CN115692345A - High-efficient heat radiation structure of chip and heat radiation equipment - Google Patents
High-efficient heat radiation structure of chip and heat radiation equipment Download PDFInfo
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- CN115692345A CN115692345A CN202310000843.0A CN202310000843A CN115692345A CN 115692345 A CN115692345 A CN 115692345A CN 202310000843 A CN202310000843 A CN 202310000843A CN 115692345 A CN115692345 A CN 115692345A
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- liquid
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- cooling plate
- heat
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- 230000005855 radiation Effects 0.000 title claims description 10
- 239000007788 liquid Substances 0.000 claims abstract description 101
- 230000017525 heat dissipation Effects 0.000 claims abstract description 69
- 238000001816 cooling Methods 0.000 claims abstract description 57
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 41
- 239000002826 coolant Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The invention provides a chip efficient heat dissipation structure and heat dissipation equipment, and relates to the technical field of chip heat dissipation, wherein the chip efficient heat dissipation structure comprises a chip and a liquid cooling heat dissipation assembly, the liquid cooling heat dissipation assembly comprises a liquid metal heat conduction gasket and a liquid cooling plate, the chip, the liquid metal heat conduction gasket and the liquid cooling plate are sequentially arranged from top to bottom, a heat dissipation channel is arranged in the liquid cooling plate, and a cooling medium in the heat dissipation channel can exchange heat with the chip through the liquid cooling plate and the liquid metal heat conduction gasket; the liquid metal heat-conducting gasket is used as a heat-conducting component of the liquid cooling plate and the chip, so that the liquid metal heat-conducting gasket has a large heat-conducting coefficient and can effectively transfer the heat of the chip, and has a small melting point; the liquid metal heat-conducting gasket and the liquid cooling plate are mutually matched, the heat dissipation effect is obvious, and the heat dissipation requirement of the ultra-high power chip can be effectively met.
Description
Technical Field
The invention relates to the technical field of chip heat dissipation devices, in particular to a chip efficient heat dissipation structure and heat dissipation equipment.
Background
With the development of high-end chips toward miniaturization and integration, the problem of "heat dissipation" has been an obstacle to the development of higher-performance chips. Therefore, the development of high performance heat dissipation systems is urgently needed.
Currently, for a high-end high-power chip, the heat flux density can reach 300w/cm, and the conventional air cooling or liquid cooling device can not meet the heat dissipation requirement.
The existing immersed liquid heat dissipation device has high requirements on water tightness, and needs to ensure that the device cannot leak liquid during long-time work, and the cooling liquid is easily polluted by other substances in the air, so that the device has a high corrosion risk, and meanwhile, for an ultra-high power chip with the heat flow density of 300w/cm, the heat dissipation capacity of the existing immersed liquid heat dissipation device is limited, and the heat dissipation requirement of the existing immersed liquid heat dissipation device cannot be effectively met.
Disclosure of Invention
The invention aims to provide a chip efficient heat dissipation structure and heat dissipation equipment, which are used for solving the technical problem that the heat dissipation requirement of an ultra-high power chip cannot be effectively met by adopting the existing chip heat dissipation device in the prior art; the invention provides a plurality of technical effects which can be generated by the optimized technical scheme in the technical schemes; see below for details.
In order to realize the purpose, the invention provides the following technical scheme:
the invention provides a chip high-efficiency heat radiation structure, which comprises a chip and a liquid cooling heat radiation assembly, wherein: the liquid cooling heat dissipation assembly comprises a liquid metal heat conduction gasket and a liquid cooling plate, and the chip, the liquid metal heat conduction gasket and the liquid cooling plate are sequentially arranged from top to bottom; and a heat dissipation channel is arranged in the liquid cooling plate, and a cooling medium in the heat dissipation channel can exchange heat with the chip through the liquid cooling plate and the liquid metal heat conduction gasket.
Preferably, the cooling medium is a liquid metal medium, soThe liquid metal medium is Ga 68 in 20 Sn 12 。
Preferably, the liquid metal heat conducting gasket adopts Ga 68 in 20 Sn 12 And (3) material quality.
Preferably, the liquid cooling plate is made of aluminum alloy.
Preferably, be provided with inlet and outlet on the liquid-cooling board, wherein: the liquid inlet and the liquid outlet are communicated with the heat dissipation channel; the liquid inlet and the liquid outlet are arranged on two side end faces opposite to the liquid cooling plate.
