CN110642998A - Epoxy resin composition, curable dry film, cured product and printed circuit board - Google Patents
Epoxy resin composition, curable dry film, cured product and printed circuit board Download PDFInfo
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- CN110642998A CN110642998A CN201910798236.7A CN201910798236A CN110642998A CN 110642998 A CN110642998 A CN 110642998A CN 201910798236 A CN201910798236 A CN 201910798236A CN 110642998 A CN110642998 A CN 110642998A
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- epoxy resin
- resin composition
- dry film
- acrylic acid
- curing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2351/08—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses an epoxy resin composition, a curable dry film, a cured product and a printed circuit board, wherein the epoxy resin composition is prepared by four steps, so that unnecessary production and processing steps are reduced, the production working efficiency of the epoxy resin composition is improved, the preparation material is simple, the manufacturing cost is reduced, equipment is controlled, the labor intensity and the labor cost are reduced, an internal photoinitiator is used for generating free radicals and positive ions in the epoxy resin composition through an external light source during curing, so that the monomer can be well initiated to polymerize, crosslink and cure, the curing is more convenient and convenient, and the internal epoxy resin contains a certain carboxyl group through the modification of bifunctional epoxy resin and acrylic acid, so that the epoxy resin composition has good adhesive force to a copper plate and a PET film, and has good compatibility with other heat-formable acrylic resins, so that the rubber has good reverse impact resistance.
Description
Technical Field
The invention relates to the technical field of production and manufacturing of printed circuit boards, in particular to an epoxy resin composition, a curable dry film, a cured product and a printed circuit board.
Background
Many Polyamideimide (PAI) and Polyimide (PI) resins are currently used in the printed circuit board industry. These can be used as protective coatings for high temperature applications or as thermal barrier coatings for applications requiring good thermal shock or resistance to moist heat. In the manufacturing process of printed circuit boards, screen printing is one of the essential important processes. To achieve fidelity of image reproduction, the ink must have good tack and suitable thixotropy. Viscosity is the internal friction of a liquid, and means the friction force exerted by the liquid in the inner layer when the liquid in one layer slides on the liquid in the other layer under the action of external force. The thick liquid inner layer has larger mechanical resistance when sliding, and the thinner liquid has smaller resistance. The units of viscosity measurement are poise. In particular, the temperature has a significant influence on the viscosity.
The prior epoxy resin composition, a dry film and a cured product thereof and a printed circuit board technology have the following problems: the prior epoxy resin composition can not be well solidified when in use, has low solidification adhesive force, does not have good reverse impact resistance and has high cost when in preparation.
Disclosure of Invention
The invention aims to provide an epoxy resin composition, a dry film and a cured product thereof and a printed circuit board, so as to solve the problems that the existing epoxy resin composition proposed in the background art cannot be well solidified, has low solidification adhesive force, does not have good reverse impact resistance and has high cost in preparation.
In order to achieve the purpose, the invention provides the following technical scheme:
an epoxy resin composition characterized by: the epoxy resin composition comprises bifunctional epoxy resin, a photoinitiator, acrylic acid, a curing agent phenolic resin, a curing accelerator, a composite inorganic filler, a release agent, a coupling agent and a colorant.
An epoxy resin composition, a dry film and a cured product thereof and a printed circuit board, wherein the epoxy resin composition is prepared by the following steps:
the epoxy resin composition comprises bifunctional epoxy resin, photoinitiator, acrylic acid, curing agent phenolic resin, curing accelerator, composite inorganic filler, release agent, coupling agent and colorant;
the method comprises the following steps: taking bifunctional epoxy resin, photoinitiator, acrylic acid, curing agent phenolic resin, curing accelerator, composite inorganic filler, release agent, coupling agent and colorant according to the ratio of 2:1.2:1.5:1.3:0.9:0.7:1.1:0.3:1, wherein the preparation equipment comprises a reaction kettle, a metering device, a temperature control device, a material conveying device and the like.
Step two: the difunctional epoxy resin who will select weighs through metering device, weigh and measure according to the ratio, thereby in carrying reation kettle through material conveyor, later weighing acrylic acid through metering device, in carrying reation kettle through material conveyor, weighing the water source through metering device, make carry reation kettle through material conveyor, later stir, in the time of the stirring, control through outside temperature control device, make and accelerate material reaction rate.
Step three: after the inside material reaction of reation kettle, weigh through metering device to carrying through material conveyor, making and carrying the inside stirring that stirs of reation kettle, after stirring for a certain time, carrying the light-resistant storage device through light-resistant conveyor and saving.
