CN115732165A - Multi-coil structure, manufacturing method thereof, and electronic device having same - Google Patents

Abstract

The invention relates to the technical field of electronic product manufacturing, and discloses a multi-coil structure, a manufacturing method thereof and electronic equipment with the multi-coil structure. The multi-coil structure comprises an insulating layer, and at least a first coil and a second coil which are adjacently arranged, wherein the first coil and the second coil at least have an overlapping part; the insulating layer is arranged on the overlapping part and is positioned between the first coil and the second coil. The invention is used for realizing the diversified functions of the multi-coil structure by at least arranging the first coil and the second coil. The first coil and the second coil are adjacent and at least have an overlapping part, which is beneficial to reducing the size of the multi-coil structure. The insulating layer is arranged at the overlapping part and is arranged between the first coil and the second coil, so that the risk of contact short circuit between the first coil and the second coil can be effectively reduced, and the reliability of the performance of the multi-coil structure and the use safety are ensured; meanwhile, the multi-coil structure with the insulating layer also has the characteristic of small thickness, and is beneficial to the ultrathin development of products.

Description

Multi-coil structure, manufacturing method thereof, and electronic device having same

technical field

The invention relates to the technical field of electronic product manufacturing, in particular to a multi-coil structure, a manufacturing method thereof and an electronic device having the same.

Background technique

At present, the insulation method of most individual coils is realized by the PU insulation layer or outer cover of the wire itself. With the rapid development of diversified functions and ultra-thin dimensions of consumer electronics products, there are now multiple or multiple coils mixed and matched, such as near-field communication function coils and wireless charging coils in mobile phones.

In the related art, as shown in Fig. 1, when a plurality of traditional coils are used in combination, the coils may be short-circuited due to pinhole damage or uneven coating of insulating varnish between the coils. and damage to product functions. In order to avoid the problem of short circuit between multiple coils, it is common practice to perform surface treatment on the single coil area of the short circuit risk area 600 , such as spraying UV glue and the like. However, the surface treatment steps are complicated, and the thickness of the short-circuit risk area 600 increases after treatment, which is prone to wear and thus also has the risk of short-circuit; in addition, the increase in thickness is not conducive to the further ultra-thinning process of the product.

Therefore, there is an urgent need for a multi-coil structure, a manufacturing method thereof, and an electronic device having the same to solve the above problems.

Contents of the invention

Based on the above, the purpose of the present invention is to provide a multi-coil structure, its manufacturing method and electronic equipment with it, which has low risk of short circuit, more reliable use, and has the characteristics of ultra-thin.

For reaching above-mentioned purpose, the present invention adopts following technical scheme:

Multi-coil structure, including:

At least including a first coil and a second coil arranged adjacently, the first coil and the second coil have at least an overlapping portion;

The insulating layer is arranged on the overlapping portion and is located between the first coil and the second coil.

The manufacturing method of multi-coil structure is used for assembling the multi-coil structure described in any of the above schemes, the manufacturing method comprising:

cutting the process film, the process film includes a main body and an auxiliary area arranged on the main body, the main body is adapted to the first coil or the second coil, and the auxiliary area corresponds to the overlapping portion set up;

An adhesive layer is provided, and the adhesive layer is bonded to the process film, including a main adhesive layer adapted to the first coil or the second coil, and an auxiliary adhesive adapted to the auxiliary area. layer;

disposing an insulating layer, and disposing the insulating layer on the side of the auxiliary adhesive layer away from the auxiliary region;

crimping the side of the process film provided with the adhesive layer and the insulating layer to the first coil;

crimping the side of the first coil away from the process film to the product, tearing off the process film, and crimping the second coil on the side of the first coil away from the product; or, The side of the second coil away from the process film is crimped on the product, the process film is torn off, and the first coil is crimped on the side of the second coil away from the product.

As a preferred solution of the manufacturing method of the multi-coil structure, a broken line is provided between the auxiliary region and the main body.

As a preferred solution of the manufacturing method of a multi-coil structure, the auxiliary adhesive layer is provided with a high-viscosity surface and a low-viscosity surface, and the adhesion of the low-viscosity surface is smaller than that of the high-viscosity surface. Relay, the high-viscosity surface is bonded to the auxiliary area, and the low-viscosity surface is bonded to the insulating layer.

As a preferred solution of the manufacturing method of the multi-coil structure, the side of the insulating layer away from the process film is provided with an adhesive surface.

As a preferred solution of the manufacturing method of a multi-coil structure, the first coil or the second coil is provided with a coil body, a wire inlet and a wire outlet, and the main adhesive layer is provided with a wire corresponding to the coil body. A coil adhesive layer, and a wire end adhesive layer corresponding to the wire inlet head and the wire outlet head.

