[go: up one dir, main page]

JPH0234823Y2 - - Google Patents

Info

Publication number
JPH0234823Y2
JPH0234823Y2 JP1985055244U JP5524485U JPH0234823Y2 JP H0234823 Y2 JPH0234823 Y2 JP H0234823Y2 JP 1985055244 U JP1985055244 U JP 1985055244U JP 5524485 U JP5524485 U JP 5524485U JP H0234823 Y2 JPH0234823 Y2 JP H0234823Y2
Authority
JP
Japan
Prior art keywords
substrate
tank
surface treatment
grooves
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985055244U
Other languages
Japanese (ja)
Other versions
JPS61171244U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985055244U priority Critical patent/JPH0234823Y2/ja
Publication of JPS61171244U publication Critical patent/JPS61171244U/ja
Application granted granted Critical
Publication of JPH0234823Y2 publication Critical patent/JPH0234823Y2/ja
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、基板を処理液に浸漬・処理するウエ
ツト処理装置に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a wet processing apparatus for immersing and processing a substrate in a processing liquid.

〔従来の技術〕[Conventional technology]

周知のごとく、ウエハ等の半導体基板や液晶基
板等の薄板状の基板は、一般には、複数枚、収納
容器に収納された状態で、現像、エツチング、剥
離または水洗等の処理液に逐次浸漬されながら、
ウエツト処理される。
As is well known, a plurality of semiconductor substrates such as wafers and thin substrates such as liquid crystal substrates are generally stored in a storage container and sequentially immersed in processing solutions such as developing, etching, peeling, or washing with water. While
Wet treatment.

従来における基板ウエツト処理装置としては、
例えば、第8図および第9図に示すごとく、収納
容器2に複数枚収納された基板1を、ローダ6、
現像、レジスト膜剥離、または、エツチングなど
の処理液槽T1〜T5、水洗槽T6〜T7、およ
び乾燥装置D、更に、アンローダ7を並設したウ
エツト処理装置の各処理槽に、逐次、出入れしな
がら移送するものが知られている。この処理槽T
1〜T5および水洗槽T6〜T7への、基板1の
浸漬および取り出しに際しては、搬送装置に装着
された、上下移動自在および開閉自在のフインガ
ー3によつて、収納容器2を挟持して行う。
Conventional substrate wet processing equipment includes:
For example, as shown in FIGS. 8 and 9, a plurality of substrates 1 stored in a storage container 2 are loaded into a loader 6,
Processing liquid tanks T1 to T5 for development, resist film stripping, or etching, etc., washing tanks T6 to T7, drying device D, and a wet processing device in which an unloader 7 is installed in parallel, are loaded and unloaded sequentially. It is known to transport while This processing tank T
The substrates 1 are immersed in and taken out of the substrates 1 to T5 and the washing tanks T6 to T7, while the storage container 2 is held between fingers 3 that are mounted on a transport device and are movable up and down and can be opened and closed.

なお、かかる搬送装置を更に詳しくいえば、第
8図の搬送装置の詳細は、例えば、特開昭52−
150974号公報に記載されている。すなわち、第8
図の概要図でこれを説明すれば、水平搬送部11
内には、レールと、このレールに係合する車輪、
およびこの車輪を駆動する駆動手段が内蔵され、
昇降部10内には、昇降駆動手段、昇降案内柱、
および昇降用ネジ部等が内蔵され、更には、挟持
部5には挟持駆動杆4,4を片持状に突設し、こ
の挟持駆動杆4,4に自由端にフインガー3を設
け、このフインガー3を開閉させる機構等が装着
されている。
In addition, to talk about such a conveying device in more detail, the details of the conveying device shown in FIG.
It is described in Publication No. 150974. That is, the eighth
To explain this using the schematic diagram in the figure, the horizontal conveyance section 11
Inside, a rail and a wheel that engages with this rail,
and a built-in drive means for driving this wheel,
Inside the elevating section 10, elevating drive means, elevating guide columns,
Furthermore, the clamping part 5 has clamping driving rods 4, 4 projecting in a cantilevered manner, and the clamping driving rods 4, 4 are provided with fingers 3 at their free ends. A mechanism etc. for opening and closing the finger 3 is installed.