Step four: and then packaging in dark according to needs, and packaging and warehousing.
Preferably, in the second step, the bifunctional epoxy resin is modified with acrylic acid so that it contains a carboxyl group inside.
Preferably, the stirring time in the second step is 1 hour, the internal temperature is controlled at 45 ℃, the stirred and mixed material in the second step can well react with external thermoplastic acrylic resin, the epoxy resin composition prepared in the third step has certain acidity, and the epoxy resin composition prepared in the third step can well react with an external light source.
Preferably, a curable dry film obtained by applying the epoxy resin composition described in claims 1 to 4 to a film and drying.
Preferably, a cured product obtained by photocuring a curable dry film obtained by applying the epoxy resin composition according to claims 1 to 4 to a film and drying the film.
Preferably, a printed circuit board having a surface with a cured dry film is obtained by the steps of:
the method comprises the following steps: firstly, applying the epoxy resin composition as claimed in claims 1 to 4 or applying the epoxy resin composition on a substrate;
step two: providing a dry film of the curable epoxy resin composition formed in one of the above steps;
step three: and finally, curing the dry film by utilizing illumination with certain energy, and finally performing thermocuring to obtain the printed circuit board.
Compared with the prior art, the invention provides an epoxy resin composition, a curable dry film, a cured product and a printed circuit board, which have the following beneficial effects:
1. the epoxy resin composition is produced and prepared through four steps, so that unnecessary production and processing steps are reduced, the production working efficiency of the epoxy resin composition is improved, the preparation material is simple, the manufacturing cost is reduced, the personnel intensity and the labor cost are reduced through equipment control, and the production and preparation are more efficient.
2. In the production and preparation of the epoxy resin composition, the internal photoinitiator is used, so that during curing, free radicals and cations are generated in the epoxy resin composition through an external light source, and thus, the polymerization, crosslinking and curing of monomers can be well initiated, and the curing is more convenient and convenient.
3. The epoxy resin composition has good adhesion to copper plates and PET films and good compatibility with other thermal-molding acrylic resins, so that the epoxy resin composition has good reverse impact resistance.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a technical scheme that:
an epoxy resin composition characterized by: the epoxy resin composition comprises bifunctional epoxy resin, a photoinitiator, acrylic acid, a curing agent phenolic resin, a curing accelerator, a composite inorganic filler, a release agent, a coupling agent and a colorant.
An epoxy resin composition, a dry film and a cured product thereof and a printed circuit board, wherein the epoxy resin composition is prepared by the following steps:
the epoxy resin composition comprises bifunctional epoxy resin, photoinitiator, acrylic acid, curing agent phenolic resin, curing accelerator, composite inorganic filler, release agent, coupling agent and colorant;
the method comprises the following steps: taking bifunctional epoxy resin, photoinitiator, acrylic acid, curing agent phenolic resin, curing accelerator, composite inorganic filler, release agent, coupling agent and colorant according to the ratio of 2:1.2:1.5:1.3:0.9:0.7:1.1:0.3:1, wherein the preparation equipment comprises a reaction kettle, a metering device, a temperature control device, a material conveying device and the like.
Step two: the difunctional epoxy resin who will select weighs through metering device, weigh and measure according to the ratio, thereby in carrying reation kettle through material conveyor, later weighing acrylic acid through metering device, in carrying reation kettle through material conveyor, weighing the water source through metering device, make carry reation kettle through material conveyor, later stir, in the time of the stirring, control through outside temperature control device, make and accelerate material reaction rate.
Step three: after the inside material reaction of reation kettle, weigh through metering device to carrying through material conveyor, making and carrying the inside stirring that stirs of reation kettle, after stirring for a certain time, carrying the light-resistant storage device through light-resistant conveyor and saving.
Step four: and then packaging in dark according to needs, and packaging and warehousing. In the preparation, the production and preparation are carried out through four steps, so that unnecessary production and processing steps are reduced, the production working efficiency of the epoxy resin composition is improved, the preparation material is simple, the manufacturing cost is reduced, the personnel intensity and the labor cost are reduced by controlling the equipment, and the production and preparation are more efficient.
