CN118471874B - Loading and unloading device for wafer groove corrosion - Google Patents
Loading and unloading device for wafer groove corrosion Download PDFInfo
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- CN118471874B CN118471874B CN202410913160.9A CN202410913160A CN118471874B CN 118471874 B CN118471874 B CN 118471874B CN 202410913160 A CN202410913160 A CN 202410913160A CN 118471874 B CN118471874 B CN 118471874B
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- 230000007797 corrosion Effects 0.000 title abstract description 15
- 238000005260 corrosion Methods 0.000 title abstract description 15
- 235000012431 wafers Nutrition 0.000 claims abstract description 86
- 239000007788 liquid Substances 0.000 claims abstract description 29
- 238000001035 drying Methods 0.000 claims abstract description 19
- 238000003860 storage Methods 0.000 claims abstract description 15
- 238000007664 blowing Methods 0.000 claims abstract description 9
- 238000007599 discharging Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 4
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims description 68
- 238000005530 etching Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 230000001154 acute effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract 1
- 239000002699 waste material Substances 0.000 description 3
- 244000309464 bull Species 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an upper and lower feeding device for wafer groove corrosion, which relates to the technical field of accessories related to wafer groove corrosion technology and comprises an upper and lower feeding unit, a drying unit and a temporary storage unit. The feeding and discharging unit comprises a pair of gears, a round rod is coaxially and fixedly arranged on the gears in a penetrating mode, rotating plates respectively located at two ends of the gears are further sleeved on the periphery side of the round rod, a first bearing part for bearing wafers is arranged between the lower ends of the two rotating plates under the same round rod, and a plurality of first wafer grooves are formed in the upper end face of the first bearing part. The drying unit is arranged below the feeding and discharging unit and comprises a pair of hot air blowers, and a plurality of air blowing pipes matched with the liquid leakage holes are arranged above the air outlet ends of the hot air blowers along a linear array. The temporary storage unit is arranged at one end of the drying unit and comprises an electric turntable, a plurality of self-driven trolleys are arranged on the electric turntable in a circumferential array, and a plurality of third round grooves are formed in one end face of the third bearing part. The invention can automatically feed and discharge materials, and can automatically clean the residual corrosive liquid on the periphery of the wafer during the discharging process, thereby improving the production efficiency.
Description
Technical Field
The invention relates to the technical field of accessories related to a wafer trench etching process, in particular to an upper and lower feeding device for wafer trench etching.
Background
The wafer trench etching process plays a critical role in the semiconductor manufacturing process, and when integrated circuits are manufactured on a wafer, various circuit elements can be defined and created through trench etching, so that necessary space is provided for subsequent material deposition, doping, metallization and other steps, and a complete circuit structure is constructed.
When the wafer groove corrosion is carried out, a plurality of wafers are required to be placed in a special storage basket, then the wafers are placed in a corrosion groove, the corrosion groove is formed on the wafers under the action of the corrosion liquid, then the wafers are taken out, the corrosion liquid on the wafers is required to be dried after the wafers are taken out, and specific steps of placing and taking out are carried out, and a manual or automatic mode is provided according to equipment. However, because the structure of the storage basket is that a plurality of grooves are arranged at the bottom for fixing the wafers, no matter what the wafers are taken and placed, if the wafers are not taken out after the groove corrosion is finished, part of corrosive liquid is difficult to blow to the whole body and remains in the grooves of the storage basket, and part of residual corrosive liquid is further arranged at the lower part of the wafers, so that the wafers still need to be manually taken down and wiped one by one, and then the wafers are placed on other storage racks one by one, and the efficiency is lower.
Disclosure of Invention
In order to overcome the defects, the invention provides the feeding and discharging device for wafer groove corrosion, which can automatically feed and discharge materials, and can automatically clean residual corrosive liquid on the periphery of a wafer during discharging, thereby improving the production efficiency.
