CN116344411B - Wafer trench etching device - Google Patents

Abstract

The invention discloses a wafer groove corrosion device, which relates to the technical field of semiconductor device production, and comprises the following components: the wafer processing device comprises a workbench, a transfer mechanism, a wafer frame and an air blowing mechanism. The workbench is sequentially provided with a corrosion pool, a collecting pool and a cleaning pool; the transfer mechanism comprises a cross rod moving along the length direction of the workbench, two clamping modules which are symmetrically arranged and move in opposite directions are arranged on the cross rod, and each clamping module comprises two clamping rods which are symmetrically arranged, and each clamping rod moves along the width directions of the vertical and cross rod and is used for clamping the wafer rack; the wafer frames are distributed in the corrosion pool, the collecting pool and the cleaning pool, and are provided with bearing frames for bearing wafers; the blowing mechanism is arranged in the collecting tank and comprises a transmission shaft penetrating through the collecting tank, two rotating rods are arranged on the transmission shaft, and a plurality of blowing ports are arranged on the rotating rods and used for blowing air to the wafer frame. And the etching liquid carried by the wafer taken out of the etching tank is collected and returned to the etching tank, so that waste is reduced, the residual of the etching liquid is reduced before cleaning, and the generation of waste liquid is reduced.

Description

A wafer trench etching device

technical field

The invention relates to the technical field of semiconductor device production, in particular to a wafer trench etching device.

Background technique

After the wafer is subjected to diffusion, oxidation, photolithography, corrosion, etching, cleaning, electrophoresis, secondary photolithography, nickel plating and other processes, multiple crystal grains can be formed on the surface of the wafer. After the wafer is split , each grain is a chip, and the etching process is the key step to enable the wafer to form a single grain. The etching process can form grooves arranged vertically and horizontally on the surface of the wafer. After the wafer is corroded, it needs to be taken out from the etching pool and cleaned, but when the wafer is taken out, it will carry a large amount of etching liquid, which will cause waste of etching liquid, and the wafer will be placed in the cleaning pool At the same time, a large amount of etching solution will also be carried into the cleaning tank, which is not conducive to the cleaning of the wafer, and more waste liquid will be generated after cleaning, the processing cost of the waste liquid will increase, and it will also cause damage to the wafer. Environmental pollution, and because the etchant used in the etching process is not only corrosive but also volatile, the staff will inevitably come into contact with the etchant when taking the wafer out of the etching pool, thus affecting the health of the staff damage.

Contents of the invention

Aiming at the deficiencies of the above-mentioned related prior art, the present application provides a wafer trench etching device, which collects the etching liquid carried back to the etching pool by blowing the wafer taken out from the etching pool, reduces waste, and It has strong practicability to reduce the residue of etching solution and reduce the generation of waste liquid.

In order to achieve the above object, the present invention adopts the following technologies:

A wafer trench etching device, comprising: a workbench, a transfer mechanism, a wafer frame, and an air blowing mechanism.

The workbench is set between two conveyor belts, and the workbench is provided with corrosion pools, collection pools and cleaning pools along its length; the transfer mechanism includes a cross bar that moves along the length of the workbench, and two symmetrical Clamping modules arranged and moved towards each other, the clamping module includes two symmetrically arranged clamping bars respectively arranged on both sides of the cross bar, and the clamping bars move along the vertical direction and the width direction of the cross bar for clamping the wafer frame ; There are multiple wafer racks, which are respectively distributed in the corrosion pool, collection pool and cleaning pool during application. The wafer rack is provided with a detachable bearing frame for carrying wafers; the air blowing mechanism is located in the collection pool, including The transmission shaft arranged along the width direction of the workbench and pierced in the collection pool is provided with two symmetrically arranged rotating rods, the rotating rods are L-shaped, and the part of the rotating rod parallel to the width direction of the worktable A blow port is used to blow air to the wafer holder.

Further, two support rods arranged symmetrically and moving towards each other are arranged in the collection pool, the support rods are arranged along the width direction of the workbench, and the surface of the support rods is provided with a bearing groove along its length direction for carrying the wafer frame, and the bearing groove Both sides are also equipped with long holes that penetrate to the outside of the support rod, and the bottom surface of the bearing tank is in an upwardly protruding arc shape, which is used to flow down the etching solution. The bottom surface of the support rod is also sleeved on the guide rod, and the guide rod is installed in the collection pool. .