また、第8図および第9図の処理槽Tには、例
えば、本出願人が実開昭59−23733号(実願昭57
−117725号)公報で出願しているごとく、槽内底
部に液供給口を、液面近くに吸込管をそれぞれ設
け、この槽内の処理液を均一に循環させる処理槽
を使用することができる。
In addition, the processing tank T shown in FIGS. 8 and 9 is, for example, a
-117725), a processing tank can be used in which a liquid supply port is provided at the bottom of the tank and a suction pipe is provided near the liquid surface, and the processing liquid in this tank is uniformly circulated. .

〔考案が解決しようとする課題〕[The problem that the idea attempts to solve]

ところで、かかる収納容器や、また、出入れす
る基板立設用治具と使用した基板ウエツト処理装
置は、実開昭54−4668号公報、実公昭57−44685
号公報、特開昭58−4143号公報および特開昭58−
48423号公報などで示されている。
By the way, such a storage container, a substrate erecting jig for loading and unloading, and a substrate wet processing device used are disclosed in Japanese Utility Model Publication No. 54-4668 and Japanese Utility Model Publication No. 57-44685.
No. 4143, JP-A-58-4143, and JP-A-58-
This is shown in Publication No. 48423, etc.

しかしながら、収納容器や、運搬して処理槽に
出入させる基板立設用治具を使用した基板ウエツ
ト処理装置では、特に収納容器の場合、処理槽内
の基板は、収納容器内に収納されているため、こ
の処理槽内の処理液の循環が均一になるように工
夫されていても、基板と収納容器間では処理液の
循環が充分に行われないという問題や、また、収
納容器が基板立設用治具の場合、基板の端部を挿
入したままにしているので、処理済後の基板の洗
浄の問題や、収納容器や基板立設用治具から基板
を一度に取出して他の治具に自動的に移し換える
ことが困難である問題を有している。
However, in substrate wet processing equipment that uses a storage container or a substrate erecting jig that transports the substrate in and out of the processing tank, especially in the case of a storage container, the substrate in the processing tank is stored in the storage container. Therefore, even if measures are taken to ensure uniform circulation of the processing solution in the processing tank, there are problems in that the processing solution is not sufficiently circulated between the substrate and the storage container, and the storage container does not stand up to the substrate. In the case of the installation jig, the edge of the board is left inserted, so there are problems with cleaning the board after processing, and removing the board at once from the storage container or the board stand-up jig so that it cannot be used in another jig. There is a problem in that it is difficult to automatically transfer it to a container.

そのため、特開昭59−134834号公報記載の基板
ウエツト処理装置では、収納容器や、従来の基板
立設用治具を止め、その代りに処理槽専用の昇降
する棒状治具と、水平移送用治具とを別々に設
け、処理槽に出入りする収納容器や基板立設用治
具における前記問題を回避させることは勿論、収
納容器や基板立設用治具を一定期間毎に洗浄した
り、塵埃を処理槽内に持ち込むことを防いでい
る。
Therefore, in the substrate wet processing apparatus described in Japanese Patent Application Laid-open No. 59-134834, the storage container and conventional substrate erecting jig are no longer used, and instead, a rod-shaped jig that moves up and down exclusively for the processing tank and a horizontal transfer jig are used. It is possible to avoid the above-mentioned problems with the storage container and the substrate erecting jig that go in and out of the processing tank by providing the jig separately, and also to clean the storage container and the substrate erecting jig at regular intervals. This prevents dust from entering the processing tank.

