CN111961365A - Solder mask ink, preparation method thereof and circuit board - Google Patents
Solder mask ink, preparation method thereof and circuit board Download PDFInfo
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- CN111961365A CN111961365A CN202010697022.3A CN202010697022A CN111961365A CN 111961365 A CN111961365 A CN 111961365A CN 202010697022 A CN202010697022 A CN 202010697022A CN 111961365 A CN111961365 A CN 111961365A
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- solder mask
- photoinitiator
- acrylic resin
- mask ink
- agent
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 60
- 238000002360 preparation method Methods 0.000 title abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 67
- 238000004383 yellowing Methods 0.000 claims abstract description 60
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 58
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 58
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 41
- 239000000945 filler Substances 0.000 claims abstract description 35
- 239000000178 monomer Substances 0.000 claims abstract description 35
- 239000000049 pigment Substances 0.000 claims abstract description 35
- 239000002904 solvent Substances 0.000 claims abstract description 35
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000004593 Epoxy Substances 0.000 claims abstract description 25
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 20
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000012752 auxiliary agent Substances 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- 239000004408 titanium dioxide Substances 0.000 claims description 10
- 238000005303 weighing Methods 0.000 claims description 10
- 239000002518 antifoaming agent Substances 0.000 claims description 9
- 239000013538 functional additive Substances 0.000 claims description 9
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 8
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 8
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical group C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 7
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 claims description 5
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 17
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 34
- 239000006185 dispersion Substances 0.000 description 8
- 229920000058 polyacrylate Polymers 0.000 description 8
- 239000002253 acid Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
Abstract
The invention is suitable for the technical field of circuit board processing, and provides solder mask ink, a preparation method thereof and a circuit board, wherein the solder mask ink comprises the following components: epoxy acrylic resin, carboxyl acrylic resin, an ultraviolet curing monomer, a solvent, a photoinitiator, triglycidyl isocyanurate, an anti-yellowing agent, a functional assistant and pigment filler. After being baked and cured, the solder mask ink provided by the invention has the characteristics of high hardness, difficult yellowing, thick printing, strong covering power, strong pattern stereoscopic impression, good glossiness and the like, and is very suitable for surface spraying of flexible circuit boards such as LED lamps and the like; in addition, the raw materials of the solder mask ink are selected to meet the standards of rohs, reach, HF and the like, and the solder mask ink can be widely applied to the industry of circuit board production and meets the control requirement of harmful substances in electronic factories.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to solder mask ink, a preparation method of the solder mask ink and a circuit board.
Background
White solder mask printing ink that coats on the positive and negative surface of LED lamp aluminium base board not only can play insulating, hinder and weld, the effect of protection circuit, but also can fully reflect LED light for the LED lamp is brighter, more energy-conserving, and does not influence light colour, makes the apparent clean. Therefore, when manufacturing a flexible circuit board such as a lamp strip, the surface of the circuit board is required to be printed with white ink which has the characteristics of high brightness, high temperature resistance, acid and alkali resistance, bending resistance, high light reflection rate and the like, so that the white ink can be applied to various environments outdoors and indoors.
However, the liquid photosensitive anti-welding white ink on the market generally has the problems of yellowing after baking, insufficient white color or insufficient surface hardness, pencil marks easily generated and the like. Therefore, the development of a solder mask ink which has high hardness, scratch resistance and difficult yellowing is urgently needed to meet the production and processing requirements of circuit boards.
Disclosure of Invention
An object of an embodiment of the present invention is to provide a solder mask ink, which is to solve the problems in the background art.
The embodiment of the invention is realized in such a way that the solder mask ink comprises the following components in percentage by mass: 20-40% of epoxy acrylic resin, 5-20% of carboxyl acrylic resin, 3-10% of ultraviolet curing monomer, 2-8% of solvent, 1-5% of photoinitiator, 1-5% of triglycidyl isocyanurate, 0.1-2% of anti-yellowing agent, 1-5% of functional additive and the balance of pigment and filler, wherein the sum of the mass percentages of the components is 100%.