Further, a double-ended telescopic rod is provided on the cross bar, and a support plate is provided at the moving end of the double-ended telescopic rod. The lifting plate is provided with two symmetrically arranged first limiting holes along its length direction, and a vertical bar is provided at one end of the clamping rod, and the vertical bar is fitted in the first limiting hole and moves along its length direction.

Further, the support plate is provided with two symmetrically arranged second limiting holes along its length direction, the projection of the second limiting hole in the vertical direction coincides with the first limiting hole, and the second limiting hole is equipped with As for the moving block, the upper end of the vertical bar passes through the moving block, a connecting ring is arranged on one side of the moving block, a first sliding rod is arranged on the side of the support plate, the connecting ring is sleeved on the first sliding rod, and both ends of the first sliding rod are provided with There is a stop ring, and a first spring is sheathed on the first sliding rod, and the two ends of the first spring are respectively connected to the stop ring and the connecting ring, and are always in a stretched state.

Further, the other side of the connecting ring is provided with a limit bar, the limit bar includes a straight section and two inclined sections arranged at both ends of the straight section, and the inclined direction of the inclined section faces the cross bar, and the limit bar passes through the limit frame , and the outer wall of the limit rod is in contact with the inner wall of the limit frame, the limit frame is installed on the cross bar, one end of the limit rod is connected to the moving rod, and one end of the moving rod is slidingly fitted on the cross bar.

Further, the cross section of the carrying frame is arc-shaped, and a plurality of slots are evenly spaced inside along its length direction, the slots are arc-shaped, and both ends penetrate the top surface of the carrying frame for carrying wafers, A through groove is also provided between two adjacent card slots for passing liquid.

Furthermore, the inner side of the wafer frame is also provided with a through-limiting groove along its length direction, and the four corners of the top surface of the carrying frame are provided with protrusions, and the protrusions fit into the limiting groove, and pressure bars are also pierced at both ends of the limiting groove , There is a retaining ring at the lower end of the pressure rod, grooves are also provided at both ends of the limit groove, the retaining ring fits in the groove, the bottom surface of the retaining ring is provided with positioning beads, and the surface of the protruding part is provided with positioning holes, and the positioning beads are matched with the positioning holes Among them, a second spring is sheathed on the pressure rod, and the two ends of the second spring are respectively connected to the bottom of the groove and the retaining ring, and are always in a compressed state.

Further, connecting rods are sleeved at both ends of the transmission shaft, one end of the rotating rod is inserted in the connecting rod, a second telescopic rod is provided on one side of the connecting rod, the moving end of the second telescopic rod is connected to the rotating rod, and the right angle of the rotating rod A second sliding rod is pierced, both ends of the second sliding rod pass through the rotating rod, and a baffle is also provided, the two ends of the second sliding rod are respectively sleeved with a third spring, and the two ends of the third spring are respectively connected to the baffle And the rotating rod, and it is always in a compressed state, and the inner wall of the collection tank is provided with a raised plate, which is used to abut against the baffle.

Further, a T-shaped bar is provided at the center of the top of the wafer rack, and handles are provided at both ends of the T-shaped bar. When in use, the clamping bar is passed through the handle.

Further, the bottom of the collection pool is inclined, and an opening is provided at one end, and the opening is connected to the corrosion pool. Two isolation covers are arranged above the collection pool, and there is an interval between the isolation covers for passing through the T-shaped bar. The end is provided with a recess for passing through the wafer frame, and a partition moving along the width direction of the workbench is fitted in the recess for blocking the etching solution.

The beneficial effects of the present invention are:

A collection pool is added between the corrosion pool and the cleaning pool, and an air blowing mechanism is set in the collection pool, and the wafers taken out of the etching pool are collected by blowing back to the etching pool to reduce the number of wafers before cleaning. It is easier to clean the wafer without the residue of etching solution on the surface, and less water is required during cleaning, which can reduce the generation of waste liquid, thereby reducing the pollution to the environment; the transfer mechanism is used to automatically transfer the wafer rack to the working on the stage, and automatically transfer away, reduce the contact between the staff and the etching solution, and thus protect the health of the staff; and two support bars that move towards each other are set in the collection pool to adapt to wafer racks of different sizes, and also It can facilitate the etching liquid to fall into the collection pool; slots are provided on both sides of the carrying tank, and the carrying tank is set in an upwardly protruding arc to prevent the etching liquid from accumulating in the carrying tank.