In order to achieve the object of the present invention, the following techniques are proposed:
the utility model provides a unloader is used in wafer slot corruption, includes:
The upper and lower blanking unit comprises a first linear mechanism, a second linear mechanism is vertically arranged below the sliding end of the first linear mechanism, an incomplete toothed ring is assembled at the lower end of an output shaft of the second linear mechanism, a pair of gears are meshed with the inner peripheral side of the incomplete toothed ring, round rods are coaxially and fixedly arranged in a penetrating mode, rotating plates which are respectively positioned at two ends of the gears are sleeved on the outer peripheral side of the round rods, a first bearing part for bearing wafers is arranged between the lower ends of the two rotating plates below the same round rod, a plurality of first wafer grooves are formed in the upper end face of the first bearing part, liquid leakage holes which are partially overlapped with the first wafer grooves and penetrate through the lower end face of the first bearing part are formed in the upper end face of the first bearing part, and a gear driving assembly for driving the gears to move under the incomplete toothed ring is further arranged on the four sides of the second linear mechanism;
The drying unit is arranged below the feeding and discharging unit and comprises a pair of fifth linear mechanisms with acute angles a between the straight lines where the output shafts are positioned and the horizontal plane, one end of the output shafts is provided with an inverted L-shaped seat, one side of the vertical edge of the inverted L-shaped seat is provided with an air heater, and a plurality of air blowing pipes matched with the liquid leakage holes are arranged above the air outlet end of the inverted L-shaped seat along a linear array;
The temporary storage unit is arranged at one end of the drying unit and comprises an electric rotary table, a plurality of self-driven trolleys are arranged on the electric rotary table in a circumferential array manner, a pair of sixth linear mechanisms are arranged on the self-driven trolleys, an acute angle b is formed between a straight line where an output shaft is located and a horizontal plane, a is larger than b, a third bearing part is arranged at one end of the output shaft of each sixth linear mechanism, and a plurality of third round grooves are formed in one end face of each third bearing part.
Further, gear drive subassembly is including locating the last equipment board of second linear mechanism output shaft lower extreme, go up the equipment board both ends and be equipped with the third linear mechanism outside the predetermined distance respectively vertically, go up the equipment board both sides and be equipped with the fourth linear mechanism outside the predetermined distance respectively vertically, third linear mechanism output shaft lower extreme is equipped with horizontal pipe, horizontal pipe both ends open respectively and sliding fit has the picture peg in the opening, horizontal pipe both ends still are equipped with the guide block respectively, the guide block both ends are equipped with the lantern ring respectively, the part that the picture peg is located horizontal pipe is located to the lantern ring cover, fourth linear mechanism output shaft lower extreme is equipped with the lifter plate, lifter plate both ends are respectively normal running fit has the bull stick, the bull stick lower extreme is equipped with the padlock respectively, the slider side has been seted up the cover and has been located the lateral groove outside the guide block with running through, the slider upper end is equipped with the rings that are used for connecting the padlock.
Further, go up the package rubbing board periphery side and be equipped with a plurality of first extension, first through-hole has been seted up to first extension, go up the package rubbing board lower extreme and be equipped with down the package rubbing board, lower package rubbing board periphery side is equipped with a plurality of second extension that match first extension respectively, the second through-hole that matches with first through-hole has been seted up to the second extension, lower package rubbing board lower extreme is equipped with the riser, a plurality of screw holes have been seted up respectively to riser both sides face, the riser lower extreme is located to incomplete ring gear, the riser both sides are equipped with the type plate of falling L respectively, the horizontal limit of type plate of falling L is equipped with the flitch, a plurality of third through-holes that match with the screw hole respectively have been seted up to the flitch side, the fourth through-hole has been seted up to the vertical limit lower part of type plate of falling L, the sixth through-hole that matches with the fourth through-hole has been seted up to the rotating plate lower part, through penetrating a round pin pole coaxial with the wafer fourth through-hole and two sixth through-holes as the rotation axis, make the rotating plate rotate around the pin pole.
Further, the latch includes an L-shaped portion and a closure plate for forming a triangular closure with the L-shaped portion.
Further, the circular groove is offered to slider one end, and the round bar normal running fit is in the circular groove.
Further, the air outlet end of the air heater is provided with a U-shaped pipe, and the air blowing pipe is arranged on the outer peripheral side of the upper transverse pipe of the U-shaped pipe.
Further, the upper end face of the inverted L-shaped seat is provided with a vertical block, the upper end of the vertical block is provided with a plurality of springs, the upper ends of the springs are provided with second bearing parts, and the upper end face of the springs is provided with a plurality of second wafer grooves.
