CN218848212U

CN218848212U - Semiconductor test probe with overvoltage buffering function

Info

Publication number: CN218848212U
Application number: CN202223028777.8U
Authority: CN
Inventors: 丁崇亮; 张飞龙
Original assignee: Weinan Muwang Intelligent Technology Co ltd
Current assignee: Weinan Muwang Intelligent Technology Co ltd
Priority date: 2022-11-14
Filing date: 2022-11-14
Publication date: 2023-04-11
Anticipated expiration: 2032-11-14

Abstract

The utility model discloses a semiconductor test probe with excessive pressure buffer function, including the needle tubing, the lower extreme of needle tubing is provided with the expander, is provided with first spring in the needle tubing, and the upper end of needle tubing is provided with first syringe needle telescopically, be provided with the second spring in the expander, be provided with the buffer block of falling T shape between the upper end of expander and the lower extreme of needle tubing, the lower extreme of needle tubing is stretched into to the vertical portion of the buffer portion of falling T shape, and the horizontal position of the buffer portion of falling T shape is in the expander, and the lower extreme of expander is provided with the second needle. This semiconductor test probe with excessive pressure buffer function has solved current semiconductor test probe when using, and it is excessive to produce the pre-compaction easily when the product that awaits measuring contacts with semiconductor test probe's syringe needle, and then takes place the problem of losing.

Description

Semiconductor test probe with overvoltage buffering function

Technical Field

The utility model belongs to the technical field of the semiconductor inspection, concretely relates to semiconductor test probe with excessive pressure buffer function.

Background

The structure of the semiconductor test probe is generally composed of a needle shaft, a needle tube and a spring, wherein the needle shaft and the spring are arranged inside the needle tube, and the needle shaft and the spring are kept inside the needle tube to form an integral structure by applying a pressing riveting necking mode at the tube opening of the needle tube. When the needle shaft is used, the needle shaft is stressed to compress the spring into the needle tube, the elastic force generated by the spring props against the needle shaft, and the needle shaft is in good contact with a tested piece to be tested.

However, when the conventional semiconductor test probe is used, the pre-pressing is easily excessive when a product to be tested contacts with the needle of the semiconductor test probe, and then the damage is caused.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a semiconductor test probe with excessive pressure buffer function, when solving current semiconductor test probe and using, it is excessive to produce the pre-compaction easily when the syringe needle contact of product and semiconductor test probe that awaits measuring, and then takes place the problem of rolling over the damage.

In order to solve the technical problem, the utility model discloses a semiconductor test probe with excessive pressure buffer function, including the needle tubing, the lower extreme of needle tubing is provided with the expander, is provided with first spring in the needle tubing, and the upper end of needle tubing is provided with first syringe needle telescopically, be provided with the second spring in the expander, be provided with the shape of falling T buffer block between the upper end of expander and the lower extreme of needle tubing, the vertical portion of the shape of falling T buffer block stretches into the lower extreme of needle tubing, and the horizontal position of the shape of falling T buffer block is in the expander, and the lower extreme of expander is provided with the second syringe needle.

The technical scheme of the utility model, still have following characteristics:

as a further improvement of the technical scheme of the utility model, first spring and second spring are compression spring.

As a further improvement of the technical proposal of the utility model, the second needle head is fixedly connected with the expanding tube through a concave point.

As a further improvement of the technical scheme of the utility model, the afterbody of first syringe needle is provided with spacing platform, the last port of needle tubing is formed with the throat.

As the utility model discloses technical scheme's further improvement, the afterbody of first syringe needle is provided with the toper connecting portion, a pot head of first spring is established on the toper connecting portion.

As a further improvement of the technical proposal of the utility model, the tail part outer edge of the second needle head is provided with a tapered groove.

Compared with the prior art, the utility model discloses a semiconductor test probe with excessive pressure buffer function, in the use, only just can compress the second spring when first spring takes place the excessive pressure, the second spring can take place the compression receiving the effect of excessive pressure to avoid taking place the excessive pressure and roll over the damage, ensure semiconductor test probe's test performance.

Drawings

The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it. In the drawings:

fig. 1 is a schematic structural diagram of a semiconductor test probe with an overvoltage buffering function according to the present invention.

In the figure: 1. the needle tube, 2, the first needle head, 3, the limiting table, 4, the inverted T-shaped buffer block, 5, the second spring, 6, the second needle head, 7, the expanding tube, 8, the first spring and 9, the conical connecting part.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, if there are first and second descriptions for distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the precedence of the indicated technical features.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

As shown in fig. 1, the utility model discloses a semiconductor test probe with excessive pressure buffer function, including needle tubing 1, the lower extreme of needle tubing 1 is provided with expander 7, is provided with first spring 8 in the needle tubing 1, and the upper end of needle tubing 1 is provided with first needle 2 telescopically, is provided with second spring 5 in the expander 7, is provided with inverted T shape buffer block 4 between the upper end of expander 7 and the lower extreme of needle tubing 1, and the lower extreme of needle tubing 1 is stretched into to the vertical portion of inverted T shape buffer block 4, and the horizontal position of inverted T shape buffer block 4 is in expander 7, and the lower extreme of expander 7 is provided with second needle 6.