Description of drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the invention.

FIG. 1 is a schematic perspective view of the overall structure of an embodiment of the present application.

FIG. 2 is a perspective view of a workbench according to an embodiment of the present application.

FIG. 3 is a perspective view of a transfer mechanism in an embodiment of the present application.

FIG. 4 is a schematic perspective view of a wafer rack installed in a collection pool according to an embodiment of the present application.

FIG. 5 is a schematic perspective view of a wafer rack according to an embodiment of the present application.

FIG. 6 is an enlarged schematic diagram of point A in FIG. 5 .

FIG. 7 is a schematic perspective view of an air blowing mechanism installed in a collection tank according to an embodiment of the present application.

FIG. 8 is a schematic perspective view of the blowing mechanism of the embodiment of the present application.

FIG. 9 is an enlarged schematic diagram of B in FIG. 8 .

Explanation of reference signs: 100—working table, 200—transfer mechanism, 300—wafer rack, 400—blowing mechanism, 101—corrosion pool, 102—collection pool, 103—cleaning pool, 104—support rod, 105—loading Groove, 106—long hole, 107—guide rod, 108—convex plate, 109—isolation cover, 110—recess, 111—partition plate, 112—support rod, 201—cross bar, 202—clamp rod, 203—double Head telescopic rod, 204—support plate, 205—first telescopic rod, 206—lifting plate, 207—first limit hole, 208—vertical rod, 209—second limit hole, 210—moving block, 211—connection Ring, 212—the first sliding rod, 213—stop ring, 214—the first spring, 215—limiting rod, 216—limiting frame, 217—moving rod, 301—loading frame, 302—card slot, 303—pass Groove, 304—limiting groove, 305—protrusion, 306—pressure rod, 307—retaining ring, 308—positioning bead, 309—positioning hole, 310—groove, 311—second spring, 312—T-shaped bar, 401—drive shaft, 402—rod, 403—air blowing port, 404—connecting rod, 405—second telescopic rod, 406—second slide rod, 407—baffle plate, 408—third spring, 409—motor, 410 - Air intake duct.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but the embodiments described in the present invention are some of the embodiments of the present invention, not all of them .

As shown in FIGS. 1-9 , the embodiment of the present application provides a wafer trench etching device, including: a workbench 100 , a transfer mechanism 200 , a wafer rack 300 , and an air blowing mechanism 400 .

The workbench 100 is arranged between two conveyor belts, and the two conveyor belts are used to transport the wafer frame 300, and the workbench 100 is sequentially provided with an etching pool 101, a collection pool 102 and a cleaning pool 103 along its length direction; the transfer mechanism 200 includes The crossbar 201 that moves along the length direction of the workbench 100 is provided with two symmetrically arranged clamping modules that move toward each other on the crossbar 201, and the clamping module includes two symmetrically arranged clamping modules that are respectively arranged on both sides of the crossbar 201 202, and the clamping bar 202 moves along the width direction of the vertical and cross bars 201, and is used to clamp and transfer the wafer rack 300; there are multiple wafer racks 300, which are respectively distributed in the corrosion pool 101 and the collection pool 102 during application. And in the cleaning pool 103, the wafer rack 300 is provided with a detachable carrier frame 301 for carrying wafers; the air blowing mechanism 400 is arranged in the collection pool 102, including being arranged along the width direction of the workbench 100 and passing through the collection pool. The transmission shaft 401 in the pool 102, one end of the transmission shaft 401 is connected to the motor 409, the motor 409 is installed on the workbench 100, the transmission shaft 401 is provided with two rotating rods 402 arranged symmetrically, the rotating rods 402 are L-shaped, and the rotating rods The part 402 parallel to the width direction of the workbench 100 is provided with a plurality of blowing ports 403, which are used to blow air to the wafer holder 300, so that the etching solution on the wafer is blown down into the collection pool 102, and the blowing ports 403 are connected with the air inlet The pipeline 410 is connected, and the air intake pipeline 410 is installed on the rotating rod 402, and one end is connected to the air pump.

