CN116679097B - Semiconductor test probe with overvoltage triggering function - Google Patents
Semiconductor test probe with overvoltage triggering function Download PDFInfo
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- CN116679097B CN116679097B CN202310697532.4A CN202310697532A CN116679097B CN 116679097 B CN116679097 B CN 116679097B CN 202310697532 A CN202310697532 A CN 202310697532A CN 116679097 B CN116679097 B CN 116679097B
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- needle tube
- needle
- test probe
- spring
- tube
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- 238000012360 testing method Methods 0.000 title claims abstract description 53
- 239000000523 sample Substances 0.000 title claims abstract description 37
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
本发明公开了一种具有过压触发功能的半导体测试探针，包括绝缘针管，所述绝缘针管的一端设置有第一针管，所述第一针管内设置有第一针头和第一弹簧，所述第一弹簧位于第一针头的尾部和第一针管的底部之间，绝缘针管的另一端设置有第二针管，所述第二针管的内设置有第二针头和第二弹簧，所述第二针头的中部设置有限位台阶，所述第二弹簧套设在第二针头上并且第二弹簧位于限位台阶的一侧与第二针管的底部之间，第二针头的尾部从第二针管的底部穿出。该具有过压触发功能的半导体测试探针，解决了解决现有半导体测试探针使用时，由于测试过程中力度过大且超过设定行程时，容易导致压坏半导体测试探针进而导致压坏待测产品的问题。
The present invention discloses a semiconductor test probe with an overvoltage trigger function, comprising an insulating needle tube, a first needle tube is provided at one end of the insulating needle tube, a first needle head and a first spring are provided in the first needle tube, the first spring is located between the tail of the first needle head and the bottom of the first needle tube, a second needle tube is provided at the other end of the insulating needle tube, a second needle head and a second spring are provided in the second needle tube, a limiting step is provided in the middle of the second needle head, the second spring is sleeved on the second needle head and the second spring is located between one side of the limiting step and the bottom of the second needle tube, and the tail of the second needle head passes through the bottom of the second needle tube. The semiconductor test probe with an overvoltage trigger function solves the problem that when the existing semiconductor test probe is used, the semiconductor test probe is easily crushed due to excessive force during the test and exceeding the set stroke, which leads to the crushing of the product to be tested.
Description
Technical Field
The invention belongs to the technical field of semiconductor detection, and particularly relates to a semiconductor test probe with an overvoltage triggering function.
Background
The semiconductor test probe is widely applied to the technical fields of mobile phones, automobiles, medical treatment, aerospace and the like, and is a high-end electronic element.
The structure of the semiconductor test probe is generally composed of a needle shaft, a needle tube and a spring, wherein the needle shaft and the spring are arranged in the needle tube, and the mouth of the needle tube is in a compression riveting mode, so that the needle shaft and the spring are kept in the needle tube to form an integral structure. When the device is used, the spring is compressed into the needle tube under the action of the stress of the needle shaft, and the elastic force generated by the spring props against the needle shaft, so that the needle shaft is in good contact with a tested piece for testing.
However, when the existing semiconductor test probe is used, the size tolerance of the exposed parts of the product to be tested and the movable needle head of the semiconductor test probe is larger, so that the point to be tested and the point to be tested of the semiconductor test probe are not collinear or have larger relative spacing difference, and the large-spacing pre-pressing distance is too short or the small-spacing pre-pressing is too excessive, so that the semiconductor test probe is crushed, and the product to be tested is crushed.
Disclosure of Invention
The invention aims to provide a semiconductor test probe with an overvoltage triggering function, which solves the problem that when the existing semiconductor test probe is used, the semiconductor test probe is easy to crush and further crush a product to be tested due to overlarge force in the test process and exceeds a set stroke.
In order to solve the technical problems, the invention discloses a semiconductor test probe with an overvoltage triggering function, which comprises an insulating needle tube, wherein one end of the insulating needle tube is provided with a first needle tube, a first needle head and a first spring are arranged in the first needle tube, the first spring is positioned between the tail part of the first needle head and the bottom part of the first needle tube, the other end of the insulating needle tube is provided with a second needle tube, a second needle head and a second spring are arranged in the second needle tube, the middle part of the second needle head is provided with a limiting step, the second spring is sleeved on the second needle head, the second spring is positioned between one side of the limiting step and the bottom part of the second needle tube, and the tail part of the second needle head penetrates out from the bottom part of the second needle tube.