The second needle 6 is arranged in the needle tube 1 and is fastened by using a point striking mode at the tail end of the needle tube 1; the second spring 5 is arranged in the needle tube 1, one end of the second spring is contacted with the second needle head 6, and the other end of the second spring is contacted with the big end of the inverted T-shaped buffer block 4; the inverted T-shaped buffer block 4 is placed in the middle of the needle tube 1, the big head of the inverted T-shaped buffer block is in contact with the second spring 5, and the small head of the inverted T-shaped buffer block is in contact with the first spring 8; the first spring 8 is arranged at the other side of the needle tube 1, one end of the first spring is contacted with the small end of the inverted T-shaped buffer block 4, and the other end of the first spring is contacted with the first needle head 2; the first needle head 2 is placed on the other side of the needle tube 1, one end of the first needle head 2 is arranged in the needle tube 1 and is in contact with the first spring 8, and the other end of the first needle head 2 is exposed outside the needle tube 1 and is limited in a mode of wrapping the opening of the end face of the needle tube 1.

During the use, semiconductor test probe installs and constitutes the test module in test fixture, second syringe needle 6 contacts with the efferent, first syringe needle 2 contacts with the product that awaits measuring when the test module is close to the product that awaits measuring, because the test point position of the product that awaits measuring is different with the terminal surface interval of first syringe needle 2 of semiconductor test probe, consequently there may be the circumstances that the interval is far away in the test process, the test process contact is inseparable in above-mentioned circumstances probably appears, in order to ensure that all positions can both reliably contact, the test module can continue to move forward in the position of theoretical marcing forward in order to satisfy the test point position that the interval is far away also can reliably contact, consequently there may be some test point position overvoltage phenomenon, because semiconductor test probe has the overvoltage cushioning effect, consequently also can be fine assurance semiconductor test probe's test performance simultaneously have the cushioning effect concurrently.

As shown in fig. 1, in the semiconductor test probe with overvoltage buffer function of the present invention, the first spring 8 and the second spring 5 are both compression springs.

The first spring 8 and the second spring 5 are preferably compression springs, so that the elastic force of the springs can be ensured to be uniformly acted on the first needle 2 and the second needle 6, the first needle 2 can move up and down along a straight line in the needle tube 1, and the deviation cannot occur.

As shown in fig. 1, in the semiconductor test probe with overpressure buffering function of the present invention, the second needle 6 is fixedly connected to the tube expander 7 through a concave point.

Even use the needle tubing tail end to beat the mode fastening, beat the round pit with second syringe needle 6 back in needle tubing 1 particularly, beat the outside of needle tubing 1 round, can be in the same place second syringe needle 6 and expander 7 are fixed, and it is comparatively convenient to operate.

As shown in fig. 1, in the semiconductor test probe with overvoltage buffer function of the present invention, the tail of the second needle 1 is provided with a limit table 3, and the other end of the needle tube 1 is formed with a reduced opening.

The end face is used for covering the opening in a limiting mode, namely, a necking is formed at the other end opening of the needle tube 1, the inner diameter of the necking is ensured to be smaller than the outer diameter of the limiting platform 3 and larger than the outer diameter of the first needle head 2, so that the first needle head 2 can be ensured to move up and down within a certain range in the needle tube 1, and the first needle head cannot fall out of the needle tube 1.

As shown in fig. 1, the utility model discloses an among the semiconductor test probe with excessive pressure buffer function, the afterbody of first syringe needle 2 is provided with toper connecting portion 9, and a pot head of first spring 8 is established on toper connecting portion 9, can increase the area of contact of first spring 8 and toper connecting portion 9, ensures that the pressure of first syringe needle 2 turns into the elasticity of first spring 8.

As shown in fig. 1, in the semiconductor test probe with overvoltage buffer function of the present invention, the tail outer edge of the second needle 6 is provided with a tapered groove.

The conical groove is arranged outside the needle tube 1, so that a reserved position can be reserved for concave point machining, and the concave point cannot be formed on the second needle head 6 during machining, so that the appearance of the second needle head 6 is damaged.

While the foregoing description shows and describes several preferred embodiments of the invention, it is to be understood, as noted above, that the invention is not limited to the forms disclosed herein, but is not intended to be exhaustive of other embodiments and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed above, or as otherwise known in the relevant art. But variations and changes may be made by those skilled in the art without departing from the spirit and scope of the invention, which is to be construed broadly within the scope of the appended claims.

Claims

1. The utility model provides a semiconductor test probe with excessive pressure buffer function, its characterized in that, includes needle tubing (1), the lower extreme of needle tubing (1) is provided with expander (7), is provided with first spring (8) in needle tubing (1), and the upper end of needle tubing (1) is provided with first syringe needle (2) telescopically, be provided with second spring (5) in expander (7), be provided with between the upper end of expander (7) and the lower extreme of needle tubing (1) shape buffer block of falling T (4), the lower extreme of needle tubing (1) is stretched into to the vertical portion of shape buffer block of falling T (4), and the horizontal portion of shape buffer block of falling T (4) is located expander (7), and the lower extreme of expander (7) is provided with second syringe needle (6).

2. The semiconductor test probe with overvoltage snubber function as claimed in claim 1, wherein the first spring (8) and the second spring (5) are both compression springs.

3. The semiconductor test probe with overvoltage buffer function according to claim 1, wherein the second needle (6) is fixedly connected with the expander (7) through a concave point.

4. The semiconductor test probe with the overvoltage buffering function according to claim 1, wherein a limiting table (3) is arranged at the tail part of the first needle (2), and a necking is formed at the upper port of the needle tube (1).

5. The semiconductor test probe with the overvoltage buffering function according to claim 1, wherein a tapered connecting portion (9) is provided at a tail portion of the first needle (2), and one end of the first spring (8) is sleeved on the tapered connecting portion (9).

6. The semiconductor test probe with overvoltage buffer function according to claim 1, characterized in that the tail outer edge of the second needle head (6) is provided with a tapered groove.