しかしながら、かかる基板ウエツト処理装置で
は、棒状治具から水平移送用治具へ移し換えるに
は、これらの治具を単に上下に交叉させるので、
各治具に刻設された溝に基板を確実に挿入するこ
とは困難で、依然として移し換えに困難があるだ
かりではなく、水平移送中、基板を落下させる恐
れもある。
However, in such a substrate wet processing apparatus, in order to transfer from a rod-shaped jig to a horizontal transfer jig, these jigs are simply crossed vertically.
It is difficult to reliably insert the substrate into the grooves carved in each jig, and not only is there still difficulty in transferring, but there is also a risk that the substrate may fall during horizontal transfer.

〔課題を解決するための手段〕[Means to solve the problem]

そこで本考案は、従来装置における上記のよう
な各種の問題点を一掃しようとするもので、その
要旨とするところは、その底部に設けた多孔性の
整流板を介して処理液を表面処理槽内に供給し
て、該表面処理槽内で略垂直状に等ピツチで並列
させた複数枚の基板に対し、表面処理を行う基板
ウエツト処理装置において、該表面処理槽を複数
個、連設し、該表面処理槽の前記整流板上に、そ
の開口部がテーパ状に拡げられ、かつ、挿入され
た基板の端部を立設・保持する断面コ字状の溝が
一定ピツチで刻設された基板保持杆23を水平状
に固設する一方、前記基板保持杆23の溝と同一
ピツチで、かつ、その開口部をテーパ状に拡げら
れた溝に刻設した基板挟持板27の1対を垂直状
にして対向させ、これらの対向する溝間で基板を
挟持・離脱自在としたフインガー装置を形成し、
該フインガー装置に、前記基板挟持板27を前記
処理槽内に出入りさせるとともに、前記フインガ
ー装置を隣接の表面処理槽へ水平移送させる昇降
兼移動装置を付加したことを特徴とする基板ウエ
ツト処理装置にある。
Therefore, the present invention attempts to eliminate the various problems mentioned above in conventional equipment, and its gist is to direct the processing liquid to the surface treatment tank through a porous rectifier plate provided at the bottom of the device. In a substrate wet processing apparatus that performs surface treatment on a plurality of substrates that are supplied to the surface treatment tank and arranged in parallel at equal pitches in a substantially vertical manner in the surface treatment tank, a plurality of the surface treatment tanks are installed in series. , on the rectifying plate of the surface treatment tank, the opening thereof is widened in a tapered shape, and grooves having a U-shaped cross section for standing and holding the end of the inserted substrate are carved at a constant pitch. A pair of substrate holding plates 27 are provided with substrate holding rods 23 fixed in a horizontal manner, and a pair of substrate holding plates 27 are formed with grooves having the same pitch as the grooves of the substrate holding rods 23 and whose openings are widened into a tapered shape. are arranged perpendicularly and facing each other, forming a finger device that can freely hold and remove the substrate between these opposing grooves,
A substrate wet processing apparatus characterized in that the finger device is further equipped with an elevating and moving device for moving the substrate holding plate 27 in and out of the processing tank and for horizontally transferring the finger device to an adjacent surface treatment tank. be.

〔実施例〕〔Example〕

以下、本考案の構成を実施例により詳細に説明
する。先ず、本実施例を適用する基板ウエツト処
理装置全体の概要をいえば、処理槽群(8〜10
個)は、例えば第9図に示す従来装置と同様、多
数連設され、これらの槽は、基板が25乃至50枚一
度に浸漬できるようになつており、これらの処理
槽群の後側部をフインガー装置が往復動する。し
たがつて、フインガー装置は上下動するととも
に、処理槽群に沿つて水平移送するものである。
Hereinafter, the configuration of the present invention will be explained in detail using examples. First, to give an overview of the entire substrate wet processing apparatus to which this embodiment is applied, the processing tank group (8 to 10
For example, similar to the conventional apparatus shown in Fig. 9, a large number of processing tanks are installed in series, and these tanks are designed to be able to immerse 25 to 50 substrates at a time. The finger device reciprocates. Therefore, the finger device moves up and down and also horizontally moves along the group of processing tanks.