The technical scheme of the invention also has the following characteristics:
As a preferable scheme of the invention, an insulating inner tube is arranged in the insulating needle tube, and two ends of the first needle tube and the second needle tube are respectively arranged at two ends of the insulating inner tube.
In a preferred embodiment of the present invention, a reduced mouth is formed at both ends of the insulated needle tube, and the first needle tube and the second needle tube are both limited in the reduced mouth.
As a preferable scheme of the invention, a necking is formed at one end of the first needle tube, and the tail part of the first needle head is limited in the necking.
As a preferable scheme of the invention, a necking is formed at one end of the second needle tube, and the limiting step is limited in the necking.
Compared with the prior art, the semiconductor test probe with the overvoltage triggering function has the advantages that in the use process, the triggering is possibly caused to generate short-circuit current only when the overvoltage occurs in the test process, and the test is stopped and the alarm is given out immediately when the short-circuit current signal is transmitted, so that the damage of a product to be tested due to the overvoltage is avoided, and the test performance of the semiconductor test probe can be well ensured on the premise of ensuring the test precision.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
fig. 1 is a schematic structural diagram of a semiconductor test probe with an overvoltage triggering function according to the present invention.
In the figure, the first needle tube is 1, the first spring is 2, the first needle head is 3, the second needle tube is 4, the limiting step is 5, the insulating needle tube is 6, the second needle head is 7, the insulating inner tube is 8, and the second spring is 9.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Example 1
As shown in fig. 1, the semiconductor test probe with the overvoltage triggering function comprises an insulating needle tube 6, wherein a first needle tube 1 is arranged at one end of the insulating needle tube 6, a first needle head 3 and a first spring 2 are arranged in the first needle tube 1, the first spring 2 is positioned between the tail part of the first needle head 3 and the bottom part of the first needle tube 1, a second needle tube 4 is arranged at the other end of the insulating needle tube 6, a second needle head 7 and a second spring 2 are arranged in the second needle tube 4, a limit step 5 is arranged in the middle part of the second needle head 7, the second spring 2 is sleeved on the second needle head 7, the second spring 2 is positioned between one side of the limit step 5 and the bottom part of the second needle tube 4, and the tail part of the second needle head 7 penetrates out from the bottom part of the second needle tube 4.
The first needle tube 1 is a carrier of a semiconductor trigger test probe and is used for carrying a first spring 2 and a first needle head 3.
The first spring 2 is arranged inside the first needle tube 1, one end of the first spring is contacted with the bottom of the first needle tube 1, and the other end of the first spring is contacted with the first needle head 3.
The first needle head 3 is arranged inside the first needle tube 1, one end of the first needle head is contacted with the first spring 2, and the first needle head is limited in the first needle tube 1 in a needle tube wrapping way.
The second needle tube 4 is a carrier for the test probe and is used for carrying the first spring 2 and the second needle 7.
The second needle 7 is arranged inside the second needle tube 4, one end of the second needle 7 is contacted with the second spring 10, and the second needle is limited in the second needle tube 4 in a needle tube wrapping way;
the insulated needle tube 6 is a carrier of the semiconductor test probe with the overvoltage triggering function of the invention and is used for the first needle tube 1 and the second needle tube 4.
The first spring 2 and the first needle head 3 are arranged in the first needle tube 1 and are fastened in a wrapping way by using the first needle tube 1, the first spring 2 and the second needle head 7 are arranged in the second needle tube 4 and are fastened in a wrapping way by using the second needle tube 4, and the first needle head 3 and the second needle head 7 are arranged at two ends of the insulating needle tube 6. When the semiconductor test probe is used, the first needle head 3 is contacted with the outgoing end, the second needle head 5 is contacted with the product to be tested when the semiconductor test probe is close to the product to be tested, and the test points of the product to be tested and the end surface of the second needle head 5 are not the same in distance, so that the situation that the distance is close in the test process can occur, and overvoltage can occur in the test process, so that the test is stopped and an alarm is given immediately after overvoltage occurs in some test points.
Example 2
As shown in fig. 1, unlike in embodiment 1, in a semiconductor test probe with an overvoltage triggering function of the present invention, an insulating inner tube 8 is provided in an insulating needle tube 6, and both ends of a first needle tube 1 and a second needle tube 4 are provided at both ends of the insulating inner tube 8, respectively.
The insulating inner tube 8 is used as a mounting platform in the insulating needle tube 6, mainly plays a role in respectively arranging the first needle tube 1 and the second needle tube 4 at two ends of the insulating inner tube 8, is convenient to assemble and position quickly and accurately, and is convenient to operate.
