CN104312269A - Ultraviolet curing solder resist ink for printed circuit board - Google Patents
Ultraviolet curing solder resist ink for printed circuit board Download PDFInfo
- Publication number
- CN104312269A CN104312269A CN201410583363.2A CN201410583363A CN104312269A CN 104312269 A CN104312269 A CN 104312269A CN 201410583363 A CN201410583363 A CN 201410583363A CN 104312269 A CN104312269 A CN 104312269A
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- parts
- ultraviolet light
- solder mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of printing ink and particularly relates to ultraviolet curing solder resist ink for a printed circuit board. The ultraviolet curing solder resist ink for the printed circuit board is prepared from the following raw materials in parts by weight: 50-60 parts of self-made carboxylated epoxy acrylate resin, 1-2 parts of pigments, 2-5 parts of a photopolymerization initiator, 10-20 parts of a reactive diluent and 1-5 parts of auxiliaries. According to the ultraviolet curing solder resist ink for the printed circuit board, carboxyl is introduced to self-made epoxy acrylate resin, so that the synthesized photosensitive resin has solubility in a sodium carbonate solution. The solder resist ink provided by the invention has high photocuring plastic and film adhesive force and low alkaline solubility and is suitable for preparing various printed circuit boards with high standard requirements.
Description
Technical field
The present invention relates to technical field of ink, particularly relate to a kind of use in printed circuit board ultraviolet light polymerization solder mask.
Background technology
Ultraviolet light polymerization solder mask is the first-selected ink of printed circuit board (PCB) (PCB), use ultraviolet light polymerization solder mask can print high-density, high precision, high performance circuit card, adaptive circuit board industry is to future developments such as two-sided, the multilayer printed circuit board of high definition and flexibilities.
Ultraviolet light polymerization solder mask is a kind of photo-thermal curing liquid alkali developing resin combination, be made up of alkali soluble resins, light trigger, thinner, pigment, filler and other auxiliary agent etc., wherein alkali soluble resins is matrix resin, and the caustic solubility, sticking power, cure times etc. of its product confrontation ultraviolet light polymerization solder mask have material impact.
Along with development in science and technology, the continuous increase of electronics manufacturing demand, quality requirements for printed circuit board (PCB) constantly rises, and is therefore badly in need of low, the high performance ultraviolet light polymerization solder mask application of a kind of cost on a printed circuit, improves quality of circuit board further.
Summary of the invention
The present invention is directed to above-mentioned background technology, a kind of use in printed circuit board ultraviolet light polymerization solder mask is provided.
For realizing the object of the invention, the technical solution used in the present invention is as follows:
A kind of use in printed circuit board ultraviolet light polymerization solder mask, is characterized in that: count by weight, is prepared from by following raw material: make carboxylated Epocryl by oneself: 50 ~ 60 parts; Pigment: 1 ~ 2 part; Photoepolymerizationinitiater initiater: 2 ~ 5 parts; Reactive thinner: 10 ~ 20 parts; Auxiliary agent: 1 ~ 5 part;
The carboxylated Epocryl of described self-control is prepared from by following steps: by Epocryl and methyl-silicone oil solvent, be heated to 70 ~ 80 DEG C, maintain 20 ~ 30min, add Resorcinol, N again, N-bis-Jia Ji Benzyl amine, benzoyl oxide, maleic anhydride, succinyl oxide, methyl tetrahydrochysene benzoic anhydride, be mixed and heated to 80 ~ 90 DEG C, maintain 2 ~ 3h, to obtain final product.
Further, described a kind of use in printed circuit board ultraviolet light polymerization solder mask is counted by weight, is prepared from: make carboxylated Epocryl by oneself: 55 parts by following raw material; Pigment: 1 part; Photoepolymerizationinitiater initiater: 5 parts; Reactive thinner: 15 parts; Auxiliary agent: 3 parts.
Further, described reactive thinner is isobornyl acrylate or isobornyl methacrylate.
Further, described Photoepolymerizationinitiater initiater is 1-hydroxycyclohexyl phenyl ketone, 2,2 '-diethoxy acetophenone or said mixture.
Further, described auxiliary agent is two (1,2,2,6,6-pentamethyl--4-piperidines) sebates.
Present invention also offers a kind of making method of above-mentioned a kind of use in printed circuit board ultraviolet light polymerization solder mask, comprise the following steps: carboxylated Epocryl, pigment, reactive thinner, auxiliary agent will be made by oneself, abundant mixing is also heated to 30 ~ 50 DEG C of stirring 10 ~ 30min, add Photoepolymerizationinitiater initiater again, stir, then leave standstill cooling and get final product.