Specifically, as shown in FIGS. 1-2 , in order to facilitate placing the wafer rack 300 in the collection pool 102 and to facilitate the etching liquid to fall, two symmetrically arranged support rods that move toward each other are provided in the collection pool 102. 104, the support rods 104 are arranged along the width direction of the workbench 100, and the surface of the support rods 104 is provided with a bearing groove 105 along its length direction, and the four corners of the bottom surface of the wafer holder 300 are fitted in the bearing grooves 105, and in order to prevent the wafer from being left The etching solution is accumulated in the bearing tank 105, and the two sides of the bearing tank 105 are also provided with a long hole 106 penetrating to the outside of the support rod 104, and the bottom surface of the bearing tank 105 is in the shape of an upward protruding arc for flowing down the etching solution. , the bottom surface of the support rod 104 is also sleeved on the guide rod 107, which guides the movement of the support rod 104. The guide rod 107 is installed in the collection pool 102, and for the relative synchronous movement of the two support rods 104, a two-way wire can be used. The structure of the rod and the motor is driven, that is, the end of the support rod 104 is connected to the moving end on the two opposite threads of the two-way screw rod. When the two-way screw rod rotates, the two support rods 104 can be synchronized in opposite or opposite directions. move.

Specifically, as shown in FIG. 1, FIG. 3, and FIG. 5, a T-shaped bar 312 is provided at the center of the top of the wafer rack 300, and handles are provided at both ends of the T-shaped bar 312. When the wafer rack 300 needs to be transferred, The clamping bar 202 passes through the handle so as to clamp the wafer rack 300 .

Specifically, as shown in Fig. 1 and Fig. 3, a double-ended telescopic rod 203 is arranged on the cross bar 201, and is arranged along the length direction of the cross bar 201, and a support plate 204 is provided at the moving end of the double-ended telescopic rod 203, then The support plate 204 moves along the length direction of the cross bar 201. The support plate 204 is provided with a vertically arranged first telescopic rod 205. The moving end of the first telescopic rod 205 is connected with a lifting plate 206. There are two symmetrically arranged first limiting holes 207 in the direction, and a vertical rod 208 is provided at one end of the clamping rod 202. The vertical rod 208 fits in the first limiting hole 207 and moves along its length direction. The first telescopic rod 205 Drive the lifting plate 206 down, and when the double-ended telescopic rod 203 drives the two support plates 204 to move towards each other, the two clamping rods 202 are also close to each other, so that the clamping rod 202 can enter the handle of the wafer rack 300, and then The wafer rack 300 can be clamped by moving the two clamping bars 202 away from each other, and the wafer rack 300 can be lifted by raising the lifting plate 206 .

Specifically, as shown in FIG. 1 and FIG. 3 , in order to ensure the smooth movement of the clamp bar 202 in the horizontal and vertical directions, two symmetrically arranged second limiting holes 209 are provided on the support plate 204 along its length direction. And the projection of the second limiting hole 209 in the vertical direction coincides with the first limiting hole 207, and the second limiting hole 209 is equipped with a moving block 210, and the moving block 210 is along the length direction of the second limiting hole 209 move, and the upper end of the vertical bar 208 passes through the moving block 210, while ensuring that the vertical bar 208 can move in the vertical direction, it can also move laterally, and also in order to ensure that the two clamping bars 202 enter the handle of the wafer rack 300 After the wafer frame 300 can be clamped, a connecting ring 211 is provided on one side of the moving block 210, and a first slide bar 212 is provided on the side of the support plate 204, and the connecting ring 211 is sleeved on the first slide bar 212. Both ends of a slide bar 212 are provided with stop rings 213, the first slide bar 212 is also sleeved with a first spring 214, and the two ends of the first spring 214 are respectively connected to the stop ring 213 and the connecting ring 211, and are always in tension. state, under the stretching action of the first spring 214, the two moving blocks 210 always have a tendency to move away from each other. When no external force is applied, the distance between the two vertical bars 208 is the farthest, and the two clips The distance between the rods 202 is also the largest.