As a preferable scheme of the embodiment of the invention, the solder mask ink comprises the following components in percentage by mass: 25-35% of epoxy acrylic resin, 10-15% of carboxyl acrylic resin, 5-8% of ultraviolet curing monomer, 4-6% of solvent, 2-4% of photoinitiator, 2-4% of triglycidyl isocyanurate, 0.5-1.5% of anti-yellowing agent, 2-4% of functional additive and the balance of pigment and filler, wherein the sum of the mass percentages of the components is 100%.
As another preferable mode of the embodiment of the present invention, the uv curable monomer is dipentaerythritol hexaacrylate and/or trimethylolpropane triacrylate.
As another preferable mode of the embodiment of the present invention, the solvent is at least one of a dibasic ester, dipropylene glycol methyl ether and propylene glycol methyl ether.
As another preferred aspect of the embodiment of the present invention, the photoinitiator is at least one of a TPO photoinitiator, a 819 photoinitiator, a MBF photoinitiator, and a 1173 photoinitiator.
In another preferred embodiment of the invention, the anti-yellowing agent is at least one of v76-p anti-yellowing agent, v85-p anti-yellowing agent, 1216 anti-yellowing agent and B24N 03 ultraviolet stabilizer.
As another preferable scheme of the embodiment of the present invention, the functional auxiliary is at least one of an antifoaming agent, a leveling agent, a flow blocking agent, and a dispersing agent; the pigment and filler is at least one of talcum powder, silicon dioxide and titanium dioxide.
Another object of an embodiment of the present invention is to provide a method for preparing the solder mask ink, which includes the following steps:
weighing epoxy acrylic resin, carboxyl acrylic resin, an ultraviolet curing monomer, a solvent, a photoinitiator, triglycidyl isocyanurate, an anti-yellowing agent, a functional auxiliary agent and pigment filler according to the mass percentage for later use;
mixing epoxy acrylic resin, carboxyl acrylic resin, an ultraviolet curing monomer, a solvent, a photoinitiator, triglycidyl isocyanurate, an anti-yellowing agent, a functional assistant and pigment and filler, and then grinding and dispersing to obtain the solder mask ink.
The embodiment of the invention also aims to provide the solder mask ink prepared by the preparation method.
It is another object of an embodiment of the present invention to provide a circuit board, the surface of which is coated with solder mask ink as described above.
After baking and curing, the solder mask ink provided by the embodiment of the invention has the characteristics of high hardness, difficult yellowing, thick printing, strong hiding power, strong pattern stereoscopic impression, good glossiness and the like, and is very suitable for surface spraying of flexible circuit boards such as LED lamps and the like; in addition, the raw materials of the solder mask ink are selected to meet the standards of rohs, reach, HF and the like, and the solder mask ink can be widely applied to the industry of circuit board production and meets the control requirement of harmful substances in electronic factories.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
The embodiment provides solder mask ink, and the preparation method of the solder mask ink comprises the following steps:
s1, weighing 200g of epoxy acrylic resin, 200g of carboxyl acrylic resin, 30g of ultraviolet curing monomer, 20g of solvent, 10g of photoinitiator, 50g of triglycidyl isocyanurate, 1g of anti-yellowing agent, 10g of functional assistant and 479g of pigment filler for later use; wherein, the carboxyl acrylic resin is common polyacrylate containing carboxyl on the market; the ultraviolet curing monomer is commercially available dipentaerythritol hexaacrylate; the solvent is a divalent acid ester sold in the market; the photoinitiator is a commercial TPO photoinitiator; the anti-yellowing agent is a v76-p anti-yellowing agent sold in Nanxiong Zhi-chemical industry; the functional auxiliary agent is a defoaming agent sold in German Bike chemical markets; the pigment and filler comprise 129g of talcum powder and 350g of titanium dioxide.
S2, mixing the weighed epoxy acrylic resin, carboxyl acrylic resin, ultraviolet curing monomer, solvent, photoinitiator, triglycidyl isocyanurate, anti-yellowing agent, functional assistant and pigment and filler, and repeatedly and sequentially placing the mixture in a grinder and a dispersion machine for grinding and dispersing for 2 times to obtain the white solder resist ink.
