CN115847954A - Preparation method of copper-clad plate - Google Patents

Abstract

The invention discloses a method for preparing a copper clad laminate. Firstly, an A film resin and a B film initiator are prepared into an A film by an extrusion casting method or an extrusion calendering method, and the A film contains a B film initiator; Resin and A film curing agent are prepared into B film by extrusion casting method or extrusion calendering method, and B film contains A film curing agent; then at least one piece of A film and at least one piece of B film are stacked together, on And, or the lower side is covered with copper foil, which is directly cured after pressing to form a copper clad laminate; each piece of A film is bonded to at least one piece of B film, and each piece of B film is bonded to at least one piece of A film. The copper-clad laminate preparation method of the present invention does not pollute the environment due to volatilization of various organic solvents during the preparation process, contributes to the improvement of environmental pollution, and has low cost, high efficiency and energy saving.

Description

Copper clad laminate preparation method

technical field

The invention relates to the production and manufacturing technology of electronic materials, in particular to a method for preparing a copper clad laminate.

Background technique

Copper-clad laminate, referred to as copper-clad laminate (CCL), is a prepreg that is impregnated with resin and baked at a high temperature to become a solid prepreg. After slicing, one or more prepregs are stacked together, one or both sides Copper foil is then covered and formed after lamination. It is mainly used in the production of printed circuit boards (PCB). After pressing multiple printed circuit boards together with prepreg, a multilayer circuit board is formed.

A traditional method for preparing a prepreg comprises the following steps: (A) uniformly mixing a thermosetting resin composition including a resin emulsion, a filler, a coupling agent and a solvent to obtain a thermosetting resin composition glue; and (B) using the steps The glue solution obtained in (A) wets the substrate and is dried to obtain the prepreg. Traditional prepreg preparation methods use different types of organic solvents in the soaking method, and the organic solvents volatilized in the final process will be incinerated and released into the air as carbon dioxide, which is not a necessity in the product and will cause a greenhouse effect.

Contents of the invention

The technical problem to be solved by the present invention is to provide a method for preparing copper clad laminates. The preparation process will not pollute the environment due to the volatilization of various organic solvents, contribute to the improvement of environmental pollution, and have low cost, high efficiency and energy saving.

In order to solve the above-mentioned technical problems, the copper-clad laminate preparation method provided by the present invention comprises the following steps:

S1. A film resin and B film initiator are prepared into A film by extrusion casting method or extrusion calendering method, and A film contains B film initiator;

B film resin and A film curing agent are prepared into B film by extrusion casting method or extrusion calendering method, and B film contains A film curing agent;

S2. Lay at least one piece of A film 1 and at least one piece of B film 2 together, cover the upper side and/or the lower side with copper foil 3, and directly solidify after pressing to form a copper clad board; each piece of A film 1 is at least the same A piece of B film 2 is bonded, and each piece of B film 2 is bonded with at least one piece of A film 1 .

Preferably, the extrusion casting method is to heat, melt, and plasticize the resin through an extruder, extrude it through a molding die, cast it on a cooling roll, cool it down and shape it, and then wind it up after traction and trimming. finally get the film;

The extrusion calendering method is to melt and plasticize the resin, then squeeze and stretch it multiple times with rollers, and then cool and shape it to obtain a film.

Preferably, in step S2, the copper clad laminate is formed by pressing and curing at a temperature of 50-300°C.

Preferably, in step S2, at least one piece of A film, at least one piece of B film and at least one piece of glass fiber cloth 4 are laminated together, and the two sides of the glass fiber cloth 4 are laminated with A film or B film respectively.

Preferably, at least two pieces of A film, at least one piece of B film and at least one piece of glass fiber cloth 4 are stacked together, and both sides of the glass fiber cloth 4 are laminated with A film respectively.

Preferably, at least one piece of A film and at least two pieces of B film are stacked together, the upper side and/or the lower side is the B film, and the upper side and/or lower side of the B film covers the copper foil 3 .

Preferably, the thickness of film A 1 is 0.01-1mm;

The thickness of B film 2 is 0.01-1mm;

The thickness of the glass fiber cloth 4 is 0.01-1mm.

Preferably, the A film resin adopts any one of PPE, PPO, PPS, PBT, PET, LSP, PC, BT, PMMA, polysulfone amide or polyether ether ketone or a combination of at least any two;

B film resin adopts any one of solid modified epoxy resin, benzoxazine resin, cyanate resin, POM, benzocyclobutene resin, MPI modified polyimide or at least any combination of two .