Preferably, the heat dissipation channel includes a plurality of unit flow channels arranged in parallel, the liquid inlet and the liquid outlet are arranged in a plurality, wherein: the number of the liquid inlets and the number of the liquid outlets are the same as that of the unit runners; and the liquid inlet end and the liquid outlet end of the unit flow channel are respectively connected with the liquid inlet and the liquid outlet correspondingly.
Preferably, all the unit runners are disposed on the same horizontal plane.
Preferably, the unit flow channels are provided as linear flow channels.
The invention provides a heat dissipation device which comprises any one of the chip high-efficiency heat dissipation structures.
The invention provides a chip high-efficiency heat radiation structure and heat radiation equipment, which at least have the following beneficial effects:
the high-efficient heat radiation structure of chip includes chip and liquid cooling radiator unit, liquid cooling radiator unit includes liquid metal heat conduction gasket and liquid cooling board, the chip the liquid metal conducting strip with the liquid cooling board sets gradually from last to down, be provided with heat dissipation channel in the liquid cooling board, at radiating in-process, when coolant flows through heat dissipation channel, carry out the heat exchange through liquid cooling board and liquid metal heat conduction gasket and chip.
The liquid metal heat-conducting gasket is used as a heat-conducting component of the liquid cooling plate and the chip, so that the liquid metal heat-conducting gasket has a large heat-conducting coefficient and can effectively transfer heat of the chip, and has a small melting point.
The liquid metal heat conducting gasket is matched with the liquid cooling plate, so that the heat dissipation effect is remarkable, the requirement on water tightness is lower compared with the existing immersion type liquid cooling mode, the equipment is more reliable to operate, meanwhile, the liquid metal heat conducting gasket is not influenced by other substances in the air, and the corrosion risk of the equipment is lower.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a rear view schematic of the present invention;
fig. 4 is a simulation diagram of the heat dissipation of the present invention.
Reference numerals
1. A chip; 2. a liquid cooling heat dissipation assembly; 21. a liquid metal heat conducting pad; 22. a liquid-cooled plate; 221. a heat dissipation channel; 2211. a unit flow channel; 222. a liquid inlet; 223. and a liquid outlet.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Example 1:
the invention provides a chip efficient heat dissipation structure, which comprises a chip 1 and a liquid cooling heat dissipation assembly 2, and is shown in figures 1-3.
The liquid cooling heat dissipation assembly 2 comprises a liquid metal heat conduction gasket 21 and a liquid cooling plate 22, and the chip 1, the liquid metal heat conduction gasket 21 and the liquid cooling plate 22 are sequentially arranged from top to bottom.
A heat dissipation channel 221 is provided in the liquid cooling plate 22, and a cooling medium flows through the heat dissipation channel 221.
When the chip 1 is cooled, the cooling medium flows through the heat dissipation channel 221, and at this time, the cooling medium exchanges heat with the chip 1 through the liquid cooling plate 22 and the liquid metal heat conduction gasket 21, so as to take away heat of the chip 1.
In this process, since the liquid metal heat conduction pad 21 has a smaller melting point, when the chip 1 generates heat, the liquid metal heat conduction pad 21 is in a liquid state and adheres to the uneven end surface of the chip 1, thereby effectively ensuring the contact area between the liquid metal heat conduction pad 21 and the chip 1.
The liquid metal heat conducting gasket 21 has a large heat conducting coefficient, so that the heat conducting performance of the liquid metal heat conducting gasket is effectively ensured.
Therefore, the liquid metal heat conducting gasket 21 is matched with the liquid cooling plate 22 with the cooling medium circulating inside, the heat dissipation effect is obvious, and the heat dissipation requirement of a high-power chip can be effectively met.
Meanwhile, compared with the existing immersed liquid cooling device, the liquid cooling heat dissipation assembly 2 with the liquid metal heat conduction gasket 21 and the liquid cooling plate 22 has the advantages that the requirement on water tightness is lower, the whole device is more reliable to operate, and meanwhile, the corrosion risk of the device is low.
Example 2:
example 2 is based on example 1:
as shown in fig. 1-3, the cooling medium is a liquid metal medium, and the liquid metal medium is Ga 68 in 20 Sn 12 。
Ga 68 in 20 Sn 12 The thermal conductivity coefficient is 39w/m.k, which is 66 times higher than that of water, compared with 0.59w/m.k, and the heat dissipation capability can be greatly improved.