Further, the electric turntable upper end face is provided with a plurality of groups of first wheel grooves in a circumferential array, one end of each first wheel groove extends to the upper side of the outer periphery of the electric turntable, the idler wheels of the self-driven trolley are movably matched in the first wheel grooves, the self-driven trolley is provided with a U-shaped frame, and two sixth linear mechanisms are respectively arranged on two vertical edges of the U-shaped frame.
Further, an outer plate is arranged at one end of the outer periphery of the electric rotating disc, an arc surface matched with the outer periphery of the electric rotating disc is formed on one end face of the outer plate, and a second wheel groove used for being connected with the first wheel groove is formed on the outer plate.
The beneficial effects of this technical scheme lie in:
1. before the wafer is subjected to groove corrosion, the wafer is firstly placed on the first bearing part of the loading and unloading unit, the following loading and unloading steps can be automatically completed from the step, the first bearing part is provided with a liquid leakage hole, more corrosive liquid can leak out in the process of lifting the wafer from the corrosion groove, then the clamped wafer part, the first wafer groove and the liquid leakage hole of the first bearing part are dried again through the drying unit, the residual corrosive liquid is thoroughly removed, and the wafers do not need to be taken down halfway manually to be cleaned, so that the production efficiency can be improved.
2. After the wafer is subjected to blanking and the residual corrosive liquid is thoroughly removed, the wafer can be automatically transferred to a temporary storage unit in batches for temporary storage, and the subsequent use is convenient.
Drawings
Fig. 1 shows a perspective view of an embodiment of the application.
Figure 2 shows a second perspective view of an embodiment of the application.
Fig. 3 shows a partial perspective view of a loading and unloading unit according to an embodiment of the present application.
Fig. 4 shows a partial perspective view of a loading and unloading unit according to an embodiment of the application.
Fig. 5 shows a partial exploded view of the loading and unloading unit according to an embodiment of the present application.
Fig. 6 shows a partial explosion diagram of the loading and unloading unit according to an embodiment of the application.
Fig. 7 shows a third partial explosion diagram of the loading and unloading unit according to an embodiment of the present application.
Fig. 8 shows a perspective view of a slider according to an embodiment of the present application.
Fig. 9 shows a perspective view of a rotating plate and a first bearing part according to an embodiment of the application.
Fig. 10 shows a second perspective view of the rotating plate and the first bearing part according to the embodiment of the application.
Fig. 11 shows a perspective view of a drying unit according to an embodiment of the present application.
Fig. 12 is a perspective view of a temporary storage unit according to an embodiment of the application.
Fig. 13 shows a schematic front view of the working mode of the embodiment of the present application.
Fig. 14 shows a schematic front view of a second mode of operation of an embodiment of the application.
Fig. 15 illustrates a schematic front view of a third mode of operation of an embodiment of the present application.
The marks in the figure: the upper and lower unit 1, the first straight mechanism 11, the second straight mechanism 12, the upper assembly plate 121, the first extension 122, the first transverse plate 123, the third straight mechanism 124, the fourth straight mechanism 125, the transverse tube 13, the insertion plate 131, the guide block 132, the collar 133, the lifting plate 134, the rotating rod 135, the buckle 136, the lower assembly plate 14, the second extension 141, the vertical plate 142, the screw hole 143, the incomplete ring gear 15, the gear 151, the round bar 152, the slide 153, the side groove 154, the round groove 155, the hanging ring 156, the inverted L-shaped plate 16, the attaching plate 161, the fourth through hole 162, the rotating plate 17, the fifth through hole 171, the sixth through hole 172, the first bearing part 18, the first round groove 181, the liquid leakage hole 182, the drying unit 2, the fifth straight mechanism 21, the inverted L-shaped seat 22, the vertical block 221, the hot air blower 23, the U-shaped tube 24, the air blowing pipe 25, the spring 26, the second bearing part 27, the second round groove 271, the temporary storage unit 3, the electric rotating disc 31, the first round groove 311, the self-driven trolley 32, the sixth straight groove 34, the third straight groove 35, the third round groove 37, and the waste liquid groove 35.
Detailed Description
The application is further described below with reference to the drawings and examples.