Preferably, the B film initiator adopts amine curing agent, acid anhydride curing agent, boron amine complex curing agent, 2,4,6-(N,N-dimethylaminomethyl)-phenol or 2-ethane Base-4 methylimidazole.

Preferably, the curing agent for film A is benzoyl peroxide, di-tert-butyl peroxide or BTW-50.

The preparation method of the copper clad laminate of the present invention first mixes one or more thermoplastic resins (containing an initiator) with low dielectric loss and makes a film, which is called A film; use other one or more functional resins ( Contains curing agent) to make another film, called B film. According to the thickness requirements, design different stack structures, stack at least one piece of A film 1 and at least one piece of B film 2 together, cover the upper side and/or lower side with copper foil 3, and directly solidify after pressing to form a copper clad laminate . In the preparation method of the copper clad laminate, both the A film 1 and the B film 2 are prepared without solvent, and the copper clad laminate preparation process will not pollute the environment due to the volatilization of various organic solvents, which contributes to the improvement of environmental pollution. For copper clad laminates with different thickness requirements, it can be solved by increasing or decreasing the number of different AB film groups, avoiding the preparation of different glass fiber prepregs with different resin contents, thereby reducing costs, saving copper clad laminate preparation processes, and improving copper clad laminate production efficiency. And save energy.

Description of drawings

In order to illustrate the technical solution of the present invention more clearly, the accompanying drawings used in the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, In other words, other drawings can also be obtained from these drawings on the premise of not paying creative work.

FIG. 1 is a schematic diagram of an embodiment of a method for preparing a copper-clad laminate of the present invention.

Explanation of reference signs:

1A film; 2B film; 3 copper foil; 4 glass fiber cloth.

Detailed ways

The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Embodiment one

The copper clad laminate preparation method comprises the following steps:

S1. A film resin and B film initiator are prepared into A film by extrusion casting method (double drawing method) or extrusion calendering method, and B film initiator is contained in A film;

B film resin and A film curing agent are prepared into B film by extrusion casting method (double drawing method) or extrusion calendering method, and B film contains A film curing agent;

The extrusion casting method is to heat, melt and plasticize the resin through an extruder, extrude it through a forming die (it can be a T-shaped structure forming die), cast it on a cooling roll, cool it down and shape it, and then draw it, cut it Winding after the edge, and finally get the film;

The extrusion calendering method is to melt and plasticize the resin, then squeeze and stretch the roller for many times, and then cool and shape it to obtain a film;

S2. As shown in Figure 1, stack at least one piece of A film 1 and at least one piece of B film 2 together, cover the upper side and/or lower side with copper foil 3, and directly solidify after pressing to form a copper clad laminate; The sheet A film 1 is bonded to at least one sheet B film 2, and each sheet B film 2 is bonded to at least one sheet A film 1.

The preparation method of the copper clad laminate in Example 1 is first mixed with one or more thermoplastic resins (containing an initiator) with low dielectric loss and made into a film, called A film; using one or more other functional resins (containing curing agent) to make another film, called B film. According to the thickness requirements, design different stack structures, stack at least one piece of A film 1 and at least one piece of B film 2 together, cover the upper side and/or lower side with copper foil 3, and directly solidify after pressing to form a copper clad laminate .

In the preparation method of the copper clad laminate in Example 1, the preparation of the A film 1 and the B film 2 has no solvent, and the preparation process of the copper clad laminate will not pollute the environment due to the volatilization of various organic solvents, which is conducive to the improvement of environmental pollution. For copper clad laminates with different thickness requirements, it can be solved by increasing or decreasing the number of different AB film groups, avoiding the preparation of different glass fiber prepregs with different resin contents, thereby reducing costs, saving copper clad laminate preparation processes, and improving copper clad laminate production efficiency. And save energy.

Embodiment two

Based on the method for preparing a copper clad laminate in Example 1, in step S2, the copper clad laminate is manufactured by pressing and curing at a temperature of 50-300°C.

Embodiment three

Based on the copper clad laminate preparation method of Example 1, in step S2, in step S2, at least one piece of A film, at least one piece of B film and at least one piece of glass fiber cloth 4 are stacked together, and the two sides of the glass fiber cloth 4 are respectively the same as the A film. Or B film fit.

Preferably, at least two pieces of A film, at least one piece of B film and at least one piece of glass fiber cloth 4 are stacked together, and both sides of the glass fiber cloth 4 are laminated with A film respectively.