As canAlternatively, ga is used as the liquid metal heat-conducting gasket 21 68 in 20 Sn 12 And (3) material quality.
Ga 68 in 20 Sn 12 The liquid metal heat conduction gasket 21 of material is in liquid when about 40 ℃, can effectively adhere to on the terminal surface of chip 1 unevenness, guarantees area of contact.
In an alternative embodiment, the liquid cooling plate 22 is made of an aluminum alloy.
Preferably, the liquid cooling plate 22 is made of a material with the trade mark AL/6063-T5, and the liquid cooling plate is low in cost on the basis of ensuring the heat conduction effect.
As an alternative embodiment, the liquid cooling plate 22 is provided with a liquid inlet 222 and a liquid outlet 223, the liquid inlet 222 and the liquid outlet 223 are both communicated with the heat dissipation channel 221, and the liquid inlet 222 and the liquid outlet 223 are provided on two opposite side end surfaces of the liquid cooling plate 22.
In the actual use process, the liquid inlet 222 and the liquid outlet 223 are respectively connected with the liquid outlet end and the backflow end of the liquid cooling machine, and a circulation loop can be formed between the liquid cooling plate 22 and the liquid cooling machine.
As an alternative embodiment, the heat dissipation channel 221 includes a plurality of unit flow channels 2211 arranged in parallel, the liquid inlet 222 and the liquid outlet 223 are arranged in a plurality, and the number of the liquid inlets 222 and the number of the liquid outlets 223 are the same as the number of the unit flow channels 2211.
The inlet end and the outlet end of the unit flow passage 2211 are connected to the corresponding inlet port 222 and the corresponding outlet port 223, respectively.
The arrangement of the plurality of unit flow passages 2211 enables the liquid metal medium to have a large flow rate, and the heat dissipation effect can be improved.
As an alternative embodiment, all the unit flow paths 2211 are disposed on the same horizontal plane, and each unit flow path 2211 can be fully utilized, thereby further improving the heat dissipation effect.
As an alternative embodiment, the unit flow passage 2211 is provided as a linear flow passage.
On the one hand, on the premise of a certain area, a linear structure is adopted, more unit flow channels 2211 can be arranged, and on the other hand, the processing is convenient.
The invention mainly aims at the chip with the power more than 100w, and can also meet the heat dissipation requirement of the chip with the power consumption of 300 w.
Fig. 4 is a thermal simulation view of the ultra-high power chip 1 with a heat dissipation rate of 300w, and it can be seen from fig. 4 that after the chip 1 operates stably, the maximum temperature is 94.22 ℃ and less than 100 ℃, which meets the heat dissipation requirement.
Therefore, the high-power chip has a good heat dissipation effect and can effectively meet the temperature requirement of the high-power chip.
Example 3
Example 3 is based on example 2:
the invention provides a heat dissipation device which comprises the chip efficient heat dissipation structure.
In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", "top", "bottom", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.
Further, in the description of the present application, "a plurality" or "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. The utility model provides a high-efficient heat radiation structure of chip which characterized in that includes chip and liquid cooling radiator unit, wherein:
the liquid cooling radiating assembly comprises a liquid metal heat conducting gasket and a liquid cooling plate, and the chip, the liquid metal heat conducting gasket and the liquid cooling plate are sequentially arranged from top to bottom;
a heat dissipation channel is arranged in the liquid cooling plate, and cooling media in the heat dissipation channel can exchange heat with the chip through the liquid cooling plate and the liquid metal heat conduction gasket.
2. The chip efficient heat dissipation structure according to claim 1, wherein the cooling medium is a liquid metal medium, and the liquid metal medium is Ga 68 in 20 Sn 12 。
3. The chip efficient heat dissipation structure of claim 1, wherein the liquid metal heat conduction gasket is Ga 68 in 20 Sn 12 And (3) material quality.
4. The efficient heat dissipation structure for chips as claimed in claim 1, wherein said liquid cooling plate is made of aluminum alloy.
5. The efficient heat dissipation structure for chips of claim 1, wherein the liquid cooling plate is provided with a liquid inlet and a liquid outlet, wherein:
the liquid inlet and the liquid outlet are both communicated with the heat dissipation channel;
the liquid inlet and the liquid outlet are arranged on two side end faces opposite to the liquid cooling plate.
