change condition of the MicroLED array in the test time period under the normal working condition, extracting the forward voltage of each time point in the test time period, calculating the forward voltage of each time point by using a standard deviation formula to obtain the voltage change value of the MicroLED array, and simultaneously extracting the highest forward voltage and the lowest forward voltage in the forward voltage of each time point, and calculating the difference value of the highest forward voltage and the lowest forward voltage to obtain the voltage difference value of the MicroLED array;

setting weight coefficients of a MicroLED array voltage variable value and a voltage difference value, multiplying the MicroLED array voltage variable value and the voltage difference value with the corresponding weight coefficients respectively, and then summing up multiplied results to serve as a MicroLED array voltage estimated value Da;

acquiring current values of MicroLED arrays under different voltages in a test time period, simultaneously measuring the effective area of MicroLED array electrodes, and calculating the acquired current values and the effective area through a formula J=K/A to obtain current density; where K is the current value and A is the effective area of the electrode;

Measuring brightness and luminous area of MicroLED array under different current density, multiplying brightness by luminous area to obtain luminous flux, converting obtained luminous flux to obtain luminous power of MicroLED array, and recording as ；

And pass through the formulaCalculating electric power of MicroLED array; Wherein V is the voltage applied specifically;

By passing through Calculating to obtain luminous efficiency of MicroLED array under different current densitiesThe standard deviation formula is utilized to calculate the luminous efficiency under different current densitiesCalculating, and taking the calculated value as a difference estimation value Db of the MicroLED array;

Applying a set reverse bias voltage to the MicroLED array for a test period, the set reverse bias voltage including an expected reverse bias voltage and an extreme reverse bias voltage, and measuring and recording reverse leakage current through the MicroLED array at each applied reverse bias voltage, the leakage current values at the expected reverse bias voltage and the extreme reverse bias voltage being labeled Dc and Ds, respectively;

substituting the voltage estimated value Da, the difference estimated value Db, the expected leakage current Dc and the extreme leakage current Ds of the MicroLED array in the power-on check test period into the formula Weighting calculation is carried out to obtain a repair evaluation index corresponding to MicroLED arrays; Wherein the method comprises the steps of、、AndRespectively, maximum allowable voltage estimate, maximum allowable difference estimate, maximum allowable expected leakage current, and maximum allowable extreme leakage current; ea1, ea2, ea3 and ea4 are the impact weight factors of the voltage estimation Da, the difference estimation Db, the expected leakage current Dc and the extreme leakage current Ds, respectively;

Step two: setting a reference threshold value of a repair evaluation index alpha based on the prepared quality standard, and conveying the corresponding MicroLED array to a corresponding workshop according to a comparison result of the repair evaluation index alpha of the corresponding MicroLED array;

The method comprises the following steps:

Comparing the repair evaluation index alpha of the MicroLED array with a set reference threshold, and if the repair evaluation index alpha is smaller than the set reference threshold, generating and conveying the repair evaluation index alpha to a curing workshop for curing; if the value is larger than the set reference threshold, generating a restoration signaling, calculating a difference value between the restoration evaluation index alpha and the reference threshold, recording the calculated difference value as a restoration difference value, setting each difference value range corresponding to the restoration difference value, respectively corresponding to one restoration grade in each difference value range, and matching the restoration difference value of the MicroLED array with each set difference value range to obtain the restoration grade of the MicroLED array; the repair grade is classified into a general repair grade, a medium repair grade, and a serious repair grade; setting a general repair, a medium repair and a serious repair to correspond to a general repair workshop, a medium repair workshop and a serious repair workshop respectively;

Delivering MicroLED arrays to corresponding repair workshops based on repair grades of MicroLED arrays;

Step three: after selecting a colloid material, soaking a corresponding MicroLED array into the selected colloid material, setting a curing time period of the MicroLED array based on the characteristics of the colloid material, monitoring the curing process in real time, and analyzing the parameter change of the curing process in the monitoring time period before the middle point when the middle point of the set curing time period is reached to obtain an optimal adjustment index beta;

Step four: based on the optimized adjustment index beta of the corresponding MicroLED array in the monitoring time period before the middle point, comparing the obtained optimized adjustment index beta with a set reference threshold, triggering an early warning signaling if the optimized adjustment index beta is larger than the set reference threshold, suspending the curing of the MicroLED array, sending the triggered early warning signaling and the optimized adjustment index beta to a mobile terminal of a manager, after receiving the early warning signaling, remotely adjusting a heating element and a pressure control system based on the optimized adjustment index beta, and continuously curing the MicroLED array based on the residual curing time period of the middle point after the optimized adjustment index beta is adjusted;

Step five: after the colloid is solidified, a series of pretreatment steps are carried out on the display screen, a flexible display screen body with a film structure is formed, and subsequent testing and inspection are carried out.