Specifically, as shown in FIG. 1 and FIG. 3 , in order to realize that the clamping bars 202 approach each other before entering the handle of the wafer rack 300 and can move away from each other after entering the handle of the wafer rack 300 , another part of the connecting ring 211 One side is provided with a limiting rod 215, the limiting rod 215 includes a straight section and two inclined sections arranged at both ends of the straight section, and the inclined direction of the inclined section faces the cross bar 201, and the limiting rod 215 is installed in the limiting frame 216 , and the outer wall of the limit rod 215 is in contact with the inner wall of the limit frame 216, the limit frame 216 is installed on the cross bar 201, one end of the limit rod 215 is connected to the moving rod 217, and one end of the moving rod 217 is slidably fitted to the cross bar 201, and the part where the limit frame 216 contacts the limit rod 215 is in an outwardly protruding arc, which makes the movement of the limit rod 215 smoother. When the wafer rack 300 needs to be clamped, the clamp bar 202 moves towards the wafer frame 300, and the distance between the two clamping bars 202 is the farthest at this time, and the clamping bars 202 cannot enter into the handle of the wafer frame 300, and as the two support plates 204 are constantly approaching, the limit The position rod 215 moves in the limit frame 216, and under the force of the first inclined section, the two moving blocks 210 on the support plate 204 are approached to each other, thereby driving the two clamp bars 202 to also approach each other, thereby ensuring that the clamp bars 202 into the handle of the wafer rack 300, then the limit frame 216 is in contact with the straight line segment of the limit bar 215, so that the distance between the two clamp bars 202 moves in the handle without change, and finally when the limit frame 216 and the When the other inclined section of the limiting rod 215 is in contact, the two clamping rods 202 will move away from each other, so as to abut against the inner sides of the two ends of the handle laterally, thereby clamping the wafer frame 300, and finally the clamping rods 202 will be lifted up. The wafer holder 300 can be clamped.

Specifically, as shown in Fig. 1, Fig. 4, and Fig. 5, the cross-section of the carrying frame 301 is arc-shaped to adapt to the shape of the wafer, and also try to avoid the redundant part of the carrying frame 301, and the inside of the carrying frame 301 along its length A plurality of evenly spaced card slots 302 are arranged in the direction, and the card slots 302 are arc-shaped, and the two ends penetrate the top surface of the carrying frame 301, and the wafer is placed in the card slots 302, and between two adjacent card slots 302 A through groove 303 is also provided to allow the liquid to pass through the wafer rack 300 more easily when the wafer rack 300 is transferred to the etching pool 101 or the cleaning pool 103, reducing the impact of the liquid surface on the wafer rack 300, and When blowing off the remaining etching solution on the wafer, it is also convenient for the etching solution to flow down.

Specifically, as shown in Fig. 1, Fig. 4-Fig. 6, the inside of the wafer holder 300 is also provided with a through-limiting groove 304 along its length direction, and the four corners of the top surface of the carrying frame 301 are provided with protrusions 305, and the protrusions 305 cooperate with each other. In the limit groove 304, the carrying frame 301 can be disassembled from the wafer frame 300, so as to facilitate placing wafers in the carrying frame 301, and also in order to prevent the carrying frame 301 from slipping from the wafer frame 300, in the limit groove The two ends of 304 are also pierced with a depression bar 306, the lower end of the depression bar 306 is provided with a retaining ring 307, the two ends of the limit groove 304 are also provided with a groove 310, the retaining ring 307 fits in the groove 310, and the depression rod 306 is also set A second spring 311 is provided, and the two ends of the second spring 311 are respectively connected to the bottom of the groove 310 and the retaining ring 307, and are always in a compressed state, so that the pressing rod 306 has a tendency to move downward all the time, and the bottom surface of the retaining ring 307 is provided There is a positioning bead 308, and a positioning hole 309 is provided on the surface of the protruding part 305. Under the action of the second spring 311, the positioning bead 308 fits in the positioning hole 309, and the carrying frame 301 can be clamped on the wafer frame 300. When the bearing frame 301 needs to be removed, the bearing frame 301 can be pushed along the limiting groove 304 .

Specifically, as shown in Fig. 1 and Fig. 7-9, the two ends of the transmission shaft 401 are provided with a connecting rod 404, one end of the rotating rod 402 is inserted in the connecting rod 404, and one side of the connecting rod 404 is provided with a second telescopic rod. 405, the moving end of the second telescopic rod 405 is connected to the rotating rod 402, so that the distance between the rotating rod 402 and the transmission shaft 401 can be adjusted, thereby adjusting the distance between the blowing port 403 and the wafer holder 300, so that the blowing port 403 can be adjusted as far as possible. Close to the wafer rack 300 to ensure the effect of blowing off the residual etching liquid on the wafer, and in order to avoid the situation that the rotating rod 402 is inclined downward, thereby avoiding the collision between the rotating rod 402 and the support rod 104, at the right angle of the rotating rod 402 A second slide bar 406 is pierced at both ends of the second slide bar 406, and both ends of the second slide bar 406 pass through the rotating bar 402, and a baffle plate 407 is also provided. The two ends of the second slide bar 406 are respectively sleeved with a third spring 408, and the third Both ends of the spring 408 are respectively connected to the baffle plate 407 and the rotating rod 402, and are always in a compressed state. The inner wall of the collection tank 102 is provided with a convex plate 108. When the rotating rod 402 is in a horizontal position, the convex plate 108 abuts against the baffle plate 407.