Further, in the second step, the bifunctional epoxy resin is modified with acrylic acid so that the interior contains a carboxyl group. When preparing, through inside stirring and temperature heating for difunctional epoxy carries out modified more high efficiency with acrylic acid, reacts more comprehensively, thereby ensures that inside contains carboxyl quantity, and the carboxyl has fine adhesion strength to outside copper, PET membrane etc. makes adhesion strength more high-efficient, thereby is difficult for droing, uses more convenience like this.
Further, the stirring time in the second step is 1h, and the internal temperature is controlled at 45 ℃. More high-efficient when carrying out the reaction like this, with the inside temperature control of temperature at 45 ℃ moreover for have fine catalytic action, and carry out 1 h's stirring through the inside puddler of reation kettle, make whole reaction faster, thereby improved production efficiency.
Further, the material stirred and mixed in the second step can well react with the external thermoplastic acrylic resin. Thereby satisfy the adhesion of multiple material, react with outside thermoplasticity acrylic resin moreover to make to have fine anti reverse impact performance, make to have fine guard action, difficult emergence is damaged like this, makes to improve holistic life, thereby has fine market competition.
Further, the epoxy resin composition prepared in the third step has certain acidity. Because the epoxy resin composition has certain acidity, the epoxy resin composition can well react with external weak alkalinity, so that the epoxy resin composition is more convenient to remove a film by weak alkali, and is convenient to recycle.
Furthermore, the epoxy resin composition prepared in the third step can well react with an external light source. Therefore, the curing is more convenient, and during the curing, free radicals and cations are generated inside the epoxy resin composition through an external light source, so that the polymerization, crosslinking and curing of monomers can be well initiated, and the curing is more convenient and convenient.
Further, a curable dry film obtained by applying an epoxy resin composition to a film and drying the same.
Further, a cured product obtained by photocuring a curable dry film obtained by applying an epoxy resin composition to a film and drying the film.
Further, a printed circuit board having a cured dry film on a surface thereof, the cured dry film being obtained by the steps of:
the method comprises the following steps: firstly, applying an epoxy resin composition on a substrate, or applying the epoxy resin composition;
step two: providing a dry film of the curable epoxy resin composition formed in one of the above steps;
step three: and finally, curing the dry film by utilizing illumination with certain energy, and finally performing thermocuring to obtain the printed circuit board.
The working principle and the using process of the invention are as follows: when the epoxy resin composition is used, due to the fact that the bifunctional epoxy resin and the acrylic acid are modified when the printing ink is prepared, the bifunctional epoxy resin and the acrylic acid contain certain carboxyl inside, the bifunctional epoxy resin and the acrylic acid can be well attached to external copper and PET films, the attaching force is high in efficiency, the bifunctional epoxy resin composition is not prone to falling off, and the bifunctional epoxy resin composition is convenient to use. During curing, the epoxy resin composition contains the photoinitiator, so that the epoxy resin composition is irradiated by an external light source during curing, the reaction of the photoinitiator is performed in the epoxy resin composition, free radicals and cations are generated, the polymerization, crosslinking and curing of monomers can be well initiated, and the curing is more convenient and convenient. When the damaged printed circuit board needs to be recycled by personnel, the epoxy resin composition has certain acidity, so that the epoxy resin composition can well react with external weak alkalinity, and is more convenient to recycle when the weak base film is removed.
The epoxy resin composition is prepared by the epoxy resin composition preparation steps, and the epoxy resin composition preparation steps are as follows:
the method comprises the following steps: taking bifunctional epoxy resin, photoinitiator, acrylic acid, curing agent phenolic resin, curing accelerator, composite inorganic filler, release agent, coupling agent and colorant according to the ratio of 2:1.2:1.5:1.3:0.9:0.7:1.1:0.3:1, wherein the preparation equipment comprises a reaction kettle, a metering device, a temperature control device, a material conveying device and the like.
Step two: the difunctional epoxy resin who will select weighs through metering device, weigh and measure according to the ratio, thereby in carrying reation kettle through material conveyor, later weighing acrylic acid through metering device, in carrying reation kettle through material conveyor, weighing the water source through metering device, make carry reation kettle through material conveyor, later stir, in the time of the stirring, control through outside temperature control device, make and accelerate material reaction rate.
Step three: after the inside material reaction of reation kettle, weigh through metering device to carrying through material conveyor, making and carrying the inside stirring that stirs of reation kettle, after stirring for a certain time, carrying the light-resistant storage device through light-resistant conveyor and saving.
