CN211578734U - Heat conducting device for electronic device - Google Patents
Heat conducting device for electronic device Download PDFInfo
- Publication number
- CN211578734U CN211578734U CN201922308391.4U CN201922308391U CN211578734U CN 211578734 U CN211578734 U CN 211578734U CN 201922308391 U CN201922308391 U CN 201922308391U CN 211578734 U CN211578734 U CN 211578734U
- Authority
- CN
- China
- Prior art keywords
- fin
- aluminum plate
- bending part
- base plate
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat conduction device for an electronic device, which comprises a base plate, a fan and a plurality of fins arranged on the base plate, wherein the fan is arranged on one side of the base plate and the plurality of fins, a first aluminum plate and a second aluminum plate are both protruded outwards relative to a connecting point, so that a cavity is formed, and the cavity between the first aluminum plate and the second aluminum plate is divided into a plurality of runners by the plurality of connecting points; the fin further comprises a fin body, a first bending part positioned at the upper end of the fin body and a second bending part positioned at the lower end of the fin body, a gap is formed between the adjacent fin bodies of the fins, the second bending part of the fin is embedded into the mounting groove, and the first bending part of the fin is close to the fin body of the adjacent fin; the base plate further comprises an aluminum plate body and a copper block embedded in the groove of the aluminum plate body. The utility model provides high heat transfer rate reduces the radiating time, and improves the holistic anti deformation intensity of a plurality of fin, has guaranteed radiator global design's stability, has reduced holistic weight of radiator and cost.
Description
Technical Field
The utility model relates to a radiator belongs to the electrical product field.
Background
With the rapid development of electronic technology, higher performance, higher density and higher intelligence are required for chips, the integration level, packaging density and operating frequency of the chips are continuously improved, the required power consumption of a single chip is increased, high heat flux density heat control or cooling processing mode of a large server is widely concerned, the design requirement of the compact structure of the device makes the heat dissipation more difficult, so in order to ensure that the chip can normally operate more efficiently and more stably, in order to maintain the efficient heat dissipation function of the heat sink, the size and weight of the heat sink are increased, and the heat sink is heavier, however, in the server system, various electronic components, structural members, chips and the like occupy a certain space, the space provided for the heat sink is very limited, how to design a radiator with higher efficiency in a limited space urgently needs to adopt a more efficient heat dissipation technology to solve the problem.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heat-transfer device for electron device, this heat-transfer device for electron device rise the area of contact of radiator increase and heat source, improve heat transfer rate, reduce the radiating time, and improve the holistic anti deformation intensity of a plurality of fin, have guaranteed the stability of radiator global design, have reduced holistic weight of radiator and cost.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a heat conduction device for an electronic device comprises a base plate, a fan and a plurality of fins arranged on the base plate, wherein the fan is arranged on one side of the base plate and one side of the plurality of fins; the fin comprises a first aluminum plate and a second aluminum plate which are arranged face to face, the edges of the first aluminum plate and the second aluminum plate are connected together, the first aluminum plate and the second aluminum plate are connected through a plurality of connecting points distributed in compartments, the first aluminum plate and the second aluminum plate protrude outwards relative to the connecting points, so that a cavity is formed, the cavity between the first aluminum plate and the second aluminum plate is divided into a plurality of flow channels through the plurality of connecting points, and condensing agents are filled in the flow channels;
the fin further comprises a fin body, a first bending part and a second bending part, wherein the first bending part is positioned at the upper end of the fin body, the second bending part is positioned at the lower end of the fin body, a gap is formed between the adjacent fin bodies of the fin, the included angle between the second bending part of the fin and the fin body is 90 degrees, the second bending part of the fin is embedded into the mounting groove, and the first bending part of the fin is close to the fin body of the adjacent fin; the base plate further comprises an aluminum plate body and a copper block embedded in the groove of the aluminum plate body.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the mounting groove is opened on the aluminum plate body and is run through with the recess, the portion of inserting directly of fin imbeds the mounting groove that is located the aluminum plate body and contacts with the copper billet.
2. In the above scheme, the aluminum plate body is provided with a plurality of mounting grooves which are arranged in parallel.
3. In the above scheme, the first bending portion and the second bending portion are located on the same side of the fin body.