The invention provides a kind of use in printed circuit board ultraviolet light polymerization solder mask, beneficial effect is as follows:
A kind of use in printed circuit board ultraviolet light polymerization of the present invention solder mask, introduces carboxyl from Epocryl, makes the photosensitive resin of synthesis have solvability in sodium carbonate solution.Solder mask of the present invention possesses high photocuring plastics, high paint film adhesion and low caustic solubility, is applicable to the print circuit plates making of various high standard demand.
Embodiment
Below in conjunction with embodiment, the present invention will be further described.
Embodiment 1:
Described a kind of use in printed circuit board ultraviolet light polymerization solder mask is counted by weight, is prepared from: make carboxylated Epocryl by oneself: 55 parts by following raw material; Pigment: 1 part; 1-hydroxycyclohexyl phenyl ketone: 5 parts; Isobornyl acrylate: 15 parts; Two (1,2,2,6,6-pentamethyl--4-piperidines) sebate: 3 parts.
The carboxylated Epocryl of described self-control is prepared from by following steps: by Epocryl and methyl-silicone oil solvent, be heated to 70 DEG C, maintain 20min, add Resorcinol, N again, N-bis-Jia Ji Benzyl amine, benzoyl oxide, maleic anhydride, succinyl oxide, methyl tetrahydrochysene benzoic anhydride, be mixed and heated to 80 DEG C, maintain 2h, to obtain final product.
Carboxylated Epocryl, pigment, isobornyl acrylate, two (1 will be made by oneself, 2,2,6,6-pentamethyl--4-piperidines) sebate, fully mix and be heated to 30 DEG C and stir 10min, then add 1-hydroxycyclohexyl phenyl ketone, stir, then leave standstill cooling and namely obtain a kind of use in printed circuit board ultraviolet light polymerization solder mask.
Embodiment 2:
Described a kind of use in printed circuit board ultraviolet light polymerization solder mask is counted by weight, is prepared from: make carboxylated Epocryl by oneself: 60 parts by following raw material; Pigment: 2 parts; 2,2 '-diethoxy acetophenone: 4 parts; Isobornyl methacrylate: 18 parts; Two (1,2,2,6,6-pentamethyl--4-piperidines) sebate: 5 parts.
The carboxylated Epocryl of described self-control is prepared from by following steps: by Epocryl and methyl-silicone oil solvent, be heated to 80 DEG C, maintain 30min, add Resorcinol, N again, N-bis-Jia Ji Benzyl amine, benzoyl oxide, maleic anhydride, succinyl oxide, methyl tetrahydrochysene benzoic anhydride, be mixed and heated to 90 DEG C, maintain 3h, to obtain final product.
Carboxylated Epocryl, pigment, isobornyl methacrylate, two (1 will be made by oneself, 2,2,6,6-pentamethyl--4-piperidines) sebate, fully mix and be heated to 50 DEG C and stir 30min, add 2 again, 2 '-diethoxy acetophenone, stirs, and then leaves standstill cooling and namely obtains a kind of use in printed circuit board ultraviolet light polymerization solder mask.
Claims (6)
1. a use in printed circuit board ultraviolet light polymerization solder mask, is characterized in that: count by weight, is prepared from by following raw material: make carboxylated Epocryl by oneself: 50 ~ 60 parts; Pigment: 1 ~ 2 part; Photoepolymerizationinitiater initiater: 2 ~ 5 parts; Reactive thinner: 10 ~ 20 parts; Auxiliary agent: 1 ~ 5 part;
The carboxylated Epocryl of described self-control is prepared from by following steps: by Epocryl and methyl-silicone oil solvent, be heated to 70 ~ 80 DEG C, maintain 20 ~ 30min, add Resorcinol, N again, N-bis-Jia Ji Benzyl amine, benzoyl oxide, maleic anhydride, succinyl oxide, methyl tetrahydrochysene benzoic anhydride, be mixed and heated to 80 ~ 90 DEG C, maintain 2 ~ 3h, to obtain final product.
2. a kind of use in printed circuit board ultraviolet light polymerization solder mask according to claim 1, it is characterized in that: described a kind of use in printed circuit board ultraviolet light polymerization solder mask is counted by weight, is prepared from: make carboxylated Epocryl by oneself: 55 parts by following raw material; Pigment: 1 part; Photoepolymerizationinitiater initiater: 5 parts; Reactive thinner: 15 parts; Auxiliary agent: 3 parts.