Example 2
The embodiment provides solder mask ink, and the preparation method of the solder mask ink comprises the following steps:
s1, weighing 400g of epoxy acrylic resin, 50g of carboxyl acrylic resin, 100g of ultraviolet curing monomer, 80g of solvent, 50g of photoinitiator, 10g of triglycidyl isocyanurate, 20g of anti-yellowing agent, 50g of functional additive and 240g of pigment filler for later use; wherein, the carboxyl acrylic resin is common polyacrylate containing carboxyl on the market; the ultraviolet curing monomer is commercial trimethylolpropane triacrylate; the solvent is the commercial dipropylene glycol methyl ether; the photoinitiator is a 819 available photoinitiator; the anti-yellowing agent is a v85-p anti-yellowing agent sold in Nanxiong Zhi-chemical industry; the functional auxiliary agent is a mixture of a defoaming agent, a leveling agent, a flow resisting agent and a dispersing agent which are commercially available from Bike chemical Germany and are mixed according to equal mass ratio; the pigment and filler is titanium dioxide.
S2, mixing the weighed epoxy acrylic resin, carboxyl acrylic resin, ultraviolet curing monomer, solvent, photoinitiator, triglycidyl isocyanurate, anti-yellowing agent, functional assistant and pigment and filler, and repeatedly and sequentially placing the mixture in a grinder and a dispersion machine for grinding and dispersing for 3 times to obtain the white solder resist ink.
Example 3
The embodiment provides solder mask ink, and the preparation method of the solder mask ink comprises the following steps:
s1, weighing 240g of epoxy acrylic resin, 160g of carboxyl acrylic resin, 40g of ultraviolet curing monomer, 60g of solvent, 20g of photoinitiator, 20g of triglycidyl isocyanurate, 5g of anti-yellowing agent, 20g of functional additive and 435g of pigment filler for later use; wherein, the carboxyl acrylic resin is common polyacrylate containing carboxyl on the market; the ultraviolet curing monomer is a mixture of commercially available dipentaerythritol hexaacrylate and trimethylolpropane triacrylate according to equal mass ratio; the solvent is a mixture of commercially available dipropylene glycol methyl ether and propylene glycol methyl ether which are mixed according to equal mass ratio; the photoinitiator is a mixture of a commercial MBF photoinitiator and a 1173 photoinitiator which are mixed according to equal mass ratio; the anti-yellowing agent is a mixture of a commercially available 1216 anti-yellowing agent and a basf B24N 03 ultraviolet stabilizer which are mixed according to equal mass ratio; the functional auxiliary agent is a mixture of a leveling agent and a dispersing agent which are sold in German Bike chemical markets and are mixed according to equal mass ratio; the pigment and filler comprises 135g of silicon dioxide and 300g of titanium dioxide.
S2, mixing the weighed epoxy acrylic resin, carboxyl acrylic resin, ultraviolet curing monomer, solvent, photoinitiator, triglycidyl isocyanurate, anti-yellowing agent, functional assistant and pigment and filler, and repeatedly and sequentially placing the mixture in a grinder and a dispersion machine for grinding and dispersing for 2 times to obtain the white solder resist ink.
Example 4
The embodiment provides solder mask ink, and the preparation method of the solder mask ink comprises the following steps:
s1, weighing 380g of epoxy acrylic resin, 170g of carboxyl acrylic resin, 80g of ultraviolet curing monomer, 30g of solvent, 40g of photoinitiator, 25g of triglycidyl isocyanurate, 17g of anti-yellowing agent, 40g of functional assistant and 218g of pigment filler for later use; wherein, the carboxyl acrylic resin is common polyacrylate containing carboxyl on the market; the ultraviolet curing monomer is commercially available dipentaerythritol hexaacrylate; the solvent is propylene glycol methyl ether which is commercially available; the photoinitiator is a mixture of a commercially available TPO photoinitiator, a 819 photoinitiator, an MBF photoinitiator and a 1173 photoinitiator which are mixed according to equal mass ratio; the anti-yellowing agent is a mixture of a commercially available Nanxiong Zhi-chemical v76-p anti-yellowing agent, a v85-p anti-yellowing agent, a 1216 anti-yellowing agent and a basf B24N 03 ultraviolet stabilizer which are mixed according to equal mass ratio; the functional auxiliary agent is a mixture of a defoaming agent, a leveling agent, a flow resisting agent and a dispersing agent which are commercially available from Bike chemical Germany and are mixed according to equal mass ratio; the pigment and filler is titanium dioxide.