かかる基板ウエツト処理装置における、処理槽
Tについていえば、第1図および第2図に示すご
とく、洗浄槽を例にして説明すると処理槽Tは2
重槽になつており、内側の槽20よりオーバフロ
ーした液を外側の槽21に溜め、これを循環ポン
プPにて内側の層20の底面から供給し、この内
側の槽20の底面上方に設けた、多孔板で形成し
た整流板22を経由して、液流を均一にしなが
ら、この液を基板1の表面に均一に接触させて洗
浄を行う。
Regarding the processing tank T in such a substrate wet processing apparatus, as shown in FIGS. 1 and 2, the processing tank T has two cleaning tanks.
The liquid overflowing from the inner tank 20 is stored in the outer tank 21, and this is supplied from the bottom of the inner layer 20 by a circulation pump P, which is installed above the bottom of the inner tank 20. In addition, cleaning is performed by uniformly bringing the liquid into contact with the surface of the substrate 1 while making the liquid flow uniform through a rectifying plate 22 formed of a porous plate.

本実施例では、この整流板22上に、2本の平
行な棒状治具である基板保持杆23,23が固定
されている。この基板保持杆23には、基板1を
垂直に保持するための、断面コ字状の溝24が等
間隔に刻設されている。これらの溝24の開口部
には、基板1を立設し易くするためのテーパ部2
5が設けられている。また、整流板22には第3
図に示すごとく、当該溝24に対応して、整流板
22下の処理液が流出する流出孔26が穿設され
ている。
In this embodiment, substrate holding rods 23, 23, which are two parallel rod-shaped jigs, are fixed on the current plate 22. Grooves 24 having a U-shaped cross section are formed at equal intervals on the substrate holding rod 23 to hold the substrate 1 vertically. Tapered portions 2 are provided at the openings of these grooves 24 to make it easier to stand the substrate 1 upright.
5 is provided. In addition, the current plate 22 has a third
As shown in the figure, an outflow hole 26 is provided corresponding to the groove 24, through which the processing liquid below the current plate 22 flows out.

次に、フインガー装置についていえば、本実施
例に用いる搬送装置(昇降兼移動装置)は、第8
図に示す従来のフインガーを有する搬送機構とほ
ぼ類似のものを利用している。すなわち、水平搬
送部11、昇降部10、挟持部5、この挟持部5
から突設した挟持駆動杆4,4からなる搬送機構
において、この挟持駆動杆4に、従来の収納容器
2を挟持するフインガーに代わり、第5図および
第6図に図示の基板挟持板27,27を片持状の
支持杆28によつて吊設している。かかる1対の
基板挟持板27,27には、基板1の端部が挿入
される所定個数の平行な基板挟持用溝29が刻設
されている。これらの溝29の間隔は、前記基板
保持杆23に刻設した溝24と同一間隔に刻設さ
れており、この溝29の開口部もテーパ部30が
設けられている。そして、一対の基板挟持板2
7,27は、第5図の矢印Bのごとく、互いに逆
方向に一定距離往復動するか、または、同図の矢
印Aのごとく、たがいに逆方向に一定角度正逆転
をするが、これらの動作は、挟持部5に内蔵され
た駆動源によつて作動される。すなわち、この挟
持部5内には、例えばエアシリンダー、または、
トルクアクチユエータ、または、モータおよび歯
車等の機構が内蔵され、これら機構によつて、支
持杆28を矢印AまたはBの方向に作動させる。
Next, regarding the finger device, the conveying device (elevating and moving device) used in this example is the 8th finger device.
It utilizes a conveyance mechanism that is almost similar to the conventional finger conveyance mechanism shown in the figure. That is, the horizontal conveying section 11, the elevating section 10, the holding section 5, this holding section 5
In a transport mechanism consisting of clamping drive rods 4, 4 protruding from the substrate, the clamping drive rods 4 are provided with substrate clamping plates 27, shown in FIGS. 5 and 6, in place of the conventional fingers that clamp the storage container 2. 27 is suspended by a cantilevered support rod 28. A predetermined number of parallel substrate clamping grooves 29 into which the ends of the substrate 1 are inserted are cut into the pair of substrate clamping plates 27, 27. The intervals between these grooves 29 are the same as the grooves 24 formed in the substrate holding rod 23, and the openings of these grooves 29 are also provided with tapered portions 30. A pair of substrate holding plates 2
7 and 27 reciprocate a certain distance in opposite directions, as shown by arrow B in Fig. 5, or rotate forward and backward by a certain angle in opposite directions, as shown by arrow A in the same figure. The operation is performed by a drive source built into the holding part 5. That is, in this holding part 5, for example, an air cylinder or
A mechanism such as a torque actuator or a motor and gears is built in, and these mechanisms actuate the support rod 28 in the direction of arrow A or B.