As a preferred solution of the manufacturing method of the multi-coil structure, the pressure-holding head is crimped, and the pressure-holding head is provided with an auxiliary crimping area corresponding to the auxiliary area.

As a preferred solution of the manufacturing method of the multi-coil structure, the insulating layer covers the overlapping portion, or the insulating layer is at least partially placed outside the overlapping portion.

As a preferred solution of the manufacturing method of the multi-coil structure, the insulating layer is a polyimide layer.

An electronic device with a multi-coil structure includes the multi-coil structure described in any of the solutions above.

The beneficial effects of the present invention are:

The multi-coil structure of the present invention is used to realize the multiple functions of the multi-coil structure by setting at least the first coil and the second coil. The first coil and the second coil are arranged adjacent to each other, and there is at least an overlapping portion between the first coil and the second coil, which is beneficial to reducing the size of the multi-coil structure. By arranging an insulating layer on the overlapping portion, and arranging the insulating layer between the first coil and the second coil, the risk of contact short circuit between the first coil and the second coil can be effectively reduced, and the reliability and performance of the multi-coil structure can be ensured. It is safe to use; at the same time, the multi-coil structure with insulating layers also has the characteristics of small thickness, which is conducive to the development of ultra-thin products.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention , for those skilled in the art, other drawings can also be obtained according to the content of the embodiment of the present invention and these drawings without any creative effort.

1 is a perspective view of a multi-coil structure in the prior art;

Fig. 2 is a schematic diagram of a multi-coil structure provided by a specific embodiment of the present invention;

3 is a schematic diagram of the process film and the adhesive layer of the manufacturing method of the multi-coil structure provided by the specific embodiment of the present invention;

Fig. 4 is a partial schematic diagram of the process film of the manufacturing method of the multi-coil structure provided by the specific embodiment of the present invention;

5 is a schematic diagram of the cooperation between the process film and the first coil of the manufacturing method of the multi-coil structure provided by the specific embodiment of the present invention;

6 is a schematic diagram of crimping the process film and the first coil in the manufacturing method of the multi-coil structure provided by the specific embodiment of the present invention;

Fig. 7 is a schematic diagram of the cooperation between the first coil and the product in the manufacturing method of the multi-coil structure provided by the specific embodiment of the present invention;

Fig. 8 is a schematic diagram of a semi-finished product of a method for manufacturing a multi-coil structure provided by a specific embodiment of the present invention;

Fig. 9 is a schematic diagram of the finished product of the manufacturing method of the multi-coil structure provided by the specific embodiment of the present invention;

Fig. 10 is a schematic diagram of the cooperation between the process film and the second coil in the manufacturing method of the multi-coil structure provided by the specific embodiment of the present invention.

In the picture:

100, the first coil; 110, the coil body; 120, the inlet head; 130, the outlet head;

200, the second coil; 300, the insulating layer; 400, the product;

500, holding pressure head; 510, auxiliary crimping area;

600. Short circuit risk area;

1. Process film; 11. Body; 12. Auxiliary area; 13. Dotted line;

2. Adhesive layer; 21. Main adhesive layer; 211. Coil adhesive layer; 212. Thread end adhesive layer; 22. Auxiliary adhesive layer.

Detailed ways

Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance. Wherein, the terms "first position" and "second position" are two different positions.

Unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected" and "fixed" should be interpreted in a broad sense, for example, it may be a fixed connection or a detachable connection; it may be a mechanical connection, or It can be an electrical connection; it can be a direct connection, or an indirect connection through an intermediary, and it can be an internal communication between two elements or an interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

As shown in FIG. 2 , this embodiment provides a multi-coil structure, the multi-coil structure includes an insulating layer 300 and at least a first coil 100 and a second coil 200 arranged adjacently, and the first coil 100 and the second coil 200 are at least There is an overlapping portion; the insulating layer 300 is disposed on the overlapping portion, and is located between the first coil 100 and the second coil 200 .

By setting at least the first coil 100 and the second coil 200, it is used to realize the multiple functions of the multi-coil structure. The first coil 100 and the second coil 200 are arranged adjacent to each other, and there is at least an overlapping portion between the first coil 100 and the second coil 200, which is beneficial to reduce the size of the multi-coil structure. By arranging the insulating layer 300 at the overlapping portion, and disposing the insulating layer 300 between the first coil 100 and the second coil 200, the risk of contact short circuit between the first coil 100 and the second coil 200 can be effectively reduced, ensuring more The performance of the coil structure is reliable and the use is safe; at the same time, the multi-coil structure with the insulating layer 300 also has the characteristics of small thickness, which is conducive to the development of ultra-thin product 400 .