3. a kind of use in printed circuit board ultraviolet light polymerization solder mask according to claim 1, is characterized in that: described reactive thinner is isobornyl acrylate or isobornyl methacrylate.
4. a kind of use in printed circuit board ultraviolet light polymerization solder mask according to claim 1, is characterized in that: described Photoepolymerizationinitiater initiater is 1-hydroxycyclohexyl phenyl ketone, 2,2 '-diethoxy acetophenone or said mixture.
5. a kind of use in printed circuit board ultraviolet light polymerization solder mask according to claim 1, is characterized in that: described auxiliary agent is two (1,2,2,6,6-pentamethyl--4-piperidines) sebate.
6. a kind of use in printed circuit board ultraviolet light polymerization solder mask according to claim 1, it is characterized in that: the making method of described a kind of use in printed circuit board ultraviolet light polymerization solder mask, comprise the following steps: carboxylated Epocryl, pigment, reactive thinner, auxiliary agent will be made by oneself, abundant mixing is also heated to 30 ~ 50 DEG C of stirring 10 ~ 30min, add Photoepolymerizationinitiater initiater again, stir, then leave standstill cooling and get final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410583363.2A CN104312269A (en) | 2014-10-28 | 2014-10-28 | Ultraviolet curing solder resist ink for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410583363.2A CN104312269A (en) | 2014-10-28 | 2014-10-28 | Ultraviolet curing solder resist ink for printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN104312269A true CN104312269A (en) | 2015-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410583363.2A Pending CN104312269A (en) | 2014-10-28 | 2014-10-28 | Ultraviolet curing solder resist ink for printed circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105153798A (en) * | 2015-10-23 | 2015-12-16 | 陈锦 | Photocuring solder-resistant ink |
| CN106496522A (en) * | 2016-10-10 | 2017-03-15 | 中科院广州化学有限公司南雄材料生产基地 | A kind of alkali solubility light-cured epoxy acrylate and preparation method and its etching resisting ink |
| CN110845909A (en) * | 2019-11-21 | 2020-02-28 | 珠海宏博电子科技有限公司 | Photosensitive solder resist white oil and preparation method thereof |
| CN111925127A (en) * | 2020-04-03 | 2020-11-13 | 田菱智能科技(昆山)有限公司 | Printing ink process for curved surface special-shaped screen glass, and preparation method and application thereof |
| CN111961365A (en) * | 2020-07-20 | 2020-11-20 | 佛山市鑫正化工有限公司 | Solder mask ink, preparation method thereof and circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103676476A (en) * | 2012-09-05 | 2014-03-26 | 株式会社田村制作所 | Black solidification resin composition and printed wiring substrate obtained through utilizing the black solidification resin composition |
-
2014
- 2014-10-28 CN CN201410583363.2A patent/CN104312269A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103676476A (en) * | 2012-09-05 | 2014-03-26 | 株式会社田村制作所 | Black solidification resin composition and printed wiring substrate obtained through utilizing the black solidification resin composition |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105153798A (en) * | 2015-10-23 | 2015-12-16 | 陈锦 | Photocuring solder-resistant ink |
| CN105153798B (en) * | 2015-10-23 | 2019-04-30 | 江苏泰特尔新材料科技有限公司 | A kind of photocurable solder resist ink |
| CN106496522A (en) * | 2016-10-10 | 2017-03-15 | 中科院广州化学有限公司南雄材料生产基地 | A kind of alkali solubility light-cured epoxy acrylate and preparation method and its etching resisting ink |
| CN106496522B (en) * | 2016-10-10 | 2018-11-09 | 中科院广州化学有限公司南雄材料生产基地 | A kind of alkali solubility light-cured epoxy acrylate and preparation method and its etching resisting ink |
| CN110845909A (en) * | 2019-11-21 | 2020-02-28 | 珠海宏博电子科技有限公司 | Photosensitive solder resist white oil and preparation method thereof |
| CN111925127A (en) * | 2020-04-03 | 2020-11-13 | 田菱智能科技(昆山)有限公司 | Printing ink process for curved surface special-shaped screen glass, and preparation method and application thereof |
| CN111961365A (en) * | 2020-07-20 | 2020-11-20 | 佛山市鑫正化工有限公司 | Solder mask ink, preparation method thereof and circuit board |
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Application publication date: 20150128 |
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