The loading and unloading device for wafer trench etching shown in fig. 1-15 comprises a loading and unloading unit 1, a drying unit 2, a temporary storage unit 3 and a waste liquid tank 4.
As shown in fig. 1 to 10 and 13 to 15, the loading and unloading unit 1 comprises a first linear mechanism 11, specifically, the first linear mechanism 11 is fixed under a ceiling of a wafer trench etching process workshop, a second linear mechanism 12 is vertically arranged under a sliding end of the first linear mechanism 11, an upper assembly plate 121 is arranged at a lower end of an output shaft of the second linear mechanism 12, a plurality of first extension parts 122 are arranged on an outer periphery side of the upper assembly plate 121, a first through hole is formed in the first extension parts 122, first transverse plates 123 are respectively arranged at two end surfaces of the upper assembly plate 121, a third linear mechanism 124 is vertically arranged at one end of the first transverse plate 123, second transverse plates are respectively arranged at two side surfaces of the upper assembly plate 121, A fourth linear mechanism 125 is vertically arranged at one end of the second transverse plate, a transverse tube 13 is arranged at the lower end of the output shaft of the third linear mechanism 124, two ends of the transverse tube 13 are respectively opened and are in sliding fit with an inserting plate 131 in the opening, two ends of the transverse tube 13 are respectively provided with a guide block 132, two ends of the guide block 132 are respectively provided with a lantern ring 133, the lantern ring 133 is sleeved on the part of the inserting plate 131 positioned outside the transverse tube 13, a lifting plate 134 is arranged at the lower end of the output shaft of the fourth linear mechanism 125, a pair of protruding blocks are respectively arranged at two ends of the lifting plate 134, a fixing rod is arranged between the protruding blocks, a rotating rod 135 is sleeved on the fixing rod, a buckling lock 136 is arranged at the lower end of the rotating rod 135, The latch 136 comprises an L-shaped part and a closing plate for forming a triangular closing part with the L-shaped part, the lower end of the upper assembling plate 121 is provided with a lower assembling plate 14, the peripheral side of the lower assembling plate 14 is provided with a plurality of second extending parts 141 which are respectively matched with the first extending parts 122, the second extending parts 141 are provided with second through holes which are respectively matched with the first through holes, the lower end of the lower assembling plate 14 is provided with a vertical plate 142, two side surfaces of the vertical plate 142 are respectively provided with a plurality of screw holes 143, the lower end of the vertical plate 142 is provided with an incomplete toothed ring 15, specifically, the covering radian of the incomplete toothed ring 15 is 200-260 degrees relative to a circle, the toothed part of the incomplete toothed ring 15 is positioned on the inner peripheral side, The inner circumference side of the incomplete ring gear 15 is meshed with a pair of gears 151, the gears 151 are coaxially and fixedly penetrated with round rods 152, two ends of the round rods 152 are respectively provided with a sliding block 153, the side surfaces of the sliding blocks 153 are penetrated with side grooves 154 sleeved outside the guide blocks 132, one end of each sliding block 153 is provided with a round groove 155, the round rods 152 are in running fit with the round grooves 155, the upper ends of the sliding blocks 153 are provided with hanging rings 156 for connecting the buckling locks 136, two sides of each vertical plate 142 are respectively provided with an inverted L-shaped plate 16, the transverse edges of the inverted L-shaped plates 16 are provided with flitch plates 161, the side surfaces of the flitch plates 161 are provided with a plurality of third through holes which are respectively matched with the screw holes 143, The lower part of the vertical edge of the inverted L-shaped plate 16 is provided with a fourth through hole 162, the periphery side of the round rod 152 is also sleeved with a rotating plate 17 respectively positioned at two ends of the gear 151, specifically, the upper part of the rotating plate 17 is provided with a fifth through hole 171, the round rod 152 is in rotating fit with the fifth through hole 171, the lower part of the rotating plate 17 is provided with a sixth through hole 172 matched with the fourth through hole 162, a pin rod coaxial with a wafer penetrates into the output shaft of the fourth through hole 162 and the two sixth through holes 172 as rotating shafts, the rotating plate 17 rotates around the pin rod, a first bearing part 18 for bearing the wafer 6 taken out from the corrosion groove 5 is arranged between the lower ends of the two rotating plates 17 under the same round rod 152, The upper end surface of the first bearing part 18 is provided with a plurality of first wafer grooves 181 with inner bottom surfaces matched with part of the outer periphery of the wafer 6, and the upper end surface of the first bearing part 18 is also provided with liquid leakage holes 182 which are partially overlapped with the first wafer grooves 181 and penetrate to the lower end surface of the first bearing part 18.