More specifically, as shown in FIG. 7 , in order to reduce corrosion of the transmission shaft 401 by the etching solution, a strut 112 is also provided in the collection tank 102 , and the transmission shaft 401 is passed through the strut 112 .

Specifically, as shown in Fig. 1 and Fig. 5, the bottom of the collection pool 102 is inclined, and is higher than the liquid level of the etchant in the corrosion pool 101, and one end of the collection pool 102 is provided with an opening, and the opening is connected to the corrosion pool 101, then the collection The etchant collected in the pool 102 will flow back into the corrosion pool again to reduce the waste of the etchant. Two isolation covers 109 are also arranged above the collection pool 102, and there is an interval between the isolation covers 109 for passing through the T-shaped bar 312 The two ends of the isolation cover 109 are provided with recesses 110 for passing through the wafer rack 300, and the recesses 110 are equipped with partitions 111 that move along the width direction of the workbench 100 for blocking the etching solution and avoiding the etching on the wafer. When the liquid blows down, the etching solution splashes everywhere; and a condensation pipe is also arranged in the isolation cover 109 to keep the inside of the isolation cover 109 at the same temperature as the etching pool 101, so as to prevent the etching solution carried on the wafer from volatilizing rapidly in the isolation cover 109 , Also avoid causing abnormal corrosion.

The above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Apparently, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims (8)