本実施例の動作は次のようにして行われる。す
なわち、図示していないローダーのテーブル開口
部に対向する位置に通常の基板収納容器を載置
し、このテーブル開口部より出没して、上下動す
る基板受けを、収納容器底面の開口を通して上昇
させ、収納容器内の基板を収納容器より持ち上
げ、予めローダーの上部に迄移動して、待機して
いる一対の基板挟持板27,27の間に位置させ
る。そこで、第5図に図示の挟持部5によつて、
これらの基板挟持板27を閉じ、基板1の端部を
基板挟持板27の溝29内に挿入して挟持する。
次いで、前記基板受を降下させた後、従来同様の
水平搬送手段を駆動して、基板1を挟持したまま
所定の処理層Tの上方にまで移動させる。次に、
従来同様の水平搬送手段を駆動して、基板1を挟
持したまま処理槽T内に降下させ、ここで、第1
図に図示のごとき基板保持杆23,23の溝24
に、各基板1の端部を挿入し、基板1をこれらの
基板保持杆23,23に立設させた後、基板挟持
板27,27を前記矢印AまたはBの外方へ作動
させることによつて基板挟持板27から基板1を
解放し、次いで、基板挟持板27は上昇する。こ
れら基板1は、所定時間処理液に浸漬され、所定
の表面処理がなされた後、再び基板挟持板27が
処理槽T内に降下し、基板1を挟持した後上昇し
て、次の処理槽へ水平移送し、以後同様の動作を
くり返す。
The operation of this embodiment is performed as follows. That is, a normal substrate storage container is placed in a position opposite to a table opening of a loader (not shown), and a substrate holder that moves up and down by retracting from the table opening is raised through an opening in the bottom of the storage container. , the substrate in the storage container is lifted from the storage container, moved to the upper part of the loader, and positioned between the pair of waiting substrate clamping plates 27, 27. Therefore, by using the holding part 5 shown in FIG.
These substrate clamping plates 27 are closed, and the ends of the substrate 1 are inserted into the grooves 29 of the substrate clamping plates 27 and clamped.
Next, after the substrate holder is lowered, a horizontal transport means similar to the conventional one is driven to move the substrate 1 above a predetermined processing layer T while holding it therebetween. next,
A horizontal conveying means similar to the conventional one is driven to lower the substrate 1 while holding it into the processing tank T, and here, the first
Grooves 24 of the substrate holding rods 23, 23 as shown in the figure
After inserting the end of each board 1 and standing the board 1 on these board holding rods 23, 23, the board holding plates 27, 27 are moved outward in the direction of the arrow A or B. Thus, the substrate 1 is released from the substrate holding plate 27, and then the substrate holding plate 27 is raised. After these substrates 1 are immersed in the processing liquid for a predetermined time and subjected to a predetermined surface treatment, the substrate holding plate 27 descends into the processing tank T again, and after sandwiching the substrates 1, rises and moves to the next processing tank. , and then repeat the same operation.

なお、前記した実施例では、基板保持杆23,
23は整流板22に直接固定されているが、例え
ば整流板22に対し若干の間隔をおいて横架して
もよく、また、基板保持杆23は2本でなく1本
の若干巾広のものであつてもよい。
In addition, in the embodiment described above, the substrate holding rod 23,
23 is directly fixed to the rectifying plate 22, but for example, it may be mounted horizontally with a slight distance from the rectifying plate 22, and the board holding rods 23 may be one slightly wider one instead of two. It may be something.