Exemplarily, the first coil 100 is a circular coil, and the second coil 200 is a square coil. As an alternative to a multi-coil structure, the insulating layer 300 covers the overlapping portion, so that the gap between the first coil 100 and the second coil 200 at the overlapping portion is within the range of the insulating layer 300, thereby ensuring reliable insulation. Or the insulating layer 300 is at least partially placed outside the overlapping portion, that is, the area of the insulating layer 300 is set to be larger than that of the overlapping portion, so as to further improve the reliability of the insulation.

In this embodiment, the insulating layer 300 is a polyimide layer. Polyimide has high density, good thermal stability, good mechanical properties, and good insulation, which can not only ensure that the multi-coil structure has a smaller thickness, but also ensure more reliable insulation.

As shown in Figures 3 to 8, this embodiment also discloses a method for manufacturing a multi-coil structure, which is used to assemble the above-mentioned multi-coil structure. The manufacturing method includes:

The process film 1 is cut, and the process film 1 is used for positioning and protecting the coils when assembling the multi-coil structure. As shown in FIG. 3 , the process film 1 includes a main body 11 and an auxiliary area 12 disposed on the main body 11 , the main body 11 is adapted to the first coil 100 , and the auxiliary area 12 is arranged correspondingly to the overlapping portion. By setting the auxiliary area 12, it is used to adapt to the installation of the subsequent insulating layer 300.

Preferably, as shown in FIG. 4 , a dotted line 13 is set between the auxiliary area 12 and the body 11. By setting the dotted line 13, the stress rebound of the process film 1 can be effectively reduced, ensuring that the subsequent crimping and pressure holding process The flatness of the process film 1.

The adhesive film is die-cut, and the adhesive layer 2 is arranged on the process film 1, and the adhesive layer 2 is used to realize the installation of the process film 1, the first coil 100 and the insulating layer 300. Specifically, the adhesive layer 2 is bonded to the process film 1, and the adhesive layer 2 includes a main adhesive layer 21 for bonding the process film 1 and the first coil 100 and adapted to the first coil 100, and for Adhesive process film 1 and insulating layer 300 , and auxiliary adhesive layer 22 adapted to auxiliary region 12 . The setting of the adhesive layer 2 ensures reliable installation between the first coil 100 and the insulating layer 300 and the process film 1 , and avoids falling off of the first coil 100 and the insulating layer 300 during the assembly process.

An insulating layer 300 is provided, and the insulating layer 300 is arranged on the side of the auxiliary adhesive layer 22 away from the auxiliary region 12; optionally, the area of the auxiliary adhesive layer 22 is set to be consistent with the area of the insulating layer 300, and both are larger than the overlapping portion The area to ensure the reliability of the insulation of the overlapping part.

Specifically, the first coil 100 is provided with a coil body 110, a wire inlet 120 and an outlet 130. In order to ensure that the main adhesive layer 21 is reliably bonded to the first coil 100, the main adhesive layer 21 is provided with a The coil adhesive layer 211, and the wire end adhesive layer 212 corresponding to the incoming wire head 120 and the wire outlet head 130.

As shown in Figure 5, the side of the process film 1 provided with the adhesive layer 2 and the insulating layer 300 is crimped to the first coil 100; so that the adhesive layer 2 is stably connected to the first coil 100, while ensuring that the insulating layer 300 It is connected to the position of the first coil 100 corresponding to the overlapping portion. At the same time, the process of crimping and holding pressure can effectively activate the adhesive force of the adhesive layer 2 to ensure reliable connection.

Specifically, the auxiliary adhesive layer 22 is provided with a high-viscosity surface and a low-viscosity surface. The adhesive surface is bonded to the insulating layer 300 . By setting the adhesive force on both sides of the auxiliary adhesive layer 22 differently, and setting the adhesive force on the side close to the insulating layer 300 to be smaller, so that while ensuring reliable fixing of the insulating layer 300, the subsequent tear-off process The film 1 will not tear off the insulating layer 300 together, so that the insulating layer 300 can be reliably bonded to the first coil 100 .

Preferably, the side of the insulating layer 300 away from the process film 1 is provided with an adhesive surface, so as to further ensure the reliability of the bonding between the insulating layer 300 and the first coil 100 .

In this embodiment, the above-mentioned processes are all crimped through the pressure-holding head 500. In order to ensure a more targeted crimping between the auxiliary area 12 and the insulating layer 300, the pressure-holding head 500 is provided with auxiliary pressure points corresponding to the auxiliary area 12. Contact area 510 .