Preferably, at least one piece of A film and at least two pieces of B film are stacked together, the upper side and/or the lower side is the B film, and the upper side and/or lower side of the B film covers the copper foil 3 .

Preferably, the thickness of the film A 1 is 0.01-1 mm.

Preferably, the thickness of the B film 2 is 0.01-1 mm.

Preferably, the thickness of the glass fiber cloth 4 is 0.01-1mm.

In the preparation method of the copper-clad laminate in Example 3, the glass fiber cloth 4 is laminated between the adjacent groups A and B films to enhance the rigidity of the prepared copper-clad laminate.

Embodiment Four

Based on the copper-clad laminate preparation method of Example 1, the A-film resin is any one or at least two of PPE, PPO, PPS, PBT, PET, LSP, PC, BT, PMMA, polysulfoneamide or polyetheretherketone The combination.

Preferably, the B film resin adopts any one or at least any one of solid-state modified epoxy resin, benzoxazine resin, cyanate resin, POM, benzocyclobutene resin, MPI modified polyimide A combination of the two.

Preferably, the B film initiator adopts amine curing agent, acid anhydride curing agent, boron amine complex curing agent, 2,4,6-(N,N-dimethylaminomethyl)-phenol or 2-ethane Base-4 methylimidazole and so on.

Preferably, the curing agent for film A is benzoyl peroxide, di-tert-butyl peroxide, BTW-50, etc.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the present invention. within the scope of protection.

Claims (10)

1. The preparation method of the copper-clad plate is characterized by comprising the following steps:

s1, preparing a film A from a film resin A and a film B initiator by adopting an extrusion tape casting method or an extrusion calendaring method, wherein the film A contains the film B initiator;

preparing the film B resin and the film A curing agent into a film B by adopting an extrusion tape casting method or an extrusion calendaring method, wherein the film B contains the film A curing agent;

s2, overlapping at least one film A (1) and at least one film B (2), covering copper foils (3) on the upper side and/or the lower side, and directly curing to prepare a copper-clad plate after lamination; each piece of the film A (1) is attached with at least one piece of the film B (2), and each piece of the film B (2) is attached with at least one piece of the film A (1).

2. The method for preparing the copper-clad plate according to claim 1,

the extrusion casting method comprises the steps of heating, melting and plasticizing resin by an extruder, extruding the resin by a forming die, casting the resin on a cooling roller, cooling and shaping the resin, and then drawing, trimming and rolling the resin to finally obtain a film;

the extrusion calendering method is to melt and plasticize the resin, extrude and extend the resin for multiple times by a roller, and then cool and shape the resin to obtain the film.

3. The method for preparing the copper-clad plate according to claim 1,

and step S2, pressing and curing at the temperature of 50-300 ℃ to prepare the copper-clad plate.

4. The method for preparing the copper-clad plate according to claim 1,

in the step S2, at least one film A, at least one film B and at least one piece of glass fiber cloth (4) are overlapped together, and two sides of the glass fiber cloth (4) are respectively jointed with the film A or the film B.

5. The method for preparing the copper-clad plate according to claim 4,

and (3) overlapping at least two films A, at least one film B and at least one piece of glass fiber cloth (4), wherein two sides of the glass fiber cloth (4) are respectively jointed with the films A.

6. The method for preparing the copper-clad plate according to claim 4,

and laminating at least one film A and at least two films B together, wherein the upper side and/or the lower side is/are provided with the film B, and the upper side and/or the lower side is/are covered with the copper foil (3).

7. The method for preparing the copper-clad plate according to claim 4,

the thickness of the A film (1) is 0.01-1 mm;

the thickness of the film B (2) is 0.01-1 mm;

the thickness of the glass fiber cloth (4) is 0.01-1 mm.

8. The method for preparing the copper-clad plate according to claim 4,

the A film resin adopts any one or the combination of at least any two of PPE, PPO, PPS, PBT, PET, LSP, PC, BT, PMMA, polysulfone amide or polyether ether ketone;

the B film resin adopts any one or the combination of at least any two of solid modified epoxy resin, benzoxazine resin, cyanate resin, POM, benzocyclobutene resin and MPI modified polyimide.

9. The method for preparing the copper-clad plate according to claim 8,

the B film initiator adopts amine curing agent, anhydride curing agent, boron-amine complex curing agent, 2,4,6- (N, N-dimethyl aminomethyl) -phenol or 2-ethyl-4 methylimidazole.

10. The method for preparing the copper-clad plate according to claim 8,

the A film curing agent adopts benzoyl peroxide, di-tert-butyl peroxide or BTW-50.

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