Step four: and then packaging in dark according to needs, and packaging and warehousing. In the preparation, the production preparation is carried out through four steps, so that the production working efficiency of the epoxy resin composition is improved, the ink material is simple to prepare, the manufacturing cost is reduced, the control is carried out through equipment, the personnel intensity and the labor cost are reduced, the production preparation is more efficient, the whole epoxy resin composition is good in photosensitivity and excellent in hole covering capacity, a thinner dry film can be prepared, and the market competitiveness is good.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. An epoxy resin composition characterized by: the epoxy resin composition comprises bifunctional epoxy resin, a photoinitiator, acrylic acid, a curing agent phenolic resin, a curing accelerator, a composite inorganic filler, a release agent, a coupling agent and a colorant.
2. The epoxy resin composition according to claim 1, wherein: the epoxy resin composition was prepared as follows:
the method comprises the following steps: taking bifunctional epoxy resin, photoinitiator, acrylic acid, curing agent phenolic resin, curing accelerator, composite inorganic filler, release agent, coupling agent and colorant according to the ratio of 2:1.2:1.5:1.3:0.9:0.7:1.1:0.3:1, wherein the preparation equipment comprises a reaction kettle, a metering device, a temperature control device, a material conveying device and the like;
step two: weighing the selected difunctional epoxy resin by a metering device, weighing according to the proportion, conveying the difunctional epoxy resin into a reaction kettle by a material conveying device, then weighing acrylic acid by the metering device, conveying the acrylic acid into the reaction kettle by the material conveying device, weighing a water source by the metering device, conveying the acrylic acid into the reaction kettle by the material conveying device, then stirring, and controlling by an external temperature control device during stirring to accelerate the material reaction speed;
step three: after the materials in the reaction kettle react, the materials are weighed through the metering device, and are conveyed through the material conveying device, so that the materials are conveyed into the reaction kettle to be stirred, and after the materials are stirred for a certain time, the materials are conveyed into the light-proof storage device through the light-proof conveying device to be stored;
step four: and then packaging in dark according to needs, and packaging and warehousing.
3. The epoxy resin composition according to claim 1, wherein: the two-functional epoxy resin and the acrylic acid are modified in the second step, so that carboxyl is contained in the epoxy resin, the stirring time in the second step is 1h, the internal temperature is controlled at 45 ℃, the stirred and mixed material in the second step can well react with external thermoplastic acrylic resin, the epoxy resin composition prepared in the third step has certain acidity, and the epoxy resin composition prepared in the third step can well react with an external light source.
4. A curable dry film obtained by applying the epoxy resin composition according to claims 1 to 3 to a film and drying the same.
5. A cured product obtained by photocuring a curable dry film obtained by applying the epoxy resin composition described in claims 1 to 3 to a film and drying the film.
6. A printed circuit board having a surface with a cured dry film, said cured dry film obtained by the steps of:
the method comprises the following steps: firstly, applying the epoxy resin composition as claimed in claims 1 to 4 or applying the epoxy resin composition on a substrate;
step two: providing a dry film of the curable epoxy resin composition formed in one of the above steps;
step three: and finally, curing the dry film by utilizing illumination with certain energy, and finally performing thermocuring to obtain the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910798236.7A CN110642998A (en) | 2019-08-27 | 2019-08-27 | Epoxy resin composition, curable dry film, cured product and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910798236.7A CN110642998A (en) | 2019-08-27 | 2019-08-27 | Epoxy resin composition, curable dry film, cured product and printed circuit board |
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| CN110642998A true CN110642998A (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910798236.7A Pending CN110642998A (en) | 2019-08-27 | 2019-08-27 | Epoxy resin composition, curable dry film, cured product and printed circuit board |
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| CN (1) | CN110642998A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115847954A (en) * | 2022-12-20 | 2023-03-28 | 宁波甬强科技有限公司 | Preparation method of copper-clad plate |
| TWI865304B (en) * | 2023-02-08 | 2024-12-01 | 南韓商Ｋｃｃ股份有限公司 | Resin composition for solder resist |
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2019
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| CN107207837A (en) * | 2015-01-21 | 2017-09-26 | 太阳油墨制造株式会社 | Hot curing resin composition, dry film, solidfied material and printed circuit board (PCB) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115847954A (en) * | 2022-12-20 | 2023-03-28 | 宁波甬强科技有限公司 | Preparation method of copper-clad plate |
| TWI865304B (en) * | 2023-02-08 | 2024-12-01 | 南韓商Ｋｃｃ股份有限公司 | Resin composition for solder resist |
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Application publication date: 20200103 |