As shown in Figure 7, the side of the first coil 100 away from the process film 1 is crimped to the product 400; as shown in Figure 8, the process film 1 is torn off to form a semi-finished product; as shown in Figure 9, the second coil 200 It is crimped on the side of the first coil 100 away from the product 400 , so far the assembly of the finished product is completed.

It is worth noting that, in order to arrange the insulating layer 300 between the first coil 100 and the second coil 200, not only the process film 1 and the adhesive layer 2 can be arranged to be compatible with the first coil 100, but also as shown in FIG. 10 As shown, the process film 1 and the adhesive layer 2 are arranged to match the second coil 200 . That is, first cut the process film 1 and the adhesive layer 2 that are suitable for the second coil 200, then install the insulating layer 300, and finally crimp the side of the second coil 200 away from the process film 1 to the product 400, and tear off the process film 1. The first coil 100 is crimped to the side of the second coil 200 away from the product 400, and the above-mentioned multi-coil structure can also be assembled. As for the process film 1 and the adhesive layer 2 arranged on the second coil 200 , those skilled in the art can set them according to the specific form of the second coil 200 , which is not specifically limited here.

This embodiment also discloses an electronic device with a multi-coil structure, including the above-mentioned multi-coil structure. The multi-coil structure can be assembled by the manufacturing method of the multi-coil structure. Electronic equipment with a multi-coil structure has the advantages of multi-function, ultra-thin, and reliable use.

The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. limits.

Claims (10)

1. A multi-coil structure, comprising:

at least comprising a first coil (100) and a second coil (200) arranged adjacently, the first coil (100) and the second coil (200) having at least an overlapping portion;

an insulating layer (300) disposed at the overlapping portion and located between the first coil (100) and the second coil (200).

2. A method of manufacturing a multi-coil structure for assembling the multi-coil structure of claim 1, the method comprising:

cutting a process film (1), wherein the process film (1) comprises a body (11) and an auxiliary area (12) arranged on the body (11), the body (11) is matched with the first coil (100) or the second coil (200), and the auxiliary area (12) is arranged corresponding to the overlapped part;

arranging an adhesive layer (2), wherein the adhesive layer (2) is adhered to the process film (1) and comprises a main adhesive layer (21) matched with the first coil (100) or the second coil (200) and an auxiliary adhesive layer (22) matched with the auxiliary area (12);

arranging an insulating layer (300), and arranging the insulating layer (300) on one side of the auxiliary bonding layer (22) far away from the auxiliary area (12);

pressing the side of the process film (1) provided with the bonding layer (2) and the insulating layer (300) to the first coil (100);

pressing the first coil (100) on the side away from the process film (1) to a product (400), tearing off the process film (1), and pressing the second coil (200) on the side away from the product (400) of the first coil (100); or, the side of the second coil (200) far away from the process film (1) is pressed on the product (400), the process film (1) is torn off, and the first coil (100) is pressed on the side of the second coil (200) far away from the product (400).

3. Method for manufacturing a multi-coil structure according to claim 2, characterized in that a virtual break line (13) is provided between the auxiliary zone (12) and the body (11).

4. Method for manufacturing a multicoil structure according to claim 2 characterized in that said auxiliary adhesive layer (22) is provided with a high adhesion surface and a low adhesion surface, the adhesion of said low adhesion surface being lower than the adhesion of said high adhesion surface, said high adhesion surface being adhered to said auxiliary zone (12) and said low adhesion surface being adhered to said insulating layer (300).

5. The method of claim 2, wherein the insulating layer (300) is provided with an adhesive surface on a side thereof remote from the process film (1).

6. The method of manufacturing a multi-coil structure according to claim 2, wherein the first coil (100) or the second coil (200) is provided with a coil body (110), a wire inlet (120) and a wire outlet (130), and the main adhesive layer (21) is provided with a coil adhesive layer (211) corresponding to the coil body (110), and a wire outlet adhesive layer (212) corresponding to the wire inlet (120) and the wire outlet (130).

7. A method of manufacturing a multi-coil structure according to claim 2, characterized in that the crimp head (500) is provided with an auxiliary crimping zone (510) corresponding to the auxiliary zone (12) by crimping of the crimp head (500).

8. Method for manufacturing a multi-coil structure according to any of claims 2-7, characterized in that the insulating layer (300) covers the overlap, or that the insulating layer (300) is placed at least partially outside the overlap.

9. Method for manufacturing a multi-coil structure according to any of claims 2-7, characterized in that the insulating layer (300) is a polyimide layer.

10. An electronic device having a multi-coil structure, comprising the multi-coil structure of claim 1.

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