Example 3
As shown in fig. 1, unlike in embodiment 1, in a semiconductor test probe with an overpressure triggering function of the present invention, both ends of an insulating needle tube 6 are formed with a reduced mouth, and a first needle tube 1 and a second needle tube 4 are both restricted in the reduced mouth, so that the first needle tube 1 and the second needle tube 4 can be stably assembled in the insulating needle tube 6 quickly.
Example 4
As shown in fig. 1, unlike in embodiment 1, in the semiconductor test probe with an overpressure triggering function of the present invention, a reduced mouth is formed at one end of the first needle tube 1, and the tail of the first needle 3 is limited in the reduced mouth, so that the first needle 3 can be quickly and stably assembled in the first needle tube 1.
Example 5
As shown in fig. 1, unlike in embodiment 1, in a semiconductor test probe with an overpressure triggering function of the present invention, one end of the second needle tube 4 is formed with a constriction, and the limiting step 5 is limited in the constriction, so that the second needle 7 can be quickly and stably assembled in the first needle tube 4.
Therefore, compared with the prior art, the semiconductor test probe with the overvoltage triggering function can trigger to generate short-circuit current only when overvoltage occurs in the test process in the use process, and the short-circuit current signal transmission equipment immediately stops testing and alarms, so that the damage of a product to be tested caused by overvoltage is avoided, and the test performance of the semiconductor test probe can be well ensured on the premise of ensuring the test precision.
While the foregoing description illustrates and describes several preferred embodiments of the invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of use in various other combinations, modifications and environments and is capable of changes or modifications within the spirit of the invention described herein, either as a result of the foregoing teachings or as a result of the knowledge or skill of the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310697532.4A CN116679097B (en) | 2023-06-13 | 2023-06-13 | Semiconductor test probe with overvoltage triggering function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310697532.4A CN116679097B (en) | 2023-06-13 | 2023-06-13 | Semiconductor test probe with overvoltage triggering function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116679097A CN116679097A (en) | 2023-09-01 |
| CN116679097B true CN116679097B (en) | 2025-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310697532.4A Active CN116679097B (en) | 2023-06-13 | 2023-06-13 | Semiconductor test probe with overvoltage triggering function |
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| Country | Link |
|---|---|
| CN (1) | CN116679097B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206420917U (en) * | 2016-12-20 | 2017-08-18 | 东莞市燊瑞电子科技有限公司 | A kind of 2-in-1 1 testing needle |
| CN112083200A (en) * | 2020-09-11 | 2020-12-15 | 苏州韬盛电子科技有限公司 | Novel high-frequency test socket |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5112248A (en) * | 1989-10-10 | 1992-05-12 | Sps Technologies, Inc. | Electrical contact mechanism for ultrasonic transducers on fasteners |
| US5982187A (en) * | 1993-07-01 | 1999-11-09 | Alphatest Corporation | Resilient connector having a tubular spring |
| DE60126936T2 (en) * | 2000-06-16 | 2007-06-14 | NHK Spring Co., Ltd., Yokohama | MICROCONTACT TEST NEEDLE AND ELECTRIC MEASURING PROBE |
| EP3550310B1 (en) * | 2016-11-30 | 2021-10-20 | Nidec-Read Corporation | Contact terminal, inspection jig, and inspection device |
| CN211978188U (en) * | 2020-03-31 | 2020-11-20 | 昆山光科鑫激光科技有限公司 | Product button pressure detection mechanism |
| KR102259074B1 (en) * | 2020-05-22 | 2021-06-02 | (주)아이윈솔루션 | Pogo pin for super high current |
| JP2023045250A (en) * | 2021-09-21 | 2023-04-03 | キオクシア株式会社 | Contact probe and inspection equipment |
| CN114778904A (en) * | 2022-04-11 | 2022-07-22 | 渭南木王智能科技股份有限公司 | Double-end single-action probe |
| CN218848212U (en) * | 2022-11-14 | 2023-04-11 | 渭南木王智能科技股份有限公司 | Semiconductor test probe with overvoltage buffering function |
-
2023
- 2023-06-13 CN CN202310697532.4A patent/CN116679097B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206420917U (en) * | 2016-12-20 | 2017-08-18 | 东莞市燊瑞电子科技有限公司 | A kind of 2-in-1 1 testing needle |
| CN112083200A (en) * | 2020-09-11 | 2020-12-15 | 苏州韬盛电子科技有限公司 | Novel high-frequency test socket |
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| Publication number | Publication date |
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| CN116679097A (en) | 2023-09-01 |
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