4. In the above scheme, the first bending portion and the second bending portion are located on two sides of the fin body respectively.
5. In the above scheme, the second bending part of the fin is connected with the mounting groove through heat conducting glue or welding.
Because of the application of the technical scheme, compared with the prior art, the utility model have following advantage and effect:
1. the utility model is used for the heat conduction device of the electronic device, the height of the inner cavity of the fin is increased, the resistance of the condensing agent backflow is further reduced, and the uniformity of the surface temperature of the radiator fin and the heat radiation efficiency of the radiator are further improved; in addition, the fin further comprises a fin body and a second bending part located at the lower end of the fin body, an included angle between the second bending part of the fin and the fin body is 90 degrees, the second bending part of the fin is embedded into the mounting groove, the contact area with a heat source is increased, the heat transfer rate is improved, and the heat dissipation time is shortened.
2. The utility model discloses a heat conduction device for electronic device, its base plate further includes the aluminum plate body and imbeds the copper billet in the recess of aluminum plate body, under the prerequisite that guarantees that whole heat dispersion does not change, has reduced the holistic weight of radiator and cost; in addition, the first bending parts at the upper ends of the fin bodies are adjacent to each other, gaps are formed between the fin bodies of the fins, the first bending parts of the fins are close to the fin bodies of the adjacent fins, an air flow duct which does not leak air is formed, heat diffusion is facilitated, the overall deformation resistance of the plurality of fins is improved, and the stability of the overall design of the radiator is guaranteed.
Drawings
FIG. 1 is a schematic structural view of a heat conducting device for an electronic device according to the present invention;
FIG. 2 is a schematic structural diagram of a first fin type of the heat conduction device of the present invention;
FIG. 3 is a schematic cross-sectional view of a second fin type of the heat conduction device of the present invention;
FIG. 4 is a schematic cross-sectional view of a fin body of a fin of a heat conduction device according to the present invention;
FIG. 5 is a schematic view of the exploded structure of the substrate of the heat conducting device for electronic devices according to the present invention;
FIG. 6 is a schematic structural view of an aluminum plate body in the heat conduction device of the present invention;
fig. 7 is a schematic view of the heat conducting device of the present invention.
In the above drawings: 1. a substrate; 2. a fin; 21. a first aluminum plate; 22. a second aluminum plate; 23. a fin body; 3. mounting grooves; 4. a cavity; 5. a joining point; 6. a flow channel; 7. a gap; 8. a first bending portion; 9. a second bending portion; 10. an aluminum plate body; 101. a groove; 11. a fan; 12. and (4) a copper block.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a heat conduction device for an electronic device comprises a substrate 1, a fan 11 and a plurality of fins 2 arranged on the substrate 1, wherein the fan 11 is arranged on one side of the substrate 1 and one side of the plurality of fins 2; the fin comprises a base plate 1, a plurality of mounting grooves 3 are formed in one side surface of the base plate 1, fins 2 comprise a first aluminum plate 21 and a second aluminum plate 22 which are arranged face to face, the edges of the first aluminum plate 21 and the second aluminum plate 22 are connected together, the first aluminum plate 21 and the second aluminum plate 22 are connected through a plurality of connecting points 5 distributed in compartments, the first aluminum plate 21 and the second aluminum plate 22 are outwards protruded relative to the connecting points 5, a cavity 4 is formed, the cavity between the first aluminum plate 21 and the second aluminum plate 22 is divided into a plurality of flow channels 6 through the connecting points 5, and condensing agents are filled in the flow channels 6;
the fin 2 further comprises a fin body 23, a first bending part 8 positioned at the upper end of the fin body 23 and a second bending part 9 positioned at the lower end of the fin body 23, a gap 7 is formed between the adjacent fin bodies 23 of the fin 2, an included angle between the second bending part 9 of the fin 2 and the fin body 23 is 90 degrees, the second bending part 9 of the fin 2 is embedded into the mounting groove 3, and the first bending part 8 of the fin 2 is close to the fin body 23 of the adjacent fin 2; the base plate 1 further comprises an aluminum plate body 10 and a copper block 12 embedded in the groove 101 of the aluminum plate body 10.