As shown in fig. 1, fig. 2, fig. 11 and fig. 13, the drying unit 2 is disposed below the feeding and discharging unit 1, and includes a pair of fifth linear mechanisms 21 having an acute angle a between a straight line where the output shaft is located and a horizontal plane, specifically, the fifth linear mechanisms 21 are disposed on the chassis, one end of the output shaft of the fifth linear mechanisms 21 is provided with an inverted L-shaped seat 22, a hot air blower 23 is disposed on a vertical side of the inverted L-shaped seat 22, an air outlet end of the inverted L-shaped seat is provided with a U-shaped tube 24, a plurality of air blowing pipes 25 matched with the liquid leakage holes 182 are disposed on an outer peripheral side of an upper transverse tube of the U-shaped tube 24 along a linear array, a vertical block 221 is disposed on an upper end surface of the transverse side of the inverted L-shaped seat 22, a plurality of springs 26 are disposed on an upper end of the vertical block 221, a second bearing portion 27 is disposed on an upper end of the springs 26, and a plurality of second wafer grooves 271 are disposed on an upper end surface of the second bearing portion 27.
As shown in fig. 1, fig. 2, fig. 12, fig. 14, fig. 15, the temporary storage unit 3 is disposed at one end of the drying unit 2, and includes an electric turntable 31, a plurality of groups of first wheel grooves 311 are disposed on an upper end surface of the electric turntable 31 in a circumferential array, one end of each first wheel groove 311 extends to a position above an outer circumference side of the electric turntable 31, a self-driving trolley 32 is disposed on each first wheel groove 311, rollers of the self-driving trolley 32 are movably matched in the first wheel grooves 311, a U-shaped frame 33 is disposed on the self-driving trolley 32, sixth linear mechanisms 34 are disposed on two vertical sides of the U-shaped frame 33, an acute angle b is disposed between a straight line of an output shaft of each sixth linear mechanism 34 and a horizontal plane, a is greater than b, a is disposed at one end of the output shaft of each sixth linear mechanism 34, a third bearing portion 35 is disposed at one end surface of each third bearing portion 35, a plurality of third round grooves 36 are disposed at one end of the outer circumference side of the electric turntable 31, a cambered surface matched with the outer circumference side of the electric turntable 31 is disposed at one end of the outer plate 37, and a second wheel groove 371 for connecting the first wheel groove 311 is disposed at the outer plate 37.
As shown in fig. 1 and 2, the waste liquid tank 4 is provided below the space between the two fifth linear mechanisms 21, and collects the blown-down etching liquid.
In the present embodiment, the first linear mechanism 11 employs a rodless linear cylinder, and the second linear mechanism 12, the third linear mechanism 124, the fourth linear mechanism 125, the fifth linear mechanism 21, and the sixth linear mechanism 34 each employ a single-axis linear cylinder.
The working mode is as follows:
Firstly, each wafer 6 is placed between two first bearing parts 18, then the wafers 6 are moved by a first linear mechanism 11, then the wafers 6 are lowered into the etching tank 5 by a second linear mechanism 12, then after etching for a preset time, the wafers 6 are taken out by the second linear mechanism 12, then the wafers are dried for the first time, a specific drying mode such as a blower can be adopted, and when the wafers are taken out and dried for the first time, part of residual etching liquid can fall back into the etching tank 5 through the liquid leakage holes 182.