S2, mixing the weighed epoxy acrylic resin, carboxyl acrylic resin, ultraviolet curing monomer, solvent, photoinitiator, triglycidyl isocyanurate, anti-yellowing agent, functional assistant and pigment and filler, and repeatedly and sequentially placing the mixture in a grinder and a dispersion machine for grinding and dispersing for 3 times to obtain the white solder resist ink.
Example 5
The embodiment provides solder mask ink, and the preparation method of the solder mask ink comprises the following steps:
s1, weighing 250g of epoxy acrylic resin, 100g of carboxyl acrylic resin, 50g of ultraviolet curing monomer, 40g of solvent, 20g of photoinitiator, 20g of triglycidyl isocyanurate, 5g of anti-yellowing agent, 20g of functional additive and 495g of pigment filler for later use; wherein, the carboxyl acrylic resin is common polyacrylate containing carboxyl on the market; the ultraviolet curing monomer is commercial trimethylolpropane triacrylate; the solvent is the commercial dipropylene glycol methyl ether; the photoinitiator is a commercial 1173 photoinitiator; the anti-yellowing agent is a mixture of a commercially available Nanxiong Zhi-chemical v76-p anti-yellowing agent and a v85-p anti-yellowing agent which are mixed according to equal mass ratio; the functional auxiliary agent is a mixture of a defoaming agent and a leveling agent which are sold in German Bike chemical markets and are mixed according to the mass ratio; the pigment and filler comprise 45g of talcum powder, 100g of silicon dioxide and 350g of titanium dioxide.
S2, mixing the weighed epoxy acrylic resin, carboxyl acrylic resin, ultraviolet curing monomer, solvent, photoinitiator, triglycidyl isocyanurate, anti-yellowing agent, functional assistant and pigment and filler, and repeatedly and sequentially placing the mixture in a grinder and a dispersion machine for grinding and dispersing for 3 times to obtain the white solder resist ink.
Example 6
The embodiment provides solder mask ink, and the preparation method of the solder mask ink comprises the following steps:
s1, weighing 350g of epoxy acrylic resin, 150g of carboxyl acrylic resin, 80g of ultraviolet curing monomer, 60g of solvent, 40g of photoinitiator, 40g of triglycidyl isocyanurate, 15g of anti-yellowing agent, 40g of functional assistant and 225g of pigment filler for later use; wherein, the carboxyl acrylic resin is common polyacrylate containing carboxyl on the market; the ultraviolet curing monomer is a mixture of commercially available dipentaerythritol hexaacrylate and trimethylolpropane triacrylate according to equal mass ratio; the solvent is a mixture of a commercially available dibasic ester, dipropylene glycol methyl ether and propylene glycol methyl ether which are mixed according to equal mass ratio; the photoinitiator is a mixture of a commercially available TPO photoinitiator, a 819 photoinitiator and a 1173 photoinitiator which are mixed according to equal mass ratio; the anti-yellowing agent is a mixture of a commercially available Nanxiong Zhi-chemical v76-p anti-yellowing agent, a v85-p anti-yellowing agent and a BASF B24N 03 ultraviolet stabilizer which are mixed according to equal mass ratio; the functional auxiliary agent is a mixture of a defoaming agent, a leveling agent and a flow resisting agent which are commercially available from Bike chemical Germany and are mixed according to equal mass ratio; the pigment and filler is titanium dioxide.
S2, mixing the weighed epoxy acrylic resin, carboxyl acrylic resin, ultraviolet curing monomer, solvent, photoinitiator, triglycidyl isocyanurate, anti-yellowing agent, functional assistant and pigment and filler, and repeatedly and sequentially placing the mixture in a grinder and a dispersion machine for grinding and dispersing for 3 times to obtain the white solder resist ink.