ただし、1本の場合には、載置される基板1に
安定感を持たせるため、溝の形状を当該基板の外
周縁と類似した形状とすることが望ましい。
However, in the case of one groove, in order to give a sense of stability to the substrate 1 on which it is placed, it is desirable that the shape of the groove be similar to the outer peripheral edge of the substrate.

さらに、上記した実施例においては、処理槽T
を内側の槽と外側の槽とからなる二重の槽とした
場合について説明したが、必ずしも二重の槽とす
る必要はなく、処理槽を通常の処理層で構成し、
当該処理槽の上部より処理液を回収し、回収され
た処理液を当該処理槽底面から整流板を介して循
環させるようにしても良いことは勿論である。
Furthermore, in the above embodiment, the treatment tank T
Although we have explained the case where the treatment tank is made up of a double tank consisting of an inner tank and an outer tank, it is not necessarily necessary to have a double tank, and the treatment tank can be composed of a normal treatment layer,
Of course, the processing liquid may be collected from the upper part of the processing tank, and the collected processing liquid may be circulated from the bottom of the processing tank via a current plate.

また、基板保持杆23に刻設した溝24は、第
4図に示すごとく、必ずしも垂直状でなくて、若
干傾斜させて刻設してもよい。
Further, the grooves 24 formed in the substrate holding rod 23 are not necessarily vertical as shown in FIG. 4, but may be formed slightly inclined.

〔考案の効果〕[Effect of idea]

本考案によれば、 従来の一般的な処理装置のように表面処理槽
内に収納容器や基板立設用治具を出入れしない
ので、それだけ塵埃を表面処理槽内に持ち込む
ことが少ないのは勿論、垂直状の基板挟持板2
7の1対のみを出入れするので、処理槽間の処
理液の持ち出し量を少なくすることができる。
According to the present invention, unlike conventional general processing equipment, there is no need to take storage containers or substrate mounting jigs into and out of the surface treatment tank, so less dust is brought into the surface treatment tank. Of course, the vertical substrate holding plate 2
Since only one pair of 7 is taken in and out, the amount of processing liquid taken out between processing tanks can be reduced.

また、前掲の特開昭59−134834号公報記載の
処理装置のように、基板を治具に単に載置して
いるのと違い、処理槽から他の処理槽に水平移
送し、また、処理槽から多数の基板を一括して
出入れするに際し、1対の基板挟持板27によ
つて基板を挟持して行うので、基板の落下がな
く、安定した出入れと移送を行うことができ
る。
In addition, unlike the processing apparatus described in the above-mentioned Japanese Patent Application Laid-open No. 59-134834, in which the substrate is simply placed on a jig, the substrate can be horizontally transferred from one processing tank to another, and the processing When a large number of substrates are taken in and taken out from the tank at once, the substrates are held between the pair of substrate holding plates 27, so that the substrates do not fall and can be taken out and transferred in a stable manner.

更に、前掲の特開昭59−134834号公報に示さ
れているように、表面処理槽内で基板保持杆2
3を昇降自在に設けたものと違い、基板保持杆
23は処理槽に固設されており、フインガー装
置の基板挟持板27のみが処理槽で出入れする
ので、特に複数個連設した各槽に昇降装置を設
けることなく、構造簡単とすることは勿論、各
処理槽の底部に基板保持杆23用の昇降装置が
ないので、整流板による処理液の流動が邪魔さ
れない。
Furthermore, as shown in the above-mentioned Japanese Patent Application Laid-Open No. 59-134834, two substrate holding rods are used in the surface treatment tank.
3 that can be raised and lowered freely, the substrate holding rod 23 is fixed to the processing tank, and only the substrate holding plate 27 of the finger device can be taken in and out of the processing tank, so it is especially difficult to use the Not only is the structure simple because no elevating device is provided, but since there is no elevating device for the substrate holding rods 23 at the bottom of each processing tank, the flow of the processing liquid by the rectifier plate is not obstructed.