These wafers 6 are then moved over the drying unit 2 for a second blow drying to remove from the wafers 6 the remaining residual etching liquid from the portions of the wafers 6 covered by the first wafer grooves 181, in particular: after the wafer 6 is on the drying unit 2 and the axis of each drain hole 182 is coaxial with one air blowing pipe 25, the first bearing parts 18 are moved by the first linear mechanism 11, and the state is as shown in fig. 13, at this time, the air heater 23 is started first, then the fifth linear mechanism 21 pushes each air blowing pipe 25 to abut against the lower end of the drain hole 182, so that hot air passes through the drain hole 182 and then enters the first wafer groove 181, the part of the wafer 6 covered by the first wafer groove 181 and the inside of the first wafer groove 181 and the drain hole 182 are dried, preferably, the second bearing parts 27 can also lift the wafer 6 by a small distance, so that the wafer 6 and the first wafer groove 181 are slightly separated, and the part to be further dried of the wafer 6 is not contacted with the first bearing parts 18, thereby improving the drying effect.
The wafers 6 are then moved further over the temporary storage unit 3, preferably a self-propelled trolley 32 can be moved onto the outer plate 37 closer to the drying unit 2 for operation, in particular: the first bearing parts 18 are moved by the first linear mechanism 11, and in the initial state, as shown in fig. 14, the included angle between the two rotating plates 17 is smaller than the included angle between the straight lines where the output shafts of the two sixth linear mechanisms 34 are located, and because the two straight lines intersect to form four included angles, the above included angles are all included angles located below, and in order to reach the state shown in fig. 14, the third bearing parts 35 need to be retracted for a small distance to enable the wafer 6 to pass through.
At this time, it is necessary to gradually increase the angle between the two rotating plates 17 so that the wafer 6 falls onto the third carrying part 35 from the first carrying part 18, fig. 15 shows a state of the middle process of increasing the angle, the third carrying part 35 is further retracted by the sixth linear mechanism 34, then the angle between the two rotating plates 17 is equal to the angle between the straight lines where the output shafts of the two sixth linear mechanisms 34 are located, after the state of fig. 15, the angle between the two rotating plates 17 is further increased, and meanwhile, the third carrying part 35 is pushed by the sixth linear mechanism 34, so that the wafer 6 is finally stored on the third carrying part 35.
For the above-mentioned change of the angle between the rotating plates 17, the loading and unloading unit 1 is realized by the following means: the fourth linear mechanism 125 can drive the rotating rod 135 to further slide the sliding block 153 laterally on the guide block 132, and because the driving gear 151 needs to move along an arc, the third linear mechanism 124 needs to push and pull the transverse tube 13 to further drive the guide block 132 to move up and down, that is, under the action of the fourth linear mechanism 125 and the third linear mechanism 124, the gear 151 can move along the incomplete ring gear 15, and then the round rod 152 can drive the rotating plate 17 to rotate to change the included angle.
After the wafer 6 is placed on the third bearing part 35 on the outer plate 37, the wafer 6 can be moved back to the electric turntable 31, then the next self-driven trolley 32 with the third bearing part 35 empty is turned to one end close to the outer plate 37 through the electric turntable 31, and the third bearing part 35 is loaded for temporarily storing the wafer 6, so that the wafer 6 can be taken by personnel who can conveniently carry out subsequent procedures.
Further preferably, the parts under each linear mechanism of the loading and unloading unit 1 can be basically detached for cleaning, and because there is a possibility of residual corrosive liquid, and when the corrosive liquid volatilizes, the corrosive liquid sometimes remains on the parts, the sliding end can be moved to the other end of the corrosion groove 5 at the end of the drying unit 2 by the first linear mechanism 11 for disassembly, specifically, the plugboard 131 can be retracted, the locking 136 can be released, the screws and the pins can be removed, and finally, the guide block 132, the lifting plate 134 and the parts carried by the lifting plate, the lower assembling plate 14 and the parts carried by the lower assembling plate, the sliding block 153, the inverted-L-shaped plate 16, the rotating plate 17 and the first bearing part 18 can be completely detached, thereby being convenient for cleaning by staff.
The above examples are only examples of the present application and are not intended to limit the present application.