2. The method for monitoring the preparation of the MicroLED flexible display according to claim 1, wherein the corresponding MicroLED array is conveyed to the corresponding workshop according to the comparison result of the corresponding MicroLED array repair evaluation index α, further comprising:

Acquiring the number to be repaired of the corresponding repair workshops in the conveying process, setting a reference value of the number to be repaired, generating conveying optimization signaling if the number to be repaired of the corresponding repair workshops is larger than the set reference value, acquiring the number to be repaired of other two repair workshops outside the corresponding repair workshops, and continuously conveying MicroLED arrays to the corresponding repair workshops if the number to be repaired of the corresponding repair workshops is larger than the number to be repaired of the corresponding repair workshops;

If the number of the repairing workshops is smaller than the number of the repairing workshops, respectively acquiring the conveying distances between the corresponding repairing workshops and the other two repairing workshops, setting the weight coefficients corresponding to the number of the repairing workshops and the conveying distances, respectively multiplying the number of the repairing workshops and the conveying distances with the corresponding weight coefficients, and then summing to obtain a result I; based on preset use priority coefficients of a general repair shop, a medium repair shop and a serious repair shop; and multiplying the first result of the other two repair workshops by the corresponding priority coefficient to obtain the preferred evaluation value of the other two repair workshops, taking the repair workshop with the smallest preferred evaluation value as a target repair workshop of the MicroLED array, marking the MicroLED array, and then changing the conveying path to the target repair workshop, wherein the number of the target repair workshops to be repaired is increased by one.

3. The method for preparing and monitoring the flexible display screen MicroLED according to claim 1, wherein the analysis of the parameter variation of the curing process in the monitoring period before the intermediate point is specifically:

Acquiring the temperature value of a curing area of each time point in a monitoring time period before an intermediate point, substituting the temperature value into a temperature graph for representation, drawing a numerical value point of the temperature value of the curing area of each time point corresponding to the temperature graph, drawing a reference area of the reference temperature change range corresponding to the temperature graph based on a preset reference temperature change range, counting the number of the numerical value points outside the reference area in the temperature graph, taking the number of the numerical value points outside the reference area as abnormal temperature numbers and recording as Fa, taking each numerical value point outside the reference area as a datum point, taking a line of the reference area closest to the target point as a vertical line, calculating the length of each vertical line, accumulating, and obtaining the abnormal temperature value and recording as Fb; calculating the temperature value of the curing area at each time point by using a standard deviation formula to obtain a temperature variation value and marking the temperature variation value as Fc;

based on the steps, the pressure values in the colloid material at each time point in the monitoring time period before the middle point are obtained and substituted into the pressure graph to be expressed, and the abnormal pressure number Ha, the abnormal pressure value Hb and the pressure variation value Hc corresponding to the pressure change in the monitoring time period are obtained.

4. The method for preparing and monitoring MicroLED flexible display screen according to claim 1, wherein the specific steps for obtaining the optimal adjustment index β are as follows:

According to the formula Weighting calculation is carried out to obtain

MicroLED optimizing and adjusting an index beta of the array; wherein ra1, ra2 and ra3 are the influence weight factors of the abnormal temperature number Fa, the abnormal temperature value Fb and the temperature variation value Fc respectively; ry1, ry2 and ry3 are the influence weight factors of the abnormal pressure number Ha, the abnormal pressure value Hb and the pressure variation value Hc, respectively; wherein Gt and Gk respectively represent a fixed temperature value and a fixed pressure value in the MicroLED array fixing process,AndRespectively representing the maximum allowable value of the fixed temperature value and the fixed pressure value; m1 and m2 are the influence weight factors of the fixed temperature value Gt and the fixed pressure value Gk respectively.