Example 7
The embodiment provides solder mask ink, and the preparation method of the solder mask ink comprises the following steps:
s1, weighing 320g of epoxy acrylic resin, 120g of carboxyl acrylic resin, 60g of ultraviolet curing monomer, 45g of solvent, 25g of photoinitiator, 25g of triglycidyl isocyanurate, 12g of anti-yellowing agent, 30g of functional additive and 363g of pigment filler for later use; wherein, the carboxyl acrylic resin is common polyacrylate containing carboxyl on the market; the ultraviolet curing monomer is a mixture of commercially available dipentaerythritol hexaacrylate and trimethylolpropane triacrylate according to equal mass ratio; the solvent is a mixture of a commercially available dibasic ester, dipropylene glycol methyl ether and propylene glycol methyl ether which are mixed according to equal mass ratio; the photoinitiator is a mixture of a commercially available TPO photoinitiator and a 819 photoinitiator which are mixed according to equal mass ratio; the anti-yellowing agent is a mixture of a commercially available Nanxiong Zhi-chemical v76-p anti-yellowing agent and a v85-p anti-yellowing agent which are mixed according to equal mass ratio; the functional auxiliary agent is a mixture of a defoaming agent, a leveling agent, a dispersing agent and the like which are sold in German Bike chemical markets in a mass ratio; the pigment and filler comprise 13g of talcum powder and 350g of titanium dioxide.
S2, mixing the weighed epoxy acrylic resin, carboxyl acrylic resin, ultraviolet curing monomer, solvent, photoinitiator, triglycidyl isocyanurate, anti-yellowing agent, functional assistant and pigment and filler, and repeatedly and sequentially placing the mixture in a grinder and a dispersion machine for grinding and dispersing for 3 times to obtain the white solder resist ink.
Example 8
The embodiment provides solder mask ink, and the preparation method of the solder mask ink comprises the following steps:
s1, weighing 300g of epoxy acrylic resin, 120g of carboxyl acrylic resin, 65g of ultraviolet curing monomer, 50g of solvent, 30g of photoinitiator, 30g of triglycidyl isocyanurate, 10g of anti-yellowing agent, 30g of functional additive and 365g of pigment filler for later use; wherein, the carboxyl acrylic resin is common polyacrylate containing carboxyl on the market; the ultraviolet curing monomer is a mixture of commercially available dipentaerythritol hexaacrylate and trimethylolpropane triacrylate according to equal mass ratio; the solvent is a mixture of a commercially available dibasic ester, dipropylene glycol methyl ether and propylene glycol methyl ether which are mixed according to equal mass ratio; the photoinitiator is a mixture of a commercially available TPO photoinitiator and a 819 photoinitiator which are mixed according to equal mass ratio; the anti-yellowing agent is a mixture of a commercially available Nanxiong Zhi-chemical v76-p anti-yellowing agent and a v85-p anti-yellowing agent which are mixed according to equal mass ratio; the functional auxiliary agent is a mixture of a defoaming agent, a leveling agent, a dispersing agent and the like which are sold in German Bike chemical markets in a mass ratio; the pigment and filler comprises 15g of silicon dioxide and 350g of titanium dioxide.
S2, mixing the weighed epoxy acrylic resin, carboxyl acrylic resin, ultraviolet curing monomer, solvent, photoinitiator, triglycidyl isocyanurate, anti-yellowing agent, functional assistant and pigment and filler, and repeatedly and sequentially placing the mixture in a grinder and a dispersion machine for grinding and dispersing for 3 times to obtain the white solder resist ink.
The solder resist ink obtained in the above example 8 was coated on an aluminum-based wiring board, and cured by baking, and the hardness of the cured coating was 8H. In addition, the coating obtained after the baking and curing was subjected to a Lab value test, and the Lab value before the baking and curing was used as a standard value for comparison, and the results of the color difference in comparison are shown in table 1. Wherein, the lightness component (L) range of the Lab color mode is 0-100; in both the Adobe color picker and the "color" panel, the a-component (green-magenta axis) and the b-component (blue-yellow axis) range from-128 to + 127. For white ink, the change of b value has great influence on color; if the b value is larger, the color of the ink is more yellow.
TABLE 1
| Lab value | L | a | b |
| Standard of merit | 91.5 | 2.6 | 1.3 |
| After baking | 91.0 | 2.3 | 0.7 |
| Color difference | -0.5 | -0.3 | -0.6 |
As can be seen from table 1 above, after the solder mask ink obtained in the embodiment of the present invention is cured by baking, the color difference value of each component is not greater than 0.6, and no yellowing phenomenon is observed visually, which indicates that the solder mask ink obtained in the embodiment of the present invention has good temperature resistance and is not easy to yellow.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The solder mask ink is characterized by comprising the following components in percentage by mass: 20-40% of epoxy acrylic resin, 5-20% of carboxyl acrylic resin, 3-10% of ultraviolet curing monomer, 2-8% of solvent, 1-5% of photoinitiator, 1-5% of triglycidyl isocyanurate, 0.1-2% of anti-yellowing agent, 1-5% of functional additive and the balance of pigment filler, wherein the sum of the mass percentages of the components is 100%.