The mounting groove 3 is formed in the aluminum plate body 10 and communicated with the groove 101, and the straight insertion portion of the fin 2 is embedded into the mounting groove 3 of the aluminum plate body 10 and contacts with the copper block 12.
The aluminum plate body 10 is provided with a plurality of mounting grooves 3 arranged in parallel.
The first bending portion 8 and the second bending portion 9 are respectively located on two sides of the fin body 23, and the second bending portion 9 of the fin 2 is connected with the mounting groove 3 through heat-conducting glue.
Example 2: a heat conduction device for an electronic device comprises a substrate 1, a fan 11 and a plurality of fins 2 arranged on the substrate 1, wherein the fan 11 is arranged on one side of the substrate 1 and one side of the plurality of fins 2; the fin comprises a base plate 1, a plurality of mounting grooves 3 are formed in one side surface of the base plate 1, fins 2 comprise a first aluminum plate 21 and a second aluminum plate 22 which are arranged face to face, the edges of the first aluminum plate 21 and the second aluminum plate 22 are connected together, the first aluminum plate 21 and the second aluminum plate 22 are connected through a plurality of connecting points 5 distributed in compartments, the first aluminum plate 21 and the second aluminum plate 22 are outwards protruded relative to the connecting points 5, a cavity 4 is formed, the cavity between the first aluminum plate 21 and the second aluminum plate 22 is divided into a plurality of flow channels 6 through the connecting points 5, and condensing agents are filled in the flow channels 6;
the fin 2 further comprises a fin body 23, a first bending part 8 positioned at the upper end of the fin body 23 and a second bending part 9 positioned at the lower end of the fin body 23, a gap 7 is formed between the adjacent fin bodies 23 of the fin 2, an included angle between the second bending part 9 of the fin 2 and the fin body 23 is 90 degrees, the second bending part 9 of the fin 2 is embedded into the mounting groove 3, and the first bending part 8 of the fin 2 is close to the fin body 23 of the adjacent fin 2; the base plate 1 further comprises an aluminum plate body 10 and a copper block 12 embedded in the groove 101 of the aluminum plate body 10.
The mounting groove 3 is formed in the aluminum plate body 10 and communicated with the groove 101, and the straight insertion portion of the fin 2 is embedded into the mounting groove 3 of the aluminum plate body 10 and contacts with the copper block 12.
The first bending portion 8 and the second bending portion 9 are located on the same side of the fin body 23, and the second bending portion 9 of the fin 2 is connected to the mounting groove 3 by welding.
When the heat conducting device for the electronic device is adopted, the height of the inner cavity of the fin is increased, the resistance of the reflux of the condensing agent is further reduced, and the uniformity of the surface temperature of the fin of the radiator and the radiating efficiency of the radiator are further improved; in addition, the contact area between the heat source and the heat source is increased, the heat transfer rate is improved, and the heat dissipation time is shortened; in addition, an air flow duct which does not leak air is formed, heat diffusion is facilitated, the integral deformation resistance strength of the plurality of fins is improved, and the stability of the integral design of the radiator is ensured; and moreover, the weight and the cost of the whole radiator are reduced on the premise of ensuring that the whole radiating performance is not changed.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (6)
1. A heat transfer device for an electronic device, comprising: the fan comprises a base plate (1), a fan (11) and a plurality of fins (2) arranged on the base plate (1), wherein the fan (11) is arranged on one side of the base plate (1) and the plurality of fins (2); the fin comprises a base plate (1), wherein a plurality of mounting grooves (3) are formed in one side surface of the base plate (1), fins (2) comprise a first aluminum plate (21) and a second aluminum plate (22) which are arranged face to face, the edges of the first aluminum plate (21) and the second aluminum plate (22) are connected together, the first aluminum plate (21) and the second aluminum plate (22) are connected through connecting points (5) distributed in a plurality of compartments, the first aluminum plate (21) and the second aluminum plate (22) are outwards protruded relative to the connecting points (5) to form a cavity (4), the cavity between the first aluminum plate (21) and the second aluminum plate (22) is divided into a plurality of flow channels (6), and condensing agents are filled in the flow channels (6);
the fin (2) further comprises a fin body (23), a first bending part (8) positioned at the upper end of the fin body (23) and a second bending part (9) positioned at the lower end of the fin body (23), a gap (7) is formed between the adjacent fin bodies (23) of the fin (2), an included angle between the second bending part (9) of the fin (2) and the fin body (23) is 90 degrees, the second bending part (9) of the fin (2) is embedded into the mounting groove (3), and the first bending part (8) of the fin (2) is close to the fin body (23) of the adjacent fin (2); the base plate (1) further comprises an aluminum plate body (10) and a copper block (12) embedded in the groove (101) of the aluminum plate body (10).