処理槽内には水平状に固設された基板保持杆
23のみで基板を立設しているため、基板と基
板保持杆23との接触部分を僅少となり、これ
によつても処理槽における処理液の流動が邪魔
されず、整流板を設けたことと併せて均一な処
理が行われる。
Since the substrates are erected in the processing tank using only the substrate holding rods 23 that are fixed horizontally, the contact area between the substrates and the substrate holding rods 23 is minimized, and this also allows the processing in the processing tank to be carried out easily. The flow of the liquid is not obstructed, and in combination with the provision of a rectifying plate, uniform processing is performed.

基板保持杆23と基板挟持板27には、その
開口部がテーパ状な拡げられた溝を刻設してい
るので、基板を挿入したり、挟持したりする
際、基板の端部を溝に滑り込ませることがで
き、基板を損傷しないばかりではなく、殊に、
基板保持杆23では、基板を断面コ字状の溝内
に確実に挿入でき、立設することができる。
The substrate holding rod 23 and the substrate clamping plate 27 have wide grooves with tapered openings, so when inserting or clamping a substrate, the edges of the substrate can be inserted into the grooves. Not only can it be slid in without damaging the board, but especially
With the substrate holding rod 23, the substrate can be reliably inserted into the groove having a U-shaped cross section and can be set upright.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例の処理槽の断面図、第
2図は第1図の〜断面図、第3図は第2図の
要部拡大図、第4図は別の実施例の要部拡大図、
第5図は本考案の実施例の搬送装置正面図、第6
図は第5図の〜断面図、第7図は第6図〜
断面図、第8図は従来例の側断面図、第9図は
第8図の正面図を示す。 1……基板、4……挟持駆動杆、23……基板
保持杆、24……溝、27……基板挟持板、29
……溝、T……処理槽。
Fig. 1 is a sectional view of a processing tank according to an embodiment of the present invention, Fig. 2 is a sectional view of Fig. 1, Fig. 3 is an enlarged view of the main part of Fig. 2, and Fig. 4 is a sectional view of another embodiment. Enlarged view of main parts,
FIG. 5 is a front view of the conveying device according to the embodiment of the present invention, and FIG.
The figure is a sectional view of Fig. 5, and Fig. 7 is a sectional view of Fig. 6.
8 shows a side sectional view of the conventional example, and FIG. 9 shows a front view of FIG. 8. 1... Board, 4... Holding drive rod, 23... Board holding rod, 24... Groove, 27... Board holding plate, 29
...Groove, T...processing tank.

Claims (1)

【実用新案登録請求の範囲】 その底部に設けた多孔性の整流板を介して処理
液を表面処理槽内に供給して、該表面処理槽内で
略垂直状に等ピツチで並列させた複数枚の基板に
対し、表面処理を行う基板ウエツト処理装置にお
いて、 該表面処理槽を複数個、連設し、 該表面処理槽の前記整流板上に、その開口部が
テーパ状に拡げられ、かつ、挿入された基板の端
部を立設・保持する断面コ字状の溝が一定ピツチ
で刻設された基板保持杆23を水平状に固設する
一方、 前記基板保持杆23の溝と同一ピツチで、か
つ、その開口部をテーパ状に拡げられた溝を刻設
した基板挟持板27の1対を垂直状にして対向さ
せ、これらの対向する溝間で基板を挟持・離脱自
在としたフインガー装置を形成し、 該フインガー装置に、前記基板挟持板27を前
記処理槽内に出入りさせるとともに、前記フイン
ガー装置を隣接の表面処理槽へ水平移送させる昇
降兼移動装置を付加したことを特徴とする基板ウ
エツト処理装置。
[Claims for Utility Model Registration] The treatment liquid is supplied into the surface treatment tank through a porous rectifying plate provided at the bottom of the tank, and a plurality of them are arranged in parallel in a substantially vertical manner at equal pitches within the surface treatment tank. In a substrate wet processing apparatus that performs surface treatment on a single substrate, a plurality of surface treatment tanks are arranged in series, and an opening thereof is widened in a tapered shape on the rectifying plate of the surface treatment tank, and , A board holding rod 23 in which grooves with a U-shaped cross section are carved at a constant pitch for standing and holding the end of the inserted board is fixed horizontally, and the grooves are the same as the grooves of the board holding rod 23. A pair of substrate holding plates 27 each having pitched grooves with tapered openings are arranged vertically to face each other, and the substrate can be freely held and removed between these opposing grooves. A finger device is formed, and an elevating and moving device is added to the finger device to move the substrate holding plate 27 in and out of the processing tank and to horizontally transfer the finger device to an adjacent surface treatment tank. Substrate wet processing equipment.
JP1985055244U 1985-04-12 1985-04-12 Expired JPH0234823Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985055244U JPH0234823Y2 (en) 1985-04-12 1985-04-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985055244U JPH0234823Y2 (en) 1985-04-12 1985-04-12