2. The solder mask ink as claimed in claim 1, wherein the solder mask ink comprises the following components in percentage by mass: 25-35% of epoxy acrylic resin, 10-15% of carboxyl acrylic resin, 5-8% of ultraviolet curing monomer, 4-6% of solvent, 2-4% of photoinitiator, 2-4% of triglycidyl isocyanurate, 0.5-1.5% of anti-yellowing agent, 2-4% of functional additive and the balance of pigment and filler, wherein the sum of the mass percentages of the components is 100%.
3. The solder mask ink of claim 1 or 2, wherein the UV curable monomer is dipentaerythritol hexaacrylate and/or trimethylolpropane triacrylate.
4. The solder resist ink according to claim 1 or 2, wherein the solvent is at least one of dibasic ester, dipropylene glycol methyl ether and propylene glycol methyl ether.
5. A solder mask ink as in claim 1 or 2 wherein said photoinitiator is at least one of a TPO photoinitiator, a 819 photoinitiator, a MBF photoinitiator and a 1173 photoinitiator.
6. The solder mask ink of claim 1 or 2, wherein the anti-yellowing agent is at least one of v76-p anti-yellowing agent, v85-p anti-yellowing agent, 1216 anti-yellowing agent and B24N 03 ultraviolet stabilizer.
7. The solder resist ink according to claim 1 or 2, wherein the functional assistant is at least one of a defoaming agent, a leveling agent, a flow inhibitor and a dispersing agent; the pigment and filler is at least one of talcum powder, silicon dioxide and titanium dioxide.
8. A method for preparing the solder mask ink according to any one of claims 1 to 7, comprising the steps of:
weighing epoxy acrylic resin, carboxyl acrylic resin, an ultraviolet curing monomer, a solvent, a photoinitiator, triglycidyl isocyanurate, an anti-yellowing agent, a functional auxiliary agent and pigment filler according to the mass percentage for later use;
mixing epoxy acrylic resin, carboxyl acrylic resin, an ultraviolet curing monomer, a solvent, a photoinitiator, triglycidyl isocyanurate, an anti-yellowing agent, a functional assistant and pigment and filler, and then grinding and dispersing to obtain the solder mask ink.
9. A solder mask ink prepared by the method of claim 8.
10. A wiring board characterized in that the surface of the wiring board is entirely or partially coated with the solder resist ink according to any one of claims 1 to 7 and claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010697022.3A CN111961365A (en) | 2020-07-20 | 2020-07-20 | Solder mask ink, preparation method thereof and circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010697022.3A CN111961365A (en) | 2020-07-20 | 2020-07-20 | Solder mask ink, preparation method thereof and circuit board |
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| CN111961365A true CN111961365A (en) | 2020-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010697022.3A Pending CN111961365A (en) | 2020-07-20 | 2020-07-20 | Solder mask ink, preparation method thereof and circuit board |
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| CN103834227A (en) * | 2014-02-27 | 2014-06-04 | 东莞市合通电子有限公司 | Photosensitive solder resist ink for LED backlight |
| CN104312269A (en) * | 2014-10-28 | 2015-01-28 | 成都纳硕科技有限公司 | Ultraviolet curing solder resist ink for printed circuit board |
| CN108164686A (en) * | 2018-02-01 | 2018-06-15 | 江南大学 | A kind of modified epoxy acrylic ester, the solder resist containing the modified epoxy acrylic ester |
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| CN103834227A (en) * | 2014-02-27 | 2014-06-04 | 东莞市合通电子有限公司 | Photosensitive solder resist ink for LED backlight |
| CN104312269A (en) * | 2014-10-28 | 2015-01-28 | 成都纳硕科技有限公司 | Ultraviolet curing solder resist ink for printed circuit board |
| CN108164686A (en) * | 2018-02-01 | 2018-06-15 | 江南大学 | A kind of modified epoxy acrylic ester, the solder resist containing the modified epoxy acrylic ester |
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Application publication date: 20201120 |