2. The heat transfer device for electronic devices according to claim 1, wherein: the mounting groove (3) is formed in the aluminum plate body (10) and communicated with the groove (101), and the straight insertion portion of the fin (2) is embedded into the mounting groove (3) in the aluminum plate body (10) and is in contact with the copper block (12).
3. The heat transfer device for electronic devices according to claim 1, wherein: the aluminum plate body (10) is provided with a plurality of parallel mounting grooves (3).
4. The heat transfer device for electronic devices according to claim 1, wherein: the first bending part (8) and the second bending part (9) are located on the same side of the fin body (23).
5. The heat transfer device for electronic devices according to claim 1, wherein: the first bending part (8) and the second bending part (9) are respectively located on two sides of the fin body (23).
6. The heat transfer device for electronic devices according to claim 1, wherein: and the second bending part (9) of the fin (2) is connected with the mounting groove (3) through heat conducting glue or welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922308391.4U CN211578734U (en) | 2019-12-20 | 2019-12-20 | Heat conducting device for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922308391.4U CN211578734U (en) | 2019-12-20 | 2019-12-20 | Heat conducting device for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211578734U true CN211578734U (en) | 2020-09-25 |
Family
ID=72549570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922308391.4U Active CN211578734U (en) | 2019-12-20 | 2019-12-20 | Heat conducting device for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211578734U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911893A (en) * | 2020-12-25 | 2021-06-04 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
-
2019
- 2019-12-20 CN CN201922308391.4U patent/CN211578734U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911893A (en) * | 2020-12-25 | 2021-06-04 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10980149B2 (en) | Thermal superconductive finned heat sink and electrical equipment cabinet | |
| US20210153394A1 (en) | Cooling arrangement for electrical components, converter with a cooling arrangement, and aircraft having a converter | |
| CN106535564A (en) | Liquid cooling type heat radiator | |
| WO2022222759A1 (en) | Radiator, packaging structure, and electronic device | |
| EP3993587B1 (en) | Water-cooler heat dissipation device and electrical device | |
| CN211578734U (en) | Heat conducting device for electronic device | |
| CN215003107U (en) | Heat pipe radiator | |
| CN210200705U (en) | High-efficiency heat dissipation module | |
| CN210534699U (en) | Heat dissipation module structure for server | |
| CN211580493U (en) | Electronic component heat radiation assembly | |
| CN211152537U (en) | Server radiator | |
| CN211909490U (en) | High-efficiency heat dissipation device | |
| CN211745055U (en) | High-efficiency radiator for electronic component | |
| CN211580494U (en) | Heat exchange radiator | |
| CN115666100A (en) | Heat radiation structure and power module assembly | |
| CN211578733U (en) | Radiator of electronic equipment | |
| CN210804276U (en) | Novel blowing plate type heat dissipation module for server | |
| CN214206200U (en) | Novel heat dissipation device | |
| CN210534623U (en) | Flat notebook with efficient heat dissipation function | |
| CN211578732U (en) | Heat exchange radiating system | |
| CN210200706U (en) | Novel blowing plate type fin heat dissipation module | |
| CN211152583U (en) | High-efficiency heat exchanger for electronic product | |
| CN211152584U (en) | Heat radiating device for heating electronic component | |
| CN211152536U (en) | High heat conduction heat radiation module | |
| CN210808021U (en) | Heat conduction type heat dissipation module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240512 Address after: 638604 Yuhua Avenue, Huaying City, Guang'an City, Sichuan Province Patentee after: Sichuan Pindai Electronic Technology Co.,Ltd. Country or region after: China Address before: No. 388, Sanjia Road, Zhangpu Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: KUNSHAN PING TAI ELECTRONIC CO.,LTD. Country or region before: China |