Claims (7)
1. The utility model provides a unloader for wafer slot corrodes which characterized in that includes:
The upper and lower material unit (1) comprises a first linear mechanism (11), a second linear mechanism (12) is vertically arranged below the sliding end of the first linear mechanism, a pair of gears (151) are meshed on the inner peripheral side of the incomplete toothed ring (15) and are meshed with the incomplete toothed ring (15), round rods (152) are coaxially and fixedly arranged on the gears (151), rotating plates (17) which are respectively arranged at two ends of the gears (151) are sleeved on the outer peripheral side of the round rods (152), a first bearing part (18) for bearing wafers (6) is arranged between the lower ends of the two rotating plates (17) below the same round rods (152), a plurality of first wafer grooves (181) are formed in the upper end face of the first bearing part (18), liquid leakage holes (182) which are partially overlapped with the first wafer grooves (181) and penetrate through the lower end face of the first bearing part (18) are formed in the upper end face of the first bearing part, a gear driving assembly component for driving the gears (151) to move below the incomplete toothed ring (15) is further arranged on the four sides of the second linear mechanism, the gear driving component comprises a first bearing part (18) which is arranged between the lower ends of the two rotating plates (17), a plurality of first bearing parts (121) for bearing wafers (121) are assembled on the upper end faces of the second linear mechanism (121), a plurality of first bearing parts (121) are respectively arranged at two ends of the upper end faces of the first bearing part (121), the lower end of an output shaft of the third linear mechanism (124) is provided with a transverse tube (13), two ends of the transverse tube (13) are respectively opened and are in sliding fit with an inserting plate (131), two ends of the transverse tube (13) are also respectively provided with a guide block (132), two ends of the guide block (132) are respectively provided with a lantern ring (133), the lantern ring (133) is sleeved on the part of the inserting plate (131) positioned outside the transverse tube (13), the lower end of an output shaft of the fourth linear mechanism (125) is provided with a lifting plate (134), two ends of the lifting plate (134) are respectively in rotating fit with a rotating rod (135), the lower end of the rotating rod (135) is provided with a buckling lock (136), two ends of a round rod (152) are respectively provided with a sliding block (153), the side face of the sliding block (153) is provided with a side groove (154) sleeved outside the guide block (132) in a penetrating way, and the upper end of the sliding block (153) is provided with a hanging ring (156) for connecting the buckling lock (136);
The drying unit (2) is arranged below the feeding and discharging unit (1) and comprises a pair of fifth linear mechanisms (21) with acute angles a between straight lines where output shafts are positioned and a horizontal plane, one end of each output shaft is provided with an inverted L-shaped seat (22), one side of the vertical edge of each inverted L-shaped seat (22) is provided with an air heater (23), a plurality of air blowing pipes (25) matched with the liquid leakage holes (182) are arranged above the air outlet end of each inverted L-shaped seat along a linear array, vertical blocks (221) are arranged on the upper end surfaces of the transverse edges of the inverted L-shaped seats (22), a plurality of springs (26) are arranged on the upper ends of the vertical blocks (221), the upper ends of the springs (26) are provided with second bearing parts (27), and the upper end surfaces of the springs are provided with a plurality of second wafer grooves (271);
the temporary storage unit (3) is arranged at one end of the drying unit (2) and comprises an electric rotary table (31), a plurality of self-driven trolleys (32) are arranged on the electric rotary table (31) in a circumferential array mode, a pair of sixth linear mechanisms (34) are arranged on the self-driven trolleys (32), an acute angle b is formed between a straight line where an output shaft of the self-driven trolleys is located and a horizontal plane, a is larger than b, a third bearing part (35) is arranged at one end of the output shaft of the sixth linear mechanisms (34), and a plurality of third round grooves (36) are formed in one end face of the third bearing part (35).
2. The wafer trench etching feeding and discharging device according to claim 1, wherein a plurality of first extension portions (122) are arranged on the outer periphery side of the upper assembly plate (121), first through holes are formed in the first extension portions (122), a lower assembly plate (14) is assembled at the lower end of the upper assembly plate (121), a plurality of second extension portions (141) which are matched with the first extension portions (122) respectively are arranged on the outer periphery side of the lower assembly plate (14), second through holes which are matched with the first through holes are formed in the second extension portions (141), a vertical plate (142) is arranged at the lower end of the lower assembly plate (14), a plurality of screw holes (143) are formed in two side surfaces of the vertical plate (142), a plurality of inverted-L-shaped plates (16) are respectively assembled at the two sides of the vertical plate (142), a pasting plate (161) is arranged on the lateral side of the inverted-L-shaped plates, a plurality of third through holes which are matched with the screw holes (143) respectively are formed in the lateral sides of the pasting plate (161), a fourth through hole (162) is formed in the lower portion of the vertical side of the inverted-L-shaped plates (16), a plurality of screw holes (172) are formed in the lower portion of the pasting plate (17), a plurality of screw holes (172) are formed in the vertical plate (17), and the sixth through holes (172) are formed in the lower portion of the vertical plate (17) and the rotating shaft (172) and the sixth through holes (172) are formed by the rotating shaft (162), and the rotating shaft (172) and the sixth through shaft (172).