1. A wafer trench etching device, characterized in that, comprising: The workbench (100) is set between the two conveyor belts, and the workbench (100) is provided with a corrosion pool (101), a collection pool (102) and a cleaning pool (103) sequentially along its length direction; The transfer mechanism (200) includes a crossbar (201) that moves along the length direction of the workbench (100). The crossbar (201) is provided with two clamping modules that are symmetrically arranged and move toward each other. The holding module includes two symmetrically arranged clamp bars (202) respectively arranged on both sides of the cross bar (201), and the clamp bars (202) move along the vertical direction and the width direction of the cross bar (201) set for clamping the wafer frame (300); there are multiple wafer frames (300), which are respectively distributed in the corrosion pool (101), the collection pool (102) and the cleaning In the pool (103), the wafer rack (300) is provided with a detachable carrying frame (301) for carrying wafers; The air blowing mechanism (400) is arranged in the collection pool (102), including a drive shaft (401) arranged along the width direction of the workbench (100) and pierced in the collection pool (102). The transmission shaft (401) is provided with two symmetrically arranged rotating rods (402), the rotating rods (402) are L-shaped, and the rotating rods (402) are parallel to the width direction of the workbench (100) The part is provided with a plurality of air blowing ports (403) for blowing air to the wafer holder (300); The collection pool (102) is provided with two symmetrically arranged support rods (104) that move toward each other, the support rods (104) are arranged along the width direction of the workbench (100), and the support rods (104 ) is provided with a bearing groove (105) along its length direction for carrying the wafer frame (300), and both sides of the bearing groove (105) are also provided with long holes penetrating to the outside of the support rod (104) (106), and the bottom surface of the carrying tank (105) is in the shape of an upwardly protruding arc for flowing down the etching solution, and the bottom surface of the support rod (104) is also sleeved on the guide rod (107), and the guide rod (107) installed in the collection pool (102); The cross section of the bearing frame (301) is arc-shaped, and a plurality of evenly spaced slots (302) are arranged inside it along its length direction. The slots (302) are arc-shaped, and the two ends penetrate the The top surface of the carrying frame (301) is used to carry the wafer, and a through groove (303) is provided between two adjacent clamping slots (302) for passing liquid. 2. The wafer trench etching device according to claim 1, characterized in that, the cross bar (201) is provided with a double-ended telescopic rod (203), and the moving end of the double-ended telescopic rod (203) A support plate (204) is provided, and a vertically arranged first telescopic rod (205) is arranged on the support plate (204). The moving end of the first telescopic rod (205) is connected with a lifting plate (206), The lifting plate (206) is provided with two symmetrically arranged first limiting holes (207) along its length direction, and a vertical rod (208) is provided at one end of the clamping rod (202), and the vertical rod (208) ) fit in the first limiting hole (207) and move along its length direction. 3. The wafer trench etching device according to claim 2, characterized in that, the support plate (204) is provided with two symmetrically arranged second limiting holes (209) along its length direction, and the first The vertical projection of the second limit hole (209) coincides with the first limit hole (207), the second limit hole (209) is fitted with a moving block (210), and the vertical rod The upper end of (208) passes through the moving block (210), a connecting ring (211) is provided on one side of the moving block (210), and a first slide bar (212) is provided on the side of the supporting plate (204), so The connecting ring (211) is sheathed on the first sliding rod (212), and both ends of the first sliding rod (212) are provided with retaining rings (213), and the first sliding rod (212) also has A first spring (214) is sheathed, and the two ends of the first spring (214) are respectively connected to the retaining ring (213) and the connecting ring (211), and are always in a stretched state. 4. The wafer trench etching device according to claim 3, characterized in that, the other side of the connecting ring (211) is provided with a limit rod (215), and the limit rod (215) includes a straight line and a Two inclined sections arranged at both ends of the straight section, and the inclined direction of the inclined sections faces the crossbar (201), the limiting rod (215) is passed through the limiting frame (216), and The outer wall of the limit rod (215) is in contact with the inner wall of the limit frame (216), the limit frame (216) is installed on the cross bar (201), and the limit rod (215 ) is connected to the moving rod (217) at one end, and one end of the moving rod (217) is slidingly fitted on the cross bar (201). 5. The wafer trench etching device according to claim 1, characterized in that, the inner side of the wafer frame (300) is also provided with a through-limiting groove (304) along its length direction, and the carrying frame ( 301) Protrusions (305) are provided at the four corners of the top surface, and the protrusions (305) fit into the limiting groove (304), and pressure rods (306) are also pierced at both ends of the limiting groove (304) ), the lower end of the pressure rod (306) is provided with a retaining ring (307), the two ends of the limiting groove (304) are also provided with grooves (310), and the retaining ring (307) is matched with the groove (310), the bottom surface of the retaining ring (307) is provided with a positioning bead (308), the surface of the protrusion (305) is provided with a positioning hole (309), and the positioning bead (308) is matched with the positioning hole (309), the pressure rod (306) is also sleeved with a second spring (311), and the two ends of the second spring (311) are respectively connected to the bottom of the groove (310) and the stop circle (307), and is always in a compressed state. 6. The wafer trench etching device according to claim 1, characterized in that a connecting rod (404) is sleeved at both ends of the transmission shaft (401), and one end of the rotating rod (402) is passed through the In the connecting rod (404), a second telescopic rod (405) is provided on one side of the connecting rod (404), and the moving end of the second telescopic rod (405) is connected to the rotating rod (402). A second sliding rod (406) is pierced at the right angle of the rotating rod (402), and both ends of the second sliding rod (406) pass through the rotating rod (402), and a baffle (407) is also provided , the two ends of the second sliding rod (406) are respectively sleeved with a third spring (408), and the two ends of the third spring (408) are respectively connected to the baffle (407) and the rotating rod (402) , and is always in a compressed state, the inner wall of the collection pool (102) is provided with a convex plate (108) for abutting against the baffle plate (407). 7. The wafer trench etching device according to claim 1, characterized in that a T-shaped bar (312) is provided at the center of the top of the wafer holder (300), and the two sides of the T-shaped bar (312) A handle is provided at the end, and the clamp rod (202) is passed through the handle during application. 8. The wafer trench etching device according to claim 7, characterized in that, the bottom of the collection pool (102) is inclined, and an opening is provided at one end, and the opening is connected to the etching pool (101), Two isolation covers (109) are also provided above the collection pool (102), and there is a space between the isolation covers (109) for passing through the T-shaped bar (312), and the isolation covers (109) ) are provided with recesses (110) at both ends for passing through the wafer rack (300), and the recesses (110) are fitted with partitions (111) that move along the width direction of the workbench (100), For blocking etchant.