6. The efficient heat dissipation structure of claim 5, wherein the heat dissipation channel comprises a plurality of unit flow channels arranged in parallel, and the liquid inlet and the liquid outlet are arranged in plurality, wherein:
the number of the liquid inlets and the number of the liquid outlets are the same as the number of the unit runners;
and the liquid inlet end and the liquid outlet end of the unit flow channel are respectively connected with the liquid inlet and the liquid outlet correspondingly.
7. The chip efficient heat dissipation structure according to claim 6, wherein all of the unit flow channels are disposed on the same horizontal plane.
8. The chip efficient heat dissipation structure of claim 7, wherein the unit flow channels are linear flow channels.
9. A heat dissipating apparatus comprising the chip efficient heat dissipating structure of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310000843.0A CN115692345A (en) | 2023-01-03 | 2023-01-03 | High-efficient heat radiation structure of chip and heat radiation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310000843.0A CN115692345A (en) | 2023-01-03 | 2023-01-03 | High-efficient heat radiation structure of chip and heat radiation equipment |
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| Publication Number | Publication Date |
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| CN115692345A true CN115692345A (en) | 2023-02-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310000843.0A Pending CN115692345A (en) | 2023-01-03 | 2023-01-03 | High-efficient heat radiation structure of chip and heat radiation equipment |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4254431A (en) * | 1979-06-20 | 1981-03-03 | International Business Machines Corporation | Restorable backbond for LSI chips using liquid metal coated dendrites |
| US5198189A (en) * | 1989-08-03 | 1993-03-30 | International Business Machines Corporation | Liquid metal matrix thermal paste |
| CN101814470A (en) * | 2010-04-15 | 2010-08-25 | 华中科技大学 | Micro-channel heat sink for electronic encapsulation device |
| CN104465562A (en) * | 2014-12-24 | 2015-03-25 | 西安电子科技大学 | Chain type staggered micro-channel structure |
| US20150289410A1 (en) * | 2011-12-13 | 2015-10-08 | Hispano Suiza | Electronic device with cooling by a liquid metal spreader |
| CN209133496U (en) * | 2018-11-14 | 2019-07-19 | 中国科学院理化技术研究所 | Liquid metal micro-channel heat dissipation device |
| CN209880593U (en) * | 2019-05-24 | 2019-12-31 | 太仓市华盈电子材料有限公司 | Chip heat dissipation device |
| CN113437031A (en) * | 2021-06-17 | 2021-09-24 | 西北工业大学 | Embedded micro-channel heat dissipation device based on liquid metal |
| CN114639647A (en) * | 2022-01-21 | 2022-06-17 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Micro-channel heat dissipation structure and microelectronic chip structure |
-
2023
- 2023-01-03 CN CN202310000843.0A patent/CN115692345A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4254431A (en) * | 1979-06-20 | 1981-03-03 | International Business Machines Corporation | Restorable backbond for LSI chips using liquid metal coated dendrites |
| US5198189A (en) * | 1989-08-03 | 1993-03-30 | International Business Machines Corporation | Liquid metal matrix thermal paste |
| CN101814470A (en) * | 2010-04-15 | 2010-08-25 | 华中科技大学 | Micro-channel heat sink for electronic encapsulation device |
| US20150289410A1 (en) * | 2011-12-13 | 2015-10-08 | Hispano Suiza | Electronic device with cooling by a liquid metal spreader |
| CN104465562A (en) * | 2014-12-24 | 2015-03-25 | 西安电子科技大学 | Chain type staggered micro-channel structure |
| CN209133496U (en) * | 2018-11-14 | 2019-07-19 | 中国科学院理化技术研究所 | Liquid metal micro-channel heat dissipation device |
| CN209880593U (en) * | 2019-05-24 | 2019-12-31 | 太仓市华盈电子材料有限公司 | Chip heat dissipation device |
| CN113437031A (en) * | 2021-06-17 | 2021-09-24 | 西北工业大学 | Embedded micro-channel heat dissipation device based on liquid metal |
| CN114639647A (en) * | 2022-01-21 | 2022-06-17 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Micro-channel heat dissipation structure and microelectronic chip structure |
Non-Patent Citations (1)
| Title |
|---|
| 国家新材料产业发展专家咨询委员会, 冶金工业出版社 * |
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Application publication date: 20230203 |