3. The wafer trench etching loading and unloading apparatus of claim 1, wherein the latch (136) comprises an L-shaped portion and a closure plate for forming a triangular closure with the L-shaped portion.
4. The loading and unloading device for wafer trench etching according to claim 1, wherein a circular groove (155) is formed at one end of the slider (153), and the circular rod (152) is rotatably fitted in the circular groove (155).
5. The loading and unloading device for wafer trench etching according to claim 1, wherein a U-shaped tube (24) is provided at an air outlet end of the air heater (23), and the air blowing tube (25) is provided on an outer peripheral side of an upper transverse tube of the U-shaped tube (24).
6. The loading and unloading device for wafer trench etching according to claim 1, wherein a plurality of groups of first wheel grooves (311) are formed in the upper end face of the electric turntable (31) in a circumferential array, one end of each first wheel groove (311) extends to the upper side of the outer periphery of the electric turntable (31), rollers of the self-driven trolley (32) are movably matched in the first wheel grooves (311), a U-shaped frame (33) is arranged on the self-driven trolley (32), and two sixth linear mechanisms (34) are respectively arranged on two vertical edges of the U-shaped frame (33).
7. The loading and unloading device for wafer trench etching according to claim 6, wherein an outer plate (37) is provided at one end of the outer peripheral side of the electric turntable (31), an arc surface matching with the outer peripheral side of the electric turntable (31) is formed on one end surface of the outer plate (37), and a second wheel groove (371) for connecting the first wheel groove (311) is provided on the outer plate (37).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410913160.9A CN118471874B (en) | 2024-07-09 | 2024-07-09 | Loading and unloading device for wafer groove corrosion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410913160.9A CN118471874B (en) | 2024-07-09 | 2024-07-09 | Loading and unloading device for wafer groove corrosion |
Publications (2)
| Publication Number | Publication Date |
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| CN118471874A CN118471874A (en) | 2024-08-09 |
| CN118471874B true CN118471874B (en) | 2024-09-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202410913160.9A Active CN118471874B (en) | 2024-07-09 | 2024-07-09 | Loading and unloading device for wafer groove corrosion |
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| Country | Link |
|---|---|
| CN (1) | CN118471874B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116344411A (en) * | 2023-05-26 | 2023-06-27 | 四川上特科技有限公司 | Wafer trench etching device |
| CN118263098A (en) * | 2024-04-09 | 2024-06-28 | 合肥海滨半导体科技有限公司 | Wafer etching slot hole depth cleaning process |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11330036A (en) * | 1998-05-08 | 1999-11-30 | Okamoto Machine Tool Works Ltd | Device for cleaning wafer and method for cleaning wafer using the same |
| JP2007227619A (en) * | 2006-02-23 | 2007-09-06 | Kondo Kogyo Kk | Charger for charging dry air or nitrogen gas into semiconductor wafer container, and wafer static electricity remover using same |
| CN113327878B (en) * | 2021-08-03 | 2021-10-08 | 四川明泰微电子有限公司 | Wafer loading device and wafer film pasting device |
| CN114334724B (en) * | 2021-12-22 | 2024-04-26 | 山东华楷微电子装备有限公司 | Wet etching method for chip production |
| CN116043297B (en) * | 2023-02-22 | 2023-12-22 | 深圳市铤创利电子科技有限公司 | Multifunctional drying and cleaning device |
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2024
- 2024-07-09 CN CN202410913160.9A patent/CN118471874B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116344411A (en) * | 2023-05-26 | 2023-06-27 | 四川上特科技有限公司 | Wafer trench etching device |
| CN118263098A (en) * | 2024-04-09 | 2024-06-28 | 合肥海滨半导体科技有限公司 | Wafer etching slot hole depth cleaning process |
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| CN118471874A (en) | 2024-08-09 |
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