Publications (2)

Publication Number Publication Date
JPS61171244U JPS61171244U (en) 1986-10-24
JPH0234823Y2 true JPH0234823Y2 (en) 1990-09-19

Family

ID=30577735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985055244U Expired JPH0234823Y2 (en) 1985-04-12 1985-04-12

Country Status (1)

Country Link
JP (1) JPH0234823Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0626210B2 (en) * 1989-06-29 1994-04-06 東邦化成株式会社 Wet processing machine

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4817894U (en) * 1971-07-12 1973-02-28
JPS544668U (en) * 1977-06-14 1979-01-12
JPS5494274A (en) * 1978-01-10 1979-07-25 Toshiba Corp Liquid terating device of semiconductor wafers
JPS5929804Y2 (en) * 1980-08-15 1984-08-27 ニチデン機械株式会社 welding machine
JPS5752138A (en) * 1980-09-16 1982-03-27 Mitsubishi Electric Corp Etching device for semiconductor substrate
JPS5764740A (en) * 1980-10-09 1982-04-20 Nippon Telegr & Teleph Corp <Ntt> Developing device
JPS584143A (en) * 1981-06-30 1983-01-11 Fujitsu Ltd How to develop positive resist film
JPS5848423A (en) * 1981-09-17 1983-03-22 Matsushita Electric Ind Co Ltd Washing tank
JPS59134834A (en) * 1983-01-21 1984-08-02 Mitsubishi Electric Corp Washing device for semiconductor wafer

Also Published As

Publication number Publication date
JPS61171244U (en) 1986-10-24

Similar Documents

Publication Publication Date Title
JP3510463B2 (en) Substrate alignment apparatus and alignment method
JP2756734B2 (en) Wafer transfer equipment for surface treatment equipment
US6656321B2 (en) Liquid processing apparatus and liquid processing method
JPH07111963B2 (en) Substrate cleaning / drying device
JPH0234823Y2 (en)
JPH05200689A (en) Wafer holding device and holding method thereof
JP3714763B2 (en) Substrate holding member and substrate processing apparatus using the same
KR20240148874A (en) Substrate cleaning device and its turn-over device
CN217182137U (en) A wafer vertical lifting mechanism for wafer drying device
JPS63208223A (en) Wafer processing equipment
JP3219284B2 (en) Cleaning equipment
JP3248789B2 (en) Substrate wet processing method and processing system
JP3008001B2 (en) Cleaning equipment
JP3346823B2 (en) Substrate wet processing equipment
JP2675734B2 (en) Thin plate dipping device
JPH07321079A (en) Carrier for cleaning substrate and substrate cleaning method
JP3875435B2 (en) Substrate support mechanism
JPH10335425A (en) Wafer transfer equipment
JPH1027770A (en) Substrate processing device
KR20070044126A (en) Wafer sorter and method
JP2541887Y2 (en) Wafer surface treatment equipment
JPH1197399A (en) Equipment and method for processing substrate
JPH1027773A (en) Wafer treating apparatus
JPH036581Y2 (en)
JP2919157B2 (en) Semiconductor manufacturing equipment